CN209344065U - A kind of power semiconductor modular to be prolonged the service life using cooling technology - Google Patents
A kind of power semiconductor modular to be prolonged the service life using cooling technology Download PDFInfo
- Publication number
- CN209344065U CN209344065U CN201920112032.9U CN201920112032U CN209344065U CN 209344065 U CN209344065 U CN 209344065U CN 201920112032 U CN201920112032 U CN 201920112032U CN 209344065 U CN209344065 U CN 209344065U
- Authority
- CN
- China
- Prior art keywords
- power semiconductor
- semiconductor modular
- cooling
- service life
- radiating component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a kind of power semiconductor modulars to be prolonged the service life using cooling technology, affiliated power inverter technical field, including power semiconductor modular, power semiconductor modular lower end is equipped with and the mutually movable wind cooling radiating component touched of power semiconductor modular, power semiconductor modular periphery is equipped with the liquid-cooling heat radiation body to fit with wind cooling radiating component, condenser pipe is equipped between liquid-cooling heat radiation body and power semiconductor modular, it condenses pipe port and is equipped with circulating pump, the control cabinet being connected to circulating pump circuitry phase is equipped on the outside of wind cooling radiating component, power semiconductor modular upper end is equipped with the temperature inductor being connected to control cabinet circuitry phase.Have the characteristics that compact-sized, intensity is high, cooling degree uniformly, it is rapid heat dissipation, high reliablity, long service life, energy-saving and easy to use.Service life is extended, product quality is improved.
Description
Technical field
The utility model relates to power inverter technical fields, and in particular to a kind of extended using cooling technology uses the longevity
The power semiconductor modular of life.
Background technique
Power semiconductor modular is exactly by the assembly of certain function, mode, and power semiconductor modular is great-power electronic
Encapsulating is integral again by certain function combination for electrical device.Power semiconductor modular can be real according to the difference of the component of encapsulation
Existing different function, power semiconductor modular adapted wind-cooling heat dissipating can make air cooling module, and adapted water-cooling can make water cooling module etc..
Semi-conductor power module has the types such as witch mirror, MOS-FET diode, Seris tower.These materials need insulation system, can make
With multiple materials such as semiconductor chip, insulating materials, heat sink, copper electrode and aluminium wires.Due to the coefficient of thermal expansion of these materials
Difference, joint portion is by thermal pressure.If long-time use, it can be damaged because of the damage of accumulation.Due to increasing thermal pressure
The difference of time shaft, life pattern are divided into two kinds of cycle lie of energy circulation service life and service.
Since transient temperature changes, it is that energy follows that the aluminum steel that the solder under semiconductor chip is connected with electrode, which is damaged,
The ring service life.On the other hand, the comparison temperature period is longer, and the solder of insulating substrate and heat liberation board, thermal stress makes the seeervice cycle
The lost of life.
Summary of the invention
The utility model mainly solves to exist in the prior art that structure is complicated, poor reliability, inconvenient to use and heat dissipation effect
The deficiency of fruit difference provides a kind of power semiconductor modular to prolong the service life using cooling technology, compact-sized, intensity
High, cooling degree uniformly, rapid heat dissipation, high reliablity, long service life, energy-saving and easy to use feature.Extending makes
With the service life, product quality is improved.
Above technical problems of the utility model are mainly solved by the following technical scheme:
A kind of power semiconductor modular to be prolonged the service life using cooling technology, including power semiconductor modular, it is described
Power semiconductor modular lower end be equipped with and the mutually movable wind cooling radiating component touched of power semiconductor modular, the power
Semiconductor module periphery is equipped with the liquid-cooling heat radiation body to fit with wind cooling radiating component, and the liquid-cooling heat radiation body is partly led with power
Condenser pipe is equipped between module, the condensation pipe port is equipped with circulating pump, is equipped with and follows on the outside of the wind cooling radiating component
Ring pumps the control cabinet of circuitry phase connection, and the power semiconductor modular upper end is equipped with the temperature sense being connected to control cabinet circuitry phase
Answer device.The power semiconductor modular includes power semiconductor, and the power semiconductor lower end is equipped with and wind-cooling heat dissipating group
The insulating base that part is halved together is equipped in the insulating base several with the mutually movable mercury touched of wind cooling radiating component
Pipe.
Preferably, the wind cooling radiating component includes heat radiation rack, the heat radiation rack side is equipped with blower, described
Equipped with several cooling fins with the perpendicular formula grafting of blower in heat radiation rack.Cooling fin improves heat dissipation ventilation, accelerates air velocity,
Improving radiating effect.
Preferably, the mercury column tube includes tube body, the tube body port is equipped with and tube body phase movable sealing
The piston boit of socket is equipped with mercury between the piston boit and tube body.
