CN209297040U - A kind of laser speckle removing device based on the micro- mirror techniques of MEMS - Google Patents

A kind of laser speckle removing device based on the micro- mirror techniques of MEMS Download PDF

Info

Publication number
CN209297040U
CN209297040U CN201920045431.8U CN201920045431U CN209297040U CN 209297040 U CN209297040 U CN 209297040U CN 201920045431 U CN201920045431 U CN 201920045431U CN 209297040 U CN209297040 U CN 209297040U
Authority
CN
China
Prior art keywords
micro
laser
mems
axis
galvanometer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201920045431.8U
Other languages
Chinese (zh)
Inventor
金传广
杜先鹏
郭俊兴
代启强
周印伟
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Qingdao Xiaoyou Intelligent Technology Co Ltd
Original Assignee
Qingdao Xiaoyou Intelligent Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Qingdao Xiaoyou Intelligent Technology Co Ltd filed Critical Qingdao Xiaoyou Intelligent Technology Co Ltd
Priority to CN201920045431.8U priority Critical patent/CN209297040U/en
Application granted granted Critical
Publication of CN209297040U publication Critical patent/CN209297040U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Mechanical Optical Scanning Systems (AREA)

Abstract

The utility model discloses a kind of laser speckle removing devices based on the micro- mirror techniques of MEMS, semiconductor laser, laser shaping system, the micro- galvanometer of biaxial MEMS, feedback system and the driving control system of setting are sequentially distributed including shell and along optical path, the light beam that semiconductor laser generates externally is projected by passing through the micro- galvanometer of biaxial MEMS after laser shaping system shaping.The micro- galvanometer of biaxial MEMS eliminates laser speckle, and structure is simple, and does not require the wavelength of laser light source, and dissipation spot effect can be achieved in the laser of any wavelength;The X-axis of the micro- galvanometer of biaxial MEMS does scanning motion, the structure light of mode needed for obtaining, and structure optical mode is unlimited;The height that the Y-axis of the micro- galvanometer of biaxial MEMS does mirror normal direction is the high-frequency vibration of wavelength magnitude, vibration frequency is higher than the frequency of X-axis, Oscillation Amplitude is wavelength magnitude, the distribution of raster will not be impacted, the method for obtaining high light beam quality is realized, the modeling accuracy of scanning module is greatly improved.

