CN209327738U - Backlight and display - Google Patents
Backlight and display Download PDFInfo
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- CN209327738U CN209327738U CN201822132979.4U CN201822132979U CN209327738U CN 209327738 U CN209327738 U CN 209327738U CN 201822132979 U CN201822132979 U CN 201822132979U CN 209327738 U CN209327738 U CN 209327738U
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- electrode
- weld pad
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- led chip
- light led
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Abstract
The utility model is suitable for field of display technology, provides a kind of backlight and display.Backlight provided by the utility model includes multiple first LED chips, first LED chip includes substrate, interval is set to red-light LED chip and green light LED chip on substrate, upper surface of base plate has spaced first weld pad, intermediate weld pad and the second weld pad, red-light LED chip includes red emitting luminophores and the first electrode and second electrode that connect with red emitting luminophores, first electrode and second electrode are separately positioned on the first weld pad and intermediate weld pad, green light LED chip includes green luminescence body and the third electrode and the 4th electrode that connect with green luminescence body, third electrode and the 4th electrode are separately positioned on intermediate weld pad and the second weld pad, it can be realized a LED chip and issue feux rouges and green light, while realizing the display of superelevation colour gamut, reduce cost of manufacture, and processing procedure is simple, It being capable of preferably control product quality.
Description
Technical field
The utility model belongs to field of display technology, in particular to a kind of backlight and display.
Background technique
All display class products such as mobile phone, plate, display, TV, people are to the most direct experience sense of product by being exactly
Its display effect.In recent years, superelevation colour gamut demand was increasingly pursued by user, and the display product one of high colour gamut in the market
As can use technology of quantum dots or OLED (Organic Light-Emitting Diode, Organic Light Emitting Diode) technology,
Wherein technology of quantum dots has price lower relative to OLED technology, the more outstanding advantage of use reliability, but both the above
Quality more difficult control when cost is relatively high or bulk production.
Summary of the invention
The purpose of this utility model is to provide a kind of backlights, it is intended to solve high colour gamut display technology technology at high cost
Problem.
The utility model is realized in this way provide a kind of backlight, including multiple first LED chips and for described
The optical module that the light that first LED chip issues is homogenized, first LED chip include:
Substrate, the upper surface of base plate have spaced first weld pad, intermediate weld pad and the second weld pad；
Red-light LED chip, including red emitting luminophores and the first electrode and second electrode that are connect with the red emitting luminophores,
The first electrode and the second electrode interval are arranged, and the first electrode and the second electrode are separately connected described the
One weld pad and the intermediate weld pad；
Green light LED chip, including green luminescence body and the third electrode and the 4th electrode that are connect with the green luminescence body,
The third electrode and the 4th electrode gap are arranged, and the third electrode and the 4th electrode are separately connected in described
Between on weld pad and second weld pad；The red-light LED chip and the green light LED wafer tandem or parallel connection；
Encapsulated layer is set on the substrate and covers the red-light LED chip and the green light LED chip；
The base lower surface has spaced first pin and second pin, and first pin is correspondingly arranged at institute
State below the first weld pad and be electrically connected with first weld pad, the second pin be correspondingly arranged at below second weld pad and
It is electrically connected with second weld pad.
In one embodiment, first weld pad, the intermediate weld pad and second weld pad are arranged in line-styled
Column, first weld pad and second weld pad are set to the both ends of the substrate, and the intermediate weld pad is set to first weld pad
Between second weld pad.
In one embodiment, the substrate two sides are respectively provided with the first connector and the second connector, and described first draws
Foot is electrically connected by the first connector and first weld pad, and the second pin passes through the second connector and second weldering
Pad is electrically connected.
In one embodiment, first weld pad, first connector and first pin are integrally formed, institute
The second weld pad, second connector and the second pin is stated to be integrally formed.
In one embodiment, the red-light LED chip and the green light LED wafer tandem, the first electrode and institute
Third electrode is stated as anode, the second electrode and the 4th electrode are cathode, and first pin connects positive pole, the
Two pins connect power cathode.
In one embodiment, the base lower surface also has between first pin and the second pin
Third pin, the third pin is correspondingly arranged at below the intermediate weld pad and is electrically connected with the intermediate weld pad.
In one embodiment, the substrate side surfaces also have third connector, and the intermediate weld pad passes through the third
Connector and the third pin are electrically connected, the intermediate weld pad, the third connector and third pin one
Molding.
In one embodiment, the red-light LED chip is in parallel with the green light LED chip, the first electrode and institute
The 4th electrode is stated as anode, the second electrode and the third electrode are cathode, first pin and the second pin
Positive pole is connected, the third pin connects power cathode.
