CN209266616U - A kind of embedded firm joint device of chip for cell phone - Google Patents
A kind of embedded firm joint device of chip for cell phone Download PDFInfo
- Publication number
- CN209266616U CN209266616U CN201920239348.4U CN201920239348U CN209266616U CN 209266616 U CN209266616 U CN 209266616U CN 201920239348 U CN201920239348 U CN 201920239348U CN 209266616 U CN209266616 U CN 209266616U
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- China
- Prior art keywords
- chip
- sliding
- pcb board
- embedded
- sliding slot
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- 239000011159 matrix material Substances 0.000 claims abstract description 20
- 238000003825 pressing Methods 0.000 claims description 22
- 244000309464 bull Species 0.000 claims description 20
- 239000007787 solid Substances 0.000 claims description 9
- 125000003003 spiro group Chemical group 0.000 claims description 9
- 230000001360 synchronised effect Effects 0.000 claims description 6
- 239000000463 material Substances 0.000 claims description 3
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000009825 accumulation Methods 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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- Telephone Set Structure (AREA)
Abstract
The utility model discloses a kind of embedded firm joint devices of chip for cell phone, including pcb board and chip, the upper surface of the pcb board is opened up there are two sliding slot disposed in parallel, being slidably connected in two sliding slots, there are two sliding blocks, and the sliding block in two sliding slots is in distributed rectangular, matrix contact for chip connection is installed on the pcb board, and matrix contact is located among sliding slot and sliding block, upper surface positioned at matrix contact the same side and two sliding blocks in different sliding slots is fixedly connected with movable block jointly, there are gaps for the upper surface of the movable block and pcb board.The utility model is convenient to be adjusted the spacing between two movable blocks by observation line and graduation mark, the fixation for completing two movable blocks is engaged using being formed between positioning screw end and sliding slot, the size and chip size for making two embedded grooves are adapted, can be affixed to a variety of chips progress of same size, that length is different, use scope is wider.
Description
Technical field
The utility model relates to chip for cell phone technical field more particularly to a kind of embedded firm joint devices of chip for cell phone.
Background technique
Chip for cell phone is one of IC classification, is that a kind of a variety of electronic components of silicon plate upper set realize certain specific function
Circuit module.It is most important part in electronic equipment, carries the function of operation and storage.
Some are not attached by dot matrix contact with mainboard current chip for cell phone by pin, therefore are needed on mainboard
Firm joint device is wanted to carry out chip for cell phone affixed, firm joint device in the prior art is mobile since its component is fixed from and is only capable of
A kind of chip for cell phone of model is carried out affixed, it is difficult to which the chip for cell phone progress different to of same size, length is affixed, and there are one
Fixed use limitation.
Utility model content
Purpose of the utility model is to solve proposing in background technique, and a kind of chip for cell phone proposed is embedding
Enter formula firm joint device.
To achieve the goals above, the utility model adopts the technical scheme that
A kind of embedded firm joint device of chip for cell phone, including pcb board and chip, the upper surface of the pcb board offer two
A sliding slot disposed in parallel, being slidably connected in two sliding slots, there are two sliding blocks, and the sliding block in two sliding slots is in rectangle
It is distributed, the matrix contact for chip connection is installed, and matrix contact is located among sliding slot and sliding block, position on the pcb board
It is fixedly connected with movable block jointly in the upper surface of matrix contact the same side and two sliding blocks in different sliding slots, institute
The upper surface of movable block and pcb board is stated there are gap, two movable blocks side side wall close to each other offers embedded groove,
The shape size of the embedded groove and the shape size on chip two sides edge match, two movable blocks be located remotely from each other one
Side side wall is fixedly connected with locating piece on the corresponding position of sliding slot, and the locating piece offers fixed on the position of sliding slot face
Position threaded hole, the positioning spiro pit internal screw thread are connected with positioning screw；
Two movable blocks are symmetrically arranged with solid pressure mechanism, and the solid pressure mechanism includes be provided with movable block upper surface two
A notch, two notches are arranged about the axisymmetrical of embedded groove, and the inner wall of two notches is rotatably connected to bull stick,
The outer wall fixing sleeve of the bull stick is connected to pressing plate, and movable sleeve is connected to wind spring on the bull stick in notch, the wind spring
Both ends are fixedly connected with the inner wall of bull stick, notch respectively, and the one end of the pressing plate far from bull stick is arranged towards matrix contact, and two
Pressing plate side side wall close to each other is fixedly connected with synchronous piece jointly, and the lower end surface of the pressing plate, which is fixedly connected with, to be compressed
Piece, the arrived tableting on the pressing plate are in downward push state under the elastic force of wind spring.
