CN209281454U - A kind of high temperature resistant anti-metal electronic tag - Google Patents
A kind of high temperature resistant anti-metal electronic tag Download PDFInfo
- Publication number
- CN209281454U CN209281454U CN201920141568.3U CN201920141568U CN209281454U CN 209281454 U CN209281454 U CN 209281454U CN 201920141568 U CN201920141568 U CN 201920141568U CN 209281454 U CN209281454 U CN 209281454U
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- CN
- China
- Prior art keywords
- high temperature
- lower case
- temperature resistant
- extension board
- electronic tag
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
The utility model belongs to labeling apparatus technical field, in particular a kind of high temperature resistant anti-metal electronic tag, including upper housing and lower case, the upper surface of the lower case is integrally formed with fixed frame, the upper surface that the inside of the fixed frame is located at lower case is fixed and has ceramic base material, the upper surface of the ceramic base material is fixed with label chip by bonded assembly, the upper surface of the label chip is integrally formed with antenna, the side surface of the upper housing and lower case offers through-hole, and the bottom surface of the lower case is equipped with auxiliary fixing assembly;Upper housing and lower case are sealed ceramic base material in equipment use process, upper housing, lower case and ceramic base material carry out label chip in label chip use process heat-insulated layer by layer, extraneous excessive temperature is avoided to interfere label chip, the stability of label chip at high temperature effectively is improved, is used at high temperature convenient for equipment.
Description
Technical field
The utility model belongs to labeling apparatus technical field, and in particular to a kind of high temperature resistant anti-metal electronic tag.
Background technique
Labeling apparatus is widely applied by people with life at present, and labeling apparatus is generally secured to marked object
On, to be recorded and be observed, whose marked object can be recorded always, and current labeling apparatus remains unchanged in use
Some problems are exposed, in automotive lacquer process always needs that vehicle is marked, prevents car from mixing up and confuse, but current label
Equipment and non-refractory, automotive lacquer baking vanish are located under high temperature environment in the process, and the chip under this environment inside labeling apparatus is easy
It overheats and damages, for the problem exposed in current electronic tag use process, it is necessary to which structure is carried out to electronic tag
On improvement and optimization.
Utility model content
To solve the above-mentioned problems in the prior art, the utility model provides a kind of high temperature resistant anti-metal electronics mark
Label, have the characteristics that equipment still can well be run under high temperature environment.
To achieve the above object, the utility model provides the following technical solutions: a kind of high temperature resistant anti-metal electronic tag, packet
Upper housing and lower case are included, integrally formed with fixed frame, the inside of the fixed frame is located at lower casing for the upper surface of the lower case
The upper surface of body, which is fixed, ceramic base material, and the upper surface of the ceramic base material is fixed with label chip by bonded assembly,
The upper surface of the label chip is integrally formed with antenna, and the side surface of the upper housing and lower case offers through-hole, institute
The bottom surface for stating lower case is equipped with auxiliary fixing assembly, and auxiliary fixing assembly includes extension board, and the bottom surface of the lower case offers
Connecting cavity, the extension board are placed on the inside of connecting cavity, and the side that the side surface of the extension board is located at through-hole offers auxiliary
Help hole.
As a kind of high temperature resistant anti-metal electronic tag optimal technical scheme of the utility model, auxiliary fixing assembly is also wrapped
Limited block, auxiliary chute are included, the inner wall that the outside of the connecting cavity is located at lower case offers auxiliary chute, the two sides of extension board
Integrally formed with limited block, symmetrically integrally formed with limited block, limited block is placed on auxiliary and slides one end both side surface of extension board
The inside of slot.
As a kind of high temperature resistant anti-metal electronic tag optimal technical scheme of the utility model, the one of the auxiliary chute
End is located at the outer rim of lower case integrally formed with block, and there are two block is set, and block is cuboid component.
As a kind of high temperature resistant anti-metal electronic tag optimal technical scheme of the utility model, the bottom surface of the extension board
Consistent with the floor height of lower case, one end of extension board is located at the outer rim of lower case integrally formed with protruding plate.