Description

A kind of laser speckle removing device based on the micro- mirror techniques of MEMS
Technical field
The utility model relates to laser scanner technique fields, and in particular to a kind of laser based on the micro- mirror techniques of MEMS is scattered Spot cancellation element.
Background technique
The high brightness of laser and good beam quality become the light source in Projection Display advantageously, but laser is certainly The distinctive strong coherence of body, when it is irradiated to body surface, the roughness of body surface wavelength magnitude can make laser in space In interfere, the speckle of generation seriously restricts the practical application of laser throwing technology.If article surface vein depth and swash Optical wavelength is suitable, and speckle interference is more obvious.In a kind of currently used laser scanning imaging technology, using the micro- vibration of uniaxial MEMS Mirror and laser speckle attenuator eliminate laser speckle, structure is complicated, and the influence severe constraints of modeling accuracy high-precision The application of laser scanner technique.
Therefore, the prior art also requires further improvement and develops.
Utility model content
The purpose of this utility model is to provide for a kind of laser speckle removing device based on the micro- mirror techniques of MEMS, purport The complicated and speckle severe constraints application of high-precision laser scanning technique in prior art construction.
Used technical solution are as follows:
A kind of laser speckle removing device based on the micro- mirror techniques of MEMS, including shell and setting is sequentially distributed along optical path Semiconductor laser, laser shaping system, the micro- galvanometer of biaxial MEMS, feedback system and driving control system, semiconductor laser The light beam that device generates externally is projected by passing through the micro- galvanometer of biaxial MEMS after laser shaping system shaping.
The mirror surface of the micro- galvanometer of biaxial MEMS is X-axis and Y-axis dual-axis vibration.
X-axis resonance frequency is lower than Y-axis resonance frequency.
The working frequency of X-axis and Y-axis is stably and controllable.
Driving control system includes Laser Control System and the micro- galvanometer control system of MEMS, Laser Control System control The luminous intensity of laser and bright dark degree, the scanning and vibration of the micro- galvanometer control system control biaxial MEMS galvanometer of biaxial MEMS It is dynamic.
X-axis control mirror surface is scanned movement, and Y-axis controls mirror surface and carries out vertical mirror surface normal direction up-down vibration.
The utility model has the advantages that the utility model provides a kind of laser speckle removing device based on the micro- mirror techniques of MEMS, use The micro- galvanometer of biaxial MEMS eliminates laser speckle, and structure is simple, and does not have constraint requirements, any wavelength to the wavelength of laser light source Laser can be achieved dissipation spot effect;Scanning motion is done using the X-axis by the driving control system control micro- galvanometer of biaxial MEMS, The structure light of mode needed for obtaining, structure optical mode are unlimited;The Y-axis of the control micro- galvanometer of biaxial MEMS does the upper of mirror normal direction Lower amplitude is the high-frequency vibration of wavelength magnitude, which is much higher than the frequency of X-axis, and Oscillation Amplitude is wavelength magnitude, because This can't impact the distribution of raster, and creative realizes the method for obtaining high light beam quality, greatly mention The modeling accuracy of high scanning module.
Detailed description of the invention
Fig. 1 is the structure of the laser speckle removing device based on the micro- mirror techniques of MEMS in the utility model specific embodiment Schematic diagram.
Fig. 2 is the optical path of the laser speckle removing device based on the micro- mirror techniques of MEMS in the utility model specific embodiment System schematic.
Fig. 3 is the twin shaft of the laser speckle removing device based on the micro- mirror techniques of MEMS in the utility model specific embodiment The structural schematic diagram of the micro- galvanometer of MEMS.
Fig. 4 is the hot spot of the laser speckle removing device based on the micro- mirror techniques of MEMS in the utility model specific embodiment Contrast on effect schematic diagram.
Fig. 5 is the speckle of the laser speckle removing device based on the micro- mirror techniques of MEMS in the utility model specific embodiment Contrast schematic diagram.
Specific embodiment
To keep the purpose of this utility model, technical solution and advantage clearer, clear, develop simultaneously implementation referring to the drawings The utility model is further described in example.
As shown in Figure 1 and Figure 2, a kind of laser speckle removing device based on the micro- mirror techniques of MEMS, including 100 He of shell The micro- galvanometer 106 of semiconductor laser 102, laser shaping system 104, biaxial MEMS, the feedback system of setting are sequentially distributed along optical path System and driving control system, the light beam that semiconductor laser 102 generates, by passing through twin shaft after 104 shaping of laser shaping system The micro- galvanometer 106 of MEMS is externally projected.The device, which is compared, two o'clock innovation on general laser scanning die set, and first point There is no constraint requirements to the wavelength of laser light source, dissipation spot effect can be achieved in the laser of any wavelength.Second point be using by The X-axis of the drive system control micro- galvanometer 106 of biaxial MEMS does scanning motion, the structure light of mode needed for obtaining, structure optical mode It is unlimited;The Y-axis of the control micro- galvanometer 106 of biaxial MEMS does the high-frequency vibration that amplitude vertically is wavelength magnitude, vibration frequency Rate is much higher than the frequency of X-axis, therefore can't impact to the distribution of raster.