Preferably, the inner wall of the embedded groove is fixedly connected with buffer layer, and the buffer layer uses temperature resistant rubber material system
At.
Preferably, the internal diameter of the positioning spiro pit is greater than the width of sliding slot.
Preferably, the sliding block limit is slided in sliding slot, and the side of the sliding block is dovetail shaped, and the sliding slot is dovetail
Slot.
Preferably, the oppositely oriented setting of the rotation direction of the wind spring and bull stick.
Preferably, the upper surface of the pcb board and respectively the two sides of two sliding slots carve be equipped with graduation mark, the movement
The two sides side wall of block, which is carved, is equipped with observation line, and the side inner wall of observation line and embedded groove is generally aligned in the same plane.
Compared with prior art, the advantages of this chip for cell phone embedded firm joint device, is:
1, it is convenient to be adjusted the spacing between two movable blocks by observation line and graduation mark, utilizes positioning spiral shell
The fixation for engaging and completing two movable blocks is formed between nail end and sliding slot, fits the size of two embedded grooves mutually with chip size
It answers, can be affixed to a variety of chips progress of same size, that length is different, use scope is wider；
2, the arrived tableting on pressing plate and pressing plate realizes the pressing to chip upper surface using the elastic force of wind spring, realizes core
Piece stablizes affixed state, ensure that the normal connection and use of chip and pcb board.
Detailed description of the invention
Fig. 1 be the utility model proposes a kind of embedded firm joint device of chip for cell phone structural schematic diagram；
Fig. 2 is the structural schematic diagram of part A amplification in the utility model Fig. 1.
In figure: 1 pcb board, 2 movable blocks, 3 sliding slots, 4 locating pieces, 5 positioning spiro pits, 6 notches, 7 bull sticks, 8 pressing plates, volume 9
Spring, 10 embedded grooves, 11 arrived tabletings, 12 synchronous pieces, 13 matrix contacts.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
In the description of the present invention, it should be understood that term " on ", "lower", "front", "rear", "left", "right",
The orientation or positional relationship of the instructions such as "top", "bottom", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
Referring to Fig.1-2, the embedded firm joint device of a kind of chip for cell phone, including pcb board 1 and chip, the upper surface of pcb board 1
It opens up there are two sliding slot 3 disposed in parallel, being slidably connected in two sliding slots 3, there are two sliding blocks, and the sliding block in two sliding slots 3
In distributed rectangular, sliding block limit is slided in sliding slot 3, and the side of sliding block is dovetail shaped, and sliding slot 3 is dovetail groove, due to sliding block with
Sliding block can be limited in sliding slot 3 by the dovetail shaped mechanism of sliding slot 3, guarantee the normal movement and use of movable block 2.
Matrix contact 13 for chip connection is installed, and matrix contact 13 is located in sliding slot 3 and sliding block on pcb board 1
Between, the upper surface positioned at 13 the same side of matrix contact and two sliding blocks in different sliding slots 3 is fixedly connected with movement jointly
There are gaps for the upper surface of block 2, movable block 2 and pcb board 1, will not influence other assemblies on pcb board 1, two movable blocks 2 are mutual
Close side side wall offers embedded groove 10, the shape size and the shape size phase on chip two sides edge of embedded groove 10
Match, the side side wall that two movable blocks 2 are located remotely from each other is fixedly connected with locating piece 4, locating piece 4 on the corresponding position of sliding slot 3
Positioning spiro pit 5 is offered on the position of 3 face of sliding slot, 5 internal screw thread of positioning spiro pit is connected with positioning screw, positioning threads
The internal diameter in hole 5 is greater than the width of sliding slot 3, realizes the engaging between sliding slot 3 by the end of positioning screw；
Two movable blocks 2 are symmetrically arranged with solid pressure mechanism, and solid pressure mechanism includes two notches for being provided with 2 upper surface of movable block
6, two notches 6 are arranged about the axisymmetrical of embedded groove 10, and the inner wall of two notches 6 is rotatably connected to bull stick 7, bull stick 7
Outer wall fixing sleeve is connected to pressing plate 8, and movable sleeve is connected to wind spring 9, rotation direction and the bull stick 7 of wind spring 9 on the bull stick 7 in notch 6
Oppositely oriented setting, identical as 9 normal operating condition of wind spring, the both ends of wind spring 9 are fixed with the inner wall of bull stick 7, notch 6 respectively to be connected
It connects, the one end of pressing plate 8 far from bull stick 7 is arranged towards matrix contact 13, and two pressing plates 8 side side wall close to each other is fixed jointly
It is connected with synchronous piece 12, the lower end surface of pressing plate 8 is fixedly connected with arrived tableting 11, elasticity of the arrived tableting 11 on pressing plate 8 in wind spring 9
Downward push state is under power.