As a kind of high temperature resistant anti-metal electronic tag optimal technical scheme of the utility model, the upper housing and lower casing
The outer surface upper and lower side of body is opened up respectively there are two through-hole, and extension board is equipped with two, and the lower section of two through-holes is located at extension board
Side surface offer via hole.
As a kind of high temperature resistant anti-metal electronic tag optimal technical scheme of the utility model, bonded assembly includes resistance to height
Temperature binding glue and high temperature resistant solidification glue, high temperature resistant binding glue are applied to the upper surface of ceramic base material, and high temperature resistant solidification glue is applied to
High temperature resistant binds the upper surface of glue, and label chip is bonded in the upper surface of high temperature resistant solidification glue.
As a kind of high temperature resistant anti-metal electronic tag optimal technical scheme of the utility model, the upper table of the upper housing
Face bonding is equipped with rubber strip, and rubber strip is equipped with two circles, and outer ring is fixed at the upper surface outer rim of upper housing, and inner ring is located at outer ring
Inside.
Compared with prior art, the utility model has the beneficial effects that upper housing and lower case pair in equipment use process
Ceramic base material is sealed, and upper housing, lower case and ceramic base material carry out label chip in label chip use process
It is heat-insulated layer by layer, it avoids extraneous excessive temperature from interfering label chip, effectively improves label chip at high temperature steady
Qualitative energy, uses at high temperature convenient for equipment.
Detailed description of the invention
Attached drawing is used to provide a further understanding of the present invention, and constitutes part of specification, practical with this
Novel embodiment is used to explain the utility model together, does not constitute limitations of the present invention.In the accompanying drawings:
Fig. 1 is the structural schematic diagram of the utility model;
Fig. 2 is the schematic diagram of internal structure in the utility model;
Fig. 3 is the side, sectional structural schematic diagram in the utility model;
Fig. 4 is the ceramic base material side structure schematic diagram in the utility model;
Fig. 5 is the line A-A structural schematic diagram in the utility model along Fig. 3;
Fig. 6 is enlarged structure schematic diagram at the C of Fig. 5 in the utility model;
Fig. 7 is the line B-B structural schematic diagram in the utility model along Fig. 5;
In figure: 1, upper housing;2, rubber strip;3, lower case;31, connecting cavity;32, auxiliary chute;33, block;4, through-hole;
5, fixed frame;6, ceramic base material;7, label chip;8, antenna;9, high temperature resistant binds glue;10, high temperature resistant solidification glue;11, extend
Plate;12, via hole;13, protruding plate;14, limited block.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Embodiment
Please refer to Fig. 1-7, the utility model the following technical schemes are provided: a kind of high temperature resistant anti-metal electronic tag, including
Upper housing 1 and lower case 3, integrally formed with fixed frame 5, the inside of fixed frame 5 is located at lower case 3 for the upper surface of lower case 3
Upper surface, which is fixed, ceramic base material 6, and the upper surface of ceramic base material 6 is fixed with label chip 7, label core by bonded assembly
The upper surface of piece 7 offers through-hole 4, the bottom of lower case 3 integrally formed with antenna 8, upper housing 1 and the side surface of lower case 3
Face is equipped with auxiliary fixing assembly, and auxiliary fixing assembly includes extension board 11, and the bottom surface of lower case 3 offers connecting cavity 31, extends
Plate 11 is placed on the inside of connecting cavity 31, and the side that the side surface of extension board 11 is located at through-hole 4 offers via hole 12, this implementation
In scheme, auxiliary fixing assembly uses extension board 11 for extension board 11 to be fixed and limited, convenient for staff.
Specifically, auxiliary fixing assembly further includes limited block 14, auxiliary chute 32, the outside of connecting cavity 31 is located at lower case
3 inner wall offers auxiliary chute 32, and the two sides of extension board 11 are integrally formed with limited block 14, one end two sides table of extension board 11
Symmetrically integrally formed with limited block 14, limited block 14 is placed on the inside of auxiliary chute 32 in face, 11 side of extension board in the present embodiment
Face is equipped with via hole 12, convenient for being fixed with the connected object of different size.
