CN209358903U - Radiating subassembly and electronic equipment - Google Patents
Radiating subassembly and electronic equipment Download PDFInfo
- Publication number
- CN209358903U CN209358903U CN201821346612.6U CN201821346612U CN209358903U CN 209358903 U CN209358903 U CN 209358903U CN 201821346612 U CN201821346612 U CN 201821346612U CN 209358903 U CN209358903 U CN 209358903U
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- component
- thermal component
- radiating subassembly
- elastic component
- limited post
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Abstract
The application discloses a kind of radiating subassembly and electronic equipment.The radiating subassembly includes at least fixing seat, elastic component and radiating piece, elastic component is set in fixing seat and needs thermal component for carrying, the elastic component can extend along direction stretch and be driven it is described need thermal component, radiating piece, which is set to the top of elastic component and presses, described needs thermal component.Based on this, the application can be it is advantageously ensured that need the good heat conductive between thermal component and radiating piece to contact, and heat dissipation is reliable.
Description
Technical field
This application involves field of electronic devices, and in particular to a kind of radiating subassembly and electronic equipment.
Background technique
The electronic equipments such as communication device can generate amount of heat at runtime, therefore in order to guarantee that stablizing for electronic equipment is transported
Row needs needing between thermal component and radiating piece with good thermal conductive contact for electronic equipment.In traditional design, radiating piece
And it needs to realize fixation by screw locking mode between thermal component, but screw is exposed, influences overall aesthetics.Improvement to this
As shown in Figure 1, the internal element of electronic equipment is all carried on lower cover 11, radiating piece 12, which is finally fixed on, to need to radiate for design
On component 13.Since each element of electronic equipment can inevitably have various sizes tolerance in process, and thus cause
Radiating piece 12 and need that there is gap between the adjacent elements such as thermal component 13, it is therefore desirable to radiating piece 12 and need thermal component 13
Between fill heat conductive pad 14, ensure that thermal conductive contact between the two is good with this.In order to adapt to radiating piece 12 and need thermal component
13 dimensional tolerance, heat conductive pad 14 need to be designed as compressible material, such as it needs the compressible space with 30% or so,
I.e. heat conductive pad 14 needs to be provided simultaneously with the two compressible and thermally conductive performances, this undoubtedly makes the higher cost of heat conductive pad 14, dress
It is larger with difficulty.
Summary of the invention
In consideration of it, the application provides a kind of radiating subassembly and electronic equipment, it is advantageously ensured that needing thermal component and radiating piece
Between good heat conductive contact, heat dissipation is reliable, and it is at low cost, assembly difficulty is small.
The radiating subassembly of one embodiment of the application, comprising:
Fixing seat；
Elastic component is set in the fixing seat and needs thermal component for carrying, and the elastic component can the side of extending along
To flexible and be driven and described need thermal component；
Radiating piece, being set to the top of the elastic component and pressing described needs thermal component.
Optionally, the quantity of the elastic component is multiple, and radiating subassembly further includes support plate, and multiple elastic components are distributed in branch
At least two sides of fagging, need thermal component to be carried in support plate.
Optionally, the elastic component is spring, and top and the support plate of spring abut against.
Optionally, the support plate offers through-hole, and the limited post upwardly extended is provided in fixing seat, and limited post is planted
In spring and through-hole, and the diameter of limited post is less than the internal diameter of through-hole.
Optionally, the limited post is screw.
Optionally, the limited post is and the integrally formed structural member of fixing seat.
Optionally, described that thermal component is needed directly to be fixedly connected with the top of elastic component, the quantity of the elastic component is more
A, multiple elastic components are distributed in at least two sides for needing thermal component.
Optionally, elastic component is spring, and the top of spring is abutted against with the bottom of thermal component is needed.
Optionally, thermal component bottom is needed to offer through-hole, fixing seat is equipped with the limited post upwardly extended, and limited post is inserted
It is placed in spring and through-hole, and the diameter of limited post is less than the internal diameter of through-hole.
The electronic equipment of one embodiment of the application, including need thermal component and above-mentioned radiating subassembly.
The utility model has the advantages that the application design need thermal component to be carried on elastic component, elastic component to need thermal component apply to
The power of upper (i.e. towards radiating piece), while radiating piece pressure holding needs on thermal component in this, radiating piece to need thermal component apply to
Under pressure, so as to which it is advantageously ensured that need good thermal conductive contact between thermal component and radiating piece, heat dissipation is reliable, and
It is compared to the design of heat conductive pad, which needs only to have telescopic nature, at low cost, assembly difficulty is small.