The inner wall of embedded groove 10 is fixedly connected with buffer layer, and buffer layer is made of temperature resistant rubber material, and buffer layer is being schemed
In be not shown, buffer layer have elasticity capacity, chip can be buffered, due to its can deformation nature, can be further to core
Piece is protected.
The upper surface of pcb board 1 and respectively the two sides of two sliding slots 3 carve be equipped with graduation mark, the two sides side wall of movable block 2
It carves and is equipped with observation line, and the side inner wall of observation line and embedded groove 10 is generally aligned in the same plane, it can by observation line and graduation mark
The convenient spacing between two movable blocks 2 of adjustment.
It further illustrates, it is above-mentioned to be fixedly connected unless specifically defined or limited otherwise, otherwise to shall be understood in a broad sense, example
Such as, it can be welding, be also possible to gluing, or be integrally formed the customary means well known to those skilled in the art such as setting.
It in the utility model, is illustrated in advance, chip realizes by matrix contact 13 and pcb board 1 and connect that this is mobile phone
The well-known technique of chip field, therefore not to repeat here.
Specific length between two movable blocks 2 of length adjustment of known chip, it is known that chip length, length adjustment is such as
Under, it is foundation according to the observation line on the graduation mark of 1 upper surface of pcb board, movable block 2, slides two movable blocks 2 until two insertions
Spacing between 10 inner wall of slot is slightly larger than the length of P chip, is threaded into positioning spiro pit 5 using positioning screw until positioning
Tip of screw engages with the realization of sliding slot 3, completes the fixation of two movable blocks 2；
Two pressing plates 8 in Liang Ge solid pressure mechanism are pulled towards the direction far from matrix contact 13 by synchronous piece 12 respectively
It moves, the pressing plate 8 in Liang Ge solid pressure mechanism is center of circle rotation with bull stick 7, and wind spring 9 batches accumulation of energy, so that in Liang Ge solid pressure mechanism
Pressing plate 8 is outwardly open and keeps pulling movement maintenance state, the joint face face matrix contact 13 of chip is put into, chip is fallen into
After in two embedded grooves 10, slowly loosen synchronous piece 12, so that pressing plate 8 returns to initial position under the elastic force that wind spring 9 restores,
Arrived tableting 11 presses the upper surface of chip, realizes being fixedly connected for chip, it should be noted that the elasticity of wind spring 9
Stablizing fixed and chip will not being damaged because elasticity is excessive for chip preferably can be able to achieve.
The preferable specific embodiment of the above, only the utility model, but the protection scope of the utility model is not
It is confined to this, anyone skilled in the art is within the technical scope disclosed by the utility model, practical according to this
Novel technical solution and its utility model design are subject to equivalent substitution or change, should all cover the protection model in the utility model
Within enclosing.