Specifically, one end of auxiliary chute 32 is located at integrally formed with block 33 at the outer rim of lower case 3, block 33 is equipped with
Two, and block 33 is cuboid component, block 33 avoids extension board 11 for limiting limited block 14 in the present embodiment
It skids off and falls off from the inside of connecting cavity 31.
Specifically, the bottom surface of extension board 11 is consistent with the floor height of lower case 3, one end of extension board 11 is located at lower case
Integrally formed with protruding plate 13 at 3 outer rim, protruding plate 13 operates in the present embodiment convenient for staff's hand, convenient for will
Extension board 11 is extracted out from the inside of connecting cavity 31.
Specifically, upper housing 1 and the outer surface upper and lower side of lower case 3 are opened up respectively there are two through-hole 4, extension board 11 is set
There are two, the side surface that the lower section of two through-holes 4 is located at extension board 11 offers via hole 12, via hole 12 in the present embodiment
Fixated body two fixation holes distance farther out when use, extension board 11 act during 12 position of via hole move together
It is dynamic, convenient for being attached with fixated body.
Specifically, bonded assembly includes high temperature resistant binding glue 9 and high temperature resistant solidification glue 10, high temperature resistant binding glue 9 is applied to
The upper surface of ceramic base material 6, high temperature resistant solidification glue 10 are applied to the upper surface of high temperature resistant binding glue 9, and label chip 7 is bonded in resistance to
The upper surface of high temperature setting glue 10, high temperature resistant binding glue 9 is that Shenzhen is produced with prosperous Li Da Science and Technology Ltd. in the present embodiment
Model COB-6812 the fixed glue of chip;High temperature resistant solidification glue 10 uses UV glue, and UV glue can solidify under the irradiation of UV light source,
Label chip 7 is bonded.
Specifically, the upper surface bonding of upper housing 1 is equipped with rubber strip 2, rubber strip 2 is equipped with two circles, and outer ring is fixed on upper casing
At the upper surface outer rim of body 1, inner ring is located at the inside of outer ring, and rubber strip 2 is able to ascend the impact resistance of equipment in the present embodiment
Can, rubber strip 2 can absorb certain impact force by the deformation quantity of itself when impact force is reached, and label is avoided to be impacted
When casing rupture, promote the stability of label.
The working principle and process for using of the utility model: in the utility model in the equipment use process upper housing 1 with
Lower case 3 is sealed ceramic base material 6, and upper housing 1, lower case 3 and ceramic base material 6 are in 7 use process of label chip
It is heat-insulated layer by layer to the progress of label chip 7, avoid extraneous excessive temperature from interfering label chip 7, so that label chip 7 is in height
Temperature is lower still can normally to work, and carry out signal connection, extension board with extraneous by antenna 8 in 7 course of work of label chip
11 can adjust the size of two 12 spacing of via hole in the internal slide of connecting cavity 31, one way in use, with
Just upper housing 1 can not be installed when position of mounting hole is excessive, and limited block 14 can be in the internal slide of connecting cavity 31,33 pairs of block limits
The position of position block 14 is limited.
Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention, it is not limited to this
Utility model, although the utility model is described in detail with reference to the foregoing embodiments, for those skilled in the art
For, it is still possible to modify the technical solutions described in the foregoing embodiments, or to part of technical characteristic
It is equivalently replaced.Within the spirit and principle of the utility model, any modification, equivalent replacement, improvement and so on,
It should be included within the scope of protection of this utility model.
