CN209356715U - A kind of optical module - Google Patents
A kind of optical module Download PDFInfo
- Publication number
- CN209356715U CN209356715U CN201920075310.8U CN201920075310U CN209356715U CN 209356715 U CN209356715 U CN 209356715U CN 201920075310 U CN201920075310 U CN 201920075310U CN 209356715 U CN209356715 U CN 209356715U
- Authority
- CN
- China
- Prior art keywords
- fixed block
- lens
- optical
- substrate
- light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
This application discloses a kind of optical modules, are set to light emitting part, lens and light receiving piece on substrate including substrate, according to optical path, further include the first fixed block and the second fixed block for fixing lens；Wherein the second fixed block gluing is on substrate, and the first fixed block gluing is connect in the side of the second fixed block, lens with the first fixed block, and lens are set in optical path；Gap is all had between lens and substrate and between the first fixed block and substrate.Solve the problems, such as that lens clamping is difficult using with lens fixation in advance or integrally formed first fixed block convenient for adjusting the position of lens when assembling by the first fixed block of clamping；Pass through the second fixed block and the first fixed block cooperation adjustment position, it can be from the position of three dimension adjustment lens, realize accurate coupling or collimation, and be easy by bondline thickness control in lesser range, avoid glue-line too it is thick be easy because temperature change or absorb wet steam cause lens position to deviate the problem of.
Description
Technical field
This application involves technical field of photo communication more particularly to a kind of optical modules comprising lens.
Background technique
It can't do without being focused coupling or collimation using lens on light signal in optical communication field, especially optical module,
When prior art is coupled for big convertible lens or collimation lens collimates, generally all for there is TEC (thermoelectric cooling module)
As the occasion of temperature control console.Generally semiconductor laser, big convertible lens or collimation lens and receiving unit when use
(PIC, PLC, optical fiber or other fiber waveguide devices) is all placed on thermoelectric cooling module, and is subject to level Hermetic Package.Gu because
Epoxy resin used in fixed big convertible lens or collimation lens has relatively high thermal expansion coefficient, while in environment
The erosion of wet steam is more sensitive, and temperature change or absorption wet steam can all cause lens position to deviate ideal position farther out.In this way
It will lead to integral device function to be deteriorated or fail.
In addition, lens size itself is smaller in compact package, and side cutting is (such as saturating using silicon when mass production
Mirror or batch moulded lens) it may result in lens side and have the problem of tilt angle, when assembling, is unfavorable for fixture clamping.
Summary of the invention
The application's is designed to provide a kind of optical module, has the lens subassembly being easily assembled to, and high reliablity can be used for
In non-hermetically sealed encapsulation.
One of to achieve the goals above, this application provides a kind of optical modules, including substrate, and are set to according to optical path
Light emitting part, lens and light receiving piece on the substrate further include the first fixed block and second for fixing the lens
Fixed block；
The second fixed block gluing is on the substrate；
The first fixed block gluing is in the side of second fixed block；
The lens are connect with first fixed block, and the lens are set between the light emitting part and light receiving piece
Optical path on；
Gap is all had between the lens and the substrate and between first fixed block and the substrate.
As the further improvement of embodiment, the lens are connect with first fixed block using glue, described
Bondline thickness between mirror and first fixed block is less than or equal to 20 microns.
As the further improvement of embodiment, the lens are an integral molding structure with first fixed block.
It is between first fixed block and second fixed block and described as the further improvement of embodiment
Glue bonding is all made of between second fixed block and the substrate；Glue between first fixed block and second fixed block
The thickness of layer and the glue-line between second fixed block and the substrate is respectively less than or is equal to 20 microns.
As the further improvement of embodiment, second fixed block further includes the light pass surface or light passing in optical path
Hole；
The lens are between the light emitting part and second fixed block；Alternatively, second fixed block is located at
Between the light emitting part and the lens.
As the further improvement of embodiment, the light pass surface or light hole are equipped with optoisolator, polarizing component, divide
The one of which of optical element or optical filter.
As the further improvement of embodiment, the optical module further includes optical element, and the optical element is installed on
On the substrate；The second fixed block gluing is installed on the substrate by the optical element on the optical element
On.
As the further improvement of embodiment, the optical element includes isolator, polarizing component, beam splitter or filter
One of which or Wave division multiplexer/demultiplexer, the one of which or more of beam shaping element or optical path adjustment element of mating plate
The combination of kind.
