CN209246546U - Semiconductor waterproof material drying equipment - Google Patents
Semiconductor waterproof material drying equipment Download PDFInfo
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- CN209246546U CN209246546U CN201822086505.0U CN201822086505U CN209246546U CN 209246546 U CN209246546 U CN 209246546U CN 201822086505 U CN201822086505 U CN 201822086505U CN 209246546 U CN209246546 U CN 209246546U
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- heat
- semiconductor
- drying
- waterproof material
- woven fabrics
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Abstract
The utility model provides a kind of semiconductor waterproof material drying equipment, including rack, the rack is equipped with drying cabinet, the glue non-woven fabrics apparatus for placing that oozes is equipped in the drying box body, drying unit is equipped in the drying box body, the drying unit includes heating device, air supply device, hot wet wind collection device, is additionally provided with heat-exchanger rig in the rack, the heat-exchanger rig is located at the outside of the drying cabinet, and the heat-exchanger rig is connect with the hot wet wind collection device and the drying cabinet；Hot wind is provided by the heating device and air supply device, under the action of hot wind, separate the moisture to ooze on glue non-woven fabrics to ooze on glue non-woven fabrics apparatus for placing described in being placed on, the hot wet wind collection device collects hot wet wind, by the heat-exchanger rig moisture export come, thermal energy reenters the drying box body recycling, and the setting of the heat-exchanger rig allows the thermal energy to reuse, saved resource and use cost.
Description
Technical field
The utility model relates to a kind of drying equipments.
Specifically, being to be related to a kind of semiconductor waterproof material drying equipment.
Background technique
The intermediate of building materials waterproof material ooze glue non-woven fabrics manufacturing process in the non-woven fabrics drying that needs to ooze after glue, it is existing
Drying course be with traditional boiler be to heat conduction oil by fuel combustion, using pipeline to tunnel baking box,
Operating costs are high, and there are also inflammable possibility.
Utility model content
The purpose of the utility model is to overcome the shortcomings of above-mentioned traditional technology, provide a kind of semiconductor waterproof material
Drying equipment.
The purpose of this utility model is reached by following technical measures: semiconductor waterproof material drying equipment, packet
Including rack, the rack are equipped with drying cabinet, are equipped with the glue non-woven fabrics apparatus for placing that oozes, the drying box in the drying box body
It is equipped with drying unit in vivo, the drying unit includes heating device, and the heating device is located at the glue non-woven fabrics placement of oozing
The lower section of device；Air supply device, the air supply device are located at the lower section of the heating device；Hot wet wind collection device, the heat
Wet wind collection device is located at the top of the glue non-woven fabrics apparatus for placing that oozes；Heat-exchanger rig is additionally provided in the rack, it is described to change
Thermal is located at the outside of the drying cabinet, and the heat-exchanger rig and the hot wet wind collection device and the drying cabinet
Connection.
As an improvement the heat-exchanger rig includes heat exchange cabinet；Heat exchanger tube is equipped in the heat exchange box body, it is described to change
Heat pipe is equipped with cold wind import, and the outlet of the heat exchanger tube extends in the drying box body, and is located under the heating device
Side；The heat exchange cabinet is equipped with the hot air pipe connecting with the hot wet wind collection device, and the lower section of the heat exchange cabinet is equipped with
Condensation-water drain.
As a further improvement, the heat exchanger tube is coil pipe type heat exchanger tube, and the heat exchanger tube is equipped with several heat dissipations
Wing.
As a further improvement, the glue non-woven fabrics apparatus for placing that oozes includes:
Rack, the both ends of the rack extend horizontally away the two sidewalls of the drying cabinet respectively；
Conveyer belt is arranged on the rack and horizontally rotates.
As a further improvement, the conveyer belt is equipped with several ventholes.
As a further improvement, the heating device includes the semiconductor heating sheet connecting with heating power supply, and described half
Conductor heating sheet is equipped with several semiconductor heat-dissipating wings.
As a further improvement, the hot wet wind collection device includes at least one conical collection cover, the collection
It is provide with and sets in the top of the glue non-woven fabrics apparatus for placing that oozes；The collection conduit being connect with the collecting hood, the collection conduit
It extends to the drying box in vitro and is connect with the hot air pipe.
As a further improvement, the air supply device includes at least one fan connecting with blower, the fan position
In the lower section of the heating device.
