CN109569991A - Non-woven fabrics oozes glue semiconductor drying equipment - Google Patents
Non-woven fabrics oozes glue semiconductor drying equipment Download PDFInfo
- Publication number
- CN109569991A CN109569991A CN201811521588.XA CN201811521588A CN109569991A CN 109569991 A CN109569991 A CN 109569991A CN 201811521588 A CN201811521588 A CN 201811521588A CN 109569991 A CN109569991 A CN 109569991A
- Authority
- CN
- China
- Prior art keywords
- woven fabrics
- oozes
- glue
- heat
- drying
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001035 drying Methods 0.000 title claims abstract description 65
- 239000003292 glue Substances 0.000 title claims abstract description 45
- 239000004745 nonwoven fabric Substances 0.000 title claims abstract description 44
- 239000004065 semiconductor Substances 0.000 title claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 34
- 230000008676 import Effects 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 238000000338 in vitro Methods 0.000 claims description 2
- 230000009471 action Effects 0.000 abstract description 3
- 238000004064 recycling Methods 0.000 abstract description 2
- 230000006872 improvement Effects 0.000 description 7
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 4
- 230000005611 electricity Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 239000003345 natural gas Substances 0.000 description 2
- 239000004566 building material Substances 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000000446 fuel Substances 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
- B05D3/04—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases
- B05D3/0406—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by exposure to gases the gas being air
- B05D3/0413—Heating with air
Abstract
Ooze glue semiconductor drying equipment the present invention provides a kind of non-woven fabrics, including rack, the rack is equipped with drying cabinet, the glue non-woven fabrics apparatus for placing that oozes is equipped in the drying box body, drying unit is equipped in the drying box body, the drying unit includes heating device, air supply device, hot wet wind collection device, is additionally provided with heat-exchanger rig in the rack, the heat-exchanger rig is located at the outside of the drying cabinet, and the heat-exchanger rig is connect with the hot wet wind collection device and the drying cabinet；Hot wind is provided by the heating device and air supply device, under the action of hot wind, separate the moisture to ooze on glue non-woven fabrics to ooze on glue non-woven fabrics apparatus for placing described in being placed on, the hot wet wind collection device collects hot wet wind, by the heat-exchanger rig moisture export come, thermal energy reenters the drying box body recycling, and the setting of the heat-exchanger rig allows the thermal energy to reuse, saved resource and use cost.
Description
Technical field
The present invention relates to a kind of drying equipments.
Specifically, being to be related to a kind of non-woven fabrics to ooze glue semiconductor drying equipment.
Background technique
The intermediate of building materials waterproof material ooze glue non-woven fabrics manufacturing process in the non-woven fabrics drying that needs to ooze after glue, it is existing
Drying course be with traditional boiler be to heat conduction oil by fuel combustion, using pipeline to tunnel baking box,
Operating costs are high, and there are also inflammable possibility.
Summary of the invention
It is an object of the invention to overcome the shortcoming of above-mentioned traditional technology, a kind of non-woven fabrics is provided and is oozed the baking of glue semiconductor
Dry equipment.
The purpose of the present invention is what is reached by following technical measures: non-woven fabrics oozes glue semiconductor drying equipment, including
Rack, the rack are equipped with drying cabinet, are equipped with the glue non-woven fabrics apparatus for placing that oozes, the drying cabinet in the drying box body
Interior to be equipped with drying unit, the drying unit includes heating device, and the heating device is located at the glue non-woven fabrics that oozes and places dress
The lower section set；Air supply device, the air supply device are located at the lower section of the heating device；Hot wet wind collection device, the heat are wet
Wind collection device is located at the top of the glue non-woven fabrics apparatus for placing that oozes；Heat-exchanger rig, the heat exchange are additionally provided in the rack
Device is located at the outside of the drying cabinet, and the heat-exchanger rig and the hot wet wind collection device and the drying cabinet connect
It connects.