As the further improvement of embodiment, second fixed block is bonded in the upper surface of described light receiving piece or side
Face.
As the further improvement of embodiment, second fixed block is bonded in the upper surface of described light emitting part or side
Face.
As the further improvement of embodiment, the light emitting part is semiconductor laser；The light receiving piece is light
Waveguide, optical integrated chip or optical fiber one of which；The optical signal of the semiconductor laser after the lens through entering
It is mapped in the optical waveguide, optical integrated chip or optical fiber.
As the further improvement of embodiment, the light emitting part is optical waveguide or optical fiber；The light receiving piece is light
Detector；The optical signal of the optical waveguide, optical integrated chip or optical fiber output after the lens by the optical detector through being connect
It receives.
The application's the utility model has the advantages that devise and lens are fixed in advance or integrally formed first fixed block, convenient for assembling
When the positions of lens is adjusted by the first fixed block of clamping, caused by solving lens because size is small or side cutting out-of-flatness
Clamp difficult problem；By the second fixed block and the first fixed block cooperation adjustment position, lens can be adjusted from three dimensions
Accurate coupling or collimation are realized in position, and are easy to control the bondline thickness of each link position in lesser range, keep away
Exempted from glue-line too it is thick be easy because temperature change or absorb wet steam cause lens position to deviate the problem of.
Detailed description of the invention
Fig. 1 is the application optical module structure schematic diagram；
Fig. 2 is 1 optical module structure schematic diagram of the embodiment of the present application；
Fig. 3 is 2 optical module structure schematic diagram of the embodiment of the present application；
Fig. 4 is 3 optical module structure schematic diagram of the embodiment of the present application；
Fig. 5 is optical module top view 1 shown in Fig. 4；
Fig. 6 is optical module top view 2 shown in Fig. 4
Fig. 7 is 4 optical module structure schematic diagram of the embodiment of the present application；
Fig. 8 is 5 optical module structure top view of the embodiment of the present application；
Fig. 9 is 6 optical module structure schematic diagram of the embodiment of the present application；
Figure 10 is 7 optical module structure top view of the embodiment of the present application；
Figure 11 is 8 optical module structure schematic diagram of the embodiment of the present application；
Figure 12 is 9 optical module structure schematic diagram of the embodiment of the present application.
Appended drawing reference: 10, substrate；11, small substrate；20, light emitting part；30, lens；40, the first fixed block；41, it connects
Face；42, adhesive surface；50, the second fixed block；51, light pass surface or light hole；60, optical waveguide；70, optoisolator；80, wavelength-division is multiple
Use device.
Specific embodiment
The application is described in detail below with reference to specific embodiment shown in the drawings.But these embodiments are simultaneously
The application is not limited, structure that those skilled in the art are made according to these embodiments, method or functionally
Transformation is all contained in the protection scope of the application.
In each diagram of the application, for the ease of illustration, structure or partial certain sizes can be relative to other knots
Structure or part are exaggerated, and therefore, are only used for the basic structure of the theme of diagram the application.
In addition, the representation space used herein such as "upper", " top ", "lower", " lower section " or xyz reference axis is with respect to position
The term set be for convenient for explanation purpose come describe as shown in the drawings a unit or feature relative to another list
The relationship of member or feature.The term of relative space position can be intended to include equipment in use or work in addition to side as shown in the figure
Different direction other than position.For example, being described as being located at other units or feature " lower section " if the equipment in figure overturn
Or " under " unit will be located at other units or feature " top ".Therefore, exemplary term " lower section " can include top and
Both orientation of lower section.Equipment can otherwise be directed (be rotated by 90 ° or other directions), and be interpreted accordingly herein
It is using with space correlation description language.When element or layer be referred to " connect in another component or layer "upper", with another component or layer
Connect " when, can directly on another component or layer, be connected to another component or layer, or may exist intermediary element
Or layer.
As shown in Figure 1, the optical module of the application includes substrate 10, and the light emitting part on substrate 10 is set to according to optical path
20, lens 30 and light receiving piece 60 further include the first fixed block 40 and the second fixed block 50 for fixing lens 30.Wherein,
Second fixed block, 50 gluing is on substrate 10, and 40 gluing of the first fixed block is in the side of the second fixed block 50；Lens 30 and first
Fixed block 40 connects, which is set in the optical path between above-mentioned light emitting part 20 and light receiving piece 60.Lens 30 with
Gap is all had between substrate 10 and between the first fixed block 40 and substrate 10, allows and passes through tune when assembling
The position of whole above-mentioned first fixed block 40 and the second fixed block 50 adjusts the positions of lens 30, and lens 30 is made to reach Best Coupling
Position or best collimation position and then fixed, the second fixed block 50 and substrate by the first fixed block 40 and the second fixed block 50
10 is fixed.