By adopting the above-described technical solution, semiconductor waterproof material drying equipment, including rack, the rack are equipped with
Cabinet is dried, the glue non-woven fabrics apparatus for placing that oozes is equipped in the drying box body, drying unit is equipped in the drying box body, it is described
Drying unit includes heating device, and the heating device is located at the lower section of the glue non-woven fabrics apparatus for placing that oozes；Air supply device, institute
State the lower section that air supply device is located at the heating device；Hot wet wind collection device, the hot wet wind collection device ooze positioned at described
The top of glue non-woven fabrics apparatus for placing；Heat-exchanger rig is additionally provided in the rack, the heat-exchanger rig is located at the drying cabinet
Outside, and the heat-exchanger rig is connect with the hot wet wind collection device and the drying cabinet.
Compared with prior art, the utility model has the advantages that: provide hot wind by the heating device and air supply device,
Under the action of hot wind, separate the moisture to ooze on glue non-woven fabrics to ooze on glue non-woven fabrics apparatus for placing described in being placed on,
The hot wet wind collection device collects hot wet wind, by the heat-exchanger rig moisture export come thermal energy reenters the baking
Dry cabinet recycling, the setting of the heat-exchanger rig allow the thermal energy to reuse, have saved resource and use cost.
The utility model is described in further detail with reference to the accompanying drawings and detailed description.
Detailed description of the invention
Attached drawing 1 is the structural schematic diagram of the utility model.
Attached drawing 2 is the structural schematic diagram of heat-exchanger rig described in the utility model.
Specific embodiment
Embodiment: as shown in Fig. 1, semiconductor waterproof material drying equipment, including rack 1, the rack 1, which is equipped with, dries
Dry cabinet 2, the drying cabinet 2 is interior to be equipped with the glue non-woven fabrics apparatus for placing 3 that oozes, and is equipped with drying unit 4 in the drying cabinet 2.
The drying unit 4 includes: heating device 41, and the heating device 41 is located at the glue non-woven fabrics apparatus for placing that oozes
3 lower section；Air supply device 42, the air supply device 42 are located at the lower section of the heating device 41；Hot wet wind collection device 43, institute
State the top that hot wet wind collection device 43 is located at the glue non-woven fabrics apparatus for placing 3 that oozes.
Heat-exchanger rig 5 is additionally provided in the rack 1, the heat-exchanger rig 5 is located at the outside of the drying cabinet 2, and institute
Heat-exchanger rig 5 is stated to connect with the hot wet wind collection device 43 and the drying cabinet 2.
The heat-exchanger rig 5 as shown in Fig. 2 includes heat exchange cabinet 51；It is equipped with heat exchanger tube 52 in the heat exchange cabinet 51,
The heat exchanger tube 52 is coil pipe type heat exchanger tube, and the heat exchanger tube 52 is equipped with several radiating fins 53；The heat exchanger tube 52 is equipped with
Cold wind import 54, the outlet 55 of the heat exchanger tube 52 extend in the drying cabinet 2, and are located under the heating device 41
Side；The heat exchange cabinet 51 is equipped with the hot air pipe 56 connecting with the hot wet wind collection device 43, the heat exchange cabinet 51
Lower section is equipped with condensation-water drain 57.
The glue non-woven fabrics apparatus for placing 3 that oozes includes: rack 31, and the both ends of the rack 31 are extend horizontally away respectively
The two sidewalls of the drying cabinet 2；Conveyer belt 32 is arranged on the rack 31 and horizontally rotates, on the conveyer belt 32
Equipped with several venthole (not shown)s, the venthole setting can more block will be placed on ooze glue non-woven fabrics baking
It is dry.
The heating device 41 includes the semiconductor heating sheet 411 connecting with heating power supply, the semiconductor heating sheet 411
Several semiconductor heat-dissipating wings 412 are equipped with, the setting of the semiconductor heat-dissipating wing 412 can allow thermal energy to be preferably dispersed into sky
Between.
The hot wet wind collection device 43 includes at least one conical collection cover 431, and the collecting hood 431 is arranged in institute
State the top for the glue non-woven fabrics apparatus for placing 3 that oozes；The collection conduit 432 being connect with the collecting hood 431, the collection conduit 432
It extends to outside the drying cabinet 2 and is connect with the hot air pipe 56.
The air supply device 42 includes the fan 422 that at least one connect with blower 421, and the fan 422 is located at described
The lower section of heating device 41；The setting of the fan 422 accelerates the flowing of air in the drying cabinet 2, to be easier
Moisture is allowed to take away.