As an improvement the heat-exchanger rig includes heat exchange cabinet；Heat exchanger tube is equipped in the heat exchange box body, it is described to change
Heat pipe is equipped with cold wind import, and the outlet of the heat exchanger tube extends in the drying box body, and is located under the heating device
Side；The heat exchange cabinet is equipped with the hot air pipe connecting with the hot wet wind collection device, and the lower section of the heat exchange cabinet is equipped with
Condensation-water drain.
As a further improvement, the heat exchanger tube is coil pipe type heat exchanger tube, and the heat exchanger tube is equipped with several heat dissipations
Wing.
As a further improvement, the glue non-woven fabrics apparatus for placing that oozes includes:
Rack, the both ends of the rack extend horizontally away the two sidewalls of the drying cabinet respectively；
Conveyer belt is arranged on the rack and horizontally rotates.
As a further improvement, the conveyer belt is equipped with several ventholes.
As a further improvement, the heating device includes the semiconductor heating sheet connecting with heating power supply, and described half
Conductor heating sheet is equipped with several semiconductor heat-dissipating wings.
As a further improvement, the hot wet wind collection device includes at least one conical collection cover, the collection
It is provide with and sets in the top of the glue non-woven fabrics apparatus for placing that oozes；The collection conduit being connect with the collecting hood, the collection conduit
It extends to the drying box in vitro and is connect with the hot air pipe.
As a further improvement, the air supply device includes at least one fan connecting with blower, the fan position
In the lower section of the heating device.
The glue semiconductor drying equipment by adopting the above-described technical solution, non-woven fabrics oozes, including rack are set in the rack
There is drying cabinet, the glue non-woven fabrics apparatus for placing that oozes is equipped in the drying box body, is equipped with drying unit, institute in the drying box body
Stating drying unit includes heating device, and the heating device is located at the lower section of the glue non-woven fabrics apparatus for placing that oozes；Air supply device,
The air supply device is located at the lower section of the heating device；Hot wet wind collection device, the hot wet wind collection device are located at described
Ooze the top of glue non-woven fabrics apparatus for placing；Heat-exchanger rig is additionally provided in the rack, the heat-exchanger rig is located at the drying box
The outside of body, and the heat-exchanger rig is connect with the hot wet wind collection device and the drying cabinet.
Compared with prior art, the invention has the advantages that hot wind is provided by the heating device and air supply device, in heat
Under wind action, separate the moisture to ooze on glue non-woven fabrics to ooze on glue non-woven fabrics apparatus for placing described in being placed on, it is described
Hot wet wind collection device collects hot wet wind, by the heat-exchanger rig moisture export come thermal energy reenters the drying box
Body recycling, the setting of the heat-exchanger rig allow the thermal energy to reuse, have saved resource and use cost.
Present invention will be further explained below with reference to the attached drawings and specific embodiments.
Detailed description of the invention
Attached drawing 1 is structural schematic diagram of the invention.
Attached drawing 2 is the structural schematic diagram of heat-exchanger rig of the present invention.
Specific embodiment
Embodiment: as shown in Fig. 1, non-woven fabrics oozes glue semiconductor drying equipment, including rack 1, and the rack 1 is equipped with
Cabinet 2 is dried, the glue non-woven fabrics apparatus for placing 3 that oozes is equipped in the drying cabinet 2, is equipped with drying unit in the drying cabinet 2
4。
The drying unit 4 includes: heating device 41, and the heating device 41 is located at the glue non-woven fabrics apparatus for placing that oozes
3 lower section；Air supply device 42, the air supply device 42 are located at the lower section of the heating device 41；Hot wet wind collection device 43, institute
State the top that hot wet wind collection device 43 is located at the glue non-woven fabrics apparatus for placing 3 that oozes.
Heat-exchanger rig 5 is additionally provided in the rack 1, the heat-exchanger rig 5 is located at the outside of the drying cabinet 2, and institute
Heat-exchanger rig 5 is stated to connect with the hot wet wind collection device 43 and the drying cabinet 2.
