CN209282605U - A kind of refrigerator, encapsulating structure and laser module - Google Patents

Abstract

The main purpose of the utility model embodiment is to provide a kind of refrigerator, encapsulating structure and laser module, by designing a kind of novel refrigerator structure, specifically: the refrigerating appliance has the upper surface for being bonded laser chip, the upper surface is provided with area to be bonded, the width in at least described area to be bonded is consistent with the width of laser chip, spreads outward for limiting the heat that luminous point generates at laser chip edges at two ends.Technical solution disclosed in the utility model enables to the heat dissipation of each luminous point for the laser chip being bonded on refrigerator to be consistent, and has significant temperature uniformity.

Description

A kind of refrigerator, encapsulating structure and laser module

Technical field

The utility model relates to field of semiconductor lasers more particularly to a kind of refrigerators, encapsulating structure and laser die Block.

Background technique

In the prior art, in order to improve semiconductor laser refrigerator heat-sinking capability and heat dissipation uniformity, Duo Shuotong It crosses the layout for changing its internal microchannel and water route flow direction is realized.

Under normal conditions, the width for the side that refrigerator surface is used to be bonded laser chip will be significantly greater than laser chip Width, i.e., there are significantly greater surpluses, this is conventional design means usual in the industry, but this scheme can to swash At optical chip edges at two ends the heat of luminous point to there are surplus at be diffused, and the heat of the luminous point of middle is not Can to there are surplus at spread, this leads to cannot keep for the heat dissipation effect of the luminous point at edges at two ends and remaining luminous point Unanimously.

Summary of the invention

In view of this, one of the main purpose of the utility model embodiment be to provide a kind of refrigerator, encapsulating structure and Laser module enables to each of the laser chip being bonded on refrigerator by designing a kind of novel refrigerator structure The heat dissipation of a luminous point is largely consistent, and has significant temperature uniformity.

The technical solution of the utility model is achieved in that

The utility model embodiment provides a kind of refrigerator, and the refrigerating appliance has the upper table for being bonded laser chip Face, the upper surface are provided with area to be bonded, and the width in at least described area to be bonded is consistent with the width of laser chip, is used for The heat that luminous point generates at limitation laser chip edges at two ends is spread outward.

In above scheme, the width in the area to be bonded is consistent with the width of laser chip, comprising: the area to be bonded Width be D, the width of laser chip is d₁, the width of the adjacent luminous point of laser chip is d₂, three meets d₁≤D≤d₁+ 2d₂。

In above scheme, the refrigerator, which is internally located at the lower section in area to be bonded, is provided with refrigerating channel, the refrigeration Device includes: the internal micro channels liquid refrigerator with refrigerating circuit.

In above scheme, the refrigerator is multi-layer combined structure, at least one layer of area to be bonded of the refrigerator Width it is consistent with the width of laser chip.

In above scheme, stress slow release layer, laser chip key after stress slow release layer are additionally provided in the area to be bonded Together in the area to be bonded.

In above scheme, the width of the stress slow release layer is less than or equal to the width D in area to be bonded, and is greater than or equal to The width d of laser chip₁。

The utility model embodiment also provides a kind of encapsulating structure, and the encapsulating structure includes at least: laser chip, more than The refrigerator, the laser chip are bonded to the area to be bonded of the refrigerator.

The utility model embodiment also provides a kind of laser module, and the module includes multiple laser elements, described Laser element includes at least above-described encapsulating structure.

In above scheme, multiple laser elements are arranged as horizontal array in the horizontal direction, form horizontal array laser Module.

In above scheme, multiple laser elements are arranged as vertically folding battle array in vertical direction, form vertically folded battle array laser Module.

Detailed description of the invention

Fig. 1 is the structural schematic diagram one of the utility model refrigerator；

Fig. 2 is the structural schematic diagram two of the utility model refrigerator；

Fig. 3 is the structural schematic diagram three of the utility model refrigerator；

Fig. 4 is the structural schematic diagram four of the utility model refrigerator；

Fig. 5 is the structural schematic diagram five of the utility model refrigerator；

Fig. 6 is the structural schematic diagram six of the utility model refrigerator；

Fig. 7 is the structural schematic diagram of the utility model laser module；

Fig. 8 is the front end sectional view of the utility model refrigerator.