In one embodiment, the red-light LED chip is in parallel with the green light LED chip, the first electrode and institute
Stating the 4th electrode is cathode, and the second electrode and the third electrode are anode, first pin and the second pin
Power cathode is connected, the third pin connects positive pole.
The another object of the utility model is to provide a kind of display, including backlight as described above and display surface
Plate.
Backlight provided by the utility model includes multiple first LED chips and the light for issuing to the first LED chip
The optical module homogenized, the first LED chip include the red-light LED chip and green light of substrate, interval on substrate
LED wafer, upper surface of base plate include with spaced first weld pad, intermediate weld pad and the second weld pad, red-light LED chip
Red emitting luminophores and the first electrode and second electrode connecting with red emitting luminophores, first electrode and second electrode are respectively set
On the first weld pad and intermediate weld pad, green light LED chip includes green luminescence body and the third connecting with green luminescence body electricity
Pole and the 4th electrode, third electrode and the 4th electrode are separately positioned on intermediate weld pad and the second weld pad, can be realized one
A first LED chip issues feux rouges and green light, while realizing the display of superelevation colour gamut, reduces cost of manufacture, and processing procedure letter
It is single, it being capable of preferably control product quality.
Detailed description of the invention
Fig. 1 is the overlooking structure diagram of the first LED chip provided by the embodiment of the utility model；
Fig. 2 is the overlooking structure diagram of substrate provided by the embodiment of the utility model；
Fig. 3 is the present invention looks up structural representation of substrate provided by the embodiment of the utility model；
Fig. 4 is the schematic cross-section of the first LED chip provided by the embodiment of the utility model.
Meaning marked in the figure are as follows: 10- substrate, the first weld pad of 11-, the first connector of 12-, the first pin of 13-, 14-
Two weld pads, the second connector of 15-, 16- second pin, the centre 17- weld pad, 18- third connector, 19- third pin, 21- are red
Light LED wafer, 211- red emitting luminophores, 212- first electrode, 213- second electrode, 22- green light LED chip, 221- green light hair
Body of light, 222- third electrode, the 4th electrode of 223-, 30- encapsulated layer.
Specific embodiment
In order to make the purpose of the utility model, technical solutions and advantages more clearly understood, below in conjunction with attached drawing and implementation
Example, the present invention will be further described in detail.It should be appreciated that specific embodiment described herein is only to explain this
Utility model is not used to limit the utility model.
It should be noted that when component is referred to as " being fixed on " or " being set to " another component, it can directly or
It connects on another component.When a component is known as " being connected to " another component, it be can be directly or indirectly
It is connected on another component.The orientation or positional relationship of the instructions such as term " on ", "lower", "left", "right" is based on attached drawing
Shown in orientation or positional relationship, be merely for convenience of describing, rather than the device or element of indication or suggestion meaning must have
There is specific orientation, be constructed and operated in a specific orientation, therefore should not be understood as the limitation to this patent.Term " first ",
" second " is used merely to facilitate description purpose, is not understood to indicate or imply relative importance or implicitly indicates technical characteristic
Quantity.The meaning of " plurality " is two or more, unless otherwise specifically defined.
In order to illustrate technical solution described in the utility model, carried out specifically below in conjunction with specific accompanying drawings and embodiments
It is bright.
The utility model provides a kind of backlight, including multiple first LED (Light referring to FIG. 1 to FIG. 4,
Emitting Diode, Organic Light Emitting Diode) optics that is homogenized of chip and the light for being issued to the first LED chip
Component, the first LED chip include:
Substrate 10,10 upper surface of substrate have spaced first weld pad 11, intermediate weld pad 17 and the second weld pad 14；
Red-light LED chip 21, including red emitting luminophores 211 and the first electrode being connect with red emitting luminophores 211 212 and
Two electrodes 213, first electrode 212 and the interval of second electrode 213 are arranged, and the setting of first electrode 212 is in the first weld pad 11, the second electricity
Pole 213 is arranged on intermediate weld pad 17, and first electrode 212 and second electrode 213 can be, but not limited to by welding
It is separately positioned on the first weld pad 11 and intermediate weld pad 17, to realize fixed and be electrically connected simultaneously；
Green light LED chip 22, including green luminescence body 221 and the third electrode 222 being connect with green luminescence body 221 and
Four electrodes 223, the setting of third electrode 222 are arranged on the second weld pad 14 in intermediate weld pad 17, the 4th electrode 223, third electrode
222 and the 4th electrode 223 can be, but not limited to be separately positioned on intermediate weld pad 17 and the second weld pad by welding
On 14, to realize fixed and be electrically connected simultaneously；22 serial or parallel connection of red-light LED chip 21 and green light LED chip；
Encapsulated layer 30 is set on substrate 10 and covers red-light LED chip 21 and green light LED chip 22；
10 lower surface of substrate has spaced first pin 13 and a second pin 16, and the first pin 13 is correspondingly arranged at the
It is electrically connected below one weld pad 11 and with the first weld pad 11, second pin 16 is correspondingly arranged at 14 lower section of the second weld pad and welds with second
Pad 14 is electrically connected.