Claims (7)
1. a kind of high temperature resistant anti-metal electronic tag, including upper housing (1) and lower case (3), it is characterised in that: the lower case
(3) integrally formed with fixed frame (5), the upper surface engaging that the inside of the fixed frame (5) is located at lower case (3) is solid for upper surface
Surely have ceramic base material (6), the upper surface of the ceramic base material (6) is fixed with label chip (7), the label by bonded assembly
The upper surface of chip (7) offers through-hole integrally formed with antenna (8), the upper housing (1) and the side surface of lower case (3)
(4), the bottom surface of the lower case (3) is equipped with auxiliary fixing assembly, and auxiliary fixing assembly includes extension board (11), the lower case
(3) bottom surface offers connecting cavity (31), and the extension board (11) is placed on the inside of connecting cavity (31), the extension board (11)
Side surface be located at the side of through-hole (4) and offer via hole (12).
2. a kind of high temperature resistant anti-metal electronic tag according to claim 1, it is characterised in that: auxiliary fixing assembly also wraps
Limited block (14), auxiliary chute (32) are included, the inner wall that the outside of the connecting cavity (31) is located at lower case (3) offers auxiliary and slides
Slot (32), integrally formed with limited block (14), one end both side surface of extension board (11) is symmetrically integrated for the two sides of extension board (11)
It forms limited block (14), limited block (14) is placed on the inside of auxiliary chute (32).
3. a kind of high temperature resistant anti-metal electronic tag according to claim 2, it is characterised in that: the auxiliary chute (32)
One end be located at the outer rim of lower case (3) integrally formed with block (33), there are two block (33) is set, and block (33) is length
Cube component.
4. a kind of high temperature resistant anti-metal electronic tag according to claim 3, it is characterised in that: the extension board (11)
Bottom surface is consistent with the floor height of lower case (3), one end of extension board (11) be located at the outer rim of lower case (3) integrally formed with
Protruding plate (13).
5. a kind of high temperature resistant anti-metal electronic tag according to claim 4, it is characterised in that: the upper housing (1) with
The outer surface upper and lower side of lower case (3) is opened up respectively there are two through-hole (4), and extension board (11) is equipped with two, two through-holes (4)
Lower section be located at the side surface of extension board (11) and offer via hole (12).
6. a kind of high temperature resistant anti-metal electronic tag according to claim 5, it is characterised in that: bonded assembly includes resistance to height
Temperature binding glue (9) and high temperature resistant solidification glue (10), high temperature resistant binding glue (9) are applied to the upper surface of ceramic base material (6), high temperature resistant
Solidification glue (10) is applied to the upper surface of high temperature resistant binding glue (9), and label chip (7) is bonded in the upper of high temperature resistant solidification glue (10)
Surface.
7. a kind of high temperature resistant anti-metal electronic tag according to claim 6, it is characterised in that: the upper housing (1)
Upper surface bonding is equipped with rubber strip (2), and rubber strip (2) is equipped with two circles, and outer ring is fixed at the upper surface outer rim of upper housing (1),
Inner ring is located at the inside of outer ring.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920141568.3U CN209281454U (en) | 2019-01-27 | 2019-01-27 | A kind of high temperature resistant anti-metal electronic tag |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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CN201920141568.3U CN209281454U (en) | 2019-01-27 | 2019-01-27 | A kind of high temperature resistant anti-metal electronic tag |
Publications (1)
Publication Number | Publication Date |
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CN209281454U true CN209281454U (en) | 2019-08-20 |
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ID=67605798
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CN201920141568.3U Expired - Fee Related CN209281454U (en) | 2019-01-27 | 2019-01-27 | A kind of high temperature resistant anti-metal electronic tag |
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CN (1) | CN209281454U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110880030A (en) * | 2019-11-21 | 2020-03-13 | 盐城工业职业技术学院 | Impact-resistant electronic tag |
-
2019
- 2019-01-27 CN CN201920141568.3U patent/CN209281454U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN110880030A (en) * | 2019-11-21 | 2020-03-13 | 盐城工业职业技术学院 | Impact-resistant electronic tag |
CN110880030B (en) * | 2019-11-21 | 2023-03-07 | 盐城工业职业技术学院 | Impact-resistant electronic tag |
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GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190820 Termination date: 20220127 |
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CF01 | Termination of patent right due to non-payment of annual fee |