The heat-exchanger rig 5 as shown in Fig. 2 includes heat exchange cabinet 51；It is equipped with heat exchanger tube 52 in the heat exchange cabinet 51,
The heat exchanger tube 52 is coil pipe type heat exchanger tube, and the heat exchanger tube 52 is equipped with several radiating fins 53；The heat exchanger tube 52 is equipped with
Cold wind import 54, the outlet 55 of the heat exchanger tube 52 extend in the drying cabinet 2, and are located under the heating device 41
Side；The heat exchange cabinet 51 is equipped with the hot air pipe 56 connecting with the hot wet wind collection device 43, the heat exchange cabinet 51
Lower section is equipped with condensation-water drain 57.
The glue non-woven fabrics apparatus for placing 3 that oozes includes: rack 31, and the both ends of the rack 31 are extend horizontally away respectively
The two sidewalls of the drying cabinet 2；Conveyer belt 32 is arranged on the rack 31 and horizontally rotates, on the conveyer belt 32
Equipped with several venthole (not shown)s, the venthole setting can more block will be placed on ooze glue non-woven fabrics baking
It is dry.
The heating device 41 includes the semiconductor heating sheet 411 connecting with heating power supply, the semiconductor heating sheet 411
Several semiconductor heat-dissipating wings 412 are equipped with, the setting of the semiconductor heat-dissipating wing 412 can allow thermal energy to be preferably dispersed into sky
Between.
The hot wet wind collection device 43 includes at least one conical collection cover 431, and the collecting hood 431 is arranged in institute
State the top for the glue non-woven fabrics apparatus for placing 3 that oozes；The collection conduit 432 being connect with the collecting hood 431, the collection conduit 432
It extends to outside the drying cabinet 2 and is connect with the hot air pipe 56.
The air supply device 42 includes the fan 422 that at least one connect with blower 421, and the fan 422 is located at described
The lower section of heating device 41；The setting of the fan 422 accelerates the flowing of air in the drying cabinet 2, to be easier
Moisture is allowed to take away.
Hot wind is provided by the heating device 41 and air supply device 42, under the action of hot wind, makes to be placed on and described ooze
The moisture to ooze on glue non-woven fabrics on glue non-woven fabrics apparatus for placing 3 is separated, and it is wet that the hot wet wind collection device 43 collects heat
Wind, by the heat-exchanger rig 5 moisture export come thermal energy reenters the drying cabinet 2 and reuses, the heat exchange dress
The setting for setting 5 allows the thermal energy to reuse, and dries the glue non-woven fabrics that oozes of equivalent amount, traditional one ton of steam of natural gas boiler
Need 3.9 yuan of unit price of 80 cubic natural gas 312 yuan total, it is 333.2 yuan total with 700 degree of 0.476 yuan of electricity unit prices of electric boiler, with this
210 degree of electricity unit prices 0.476 of invention electricity consumption are 99.96 yuan total, and cost is greatly saved.
Claims (8)
- The glue semiconductor drying equipment 1. non-woven fabrics oozes, including rack, the rack are equipped with drying cabinet, the drying cabinet It is interior to be equipped with the glue non-woven fabrics apparatus for placing that oozes, drying unit is equipped in the drying box body, it is characterised in that:The drying unit includesHeating device, the heating device are located at the lower section of the glue non-woven fabrics apparatus for placing that oozes；Air supply device, the air supply device are located at the lower section of the heating device；Hot wet wind collection device, the hot wet wind collection device are located at the top of the glue non-woven fabrics apparatus for placing that oozes；Heat-exchanger rig is additionally provided in the rack, the heat-exchanger rig is located at the outside of the drying cabinet, and the heat exchange fills It sets and is connect with the hot wet wind collection device and the drying cabinet.
