CN209232752U - 一种编带机导轨防堵塞装置 - Google Patents
一种编带机导轨防堵塞装置 Download PDFInfo
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- CN209232752U CN209232752U CN201822067711.7U CN201822067711U CN209232752U CN 209232752 U CN209232752 U CN 209232752U CN 201822067711 U CN201822067711 U CN 201822067711U CN 209232752 U CN209232752 U CN 209232752U
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- 239000007787 solid Substances 0.000 claims 1
- 239000004065 semiconductor Substances 0.000 abstract description 7
- 239000002184 metal Substances 0.000 abstract description 6
- 229910052751 metal Inorganic materials 0.000 abstract description 6
- 230000000694 effects Effects 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- BGPVFRJUHWVFKM-UHFFFAOYSA-N N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] Chemical compound N1=C2C=CC=CC2=[N+]([O-])C1(CC1)CCC21N=C1C=CC=CC1=[N+]2[O-] BGPVFRJUHWVFKM-UHFFFAOYSA-N 0.000 description 5
- 238000000034 method Methods 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
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- 229910052742 iron Inorganic materials 0.000 description 1
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CN201822067711.7U CN209232752U (zh) | 2018-12-07 | 2018-12-07 | 一种编带机导轨防堵塞装置 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113328026A (zh) * | 2021-05-28 | 2021-08-31 | 深圳市长方集团股份有限公司 | 一种大功率led芯片封装装置 |
CN113936922A (zh) * | 2021-11-09 | 2022-01-14 | 江苏振华新云电子有限公司 | 一种钽电解电容器加工用防堵塞编带机 |
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Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113328026A (zh) * | 2021-05-28 | 2021-08-31 | 深圳市长方集团股份有限公司 | 一种大功率led芯片封装装置 |
CN113328026B (zh) * | 2021-05-28 | 2022-08-30 | 深圳市长方集团股份有限公司 | 一种大功率led芯片封装装置 |
CN113936922A (zh) * | 2021-11-09 | 2022-01-14 | 江苏振华新云电子有限公司 | 一种钽电解电容器加工用防堵塞编带机 |
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Effective date of registration: 20220623 Address after: 230000 Room 301 and 302, building 4, phase I, mechanical and Electrical Industrial Park, No. 767, Yulan Avenue, high tech Zone, Hefei City, Anhui Province Patentee after: Hefei Huayu Semiconductor Co.,Ltd. Address before: 230088 6th floor, building B, science and technology innovation public service and applied technology R & D center, hewubeng Experimental Zone, No. 860, Wangjiang West Road, high tech Zone, Hefei, Anhui Province Patentee before: HEFEI HUADA SEMICONDUCTOR Co.,Ltd. |
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Address after: 230000, No. 66 Tiantangzhai Road, High tech Zone, Hefei City, Anhui Province Patentee after: Hefei Huayu Semiconductor Co.,Ltd. Country or region after: China Address before: 230000 Room 301 and 302, building 4, phase I, mechanical and Electrical Industrial Park, No. 767, Yulan Avenue, high tech Zone, Hefei City, Anhui Province Patentee before: Hefei Huayu Semiconductor Co.,Ltd. Country or region before: China |
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