CN209265140U

CN209265140U - A kind of big beam angle Mini LED backlight mould group

Info

Publication number: CN209265140U
Application number: CN201821942645.7U
Authority: CN
Inventors: 华斌; 黄慧诗
Original assignee: Jiangsu Xinguanglian Semiconductors Co Ltd; JIANGSU XINGUANGLIAN TECHNOLOGY Co Ltd
Current assignee: Jiangsu Xinguanglian Semiconductors Co Ltd; JIANGSU XINGUANGLIAN TECHNOLOGY Co Ltd
Priority date: 2018-11-23
Filing date: 2018-11-23
Publication date: 2019-08-16
Anticipated expiration: 2028-11-23

Abstract

The utility model belongs to LED technical field of liquid crystal display, a kind of big beam angle Mini LED backlight mould group is provided, including substrate, it is characterized in that, inverted trapezoidal pit is equipped in the substrate, the white ink layer for being deposited with metal conducting layer on the substrate and being covered on metal conducting layer, Mini LED chip is equipped in inverted trapezoidal pit, the Mini LED chip lower electrode is with for the metal conducting layer that Mini LED core plate electrode is drawn to be electrically connected, and Mini LED chip side is contacted with white ink layer；The light-emitting angle of the mini LED chip of the utility model backlight module greatly increases, so that mini LED chip needed for liquid crystal display panel greatly reduces, the material cost of backlight panel is effectively reduced, while the failure rate of chip reduces, and improves the yield of backlight panel.

Description

A kind of big beam angle Mini LED backlight mould group

Technical field

The utility model relates to a kind of Mini LED backlight mould group, especially a kind of big beam angle Mini LED backlight mould Group belongs to LED technical field of liquid crystal display.

Background technique

As masses pursue super clear display, display technology needs more high contrast, referred to as secondary epoch display technology Micro LED becomes the field that many manufacturers are actively laid out.But at present due to the bottleneck by various technologies, Micro LED is also Reach formal volume production far away, then Mini LED just comes into being.Using the LCD(liquid crystal of Mini LED backlight technology) display Screen is far superior to current LCD display in brightness, contrast, color rendition and energy conservation, it might even be possible to it is competed with AMO LED, It also can control production cost simultaneously.Since the LED quantity for panel backlit greatly increases, new technology can be largely Improve the HDR performance of LCD screen.

In general, Mini LED's is related with luminance needed for complete machine thickness and backlight using number, since electronics produces Product are constantly required recently towards thin design, and as complete machine thickness reduces, the light mixing area retained in backlight is bound to shorten, however In order to maintain good optical appearance, the use number of Mini LED is high.By taking standard smart phone as an example, 5 English Very little mobile phone display screen includes about 25 LED chips, and Mini LED backlight may include 9000 to 10000 chips；If Want to maintain thin design but reduce the LED number used again simultaneously, opening LED light-emitting angle is a key subject.

As shown in Figure 1, for the Mini LED backlight mould group schematic diagram for LCD.001 is circuit base plate, 008 for based on The Mini LED chip of LED inverted structure, 005 is liquid crystal display panel, and 004 is light mixing area；The beam angle of usual Mini LED chip Degree between 120 ° ~ 130 °, for frivolous design, the height distance trend in light mixing area be it is smaller and smaller so that liquid crystal display panel It is more and more closer at a distance from Mini LED chip, since the light-emitting angle of Mini LED chip is smaller, so that we need more Chip meet the backlight demand of entire panel；The cost for increasing the backlight module of production panel, since chip is more, meaning Taste higher failure of chip rate, reduce the yield of entire panel.

Summary of the invention

The purpose of the utility model is to overcome existing defect, provide a kind of big beam angle Mini LED backlight mould group and Its production method, under light mixing distance same as existing backlight module, due to the backlight module mini LED chip go out Angular greatly increases, so that mini LED chip needed for liquid crystal display panel greatly reduces, effectively reduces the material of backlight panel Expect cost, while the failure rate of chip reduces, and improves the yield of backlight panel.