Above-mentioned second fixed block 50 includes the bottom surface connecting with substrate 10, and the side connecting with the first fixed block 40；
First fixed block 40 includes the joint face 41 connecting with lens 30, and the adhesive surface connecting with the side of the second fixed block 50
42.When assembling, lens 30 are adhesively fixed together with the first fixed block 40 in advance, and when bonding ensures that glue-line a thickness is sufficiently thin, and one
As can guarantee glue-line a thickness less than 20 μm, it might even be possible to it is ironed to less than 10 μm；Certainly, lens 30 and the first fixed block 40
Integrally formed structure can be used using the connection of the other ways such as welding or lens 30 and the first fixed block 40.Then again
Second fixed block 50 and the lens 30 for having bonded the first fixed block 40 are placed into the optical path of light emitting part 20, lens are adjusted
After 30 position, between the adhesive surface 42 of the first fixed block 40 and the side of the second fixed block 50 and the second fixed block
Dispensing between 50 bottom surface and substrate 10, and by glue-line b and glue-line c it is ironed to less than 20 μm thickness or thickness less than 10 μm
Degree, while opening ultraviolet light and solidifying glue at above-mentioned two.It increases and consolidates with the fixation in advance of lens 30 or integrally formed first
Determine block 40, convenient for adjusting the position of lens 30 when assembling by the first fixed block 40 of clamping, solves lens 30 because size is small
Or difficult problem is clamped or drawn caused by the cutting out-of-flatness of side；Because lens 30 are not necessarily to contact with substrate 10, also avoid
30 bottom of lens and problem that may be in uneven thickness because of bottom glue caused by cutting tilt angle when 10 viscose glue of substrate.Together
When, it, can be real from the position of three dimension adjustment lens 30 by the second fixed block 50 and the first fixed block 40 cooperation adjustment position
It now accurately couples or collimates, and be easy to control the bondline thickness of each link position in lesser range, avoid glue
Layer is too thick to be easy because of temperature change or absorbs the problem of wet steam causes lens position to deviate.
Embodiment 1
Specifically, embodiment 1 as shown in Figure 2, optical module includes light emitting end in the embodiment.The light emitting end includes
As the semiconductor laser of light emitting part 20, lens 30 and as the optical waveguide 60 of light receiving piece.Wherein, semiconductor laser
Device is fixed on substrate 10 by a small substrate 11, and lens 30 are installed on by above-mentioned first fixed block 40 and the second fixed block 50
On substrate 10, lens 30 are coupled lens here, can be big multiplying power globe lens or non-globe lens etc..It will partly be led by lens 30
The optical signal of body laser transmitting is coupled in optical waveguide 60.Above-mentioned optical waveguide 60 be also possible to optical integrated chip, optical fiber or its
It transmits the medium of optical signal.Here, substrate 10 can be a plane of encapsulating housing, be also possible to heat sink or other flat
Plate, such as TEC (Thermo Electric Cooler semiconductor cooler), heat-conducting metal.It is, of course, also possible in lens element
Increase other optical elements in optical path between optical waveguide, such as Wave division multiplexer/demultiplexer, optoisolator, polarization beam splitting element
Deng also belonging to the protection scope of the application.
In the embodiment, towards substrate 10, lens 30 are located under the first fixed block 40 joint face 41 of the first fixed block 40
Side；The adhesive surface 42 of first fixed block 40 is connected thereto face 41 vertically, is located at optical path by adhesive surface 42 and the second fixed block 50
On side bonding.Second fixed block 50 is located in the optical path after semiconductor laser and lens 30, the second fixed block 50
Side is additionally provided with light pass surface or light hole 51 in optical path, and the position with the first fixed block 40 bonding is in light pass surface or light passing
The top in hole 51；Second fixed block 50 can also use the transparent square of such as glass blocks or transparent panel, or its with light hole
Its square or vertical plate.After the optical signal of semiconductor laser is focused through lens 30, across the light passing of the second fixed block 50
Face or light hole 51, converge in optical waveguide 60.When assembling, semiconductor laser and optical waveguide 60 are first installed, then again will
Second fixed block 50 and the lens 30 for having bonded the first fixed block 40 in advance are placed between semiconductor laser and optical waveguide 60
Optical path in, the first fixed block 40 is drawn by fixture clamping or suction nozzle and adjusts lens 30 to Best Coupling position, will
The optical signal of semiconductor laser is maximally coupled in optical waveguide 60.Finally the adhesive surface 42 of the first fixed block 40 with
Between the side of second fixed block 50 and dispensing between the bottom surface and substrate 10 of the second fixed block 50, and by glue-line b and glue-line
C it is ironed to less than 20 μm thickness or thickness less than 10 μm, while opening ultraviolet light and solidifying glue at above-mentioned two.Here
It can also be substituted by other binders using ultraviolet glue as binder, belong to the range of the application protection.