Claims (6)
1. a kind of embedded firm joint device of chip for cell phone, including pcb board (1) and chip, which is characterized in that the pcb board (1)
Upper surface is opened up there are two sliding slot disposed in parallel (3), is slidably connected in two sliding slots (3) there are two sliding block, and two
Sliding block in a sliding slot (3) is in distributed rectangular, and the matrix contact (13) for chip connection is equipped on the pcb board (1), and
Matrix contact (13) is located among sliding slot (3) and sliding block, is located at matrix contact (13) the same side and is located in different sliding slots (3)
The upper surface of two sliding blocks is fixedly connected with movable block (2) jointly, and the movable block (2) and the upper surface of pcb board (1) are stayed
There is gap, two movable block (2) side side walls close to each other offer embedded groove (10), the shape of the embedded groove (10)
Shape size and the shape size on chip two sides edge match, and the side side wall that two movable blocks (2) are located remotely from each other is in cunning
It is fixedly connected on the corresponding position of slot (3) locating piece (4), the locating piece (4) offers on the position of sliding slot (3) face
Positioning spiro pit (5), positioning spiro pit (5) internal screw thread are connected with positioning screw；
Two movable blocks (2) are symmetrically arranged with solid pressure mechanism, and the solid pressure mechanism includes being provided with movable block (2) upper surface
Two notches (6), two notches (6) are arranged about the axisymmetrical of embedded groove (10), the inner wall of two notches (6)
It is rotatably connected to bull stick (7), the outer wall fixing sleeve of the bull stick (7) is connected to pressing plate (8), the bull stick being located in notch (6)
(7) movable sleeve is connected to wind spring (9) on, and the both ends of the wind spring (9) are fixedly connected with the inner wall of bull stick (7), notch (6) respectively,
The pressing plate (8) far from bull stick (7) one end towards matrix contact (13) be arranged, two pressing plates (8) it is close to each other one
Side side wall is fixedly connected with synchronous piece (12) jointly, and the lower end surface of the pressing plate (8) is fixedly connected with arrived tableting (11), the pressure
Arrived tableting (11) on plate (8) is in downward push state under the elastic force of wind spring (9).
2. the embedded firm joint device of a kind of chip for cell phone according to claim 1, which is characterized in that the embedded groove (10)
Inner wall be fixedly connected with buffer layer, the buffer layer is made of temperature resistant rubber material.
3. the embedded firm joint device of a kind of chip for cell phone according to claim 1, which is characterized in that the positioning spiro pit
(5) internal diameter is greater than the width of sliding slot (3).
4. the embedded firm joint device of a kind of chip for cell phone according to claim 1, which is characterized in that the sliding block limit exists
Sliding in sliding slot (3), the side of the sliding block are dovetail shaped, and the sliding slot (3) is dovetail groove.
5. the embedded firm joint device of a kind of chip for cell phone according to claim 1, which is characterized in that the wind spring (9)
The oppositely oriented setting of rotation direction and bull stick (7).
6. the embedded firm joint device of a kind of chip for cell phone according to claim 1, which is characterized in that the pcb board (1)
Upper surface and respectively the two sides of two sliding slots (3) carve be equipped with graduation mark, the two sides side wall of the movable block (2), which is carved, to be equipped with
Observation line, and the side inner wall of observation line and embedded groove (10) is generally aligned in the same plane.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920239348.4U CN209266616U (en) | 2019-02-26 | 2019-02-26 | A kind of embedded firm joint device of chip for cell phone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920239348.4U CN209266616U (en) | 2019-02-26 | 2019-02-26 | A kind of embedded firm joint device of chip for cell phone |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209266616U true CN209266616U (en) | 2019-08-16 |
Family
ID=67585619
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920239348.4U Expired - Fee Related CN209266616U (en) | 2019-02-26 | 2019-02-26 | A kind of embedded firm joint device of chip for cell phone |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209266616U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115038259A (en) * | 2022-08-10 | 2022-09-09 | 江苏津芯集成电路技术有限公司 | Intelligent installation system for single chip microcomputer chip |
-
2019
- 2019-02-26 CN CN201920239348.4U patent/CN209266616U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115038259A (en) * | 2022-08-10 | 2022-09-09 | 江苏津芯集成电路技术有限公司 | Intelligent installation system for single chip microcomputer chip |
| CN115038259B (en) * | 2022-08-10 | 2022-10-28 | 江苏津芯集成电路技术有限公司 | Intelligent installation system for single chip microcomputer chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: Building 5, No. 57, Jinfu Avenue, Gunan street, Qijiang District, Chongqing Patentee after: Huaxin Zhizao Microelectronics (Chongqing) Co.,Ltd. Address before: Building 5, No. 57, Jinfu Avenue, Guinan street, Qijiang County, Chongqing Patentee before: Huaxin Zhisheng Microelectronics (Chongqing) Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190816 |