Backlight provided by the embodiment of the utility model includes multiple first LED chips and is used to send out the first LED chip
The optical module that light out is homogenized, the first LED chip include that the red-light LED of substrate 10, interval on substrate 10 is brilliant
Piece 21 and green light LED chip 22,10 upper surface of substrate have spaced first weld pad 11, intermediate weld pad 17 and second
Weld pad 14, red-light LED chip 21 include red emitting luminophores 211 and the first electrode 212 connecting with red emitting luminophores 211 and second
Electrode 213, first electrode 212 and second electrode 213 are separately positioned on the first weld pad 11 and intermediate weld pad 17, green light
LED wafer 22 includes green luminescence body 221 and the third electrode 222 and the 4th electrode 223 that connect with green luminescence body 221, the
Three electrodes 222 and the 4th electrode 223 are separately positioned on intermediate weld pad 17 and the second weld pad 14, can be realized one first
LED chip issues feux rouges and green light, while realizing the display of superelevation colour gamut, reduces cost of manufacture, and processing procedure is simple, can
Preferably control product quality.
In one embodiment, in conjunction with Fig. 1 and Fig. 2, the first weld pad 11, intermediate weld pad 17 and the second weld pad 14 are in " one "
Font arrangement, the first weld pad 11 and the second weld pad 14 are set to the both ends of substrate 10, and intermediate weld pad 17 is set on the first weld pad 11 and the
Between two weld pads 14.Certainly, use according to the actual situation, the first weld pad 11, intermediate weld pad 17 can be in the second weld pad 14
Other arrangement modes, this does not influence the implementation of the utility model, and the present embodiment is herein with no restrictions.
In one embodiment, 10 two sides of substrate are respectively provided with the first connector 12 and the second connector 15, the first pin
13 are electrically connected by the first connector 12 and the first weld pad 11, and second pin 16 passes through the second connector 15 and the second weld pad 14
It is electrically connected.Optionally, the first weld pad 11, the first connector 12 and the first pin 13 are integrally formed, the second weld pad 14,
Second connector 15 and second pin 16 are integrally formed, and effectively simplify processing procedure, improve production efficiency.
In one embodiment, red-light LED chip 21 is connected with green light LED chip 22, first electrode 212 and third electrode
222 be anode, and second electrode 213 and the 4th electrode 223 are cathode, namely when the first pin 13 connects positive pole, second draws
When foot 16 connects power cathode, red-light LED chip 21 and green light LED chip 22 are in being connected in series, the first weld pad 11 and the at this time
Two weld pads 14, which are powered, to be connected, while lighting red-light LED chip 21 and green light LED chip 22, red-light LED chip 21 and green light LED
Chip 22 issues feux rouges and green light respectively, and superelevation colour gamut can be realized by the design of simple structure and show that cost is relatively low.
In one embodiment, 10 lower surface of substrate also has the third between the first pin 13 and second pin 16
Pin 19, third pin 19 are correspondingly arranged at intermediate 17 lower section of weld pad and are electrically connected with intermediate weld pad 17.Substrate also has third
Connector 18, intermediate weld pad 17 are electrically connected by third connector 18 and third pin 19, intermediate weld pad 17, third connector
18 and third pin 19 can be integrally formed, be conducive to simplify processing procedure, improve production efficiency.
Optionally, red-light LED chip 21 is in parallel with green light LED chip 22, and first electrode 212 and the 4th electrode are anode,
Second electrode 213 and third electrode 222 are that cathode namely the first pin and second pin connect positive pole, third pin 19
When connecting power cathode, red-light LED chip 21 is with green light LED chip 22 in being connected in parallel, and the first weld pad 11 is welded with intermediate at this time
Pad 17 is connected, and red-light LED chip 21 is lit；Second weld pad 14 is connected with intermediate weld pad 17, and green light LED chip 22 is lit,
Red-light LED chip 21 and green light LED chip 22 issue feux rouges and green light respectively, and superelevation can be realized by the design of simple structure
Colour gamut shows that cost is relatively low.Certainly, use according to the actual situation, first electrode 212 and the 4th electrode 223 can be cathode,
Second electrode 213 and third electrode 222 can be anode, and the first pin 13 and second pin 16 connect power cathode, and third is drawn
Foot 19 connects positive pole, can equally make red-light LED chip 21 in parallel with green light LED chip 22.