Since the size of the first fixed block 40 and the second fixed block 50 can be made bigger, so each plane at viscose glue
Flatness can be made very well, thereby may be ensured that between lens 30 and the first fixed block 40, the first fixed block 40 and second
Bondline thickness between fixed block 50 and between the second fixed block 50 and substrate 10 is uniform and thin, and lens 30 not with base
Plate 10 contacts, may be because of bottom glue thickness caused by cutting tilt angle when avoiding 30 bottom of lens and 10 viscose glue of substrate
It is too thick easy because temperature change or absorption wet steam cause lens position to deviate also maximally to reduce glue-line for non-uniform problem
The problem of, effectively increase the stability and reliability of component and integral device.Matched by the second fixed block and the first fixed block
Adjustment position is closed, accurate coupling or collimation can be realized from the position of three dimension adjustment lens, improve component assembling effect
Rate.
Embodiment 2
Embodiment 2 as shown in Figure 3, optical module equally includes light emitting end in the embodiment, different from embodiment 1
It is that for the joint face 41 of the first fixed block 40 backwards to substrate 10, lens 30 are located at 40 top of the first fixed block in the embodiment；Second
The position of fixed block 50 and the first fixed block 40 bonding is in its light pass surface or the lower section of light hole 51, and other structures are and embodiment
1 is consistent.When assembling, need to clamp the first fixed block 40 from 40 both sides of the first fixed block below lens 30 using fixture,
It is equally adhesively fixed by the adhesive surface 42 of the first fixed block 40 and the side of the second fixed block 50, the first fixed block 40 is still not
Contacted with substrate 10, avoid glue-line too it is thick be easy because temperature change or absorb wet steam cause lens position to deviate the problem of.
Embodiment 3
Embodiment 3 as shown in Figure 4, unlike the first embodiment, the joint face of the first fixed block 40 in the embodiment
41 is vertical with substrate 10, and lens 30 are located at the side of the first fixed block 40.The bonding of first fixed block 40 and the second fixed block 50
Two kinds of bonding modes that can be as illustrated in Figures 5 and 6.
Such as the bonding mode of Fig. 5, the adhesive surface 42 of the first fixed block 40 is still connected thereto face 41 vertically, the second fixed block
50 and first the side that bonds of fixed block 40 and side where its light pass surface or light hole 51 in the same plane, be located at light passing
Face or the side of light hole 51.The position of the first fixed block 40 and the second fixed block 50 bonding is only shown on figure second
One side of 50 light pass surface of fixed block or light hole 51, it is of course also possible in light pass surface or another side of light hole 51,
When another side, only lens 30 and light pass surface or light hole 51 need to be kept in the optical signal of semiconductor laser
Optical path on.
Bonding mode as shown in FIG. 6, unlike bonding mode shown in fig. 5, in the bonding mode, first is fixed
The adhesive surface 42 of block 40 is connected thereto face 41 in the same plane, the second fixed block 50 and the first fixed block 40 bonding side with
Side where its light pass surface or light hole 51 is mutually perpendicular to, and the position that the second fixed block 50 and the first fixed block 40 bond is the
41 side of joint face that one fixed block 40 is connect with lens 30.
Embodiment 4
Embodiment 4 as shown in Figure 7, unlike the first embodiment, the second fixed block 50 is located at and partly leads in the embodiment
In optical path between body laser and lens 30, the optical signal of semiconductor laser passes through the light pass surface of the second fixed block 50
Or focused again through lens 30 after light hole 51, it converges in optical waveguide 60.