As shown in figure 3, the mirror surface of the micro- galvanometer 106 of biaxial MEMS is X-axis and Y-axis dual-axis vibration, mirror shape is wanted without fixation Ask, can for it is rectangular, be also round or other are able to satisfy the shape of the reflected beams size requirements.
X-axis resonance frequency is lower than Y-axis resonance frequency, and the resonance of Y-axis will not have an impact the resonance of X-axis, X-axis and Y-axis Working frequency it is stably and controllable.X-axis control mirror surface is scanned movement, and sweep waveform is unlimited;Y-axis controls mirror surface and carries out on vertical Lower vibration, by vibration frequency control amplitude, amplitude is wavelength magnitude.
Driving control system includes Laser Control System and the micro- galvanometer control system of MEMS, two driving control system associations With work, the parameters such as the light and shade, shape, density of scanning projection can control by corresponding relation.Laser Control System control Bright dark, the biaxial movement of micro- 106 control system of the galvanometer control biaxial MEMS galvanometer 106 of biaxial MEMS of semiconductor laser 102, The high-frequency vibration of wavelength magnitude is realized while carrying out conventional sweep.Laser light source and the micro- galvanometer of biaxial MEMS 106 are by driving Control system control, the mirror surface that laser light source passes through the arrival micro- galvanometer 106 of biaxial MEMS after 104 shaping of laser shaping system. Under the control of driving control system, the X-axis of the brightness and micro- galvanometer 106 of biaxial MEMS of semiconductor laser modulation 102 Vibrational state is cooperated, and coding grating structured light is externally scanned.The Y-axis of the micro- galvanometer 106 of biaxial MEMS is shaken by drive control System control carries out high-frequency vibration along perpendicular to mirror surface direction, and vibration frequency is more than or equal to the modulation frequency for swashing semiconductor light device Rate, Oscillation Amplitude are the wavelength magnitude of corresponding light source.
X-axis control mirror surface is scanned movement, and Y-axis controls mirror surface and carries out vertical mirror surface normal direction up-down vibration.
Specifically, the light beam that semiconductor laser 102 generates is micro- by passing through biaxial MEMS after the shaping of laser shaping system Galvanometer 106 externally projects;Driving control system controls galvanometer X-axis and semiconductor laser 102, does sinusoidal coding grating structured light Scanning;Driving control system controls Y-axis and carries out high-frequency, low amplitude vibrations;Light beam reflection, feedback system receive reflected light Beam, driving control system control the vibration frequency of the intensity of semiconductor laser 102, the X-axis of the micro- galvanometer 106 of biaxial MEMS and Y-axis Rate eliminates the structured light patterns that speckle influences required for obtaining.
The micro- galvanometer 106X axis of biaxial MEMS and semiconductor laser 102 are controlled by driving control system, does sinusoidal coding Optical grating construction optical scanning, the micro- galvanometer 106Y axis progress high-frequency of driving control system control biaxial MEMS, low amplitude vibrations, so that The laser being projected out while not changing original structure optical mode, the synchronous high frequency that generates of light path quickly changes, in same position Place is set, due to the high-frequency vibration of Y direction, the position for irradiating the light of each point on a surface of an is mutually also constantly changing, Then to as upper given any point, the amplitude random movement generated on object to the contributive region of this picture point is also constantly becoming Change, each contribution phase of this picture point is changed over time in a complex manner at this time.As time goes by, make any as in Speckle intensity on point changes over time.The intensity measured in time of integration T is the integral in multiple independent speckles. If producing the different speckle pattern of M width in time of integration T, according to the theory of Goodman, the contrast of speckle can drop It is low to beIt generates several and quickly changes laser phase, coherence is destroyed, so that projecting to swashing for receiving plane Light is smoother, without significantly relevant speckle bright spot, as shown in Figure 4, Figure 5.
It should be understood that the application of the utility model is not limited to above-mentioned citing, those of ordinary skill in the art are come It says, it can be modified or changed according to the above description, and all these modifications and variations all should belong to the appended power of the utility model The protection scope that benefit requires.