In one embodiment, backlight further includes multiple blue-light LED chips, since the first LED chip includes red-light LED
Chip and green light LED chip, therefore first LED chip can be simultaneously emitted by feux rouges and green light, feux rouges is mixed to form with green light
First LED chip collocation blue-light LED chip use can be obtained high colour gamut white light, to meet people by the higher yellow light of colour gamut
Demand that superelevation colour gamut is shown.
The another object of the utility model is to provide a kind of display, including backlight and display panel as above.
The foregoing is merely the alternative embodiments of the utility model, are not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (10)
1. a kind of backlight, which is characterized in that including multiple first LED chips and for issuing to first LED chip
The optical module that light is homogenized, first LED chip include:
Substrate, the upper surface of base plate have spaced first weld pad, intermediate weld pad and the second weld pad；
Red-light LED chip, it is described including red emitting luminophores and the first electrode and second electrode that are connect with the red emitting luminophores
First electrode and the second electrode interval are arranged, and the first electrode and the second electrode are separately connected first weldering
Pad and the intermediate weld pad；
Green light LED chip, it is described including green luminescence body and the third electrode and the 4th electrode that are connect with the green luminescence body
Third electrode and the 4th electrode gap are arranged, and the third electrode and the 4th electrode are separately connected the intermediate weldering
Pad and second weld pad；The red-light LED chip and the green light LED wafer tandem or parallel connection；
Encapsulated layer is set on the substrate and covers the red-light LED chip and the green light LED chip；
The base lower surface has spaced first pin and second pin, and first pin is correspondingly arranged at described the
Be electrically connected below one weld pad and with first weld pad, the second pin be correspondingly arranged at below second weld pad and with institute
State the electric connection of the second weld pad.
2. backlight as described in claim 1, which is characterized in that first weld pad, the intermediate weld pad and described
Two weld pads are arranged in line-styled, and first weld pad and second weld pad are set on the both ends of the substrate, the intermediate weldering
Pad is set between first weld pad and second weld pad.
3. backlight as described in claim 1, which is characterized in that the substrate two sides are respectively provided with the first connector and second
Connector, first pin are electrically connected by the first connector and first weld pad, and the second pin passes through second
Connector and second weld pad are electrically connected.
4. backlight as claimed in claim 3, which is characterized in that first weld pad, first connector and described
First pin is integrally formed, and second weld pad, second connector and the second pin are integrally formed.
5. such as the described in any item backlights of Claims 1-4, which is characterized in that the red-light LED chip and the green light
LED wafer series connection, the first electrode and the third electrode are anode, and the second electrode is negative with the 4th electrode
Pole, first pin connect positive pole, and second pin connects power cathode.
6. such as the described in any item backlights of Claims 1-4, which is characterized in that the base lower surface also has set on institute
State the third pin between the first pin and the second pin, the third pin be correspondingly arranged at below the intermediate weld pad and
It is electrically connected with the intermediate weld pad.
7. backlight as claimed in claim 6, which is characterized in that the substrate side surfaces also have a third connector, it is described in
Between weld pad be electrically connected by the third connector and the third pin, the intermediate weld pad, the third connector with
And the third pin is integrally formed.
8. backlight as claimed in claim 6, which is characterized in that the red-light LED chip and the green light LED chip are simultaneously
Connection, the first electrode and the 4th electrode are anode, and the second electrode and the third electrode are cathode, described first
Pin connects positive pole with the second pin, and the third pin connects power cathode.
9. backlight as claimed in claim 6, which is characterized in that the red-light LED chip and the green light LED chip are simultaneously
Joining, the first electrode and the 4th electrode are cathode, the second electrode and the third electrode to be positive, described first
Pin connects power cathode with the second pin, and the third pin connects positive pole.
10. a kind of display, which is characterized in that including backlight as described in any one of claim 1 to 9 and display panel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822132979.4U CN209327738U (en) | 2018-12-14 | 2018-12-14 | Backlight and display |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822132979.4U CN209327738U (en) | 2018-12-14 | 2018-12-14 | Backlight and display |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209327738U true CN209327738U (en) | 2019-08-30 |
Family
ID=67727396
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822132979.4U Active CN209327738U (en) | 2018-12-14 | 2018-12-14 | Backlight and display |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209327738U (en) |
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2018
- 2018-12-14 CN CN201822132979.4U patent/CN209327738U/en active Active
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