Likewise, second fixed block 50 can also be arranged in semiconductor laser in the structure of above-described embodiment 2 and 3
In optical path between lens 30.
Embodiment 5
Embodiment 5 as shown in Figure 8, unlike the various embodiments described above, the second fixed block 50 does not exist in the embodiment
In optical path, and it is provided at the side of the first fixed block 40.That is the adhesive surface 42 of the first fixed block 40 and the second fixed block 50 bonding
Positioned at side parallel with optical path and far from optical path.The joint face 41 of the first fixed block 40 and lens 30 that indicate in Fig. 8 is backwards
Substrate 10, lens 30 are located at the upper surface of first fixed block 40, and it is vertical that the adhesive surface 42 of the first fixed block 40 is then connected thereto face 41
And it is parallel with optical path.Second fixed block 50 is located at outside optical path, with the first fixed block 40 bonding side it is also parallel with optical path and
Perpendicular to substrate 10.Likewise, lens 30 can also be arranged in below the first fixed block 40, or with its 42 phase of adhesive surface
Pair another side.
Embodiment 6
Embodiment 6 as shown in Figure 9, as embodiment 5, the second fixed block 50 not in optical path, unlike, the reality
The second fixed block 50 in example is applied to be set to above as the optical waveguide 60 of light receiving piece.When assembling, first by semiconductor laser and light
The installation of waveguide 60 fixes, then the second fixed block 50 is placed into above optical waveguide 60, and will be fixed together in advance or one
Molding lens 30 and the first fixed block 40 are placed into the optical path between semiconductor laser and optical waveguide 60, solid by first
Determine block 40 to adjust lens 30 to Best Coupling position, the optical signal of semiconductor laser is maximally coupled to light wave
It leads in 60.Finally point between the first fixed block 40 and the second fixed block 50 and between the second fixed block 50 and optical waveguide 60
Glue, and by glue-line b, c be ironed to less than 20 μm of thickness, or the thickness less than 10 μm, while it is above-mentioned to open ultraviolet light solidification
Glue at two.After 30 position of lens can also first be adjusted, keep the position of the first fixed block 40 and lens 30 motionless, then
Second fixed block 50 is placed into above optical waveguide 60, the second fixed block 50 is fixed in optical waveguide 60 using glue, simultaneously
First fixed block 40 is fixed on the second fixed block 50, i.e., is consolidated the first fixed block 40 and lens 30 by the second fixed block 50
It sets.
Certainly, the second fixed block can also be bonded in the side of optical waveguide, as long as by adjusting the first fixed block and second
The position of fixed block, which can be realized, carries out three-dimensional position adjustment to lens.
Embodiment 7
Embodiment 7 as shown in Figure 10, as different from Example 6, the second fixed block 50 is set to conduct in the embodiment
Light is emitted the semiconductor laser side side of part 20, is located above small substrate 11.Its assembling process is close with embodiment 6, different
It is that the second fixed block 50 is bonded on small substrate 11, rather than is bonded in optical waveguide 60, which is not described herein again.Certainly, class
As, small 11 side of substrate can also be bonded to.
Embodiment 8
Embodiment 8 as shown in figure 11, unlike the first embodiment, in the embodiment, the second fixed block 40 is below
One optoisolator 70 being fixedly mounted, optoisolator 70 are located in optical path, and the second fixed block 50 is located at not in optical path
70 top of optoisolator.When assembling, first the installation of semiconductor laser, optoisolator 70 and optical waveguide 60 is fixed, and by light
Glue-line d between isolator 70 and substrate 10 is ironed to less than 20 μm or the thickness less than 10 μm, and is cured.Then by second
Fixed block 50 is placed into the top of optoisolator 70, and will be fixed together in advance or integrally formed lens 30 and the first fixed block
40 are placed into the optical path between semiconductor laser and optoisolator 70, by the first fixed block 40 by lens 30 adjust to
Best Coupling position, the optical signal of semiconductor laser is maximally coupled in optical waveguide 60.It is finally solid first
Determine between block 40 and the second fixed block 50 and dispensing between the second fixed block 50 and optoisolator 70, and glue-line b, c is ironed
To less than 20 μm of thickness, or the thickness less than 10 μm, while opening ultraviolet light and solidifying glue at above-mentioned two.In optical path
In increase optoisolator 70, can isolate reversed return light, avoid return light enter semiconductor laser influence device
Stability, and the second fixed block 50 is placed in the top of optoisolator 70, can effectively reduce the length of device.In addition, optical isolation
The position of device 70 can install fixation in advance, especially suitable for multichannel light emitting end.