Detailed description of the invention
Fig. 1 is the radiator structure schematic diagram of the electronic equipment of an embodiment of the prior art；
Fig. 2 is the structural profile illustration of the radiating subassembly of one embodiment of the application；
Fig. 3 is the radiator structure schematic diagram of the electronic equipment of an embodiment of the prior art；
Fig. 4 is the structural profile illustration of the radiating subassembly of another embodiment of the application.
Specific embodiment
The primary and foremost purpose of the application is: design needs thermal component to be carried on elastic component, and elastic component is applied to needing thermal component
Add the power of upward (i.e. towards radiating piece), while radiating piece pressure holding needs on thermal component in this, radiating piece is applied to needing thermal component
Add downward pressure, in this it is advantageously ensured that needing good thermal conductive contact between thermal component and radiating piece, heat dissipation is reliable；It compares
Compared with the design of heat conductive pad, which needs only to have telescopic nature, at low cost, assembly difficulty is small.
It is an electric elements of electronic equipment, such as PCB (Printed that the application was applicable in, which needs thermal component,
Circuit Board, printed circuit board), driving IC etc., which can be smart phone, PAD (portable
Android device, tablet computer) etc. communication equipments, or in being worn on limbs or be embedded in clothes and jewellery etc.
Wearable device.
The technical solution of each embodiment of the application is clearly and completely described with reference to the accompanying drawing.It is not rushing
In the case where prominent, following embodiments and its technical characteristic be can be combined with each other.Also, directional terminology used by full text, example
Such as "upper", "lower" are for preferably describing each embodiment, are not intended to limit the protection scope of the application.
Fig. 2 is the structural profile illustration of the radiating subassembly of one embodiment of the application.Referring to Fig. 2, the radiating subassembly
Including fixing seat 21, elastic component 22 and radiating piece 23.
Fixing seat 21 can be considered the shell of electronic equipment, such as lower cover or rear cover, for carrying the PCB etc. of electronic equipment
Internal structural element, and while bearing structure element, which can also arrange what driving structure element was run
Driving circuit, such as FPC (Flexible Printed Circuit, flexible circuit board), IC and relevant tracks.
Elastic component 22 is set in fixing seat 21 and needs thermal component 25 for carrying, which has scalable spy
Property, that is to say, that the elastic component 22 can extend along a length thereof direction stretching, extension and compression, need to radiate with what this was driven that it is carried
Component 25 upwardly or downwardly moves, and what is carried in other words to it needs the active force of the application of thermal component 25 upwardly or downwardly.
Radiating piece 23 is set to the top of the elastic component 22, specifically, installs in each structural detail of electronic equipment
After being fixed in fixing seat 21, radiating piece 23 is pressed in the upper surface for needing thermal component 25.Wherein, thermal component 25 is needed
Top should be higher than that before unassembled radiating piece 23 installation radiating piece 23 after, the part being higher by and the weight of radiating piece 23
And the oscillatory surge size of electronic equipment at runtime is related.In this, which contacts (specifically with thermal component 25 is needed
For face contact), passage of heat is formed between the two, and the heat for needing thermal component 25 to generate is ultimately conducted to by the passage of heat
In external environment.
Based on above-mentioned design, 22 pairs of elastic component need thermal component 25 to apply upward power, while 23 pairs of radiating piece need to radiate
Component 25 applies downward pressure, it is seen then that and the active force of both direction is that thermal component 25 will be needed close towards radiating piece 23,
Therefore, the application can be it is advantageously ensured that need good thermal conductive contact between thermal component 25 and radiating piece 23, and heat dissipation is reliable.
Certainly, deformable heat-conducting medium, example has can be set towards the side for needing thermal component 25 in radiating piece 23
Such as heat conductive silica gel, so that radiating piece 23 and needing the contact between thermal component 25 better, further it is advantageously ensured that the two
Between thermal conductive contact.
In addition, referring to figs. 1 and 2, being compared to the design that the prior art realizes heat dissipation using heat conductive pad 14, the bullet
Property part 22 needs only to have telescopic nature, must be provided simultaneously with the two compressible and thermally conductive property without such as heat conductive pad 14
Can, it is at low cost, assembly difficulty is small.