To realize the above technical purpose, the technical solution adopted in the utility model is: a kind of big beam angle Mini LED back Optical mode group, including substrate, which is characterized in that be equipped with inverted trapezoidal pit in the substrate, be deposited with metal on the substrate Conductive layer and the white ink layer being covered on metal conducting layer are equipped with Mini LED chip in inverted trapezoidal pit, described Mini LED chip lower electrode with for the metal conducting layer that Mini LED core plate electrode is drawn to be electrically connected, and Mini LED Chip sides are contacted with white ink layer.

Further, the depth of the inverted trapezoidal pit is greater than the thickness of Mini LED chip, and inverted trapezoidal pit bottom Inverted trapezoidal base angle angle be greater than °.

Further, the substrate includes ceramic substrate, PCB editions or other insulating sheet materials.

In order to further realize the above technical purpose, the utility model also proposes a kind of big beam angle Mini LED backlight mould The production method of group, characterized in that include the following steps:

Step 1 chooses a substrate as backlight module wiring board, and uses photoetching technique, and figure is formed on substrate Change mask layer；

Step 2 performs etching substrate under the blocking of Patterned masking layer by dry etching, on substrate To inverted trapezoidal pit；

Step 3 removes Patterned masking layer, and the substrate of backlight module is made；

Step 4 deposits the patterned metal for carrying out circuit connection to chip and leads on the substrate of backlight module Electric layer；

Step 5 deposits the white ink layer of a layer pattern on metal conducting layer；

Mini LED flip chip is welded on the metal conducting layer in inverted trapezoidal pit by step 6, and Mini LED The electrode of flip-chip is connect with metal conducting layer, completes the production of Mini LED backlight mould group.

Further, described to carry out dry etching to substrate in the step 2, the dry etching includes CP etching, By controlling the technique that ICP is etched, RF power and etching apparatus upper/lower electrode power are adjusted, enhances lateral etching, reaches It is etched to inverted trapezoidal, forms the pit of inverted trapezoidal.

Further, the depth of the inverted trapezoidal pit is greater than Mini LED chip thickness, and inverted trapezoidal pit bottom The angle at inverted trapezoidal base angle be greater than °.

From the above, it can be seen that the utility model has the beneficial effects that:

1) the utility model is patterned processing by the substrate to backlight module, forms certain depth, wide-angle Inverted trapezoidal pit, Mini LED chip are arranged in each independent pit, so that the utility model Mini LED chip goes out Angular can reach 130 ° to 150 °, and light-emitting angle increases, and Mini LED chip needed for entire liquid crystal display panel can greatly reduce；

2) compared with the structure of existing backlight module shown in FIG. 1, under same light mixing distance, the utility model is entire Mini LED chip needed for liquid crystal display panel can greatly reduce, and effectively reduce production backlight module cost, while less core Piece means lower failure rate, therefore can also promote the yield of entire panel.

Detailed description of the invention

Fig. 1 is the Mini LED backlight mould group schematic diagram for being used for LCD in the prior art.

Fig. 2 is the big beam angle Mini LED backlight mould group schematic diagram of the utility model.

Fig. 3 is the schematic cross-sectional view for forming Patterned masking layer in the utility model embodiment 1 on substrate.

Fig. 4 is the schematic cross-sectional view that inverted trapezoidal pit is formed in the utility model embodiment 1.

Fig. 5 is that the schematic cross-sectional view after Patterned masking layer is removed in the utility model embodiment 1.

Fig. 6 is the schematic cross-sectional view that conductive metal layer is formed in the utility model embodiment 1.

Fig. 7 is the schematic cross-sectional view that white ink layer is formed in the utility model embodiment 1.

Description of symbols: 001- substrate, 002- Patterned masking layer, 003- inverted trapezoidal pit, 004- light mixing area, 005- Liquid crystal display panel, 006- metal conducting layer, 007- white ink layer, 008-Mini LED chip.

Specific embodiment

Below with reference to specific drawings and examples, the utility model is described in further detail.

Embodiment 1: a kind of big beam angle Mini LED backlight mould group, including substrate 001 are equipped in the substrate 001 Inverted trapezoidal pit 003, the white for being deposited with metal conducting layer 006 on the substrate 001 and being covered on metal conducting layer 006 Ink layer 007, in inverted trapezoidal pit 003 be equipped with Mini LED chip 008,008 lower electrode of Mini LED chip with Metal conducting layer 006 for drawing 008 electrode of Mini LED chip is electrically connected, and 008 side of Mini LED chip with it is white Color ink layer 007 contacts；

The depth of the inverted trapezoidal pit 003 is greater than the thickness of Mini LED chip 008, and 003 bottom of inverted trapezoidal pit Inverted trapezoidal base angle angle be greater than 130 °.

Substrate 001 in the present embodiment includes ceramic substrate, PCB editions or other insulating sheet materials.

The production method of the big beam angle Mini LED backlight mould group of one of embodiment as above, includes the following steps:

Step 1 chooses a substrate 001 and is used as backlight module wiring board, and uses photoetching technique, the shape on substrate 001 At Patterned masking layer 002；

Step 2 performs etching substrate 001, under the blocking of Patterned masking layer 002 in base by dry etching Inverted trapezoidal pit 003 is obtained on plate；

Described to carry out dry etching to substrate 001, the dry etching includes CP etching, passes through the technique etched to ICP It is controlled, adjusts RF power and etching apparatus upper/lower electrode power, enhance the dynamics of lateral etching, reach inverted trapezoidal etching, Form the pit 003 of inverted trapezoidal；

The depth of the inverted trapezoidal pit 003 is greater than the thickness of Mini LED chip 008, and 003 bottom of inverted trapezoidal pit Inverted trapezoidal base angle angle be greater than 130 °；

Step 3 removes Patterned masking layer 002, and the substrate of backlight module is made；

Step 4 is deposited patterned for carrying out the gold of circuit connection to chip on the substrate 001 of backlight module Belong to conductive layer 006；

Formed in the present embodiment patterned metal conducting layer 006 can in several ways, 1, by deposited metal, Metal layer is performed etching again, obtains patterned metal conducting layer 006；2, by photoetching process, in pattern mask plate It blocks down, deposited metal layer, then lift-off mask plate and the metal of top, obtains patterned metal conducting layer 006；3, pass through silk Net printing technology obtains patterned metal conducting layer 006；

Step 5, by photoetching process, deposits the white ink layer 007 of a layer pattern on metal conducting layer 006；

As formation metal conducting layer 006, patterned white ink layer 007 can also be obtained in several ways；Instead The white ink layer 007 of penetrating property acts on of both mainly having, first is that the insulating layer as metal conducting layer 006, second is that conduct The reflecting layer of 008 emergent light of Mini LED chip, for increasing the light reflectivity of substrate 001；

Metal conducting layer of the step 6 by the electrode welding of Mini LED flip chip 008 in inverted trapezoidal pit 003 On 006, and the electrode of Mini LED flip chip 008 is electrically connected with metal conducting layer 006, completes Mini LED backlight mould group Production；

It is located in the pit 003 of inverted trapezoidal due to Mini LED chip 008, is had in the pit 003 of inverted trapezoidal for reflecting White ink layer 007, therefore the emergent light of every chips through white ink layer 007 reflection after project, light-emitting angle with fall The increase of trapezium base angle and increase.

The utility model and embodiments thereof are described above, description is not limiting, shown in the drawings It also is one of the embodiments of the present invention, actual structure is not limited to this.If the ordinary skill people of this field Member is enlightened by it, without deviating from the purpose of the present invention, is not inventively designed and the technical solution Similar frame mode and embodiment, all should belong to the protection range of the utility model.

Claims

1. a kind of big beam angle Mini LED backlight mould group, including substrate (001), which is characterized in that in the substrate (001) Equipped with inverted trapezoidal pit (003), it is deposited with metal conducting layer (006) on the substrate (001) and is covered on metal conducting layer (006) the white ink layer (007) on is equipped with Mini LED chip (008) in inverted trapezoidal pit (003), the Mini LED chip (008) lower electrode with for the metal conducting layer (006) that Mini LED chip (008) electrode is drawn to be electrically connected, And Mini LED chip (008) side is contacted with white ink layer (007).

2. a kind of big beam angle Mini LED backlight mould group according to claim 1, which is characterized in that the inverted trapezoidal is recessed The depth for cheating (003) is greater than the thickness of Mini LED chip (008), and the inverted trapezoidal base angle of inverted trapezoidal pit (003) bottom Angle is greater than 130 °.

3. a kind of big beam angle Mini LED backlight mould group according to claim 1, which is characterized in that the substrate It (001) include ceramic substrate, PCB editions or insulating sheet material.