Likewise, optoisolator 70 can also be placed in the optical path between semiconductor laser and lens 30.
It is of course also possible to the light pass surface or light hole 51 of the second fixed block 50 of the optical module shown in above-described embodiment 1-4
It is upper directly to increase optoisolator, the length and height of device can be further decreased, is conducive to realize compact package.
Above-mentioned optoisolator 70 can also change the one of which such as polarizing component, beam splitter or optical filter into.
Embodiment 9
Embodiment 9 as shown in figure 12, unlike the various embodiments described above, the optical module in the embodiment further includes wave
The combination of the one or more of them such as division multiplexer 80, beam shaping element or optical path adjustment element, is set to after lens 30
Optical path on.Here lens 30 are collimation lens, when installation, need to adjust lens 30 to best collimation position, make lens
The optical signal of 30 noise spectra of semiconductor lasers transmitting is collimated, and the optical signal after collimation is whole through above-mentioned wavelength division multiplexer 80, light beam
Shape element or optical path adjustment element etc. be again incident in optical waveguide 60 after shaping.In the embodiment, the second fixed block
It can be bonded in the upper surface of optical elements such as above-mentioned wavelength division multiplexer 80, beam shaping element or optical path adjustment element or side,
Also belong to the protection scope of the application.
Similar, the optical module in the various embodiments described above can also be optical receiving end, including the light wave as light emitting part
It leads or optical fiber, lens and the optical detector as light receiving piece.Wherein optical waveguide or optical fiber can also be other for inputting
The element of optical signal, optical signal are focused on optical detector after optical waveguide or optical fiber input by Lens Coupling.Wherein, light-receiving
Part is also possible to optical integrated chip etc..Likewise, also can be set between lens and light receiving piece such as Wave decomposing multiplexer, light
The combination of the one or more of them such as beam shaping element or optical path adjustment element carries out shaping to optical path.
The series of detailed descriptions listed above only for the application feasible embodiment specifically
Bright, they are not the protection scope to limit the application, all without departing from equivalent implementations made by the application skill spirit
Or change should be included within the scope of protection of this application.
Claims (12)
1. a kind of optical module, including substrate, and the light emitting part, lens and the light-receiving that are set to according to optical path on the substrate
Part, it is characterised in that: further include the first fixed block and the second fixed block for fixing the lens；
The second fixed block gluing is on the substrate；
The first fixed block gluing is in the side of second fixed block；
The lens are connect with first fixed block, and the lens are set to the light between the light emitting part and light receiving piece
On the road；
Gap is all had between the lens and the substrate and between first fixed block and the substrate.
2. optical module according to claim 1, it is characterised in that: the lens and first fixed block are connected using glue
It connects, the bondline thickness between the lens and first fixed block is less than or equal to 20 microns.
3. optical module according to claim 1, it is characterised in that: the lens are integrally formed with first fixed block
Structure.
4. optical module according to claim 1, it is characterised in that: first fixed block and second fixed block it
Between and second fixed block and the substrate between be all made of glue bonding；First fixed block is solid with described second
It is respectively less than or micro- equal to 20 to determine the thickness of the glue-line between the glue-line and second fixed block and the substrate between block
Rice.
5. optical module according to claim 1, it is characterised in that: second fixed block further includes logical in optical path
Smooth surface or light hole；
The lens are between the light emitting part and second fixed block；Alternatively, second fixed block is positioned at described
Between light emitting part and the lens.
6. optical module according to claim 5, it is characterised in that: the light pass surface or light hole be equipped with optoisolator,
The one of which of polarizing component, beam splitter or optical filter.
7. optical module according to claim 1, it is characterised in that: the optical module further includes optical element, the optics
Element is installed on the substrate；The second fixed block gluing is installed on the optical element by the optical element
In on the substrate.
8. optical module according to claim 7, it is characterised in that: the optical element includes isolator, polarizing component, divides
The one of which or Wave division multiplexer/demultiplexer of optical element or optical filter, beam shaping element or optical path adjustment element its
In one or more combination.
9. optical module according to claim 1, it is characterised in that: second fixed block is bonded in the light receiving piece
Above or side.
10. optical module according to claim 1, it is characterised in that: second fixed block is bonded in the light emitting part
The upper surface of or side.