Description of symbols: 1 is refrigerator, and 11 be area to be bonded, and 12 be refrigerating channel, and D is the width in area to be bonded, d₁ For the width of laser chip, d₂For the width of the adjacent luminous point of laser chip, 2 be stress slow release layer, and 3 be laser module, 31 It is electrode slice for laser element, 32,33 be radiating block.

Specific embodiment

The utility model embodiment provides a kind of refrigerator, the laser chip being bonded on refrigerator that enables to The heat dissipation of each luminous point is largely consistent, and has significant temperature uniformity.

The technical solution of the utility model is described in further details below in conjunction with drawings and the specific embodiments.

Fig. 1 is the structural schematic diagram one of the utility model refrigerator, as shown in Figure 1, the refrigerator 1 has for being bonded The upper surface of laser chip is provided with area 11 to be bonded on the upper surface, which is for being bonded laser chip Specific location.

For the refrigerator 1, the width at least its area 11 to be bonded is consistent with the width of laser chip, here Described " at least " refers to: can only its area 11 to be bonded width it is consistent with the width of laser chip, can also to The width of bonding region extends to a certain distance to the other end, such as extends to entire refrigerator, namely the width of entire refrigerator It is consistent with the width of laser chip.

Width relative to traditional laser chip area to be bonded is largely greater than the width of laser chip, that is, reserves The bonding strategy of significantly greater hole surplus, the above design special consideration should be given to places to be: by the way that the width in area to be bonded is set Be calculated as it is consistent with the width of laser chip so that the hole surplus in traditional design no longer exists or is substantially not present, in turn It limits heat produced by the luminous point at laser chip edges at two ends to spread outward, so that the heat that each luminous point generates Substantially all only diffusions downwards, thus the consistency of each luminous point heat-sinking capability is greatly improved, make the equal of its Temperature Distribution Even property is higher.

In conjunction with Fig. 8, it is provided with refrigerating channel 12 at the lower section for being internally located at area 11 to be bonded of the utility model refrigerator, Lower section in view of refrigerating channel 12 due to being located at area 11 to be bonded, in conjunction with " width in area to be bonded and the width of laser chip Spend consistent ", this enables heat caused by bonding laser chip on it directly down at square refrigerating channel 12 Transmitting avoids the formation temperature gradient in refrigerator width direction, to protect so that heat effectively be inhibited to spread to two sides The uniformity of luminous point temperature is demonstrate,proved.

Specifically, the width in the area 11 to be bonded is consistent with the width of laser chip in the utility model embodiment, Here being not required for the two must be essentially equal, almost the same, for the laser chip with multiple luminous points, Under the premise of can be realized the utility model technical purpose and technical effect, it is described it is " consistent " may include following:

The width in the area to be bonded is D, and the width of laser chip is d₁, the width of the adjacent luminous point of laser chip is d₂, three meets d₁≤D≤d₁+2d₂。

That is, the minimum width d with laser chip of the width D in area to be bonded₁Keep equal, it is maximum are as follows: side It is not more than the distance of 1 luminous point, the width i.e. the adjacent luminous point of laser chip of 1 luminous point beyond laser chip edge Width d₂, therefore by the unified consideration in two sides, the width D in area to be bonded is up to d₁+2d₂。

Further, the refrigerator 1 mainly includes the internal micro channels liquid refrigerator with refrigerating circuit, the system Cooler is multi-layer combined structure, and the width of the width in at least one layer of area to be bonded of the refrigerator and laser chip It is consistent.Certainly, refrigerator 1 can also be other types, be provided with as long as refrigerator 1 is internally located at the lower section in area to be bonded Refrigerating channel.

The utility model embodiment by taking the refrigerator 1 is micro channels liquid refrigerator as an example, such as: the refrigerator is logical It is often five-layer structure, the refrigerator of five floor can be the only width and laser chip in the area to be bonded of the first layer of the top Width is consistent (such as Fig. 2), is also possible to the width in the area to be bonded of first layer and the second layer and the width phase one of laser chip It causes (such as Fig. 3), the width for being also possible to the area to be bonded of first layer, the second layer and third layer is consistent with the width of laser chip (such as Fig. 4) is also possible to the width in the area to be bonded of first layer, the second layer, third layer and the 4th floor and the width of laser chip Consistent (such as Fig. 5) is also possible to width (such as figure consistent with the width of laser chip that five floor whole meet area to be bonded 1)；Above-described several situations, the influence degree to technical effect described in the utility model are in gradually increase trend.