- The glue semiconductor drying equipment 2. non-woven fabrics according to claim 1 oozes, it is characterised in that: the heat-exchanger rig includes Exchange heat cabinet；Heat exchanger tube is equipped in the heat exchange box body, the heat exchanger tube is equipped with cold wind import, and the outlet of the heat exchanger tube extends In to the drying box body, and it is located at the lower section of the heating device；The heat exchange cabinet is equipped with to be collected with the hot wet wind The lower section of the hot air pipe of device connection, the heat exchange cabinet is equipped with condensation-water drain.
- The glue semiconductor drying equipment 3. non-woven fabrics according to claim 2 oozes, it is characterised in that: the heat exchanger tube is coiled pipe Formula heat exchanger tube, and the heat exchanger tube is equipped with several radiating fins.
- The glue semiconductor drying equipment 4. non-woven fabrics according to claim 1 oozes, it is characterised in that: the glue nonwoven that oozes is laid Setting device includes:Rack, the both ends of the rack extend horizontally away the two sidewalls of the drying cabinet respectively；Conveyer belt is arranged on the rack and horizontally rotates.
- The glue semiconductor drying equipment 5. non-woven fabrics according to claim 4 oozes, it is characterised in that: the conveyer belt is equipped with Several ventholes.
- The glue semiconductor drying equipment 6. non-woven fabrics according to claim 1 oozes, it is characterised in that: the heating device includes The semiconductor heating sheet connecting with heating power supply, the semiconductor heating sheet are equipped with several semiconductor heat-dissipating wings.
- The glue semiconductor drying equipment 7. non-woven fabrics according to claim 2 oozes, it is characterised in that: the hot wet wind collects dress It sets including at least one conical collection cover, the top of the glue non-woven fabrics apparatus for placing that oozes is arranged in the collecting hood；With institute The collection conduit of collecting hood connection is stated, the collection conduit extends to the drying box in vitro and connect with the hot air pipe.
- The glue semiconductor drying equipment 8. non-woven fabrics according to claim 2 oozes, it is characterised in that: the air supply device includes At least one fan connecting with blower, the fan are located at the lower section of the heating device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811521588.XA CN109569991A (en) | 2018-12-13 | 2018-12-13 | Non-woven fabrics oozes glue semiconductor drying equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201811521588.XA CN109569991A (en) | 2018-12-13 | 2018-12-13 | Non-woven fabrics oozes glue semiconductor drying equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN109569991A true CN109569991A (en) | 2019-04-05 |
Family
ID=65928317
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811521588.XA Pending CN109569991A (en) | 2018-12-13 | 2018-12-13 | Non-woven fabrics oozes glue semiconductor drying equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN109569991A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115365092A (en) * | 2022-08-03 | 2022-11-22 | 江苏百福能源科技有限公司 | Lithium battery surface drying device |
| CN115870185A (en) * | 2022-11-04 | 2023-03-31 | 滁州天鼎丰非织造布有限公司 | Waste heat recovery device for non-woven fabric post-impregnation drying equipment |
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| CN201093703Y (en) * | 2007-08-21 | 2008-07-30 | 王增福 | Semiconductor heat exchange device for electric heating stove |
| KR20130029864A (en) * | 2011-09-16 | 2013-03-26 | (주)보광 | Weaving system of light fabric |
| CN204854236U (en) * | 2015-08-27 | 2015-12-09 | 诺奥(福建)环保家居用品有限公司 | Design drying equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN115365092A (en) * | 2022-08-03 | 2022-11-22 | 江苏百福能源科技有限公司 | Lithium battery surface drying device |
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| CN115870185A (en) * | 2022-11-04 | 2023-03-31 | 滁州天鼎丰非织造布有限公司 | Waste heat recovery device for non-woven fabric post-impregnation drying equipment |
| CN115870185B (en) * | 2022-11-04 | 2024-02-06 | 滁州天鼎丰非织造布有限公司 | Waste heat recovery device for drying equipment after non-woven fabric gum dipping |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20190405 |
|
| RJ01 | Rejection of invention patent application after publication |