11. -10 described in any item optical modules according to claim 1, it is characterised in that: the light emitting part is semiconductor laser
Device；The light receiving piece is optical waveguide, the one of which of optical integrated chip or optical fiber；The light of the semiconductor laser is believed
Number through being incident in the optical waveguide, optical integrated chip or optical fiber after the lens.
12. -10 described in any item optical modules according to claim 1, it is characterised in that: the light emitting part is optical waveguide or light
It is fine；The light receiving piece is optical detector；The optical signal of the optical waveguide, optical integrated chip or optical fiber output through the lens it
It is received afterwards by the optical detector.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920075310.8U CN209356715U (en) | 2019-01-17 | 2019-01-17 | A kind of optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920075310.8U CN209356715U (en) | 2019-01-17 | 2019-01-17 | A kind of optical module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209356715U true CN209356715U (en) | 2019-09-06 |
Family
ID=67801982
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920075310.8U Active CN209356715U (en) | 2019-01-17 | 2019-01-17 | A kind of optical module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209356715U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111679382A (en) * | 2020-07-28 | 2020-09-18 | 长飞光纤光缆股份有限公司 | Single lens coupling method and light emitter |
| CN111965770A (en) * | 2020-09-25 | 2020-11-20 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| US11256047B2 (en) | 2019-11-27 | 2022-02-22 | Innolight Technology (Suzhou) Ltd. | Optical assembly |
| CN116148993A (en) * | 2023-04-21 | 2023-05-23 | 武汉钧恒科技有限公司 | Silicon optical module |
-
2019
- 2019-01-17 CN CN201920075310.8U patent/CN209356715U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11256047B2 (en) | 2019-11-27 | 2022-02-22 | Innolight Technology (Suzhou) Ltd. | Optical assembly |
| CN111679382A (en) * | 2020-07-28 | 2020-09-18 | 长飞光纤光缆股份有限公司 | Single lens coupling method and light emitter |
| CN111965770A (en) * | 2020-09-25 | 2020-11-20 | 青岛海信宽带多媒体技术有限公司 | Optical module |
| CN116148993A (en) * | 2023-04-21 | 2023-05-23 | 武汉钧恒科技有限公司 | Silicon optical module |
| CN116148993B (en) * | 2023-04-21 | 2023-08-04 | 武汉钧恒科技有限公司 | Silicon optical module |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209356715U (en) | A kind of optical module | |
| CN109613655A (en) | A kind of optical module and its manufacturing method | |
| US9829638B2 (en) | Multichannel optical transmitter and method of aligning components in the same | |
| CN210605074U (en) | Optical assembly | |
| US10735101B2 (en) | Method for manufacturing an optical communication device | |
| WO2015096782A1 (en) | Light steering for silicon photonic devices | |
| CN105388571B (en) | Optical transmitter module with multiple signal paths | |
| JP2006512612A (en) | Assembly, contact and coupling interconnections for optoelectronic devices | |
| US11307376B2 (en) | Optical module | |
| US11733467B2 (en) | Optical module and method of producing the same | |
| CN104516070A (en) | High-reliability non-airtight packaged parallel transceiving component | |
| CN208283580U (en) | Mirror lens, laser emitter, light emission component and light emitting receiving unit | |
| CN204314514U (en) | The parallel transmitting-receiving subassembly of high reliability non-hermetically sealed encapsulation | |
| JP2004006879A (en) | Collimation method of optical module | |
| WO2019208053A1 (en) | Optical module, optical wiring board, and production method for optical module | |
| JP2001094191A (en) | Optical semiconductor module and manufacturing method therefor | |
| KR100480284B1 (en) | Method for aligning optical axis with optical module | |
| WO2021157454A1 (en) | Optical device and optical component | |
| CN116088105A (en) | Optical module | |
| Lee et al. | Low-cost and highly manufacturable 10Gb/s mini-flat transmitter for ethernet applications | |
| CN116088106A (en) | Optical module | |
| CN115524810A (en) | Single-fiber bidirectional module and single-fiber bidirectional coaxial packaging device | |
| CN116088091A (en) | Optical module | |
| CN116088107A (en) | Optical socket and optical module |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220125 Address after: 25 Singapore International Business Park, German Center, 03-60b (609916) Patentee after: Xuchuang Technology Co.,Ltd. Address before: 215000 No.8 Xiasheng Road, Suzhou Industrial Park, Jiangsu Province Patentee before: InnoLight Technology (Suzhou) Ltd. |