Please continue to refer to Fig. 2, the quantity that elastic component 22 can be set in the radiating subassembly is multiple, and the radiating subassembly
Further include support plate 24, needs thermal component 25 that can be fixed on the support plate 24 using modes such as screw locking mode or viscoses
On, support plate 24 is carried in fixing seat 21 by these elastic components 22, and these elastic components 22 are distributed in the phase of support plate 24
To two sides or surrounding.Wherein, in order to ensure needing thermal component 25 from elastic component 22 by uniformly upward active force, the application
The distribution of these elastic components 22 can be set according to the position of centre of gravity of thermal component 25 is needed, for example, when needing thermal component 25
When center of gravity is located at the center of loading end locating for support plate 24, these elastic components 22 can be symmetrically distributed in the opposite of support plate 24
Two sides or surrounding；In another example the application can be at this when needing the center of gravity of thermal component 25 to be biased to certain side of support plate 24
A fairly large number of elastic component 22 is arranged in side.
In application scenarios, elastic component 22 can be spring, and in order to avoid spring 22 is when carrying needs thermal component 25
Limited post 211 can be arranged in left and right offset, the application in fixing seat 21, which is arranged in a one-to-one correspondence with spring 22,
Each limited post 211 is inserted in a corresponding spring 22, and the top of spring 22 and the lower surface of support plate 24 abut against.
Limited post 211 can be screw, and screw is passed through from the through-hole of support plate 24 and finally fixed with 21 phase of fixing seat.
It should be noted that the internal diameter for the through-hole that support plate 24 is opened up should be greater than the diameter of limited post 211, thus support plate 24 and it is carried on
Thereon need thermal component 25 that can move up and down under the telescopic action of elastomer 22.Certainly, the limited post 211 can also be with
It is not limited with the integrally formed structural member of fixing seat 21, the application this.
Fig. 3 is the radiator structure schematic diagram of the electronic equipment of an embodiment of the prior art.As shown in figure 3, electronic equipment packet
Include the first electric elements 31 for being fixed on upper cover 33 and the second electric elements 32 for being fixed on lower cover 34, wherein lower cover 34 is tool
There is the structure of heat sinking function, is opened and closed between upper cover 33 and lower cover 34.In 30 assembling process of electronic equipment, upper cover 33 and lower cover 34
It opens, distance is longer between the first electric elements 31 and the second electric elements 32, realizes the length of the conducting wire 35 of the two electrical connection
Also longer, and distance is shorter in 34 closing lid of upper cover 33 and lower cover, between the first electric elements 31 and the second electric elements 32, it is real
Conductor length required for border is shorter, and conducting wire 35 can the tortuous inside for being placed in electronic equipment 30.And with upper cover 33 and lower cover
The state of 34 folding, conducting wire 35 constantly changes, and causes wiring difficulty higher.
And use the aforementioned radiating subassembly of the application, then it can solve the problem.That is, the aforementioned heat dissipation of the application
Component can be applicable to the electronic equipment for the structural detail that there are upper and lower two parts to need to radiate.It is described please continue to refer to Fig. 2
It can preset the supporting region for carrying electric elements 26 in fixed plate 21, the electric elements 26 and described need thermal component
It is electrically connected between 25 by conducting wire 27, the supporting region is located in region defined by multiple limited posts 211.Wherein, the need
Thermal component 25 can be considered the second electric elements 32, and accordingly, the electric elements 26 can be considered the first electric elements 31.
In the assembling process of electronic equipment, electric elements 26 are first fixed on to the supporting region of fixing seat 21, then need to
Thermal component 25 is carried on elastic component 22, needs the distance between thermal component 25 and electric elements 26 at this time it has been determined that phase
When needing thermal component 25 and electric elements in needing thermal component 25 and electric elements 26 to be mounted in upper cover 33 shown in Fig. 3
26 will not send out as the lid (upper cover and lower cover can be considered the radiating piece 22 and fixing seat 21 of the application) of electronic equipment opens and closes
Raw distance change, the length of conducting wire 27 is shorter, and wiring difficulty is lower.
Fig. 4 is the structural profile illustration of the radiating subassembly of another embodiment of the application.For ease of description, the application uses
Identical label identifies the structural details of same names.On the basis of the description of aforementioned embodiment illustrated in fig. 2, but it is different from
, in conjunction with shown in Fig. 2 and Fig. 4, the radiating subassembly of the present embodiment and not set support plate 24, but thermal component 25 will be needed straight
It connects and is fixedly connected with the top of the elastic component 22, at this point, multiple elastic components 22 are distributed in and described need thermal component 25 at least
Two sides, the present embodiment can be considered need thermal component 25 itself have similar to aforementioned support plate 24 structure, elastic component 22 with should
Structure connection.
In the application scenarios that the elastic component 22 is spring, the top of spring 22 and the bottom for needing thermal component 25
It abuts against.The limited post 211 is passed through from the through-hole for needing 25 bottom of thermal component to open up and is finally fixed with 21 phase of fixing seat.
Wherein, the internal diameter of the through-hole for needing 25 bottom of thermal component to be opened up should be greater than the diameter of limited post 211, thus need radiating part
Part 25 can move up and down under the telescopic action of elastomer 22.
In the embodiment shown in fig. 4, thermal component 25 is needed to apply upward power, while 23 pairs of need of radiating piece for 22 pairs of elastic component
Thermal component 25 applies downward pressure, and the active force of both direction is that thermal component 25 will be needed close towards radiating piece 23,
Therefore, the present embodiment also can be it is advantageously ensured that need between thermal component 25 and radiating piece 23 that good thermal conductive contact, heat dissipation can
It leans on.
The application also provides a kind of electronic equipment.The electronic equipment includes needing thermal component and aforementioned radiating subassembly,
On the elastic component 22 for needing thermal component to be carried on the radiating subassembly.In this, the electronic equipment also has radiating subassembly
The beneficial effect that can be generated.
It should be understood that above is only an example of the present application, being not intended to limit the scope of the patents of the application, all benefits
Technical characteristic between the equivalent structure or equivalent flow shift made by present specification and accompanying drawing content, such as each embodiment
Be combined with each other, being applied directly or indirectly in other relevant technical fields, similarly includes patent protection in the application
In range.
Claims (10)
1. a kind of radiating subassembly, which is characterized in that the radiating subassembly includes:
Fixing seat；
Elastic component is set in the fixing seat and needs thermal component for carrying, and the elastic component can extend along direction and stretch
It contracts to be driven and described needs thermal component；
Radiating piece, being set to the top of the elastic component and pressing described needs thermal component.
2. radiating subassembly according to claim 1, which is characterized in that the quantity of the elastic component is multiple, the heat dissipation
Component further includes support plate, and multiple elastic components are distributed in at least two sides of the support plate, described that thermal component is needed to be carried on institute
It states in support plate.
3. radiating subassembly according to claim 2, which is characterized in that the elastic component is spring, the top of the spring
It is abutted against with the support plate.
4. radiating subassembly according to claim 3, which is characterized in that the support plate offers through-hole, the fixing seat
On be provided with the limited post upwardly extended, the limited post is inserted in the spring and through-hole, and the diameter of the limited post
Less than the internal diameter of the through-hole.
5. radiating subassembly according to claim 4, which is characterized in that the limited post is screw.
6. radiating subassembly according to claim 4, which is characterized in that the limited post is to be integrally formed with the fixing seat
Structural member.
7. radiating subassembly according to claim 1, which is characterized in that it is described need thermal component directly with the elastic component
Top is fixedly connected, the quantity of the elastic component be it is multiple, multiple elastic components are distributed in at least two sides for needing thermal component.
8. radiating subassembly according to claim 7, which is characterized in that the elastic component is spring, the top of the spring
It is abutted against with the bottom for needing thermal component.
9. radiating subassembly according to claim 8, which is characterized in that the bottom for needing thermal component offers through-hole,
The fixing seat is equipped with the limited post upwardly extended, and the limited post is inserted in the spring and through-hole, and the limit
The diameter of column is less than the internal diameter of the through-hole.
10. a kind of electronic equipment, which is characterized in that the electronic equipment includes needing thermal component and claim 1~9 any
Radiating subassembly described in.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821346612.6U CN209358903U (en) | 2018-08-20 | 2018-08-20 | Radiating subassembly and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821346612.6U CN209358903U (en) | 2018-08-20 | 2018-08-20 | Radiating subassembly and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209358903U true CN209358903U (en) | 2019-09-06 |
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ID=67777967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821346612.6U Active CN209358903U (en) | 2018-08-20 | 2018-08-20 | Radiating subassembly and electronic equipment |
Country Status (1)
| Country | Link |
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| CN (1) | CN209358903U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112638115A (en) * | 2019-11-11 | 2021-04-09 | 谷歌有限责任公司 | Heat sink load balancing device |
| US20210274640A1 (en) * | 2020-02-27 | 2021-09-02 | Giga-Byte Technology Co., Ltd. | Heat dissipation device |
-
2018
- 2018-08-20 CN CN201821346612.6U patent/CN209358903U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112638115A (en) * | 2019-11-11 | 2021-04-09 | 谷歌有限责任公司 | Heat sink load balancing device |
| US20210274640A1 (en) * | 2020-02-27 | 2021-09-02 | Giga-Byte Technology Co., Ltd. | Heat dissipation device |
| US11612050B2 (en) * | 2020-02-27 | 2023-03-21 | Giga-Byte Technology Co., Ltd. | Heat dissipation device |
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