Claims (6)

1. a kind of laser speckle removing device based on the micro- mirror techniques of MEMS, which is characterized in that including shell and along optical path according to Semiconductor laser, laser shaping system, the micro- galvanometer of biaxial MEMS, feedback system and the driving control system of secondary distribution setting, The light beam that the semiconductor laser generates externally is thrown by passing through the micro- galvanometer of biaxial MEMS after laser shaping system shaping It penetrates.
2. the laser speckle removing device according to claim 1 based on the micro- mirror techniques of MEMS, which is characterized in that described The mirror surface of the micro- galvanometer of biaxial MEMS is X-axis and Y-axis dual-axis vibration.
3. the laser speckle removing device according to claim 2 based on the micro- mirror techniques of MEMS, which is characterized in that described X-axis resonance frequency is lower than Y-axis resonance frequency.
4. the laser speckle removing device according to claim 2 based on the micro- mirror techniques of MEMS, which is characterized in that described The working frequency of X-axis and Y-axis is stably and controllable.
5. the laser speckle removing device according to claim 1 based on the micro- mirror techniques of MEMS, which is characterized in that described Driving control system includes Laser Control System and the micro- galvanometer control system of MEMS, and the Laser Control System controls laser The luminous intensity of device and bright dark degree, the scanning and vibration of the micro- galvanometer control system control biaxial MEMS galvanometer of biaxial MEMS It is dynamic.
6. the laser speckle removing device according to claim 2 based on the micro- mirror techniques of MEMS, which is characterized in that described X-axis control mirror surface is scanned movement, and the Y-axis control mirror surface carries out vertical mirror surface normal direction and vibrates up and down.
CN201920045431.8U 2019-01-11 2019-01-11 A kind of laser speckle removing device based on the micro- mirror techniques of MEMS Active CN209297040U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201920045431.8U CN209297040U (en) 2019-01-11 2019-01-11 A kind of laser speckle removing device based on the micro- mirror techniques of MEMS

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201920045431.8U CN209297040U (en) 2019-01-11 2019-01-11 A kind of laser speckle removing device based on the micro- mirror techniques of MEMS

Publications (1)

Publication Number Publication Date
CN209297040U true CN209297040U (en) 2019-08-23

Family

ID=67642139

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201920045431.8U Active CN209297040U (en) 2019-01-11 2019-01-11 A kind of laser speckle removing device based on the micro- mirror techniques of MEMS

Country Status (1)

Country Link
CN (1) CN209297040U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112221020A (en) * 2020-10-14 2021-01-15 武汉博激世纪科技有限公司 Semiconductor laser galvanometer treatment system

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112221020A (en) * 2020-10-14 2021-01-15 武汉博激世纪科技有限公司 Semiconductor laser galvanometer treatment system

Similar Documents

Publication Publication Date Title
JP7568752B2 (en) System and method for reducing speckle laser line generation - Patents.com
JP5654234B2 (en) XY high speed drilling system
RU2671740C1 (en) Stereolithographic device with improved optical unit
JP5549459B2 (en) Image display device
US20080304128A1 (en) Speckle Reduction by Angular Scanning for Laser Projection Displays
JPWO2008053915A1 (en) Scanner optical system, laser processing apparatus, and scanner optical apparatus
US9081173B2 (en) Laser scanning microscope for scanning along a 3D trajectory
JP2015517120A5 (en)
CN209297040U (en) A kind of laser speckle removing device based on the micro- mirror techniques of MEMS
CN108983555B (en) Processing method for improving three-dimensional micro-nano structure based on composite scanning
CN115655153B (en) Light source modulation method, MEMS scanning 3D imaging system and imaging method thereof
KR100809583B1 (en) Apparatus for making pattern by using laser
TW201317624A (en) Micro-projector, control signal for a micro-projector and method for generating the same
JP4212305B2 (en) Laser irradiation device
JP5934481B2 (en) Optical scanning device
KR101451972B1 (en) Laser direct patterning system using in field on the fly function and method for controlling the same
JPH10175084A (en) Line type laser marker device, its optical device and its marking method
JP6478008B2 (en) Image display device
Grahmann et al. Laser projector solution based on two 1D resonant scanning micromirrors assembled in a low vertical distortion scan head
KR20110083015A (en) Pattern formation device using laser
JPH06114577A (en) Fine working device
JPH0394986A (en) Method and device for laser beam machining for metallic surface
JP3140312U (en) Laser etching equipment
JP6123877B2 (en) Image display device
JP2002005623A (en) Method for measuring displacement using laser light

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant