CN209249454U - A kind of power semiconductor contact element - Google Patents
A kind of power semiconductor contact element Download PDFInfo
- Publication number
- CN209249454U CN209249454U CN201821859640.8U CN201821859640U CN209249454U CN 209249454 U CN209249454 U CN 209249454U CN 201821859640 U CN201821859640 U CN 201821859640U CN 209249454 U CN209249454 U CN 209249454U
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- Prior art keywords
- contact
- flange
- contact jaw
- power semiconductor
- contact element
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Abstract
The utility model discloses a kind of power semiconductor contact elements, including the first contact jaw, the second contact jaw and hollow contacting pipe, hollow contacting pipe is set as hollow tubular, and the first contact jaw and the second contact jaw are separately positioned on the both ends of hollow contacting pipe, and are in same design；First contact jaw is provided with the first flange, and the second contact jaw is provided with the second flange.Both ends make contact element not have to distinguish front and back sides when in use in same design.A kind of power semiconductor contact element of the utility model, in conjunction with existing product H-type and T-type the advantages of so that contact element manufacturing cost it is low, it is easy to operate, have stable performance.
Description
Technical field
The utility model relates to electronic field more particularly to a kind of power semiconductor contact elements.
Background technique
The contact element that may be coupled to other elements is needed in power semiconductor modular, contact element needs can be led
It is electric and easy to operate.Existing contact element has H-type and T-type, and the contact element of H-type does not need to distinguish front and back sides when installing, but right
Manufacturing requirements is relatively high, can not accomplish that punching press is integrally formed, and at high cost, the contact element of T-type is simple to manufacture, punching press one
Molding, but need to distinguish front and back sides when installation, it is complicated for operation.In addition, contact element needs to be stably installed in circuit board, keep away
Exempt to generate shaking in generating mechanical stress or vibration, to influence its function.
Therefore, those skilled in the art are dedicated to providing a kind of power semiconductor contact element, in conjunction with the H-type of existing product
And the advantages of T-type so that contact element manufacturing cost it is low, it is easy to operate, have stable performance.
Utility model content
The utility model is to develop one kind to solve the problems such as existing contact element manufacturing cost is high, complicated for operation
Power semiconductor contact element so that contact element manufacturing cost it is low, it is easy to operate, with stable solderability.
The utility model provides a kind of power semiconductor contact element, including the first contact jaw, the second contact jaw and in
Empty contacting pipe, hollow contacting pipe are set as hollow tubular, and the first contact jaw and the second contact jaw are separately positioned on hollow contacting pipe
Both ends, and be in same design；First contact jaw is provided with the first flange, and the first flange has one with plane and continuously connects
Region is touched, and the first contact jaw is divided into one or more snippets by the first flange；Second contact jaw is provided with the second flange, and second is convex
Edge and plane have a continuous contact area, and the second contact jaw is divided into one or more snippets by the second flange.Both ends are in
Same design makes contact element not have to distinguish front and back sides when in use.
Further, power semiconductor contact element setting is integrally formed.Preferably integrated punching forms.
Further, the cross section outer rim of the first contact jaw is provided in round or abnormity, outside the cross section of the second contact jaw
Edge is provided in round；The cross section outer rim of first flange is provided in round or abnormity, the cross section outer rim of the second flange are set as
It is round.Circular cross section outer rim reduces the complexity of production technology.
Further, the cross section outer rim of the first flange is provided in round；The cross section outer rim of second flange is set as round
Shape.
Further, the maximum radius of the first flange be less than or equal to the first contact jaw radius, the second flange maximum half
Diameter is less than or equal to the radius of the second contact jaw.And circuit board when flange is connect with circuit board, contact face is higher than circuit board, i.e.,
Between have gap, facilitate welding.
Further, the first flange and the first contact jaw are provided with joint face, and the second flange is provided with the second contact jaw
Joint face.The setting of joint face is so that welding is stronger.
Further, the first flange setting identical with the second flange both ends, therefore, when use do not need to distinguish positive and negative
Face.
Further, power semiconductor contact element is set as using copper as raw material.
Further, hollow contacting pipe is set as fillet with the first contact jaw and connects, hollow contacting pipe and the second contact jaw
It is set as fillet connection.The connection type of fillet to be integrally formed more convenient.
Further, the connection type of the first contact jaw and hollow contacting pipe is set as funnel type, and the second contact jaw is in
The connection type of empty contacting pipe is set as funnel type.Funnel type interface simplifies the precision of operation in operation.
The power semiconductor contact element of the utility model, structure is simple, simple production process, at low cost, operates more square
Just and energy with good stability.
Detailed description of the invention
Fig. 1 is a kind of schematic diagram for power semiconductor contact element that an embodiment of the utility model provides.
Fig. 2 is a kind of main view for power semiconductor contact element that an embodiment of the utility model provides.
Fig. 3 is a kind of top view for power semiconductor contact element that an embodiment of the utility model provides.
Fig. 4 is a kind of schematic diagram for power semiconductor contact element that the another embodiment of the utility model provides.
Fig. 5 is a kind of main view for power semiconductor contact element that the another embodiment of the utility model provides.
Fig. 6 is a kind of top view for power semiconductor contact element that another embodiment of the utility model provides.
Fig. 7 is a kind of top view of the power semiconductor contact element provided of the embodiments of the present invention.
Specific embodiment
The utility model is described further with reference to the accompanying drawings and detailed description.
Embodiment one
As described in Figure 1, it present embodiments provides a kind of power semiconductor contact element, including the first contact jaw 2, second connects
Contravention 3 and hollow contacting pipe 1, hollow contacting pipe 1 are set as hollow tubular, specially cylindrical tube and have cylinder axis, the
One contact jaw 2 and the second contact jaw 3 are separately positioned on the both ends of hollow contacting pipe 1, and are in same design；Such as the institute of Fig. 1,3,6
Show, the first contact jaw 2 is provided with the first flange 4, and the first flange 4 has a continuous contact area, and first with plane
First contact jaw is divided into one or more snippets second contact jaw 3 and is provided with the second flange 5, the second flange 5 and plane by flange 4
With a continuous contact area, and second contact jaw is divided into one or more snippets by the second flange 5.Both ends are in identical
Design is not so that contact element has to distinguish front and back sides when in use.Power semiconductor contact element setting in this implementation is integrated
Molding, preferably integrated punching form.
Wherein, the cross section outer rim of the first contact jaw is provided in round, and the cross section outer rim of the second contact jaw is set as round
Shape；The cross section outer rim of first flange 4 is provided in round, and the cross section outer rim of the second flange 5 is provided in round, as shown in Figure 6.
First contact jaw is divided into one section by the first flange 4, is a continuous annular 8；Second contact jaw is divided by the second flange 5
One section, be equally a continuous annular.Circular cross section outer rim reduces the complexity of production technology.
Wherein, the cross section outer rim of the first contact jaw is provided in round, and the cross section outer rim of the second contact jaw is set as round
Shape；The cross section outer rim of first flange 4 is set as abnormity, and the cross section outer rim of the second flange 5 is set as abnormity, as shown in Figure 3.
First contact jaw 2 is divided into 3 sections of discontinuous parts by the first flange 4；Second contact jaw is divided into 3 sections discontinuously by the second flange
Part.
As shown in figures 1 and 3, the radius of the first flange 4 is not more than the radius of the first contact jaw 2, the radius of the second flange
No more than the radius of the second contact jaw.The radius of the flange of the present embodiment is less than the radius of contact jaw, when flange and circuit board
And circuit board when plane connects, flange and circuit board plane only have a continuous contact surface, and contact jaw is higher than circuit board, i.e.,
Between have gap, facilitate welding.The identical setting in both ends, therefore, when use, does not need to distinguish front and back sides.Power semiconductor connects
Touching element is set as using copper as raw material.
Power semiconductor contact element in the present embodiment is usually first directly by power semiconductor contact element when in use
One end of part is placed on circuit boards, for example, the first flange is put on circuit boards in the present embodiment, the second flange upward and
Far from circuit board, then by solder be applied between the first contact jaw and circuit board and the second flange longitudinal direction outer rim it
Outside, then in the outermost heating and melting solder of solder and it is cooled to its fusing point or less.Such welding manner can completely avoid
Solder penetrates into the inside of the hollow contacting pipe of power semiconductor, avoids solder to the bolt in power semiconductor contact element
It impacts.If solder largely penetrates into the hollow tube of contact element, when the size of contact plug is less than in hollow contacting pipe
When portion's diameter, contact plug is not it is possible that the case where contacting.
For the contact by means of contact element with circuit board, usually by the hollow contacting pipe of contact plug insertion contact element
Hollow circuit cylinder axis in, be connected to other electronic components so as to contact plug electric conductivity.Usual contact plug is pros with rounded corners
The cross section outer rim of body, i.e. contact plug is square, and four angles of square are fillet.When the catercorner length of contact plug is big
When the inside diameter of hollow contacting pipe, hollow contact is empty will to occur slight deformation.
The power semiconductor contact element of the utility model, structure is simple, simple production process, at low cost, operates more square
Just and energy with good stability.
Embodiment two
The present embodiment has done improvement the present embodiment on the basis of example 1, to the shape of the first flange and the second flange
In the first flange and the second flange be abnormity, specifically increase N number of projecting block, the cross section shape of projecting block on the basis of cricoid
Shape can preferably be square, rectangle, sector, abnormity etc., and preferably 4, as shown in Figure 4 and Figure 5.In the present embodiment, the
The maximum gauge of one flange is equal to the diameter of the first contact jaw, and the maximum gauge of the second flange is equal to the diameter of the second contact jaw.
Therefore, the first contact jaw is divided into discontinuous 3 sections by the first flange, and the second contact jaw is divided into discontinuous by the second flange
4 sections.The first flange and the second flange of abnormity can increase the contact area of power semiconductor contact element and circuit board, guarantee
Power semiconductor contact element and circuit board are in close contact.
Embodiment three
The present embodiment is modified on the basis of example 1, and the first flange includes N number of unconnected cynapse, and cynapse is set
It is set to along the first flange horizontal extension, it is vertical with cylinder axis and highly consistent with the height of the first flange.The number of cynapse
Setting is between 3-6, and preferably 5.Unconnected cynapse can correspondingly form a grading ring, the outside half of grading ring
Diameter is 0.5mm-1mm bigger than inner radial, and the outer radius of cynapse is 0.3mm-2mm bigger than the outer radius of flange, each cynapse
Independently of each other, the radius of each cynapse is set as identical, may be set to be difference.In the present embodiment, the half of the first flange 4
Diameter less than the first contact jaw radius, and the radius of the first contact jaw be not less than cynapse maximum radius.The height of first flange
Height than the first contact jaw is compared, and 1.5mm is not more than.
In the present embodiment, as shown in fig. 7, Fig. 7 shows that hollow contacting pipe has outer radius and inner radial, outside half
Diameter is 0.15-0.5mm bigger than inner radial, i.e., the thickness of hollow contacting pipe is about 0.15-0.5mm.The axis of hollow contacting pipe with
First contact transverse plane and second connects transverse plane and is mutually perpendicular to.
The contact element of the present embodiment uses and welding method is similar to embodiment one, but the present embodiment and embodiment one
It compares, is suitble to weld using liquid, i.e., after cynapse and circuit board contacts, liquid can be injected in unconnected part between cynapse
Then body solder welds and waits cooling and shapings.
The power semiconductor contact element of the present embodiment with there is cynapse, be not connected between cynapse, therefore have gap, be applicable in
It is welded in using solid, for example is suitble to welding wire welding, be also applied for liquid welding.
Example IV
The present embodiment is modified on the basis of embodiment one, two and three, as shown in Figure 1, hollow contacting pipe 1 and first
Contact jaw 2 is set as fillet connection, and hollow contacting pipe 1 is set as fillet with the second contact jaw 3 and connects.The moulding of fillet to make
Type is more beautiful.The connection type of fillet to be integrally formed more convenient.
Embodiment five
As shown in fig. 7, the first contact jaw is set as funnel type, the second contact jaw is set as funnel type.As shown in figure 3, the
Least radius inside one contact jaw is identical as the radius of hollow contacting pipe, and the maximum radius inside the first contact jaw connects with first
Least radius ratio inside contravention is 1.5:1.As shown in figure 3,61 be the inner radial of hollow contacting pipe, 62 the first contact jaws
Funnel inner face.Funnel type interface simplifies the precision of operation in operation.
The contact element of the present embodiment has funnel type interface, so that contact plug can with fast accurate be inserted into contact element
Hollow contacting pipe in.
Embodiment six
The present embodiment improves on the basis of example 1, and the first flange and the first contact jaw are provided with the first connection
Face, the second flange and the second contact jaw are provided with the second joint face.The setting of joint face avoids generating gap when so that welding, more
Add securely.
Embodiment seven
The present embodiment is improved on the basis of embodiment five, is welded for convenience, the firmness with welding, the
One joint face and the second joint face are set as arcuation joint face, at the same by original the first contact jaw in fully horizontal state and
Second contact jaw is set as edge and upwarps, wherein edge upwarp refer to the first contact jaw and the second contact jaw from horizontal direction to
The bending of hollow contact tube portion the first contact jaw or second connects when the first contact jaw or the second contact jaw and circuit board contacts
The edge of contravention is upwarped relative to circuit board, maximum height setting of the edge of the first contact jaw or the second contact jaw far from circuit board
For 0.1~0.3mm.Space height is provided between edge and circuit board, convenient for welding.
The power semiconductor contact element of the utility model, structure is simple, simple production process, at low cost, operates more square
Just and energy with good stability.
In addition, contact element is chosen as the shape using non-cylinder, it is square, rectangular for being also possible to cross section outer rim
Shape, triangle, ellipse or other shapes.But contact element both ends be designed to it is identical so that contact element is easy to be integrally formed,
Reduce production cost.
The preferred embodiments of the present invention have been described in detail above.It should be appreciated that the ordinary skill people of this field
Member according to the present utility model can conceive without creative work makes many modifications and variations.Therefore, all this technology necks
Technical staff passes through logic analysis, reasoning or limited reality according to the design of the utility model on the basis of existing technology in domain
Available technical solution is tested, it all should be within the scope of protection determined by the claims.
Claims (6)
1. a kind of power semiconductor contact element, which is characterized in that including the first contact jaw, the second contact jaw and hollow contact
Pipe, the hollow contacting pipe are set as hollow tubular, and first contact jaw and second contact jaw are separately positioned on described
The both ends of hollow contacting pipe, and be in same design；First contact jaw is provided with the first flange, first flange and flat
Face has a continuous contact area, and first contact jaw is divided into one or more snippets by first flange；It is described
Second contact jaw is provided with the second flange, and second flange and plane have a continuous contact area, and described the
Second contact jaw is divided into one or more snippets by two flanges.
2. a kind of power semiconductor contact element as described in claim 1, which is characterized in that the power semiconductor contact element
Part setting is integrally formed.
3. a kind of power semiconductor contact element as described in claim 1, which is characterized in that first contact jaw it is transversal
Face outer rim is provided in round, and the cross section outer rim of second contact jaw is provided in round；Outside the cross section of first flange
Edge is provided in round or abnormity, and the cross section outer rim of the second flange is provided in round or abnormity.
4. a kind of power semiconductor contact element as described in claim 1, which is characterized in that first flange and described the
One contact jaw is provided with joint face, and second flange and second contact jaw are provided with joint face.
5. a kind of power semiconductor contact element as described in claim 1, which is characterized in that the power semiconductor contact element
Part is set as using copper as raw material.
6. a kind of power semiconductor contact element as described in claim 1, which is characterized in that the hollow contacting pipe and described
First contact jaw is set as fillet connection, and the hollow contacting pipe is set as fillet with the second contact jaw and connects.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821859640.8U CN209249454U (en) | 2018-11-06 | 2018-11-06 | A kind of power semiconductor contact element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821859640.8U CN209249454U (en) | 2018-11-06 | 2018-11-06 | A kind of power semiconductor contact element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209249454U true CN209249454U (en) | 2019-08-13 |
Family
ID=67527973
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821859640.8U Active CN209249454U (en) | 2018-11-06 | 2018-11-06 | A kind of power semiconductor contact element |
Country Status (1)
| Country | Link |
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| CN (1) | CN209249454U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300872A (en) * | 2018-11-06 | 2019-02-01 | 杭州中好蔚莱电子有限公司 | A kind of power semiconductor contact element |
| CN113035790A (en) * | 2019-12-24 | 2021-06-25 | 株洲中车时代半导体有限公司 | Welding base and power semiconductor module |
-
2018
- 2018-11-06 CN CN201821859640.8U patent/CN209249454U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109300872A (en) * | 2018-11-06 | 2019-02-01 | 杭州中好蔚莱电子有限公司 | A kind of power semiconductor contact element |
| CN113035790A (en) * | 2019-12-24 | 2021-06-25 | 株洲中车时代半导体有限公司 | Welding base and power semiconductor module |
| CN113035790B (en) * | 2019-12-24 | 2024-04-02 | 株洲中车时代半导体有限公司 | Welding base and power semiconductor module |
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