Preferably, the piston boit with wind cooling radiating component is mutually movable touches.According to temperature rise situation, rationally dissipate
Heat avoids invalid waste of energy.
Preferably, the condenser pipe is " U "-shaped.Film-cooled heat is added, heat dissipation effect is improved.
=the utility model can reach following effect:
The utility model provides a kind of power semiconductor modular to prolong the service life using cooling technology, with existing skill
Art compares, have compact-sized, intensity is high, cooling degree uniformly, it is rapid heat dissipation, high reliablity, long service life, energy-saving
With feature easy to use.Service life is extended, product quality is improved.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model.
Fig. 2 is the mounting structure schematic diagram of the power semiconductor modular and wind cooling radiating component in the utility model.
Fig. 3 is the structural schematic diagram of the wind cooling radiating component in the utility model.
Fig. 4 is the structure sectional view of the mercury column tube in the utility model.
In figure: control cabinet 1, liquid-cooling heat radiation body 2, temperature inductor 3, power semiconductor modular 4, condenser pipe 5, wind-cooling heat dissipating
Component 6, circulating pump 7, power semiconductor 8, insulating base 9, mercury column tube 10, blower 11, heat radiation rack 12, cooling fin 13, tube body
14, mercury 15, piston boit 16.
Specific embodiment
Below with reference to the embodiments and with reference to the accompanying drawing the technical solutions of the present invention will be further described.
Embodiment: as shown in Figure 1, Figure 2, Figure 3 and Figure 4, a kind of power to be prolonged the service life using cooling technology is partly led
Module, including power semiconductor modular 4,4 lower end of power semiconductor modular are equipped with and the mutually movable touching of power semiconductor modular 4
The wind cooling radiating component 6 connect, wind cooling radiating component 6 include heat radiation rack 12, and 12 side of heat radiation rack is equipped with blower 11, in heat radiation rack 12
Cooling fin 13 equipped with 15 pieces with the perpendicular formula grafting of blower 11.4 periphery of power semiconductor modular is equipped with and wind cooling radiating component 6
The liquid-cooling heat radiation body 2 to fit, is equipped with condenser pipe 5 between liquid-cooling heat radiation body 2 and power semiconductor modular 4, condenser pipe 5 is " U "-shaped.
5 port of condenser pipe is equipped with circulating pump 7, is equipped with the control cabinet 1 being connected to 7 circuitry phase of circulating pump, power on the outside of wind cooling radiating component 6
4 upper end of semiconductor module is equipped with the temperature inductor 3 being connected to 1 circuitry phase of control cabinet.Control cabinet 1 respectively with temperature inductor 3,
Blower 11 is connected to 7 circuitry phase of circulating pump.
Power semiconductor modular 4 includes power semiconductor 8, and 8 lower end of power semiconductor is equipped with mutually embedding with wind cooling radiating component 6
The insulating base 9 connect, insulating base 9 is interior to be equipped with 16 groups and the mutually movable mercury column tube 10 touched of wind cooling radiating component 6.Mercury
Column tube 10 includes tube body 14, and 14 port of tube body is equipped with the piston boit 16 that be socketed with 14 phase movable sealing of tube body, piston boit 16 and
Wind cooling radiating component 6 is mutually movable to be touched.Mercury 15 is equipped between piston boit 16 and tube body 14.
When power semiconductor 8 is run, when temperature heats up, mercury 15 expands, so that piston boit 16 and wind cooling radiating component 6
After touching.It drives blower 11 to start, wind cooling temperature lowering is carried out to power semiconductor 8.When wind cooling temperature lowering, 3 temperature of temperature inductor
It is excessively high when reaching 40~50 degree.At this point, 1 control loop of control cabinet pump, 7 starting, carries out fastly power semiconductor 8 using condenser pipe 5
The liquid flow-type cooling of speed.Medium in condenser pipe 5 is water.
In conclusion the power semiconductor modular for using cooling technology to prolong the service life, has compact-sized, intensity
High, cooling degree uniformly, rapid heat dissipation, high reliablity, long service life, energy-saving and easy to use feature.Extending makes
With the service life, product quality is improved.
It is obvious to a person skilled in the art that the utility model is not limited to the details of above-mentioned example embodiment, and
Without departing substantially from the essential characteristic of utility model, the utility model can be realized in other specific forms.Therefore nothing
By from the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, the scope of the utility model by
Appended claims rather than above description limit, it is intended that will fall within the meaning and scope of the equivalent elements of the claims
All changes be embraced therein.It should not treat any reference in the claims as limiting related power
Benefit requires.
In short, the foregoing is merely specific embodiment of the utility model, but the structure feature of the utility model not office
It is limited to this, in the field of the utility model, made changes or modifications all cover in this reality any those skilled in the art
Among novel the scope of the patents.