In the utility model embodiment and attached drawing, specifically by taking the width in area to be bonded is equal with the width of laser chip as an example Illustrated, be not intended to limit this programme, from the above description, it can be seen that other situations for meeting the range are also can be with 's.

Further, it is additionally provided with stress slow release layer 2 in the area to be bonded 11, as shown in fig. 6, the laser chip passes through Stress slow release layer 2 is bonded to the area to be bonded 11.The stress slow release layer 2 can include but is not limited to: copper tungsten layer or copper gold Hard rock layer etc..

Similar, the width of the stress slow release layer is less than or equal to the width D in area to be bonded, and is greater than or equal to laser The width d of chip₁。

The utility model embodiment also provides a kind of encapsulating structure, and the encapsulating structure includes at least: laser chip, more than The refrigerator 1, the laser chip are bonded to the area to be bonded 11 of the refrigerator 1.

The utility model embodiment also provides a kind of laser module, and the module includes multiple laser elements 31, institute It can also include other electrodes in addition to the encapsulating structure that laser element 31, which is stated, including at least above-described encapsulating structure Connector, mechanical fixed part etc..

Specifically, the module are as follows: multiple laser elements are arranged as horizontal array (such as Fig. 7) in the horizontal direction, are formed Horizontal array laser module, the laser module can also include radiating block 33, electrode slice 32 etc., and other structures are with reference to existing Technology is no longer listed herein.

For horizontal array shown in Fig. 7, the technical solution of the utility model can make the entirety of its encapsulating structure Width becomes smaller, so that the distance between each laser element accordingly reduces, so that whole spot width also becomes smaller, and hot spot Brightness is improved obviously.In addition, making since technical solutions of the utility model can significantly improve the temperature uniformity of refrigerator The spectral width that laser must be exported reduces, it is thus possible to significantly promote the pumping efficiency applied in solid state laser pumping.

Alternatively, multiple laser elements are arranged as vertically folding battle array in vertical direction, vertically folded battle array laser module is formed, is hung down The other structures of straight folded battle array laser module refer to the prior art, also no longer extra to list.Technical solutions of the utility model are to vertical The advantageous effects of straight folded battle array laser module refer to above-mentioned horizontal array, here no longer extra narration.

The above, the only preferred embodiment of the utility model, are not intended to limit the protection of the utility model Range.For those skilled in the art, the present invention may have various modifications and changes.It is all in the utility model Any modification, equivalent substitution, improvement and etc. done within spirit and principle, should be included in the protection scope of the utility model it It is interior.

Claims (9)

1. a kind of refrigerator, which is characterized in that the refrigerating appliance has the upper surface for being bonded laser chip, the upper surface It is provided with area to be bonded, the width in at least described area to be bonded is consistent with the width of laser chip, for limiting laser chip The heat that luminous point generates at edges at two ends is spread outward；Wherein,

The width in the area to be bonded is consistent with the width of laser chip, comprising: the width in the area to be bonded is D, laser The width of chip is d₁, the width of the adjacent luminous point of laser chip is d₂, three meets d₁≤D≤d₁+2d₂。

2. refrigerator according to claim 1, which is characterized in that the refrigerator is internally located at the lower section in area to be bonded It is provided with refrigerating channel, the refrigerator includes: the internal micro channels liquid refrigerator with refrigerating circuit.

3. refrigerator according to claim 2, which is characterized in that the refrigerator is multi-layer combined structure, the system The width in at least one layer of area to be bonded of cooler is consistent with the width of laser chip.

4. refrigerator according to claim 1, which is characterized in that it is additionally provided with stress slow release layer in the area to be bonded, Laser chip is bonded to the area to be bonded after stress slow release layer.

5. refrigerator according to claim 4, which is characterized in that the width of the stress slow release layer is less than or equal to key The width D in area is closed, and is greater than or equal to the width d of laser chip₁。

6. a kind of encapsulating structure, which is characterized in that the encapsulating structure includes at least: laser chip, claim 1 to 5 are any Refrigerator described in, the laser chip are bonded to the area to be bonded of the refrigerator.

7. a kind of laser module, which is characterized in that the module includes multiple laser elements, and the laser element is at least Including encapsulating structure as claimed in claim 6.

8. module according to claim 7, which is characterized in that multiple laser elements are arranged as horizontal array in the horizontal direction Column form horizontal array laser module.

9. module according to claim 7, which is characterized in that multiple laser elements are arranged as vertically folded in vertical direction Battle array forms vertically folded battle array laser module.