Hot wind is provided by the heating device 41 and air supply device 42, under the action of hot wind, makes to be placed on and described ooze
The moisture to ooze on glue non-woven fabrics on glue non-woven fabrics apparatus for placing 3 is separated, and it is wet that the hot wet wind collection device 43 collects heat
Wind, by the heat-exchanger rig 5 moisture export come thermal energy reenters the drying cabinet 2 and reuses, the heat exchange dress
The setting for setting 5 allows the thermal energy to reuse, and dries the glue non-woven fabrics that oozes of equivalent amount, traditional one ton of steam of natural gas boiler
Need 3.9 yuan of unit price of 80 cubic natural gas 312 yuan total, it is 333.2 yuan total with 700 degree of 0.476 yuan of electricity unit prices of electric boiler, with this
210 degree of electricity unit prices 0.476 of utility model electricity consumption are 99.96 yuan total, and cost is greatly saved.
Claims (8)
1. semiconductor waterproof material drying equipment, including rack, the rack, which is equipped with, dries cabinet, in the drying box body
Equipped with the glue non-woven fabrics apparatus for placing that oozes, drying unit is equipped in the drying box body, it is characterised in that:
The drying unit includes
Heating device, the heating device are located at the lower section of the glue non-woven fabrics apparatus for placing that oozes；
Air supply device, the air supply device are located at the lower section of the heating device；
Hot wet wind collection device, the hot wet wind collection device are located at the top of the glue non-woven fabrics apparatus for placing that oozes；
Heat-exchanger rig is additionally provided in the rack, the heat-exchanger rig is located at the outside of the drying cabinet, and the heat exchange fills
It sets and is connect with the hot wet wind collection device and the drying cabinet.
2. semiconductor waterproof material drying equipment according to claim 1, it is characterised in that: the heat-exchanger rig includes changing
Hot tank body；Heat exchanger tube is equipped in the heat exchange box body, the heat exchanger tube is equipped with cold wind import, and the outlet of the heat exchanger tube extends to
In the drying box body, and it is located at the lower section of the heating device；The heat exchange cabinet is equipped with to collect with the hot wet wind and fill
The hot air pipe of connection is set, the lower section of the heat exchange cabinet is equipped with condensation-water drain.
3. semiconductor waterproof material drying equipment according to claim 2, it is characterised in that: the heat exchanger tube is coil pipe type
Heat exchanger tube, and the heat exchanger tube is equipped with several radiating fins.
4. semiconductor waterproof material drying equipment according to claim 1, it is characterised in that: the glue non-woven fabrics placement of oozing
Device includes:
Rack, the both ends of the rack extend horizontally away the two sidewalls of the drying cabinet respectively；
Conveyer belt is arranged on the rack and horizontally rotates.
5. semiconductor waterproof material drying equipment according to claim 4, it is characterised in that: if the conveyer belt is equipped with
Dry venthole.
6. semiconductor waterproof material drying equipment according to claim 1, it is characterised in that: the heating device include with
The semiconductor heating sheet of heating power supply connection, the semiconductor heating sheet are equipped with several semiconductor heat-dissipating wings.
7. semiconductor waterproof material drying equipment according to claim 2, it is characterised in that: the hot wet wind collection device
Including at least one conical collection cover, the top of the glue non-woven fabrics apparatus for placing that oozes is arranged in the collecting hood；With it is described
The collection conduit of collecting hood connection, the collection conduit extend to the drying box in vitro and connect with the hot air pipe.
8. semiconductor waterproof material drying equipment according to claim 2, it is characterised in that: the air supply device includes extremely
A few fan connecting with blower, the fan are located at the lower section of the heating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822086505.0U CN209246546U (en) | 2018-12-13 | 2018-12-13 | Semiconductor waterproof material drying equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822086505.0U CN209246546U (en) | 2018-12-13 | 2018-12-13 | Semiconductor waterproof material drying equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209246546U true CN209246546U (en) | 2019-08-13 |
Family
ID=67532681
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822086505.0U Active CN209246546U (en) | 2018-12-13 | 2018-12-13 | Semiconductor waterproof material drying equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209246546U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109569991A (en) * | 2018-12-13 | 2019-04-05 | 寿光市东方无纺布有限公司 | Non-woven fabrics oozes glue semiconductor drying equipment |
-
2018
- 2018-12-13 CN CN201822086505.0U patent/CN209246546U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109569991A (en) * | 2018-12-13 | 2019-04-05 | 寿光市东方无纺布有限公司 | Non-woven fabrics oozes glue semiconductor drying equipment |
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