Claims (5)
1. a kind of power semiconductor modular to be prolonged the service life using cooling technology, it is characterised in that: including power semiconductor
Module (4), the power semiconductor modular (4) lower end be equipped with power semiconductor modular (4) it is mutually movable touch it is air-cooled
Radiating subassembly (6), the power semiconductor modular (4) periphery are equipped with the liquid-cooling heat radiation to fit with wind cooling radiating component (6)
Body (2) is equipped with condenser pipe (5) between the liquid-cooling heat radiation body (2) and power semiconductor modular (4), the condenser pipe (5) end
Mouth is equipped with circulating pump (7), and the control cabinet being connected to circulating pump (7) circuitry phase is equipped on the outside of the wind cooling radiating component (6)
(1), the power semiconductor modular (4) upper end is equipped with the temperature inductor (3) being connected to control cabinet (1) circuitry phase；It is described
Power semiconductor modular (4) include power semiconductor (8), the power semiconductor (8) lower end is equipped with and wind-cooling heat dissipating group
The insulating base (9) that part (6) is halved together, the insulating base (9) are interior equipped with several mutually movable with wind cooling radiating component (6)
The mercury column tube (10) touched.
2. a kind of power semiconductor modular to be prolonged the service life using cooling technology according to claim 1, feature
Be: the wind cooling radiating component (6) includes heat radiation rack (12), and the heat radiation rack (12) side is equipped with blower (11), institute
Equipped with several cooling fins (13) with blower (11) perpendicular formula grafting in the heat radiation rack (12) stated.
3. a kind of power semiconductor modular to be prolonged the service life using cooling technology according to claim 1, feature
Be: the mercury column tube (10) includes tube body (14), and the tube body (14) port is equipped with mutually movable with tube body (14)
The piston boit (16) for sealing socket is equipped with mercury (15) between the piston boit (16) and tube body (14).
4. a kind of power semiconductor modular to be prolonged the service life using cooling technology according to claim 3, feature
Be: the piston boit (16) with wind cooling radiating component (6) is mutually movable touches.
5. a kind of power semiconductor modular to be prolonged the service life using cooling technology according to claim 1, feature
Be: the condenser pipe (5) is " U "-shaped.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920112032.9U CN209344065U (en) | 2019-01-23 | 2019-01-23 | A kind of power semiconductor modular to be prolonged the service life using cooling technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920112032.9U CN209344065U (en) | 2019-01-23 | 2019-01-23 | A kind of power semiconductor modular to be prolonged the service life using cooling technology |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209344065U true CN209344065U (en) | 2019-09-03 |
Family
ID=67762039
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920112032.9U Active CN209344065U (en) | 2019-01-23 | 2019-01-23 | A kind of power semiconductor modular to be prolonged the service life using cooling technology |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209344065U (en) |
-
2019
- 2019-01-23 CN CN201920112032.9U patent/CN209344065U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN105932539B (en) | Has the air-cooled type laser aid of the conducting-heat elements with radiating fin | |
| US20230328936A1 (en) | Power converter, heat exchanger, heat sink, and photovoltaic power generation system | |
| CN209344065U (en) | A kind of power semiconductor modular to be prolonged the service life using cooling technology | |
| CN209861243U (en) | Novel heat dissipation circuit board | |
| CN217606336U (en) | Water-cooling heat dissipation base | |
| CN109979896B (en) | Brand-new IGBT module | |
| CN217086321U (en) | Energy-saving transformer | |
| CN201119247Y (en) | Liquid cooling auxiliary heat radiation device | |
| CN213459724U (en) | High heat dissipating EPS power module | |
| CN215807953U (en) | High-power integrated LED lamp | |
| CN211650663U (en) | Electric control assembly and air conditioner | |
| CN211090376U (en) | Cooling system and air conditioner | |
| CN112013289A (en) | High-efficient heat dissipation type LED lamp | |
| CN209298102U (en) | A kind of igbt chip Water-cooling circulating type radiator | |
| CN108224123B (en) | High-efficient heat dissipation type LED lamp | |
| CN209449127U (en) | A kind of high frequency electric source radiator | |
| CN216670331U (en) | Quick radiator of optical module | |
| CN210984463U (en) | Transformer with efficient heat dissipation function | |
| CN216086457U (en) | High-efficient heat dissipation converter | |
| CN211630069U (en) | High-voltage frequency converter with high-efficient heat dissipation function | |
| CN110299443B (en) | COB (chip on board) packaging-based high-power L ED (electronic device) heat dissipation device | |
| CN2500014Y (en) | Self cooling type thyrister cut-in and cut-off capacitor device | |
| CN213304106U (en) | High-heat-dissipation integrated circuit board structure | |
| CN216307733U (en) | Heat radiation assembly for light emitting diode | |
| CN213755497U (en) | Air-cooling and water-cooling integrated radiator |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |