CN209231639U - A kind of ACF pressure adsorption device - Google Patents
A kind of ACF pressure adsorption device Download PDFInfo
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- CN209231639U CN209231639U CN201920153115.2U CN201920153115U CN209231639U CN 209231639 U CN209231639 U CN 209231639U CN 201920153115 U CN201920153115 U CN 201920153115U CN 209231639 U CN209231639 U CN 209231639U
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- acf
- pedestal
- glue
- adsorption device
- thermal head
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Abstract
The utility model discloses a kind of ACF to press adsorption device, belongs to technical field of liquid crystal display, including pressure head, pedestal and machine and glue removing structure.Pedestal is located at below thermal head and being capable of bearing glass substrate, ACF material strip is provided between thermal head and pedestal, machine and glue removing structure is set to pedestal side, is configured as extending between thermal head and pedestal, to remove the ACF glue-line of residue glue and ACF material strip initial end on pedestal.The utility model proposes ACF press adsorption device, by the way that machine and glue removing structure is arranged, adsorption device can be pressed to extend between thermal head and pedestal when initializing in ACF to remove the ACF glue-line of ACF material strip initial end, not only easy to operate, work efficiency is high, guarantees that the positive normal pressure of subsequent ACF glue-line is attached, avoid ACF glue-line pressure attached bad, and can by pedestal residue glue or foreign matter remove, avoid the residue glue on pedestal that substrate is caused to tilt, the pressure for influencing ACF glue-line is attached.
Description
Technical field
The utility model relates to technical field of liquid crystal display more particularly to a kind of ACF to press adsorption device.
Background technique
Liquid crystal display is one kind of flat-panel monitor, and liquid crystal display is that liquid crystal is enclosed by upper and lower two panels transparent substrate
It is formed between the liquid crystal display panel of composition.Liquid crystal display panel is connected to printed circuit board by driving circuit, in driving circuit
Lateral electrode is connect with liquid crystal display panel, and the electrode in the outside of driving circuit is connect with printed circuit board.Representative driving circuit
Mounting means has a TAB mode and COG mode, no matter which kind of mode, be all to form wiring on at least both sides of liquid crystal panel surface
The electrode of pattern, electrode and driving circuit in Wiring pattern is electrically connected.
ACF (Anisotropic Conductive Film, anisotropy conductiving glue) glue-line by it is small it is conductive from
Son is evenly dispersed in the binder resin with caking property and is formed, and ACF glue-line is electrically connected to drive circuit board and liquid crystal display panel
Between substrate and between drive circuit board and printed circuit board, to realize that electricity is logical.
In the prior art, ACF presses adsorption device initially or after replacement ACF material strip to initialize in work, needs
ACF material strip is initialized, that is, tears the ACF glue-line of ACF material strip initial end, to avoid ACF glue-line after normal work
It presses attached bad.But may cause residue glue when removing ACF glue-line again and fall on pedestal, cause the glass substrate on pedestal to stick up
It rises, ACF glue-line occurs and glass substrate presses attached bad situation.
Utility model content
The purpose of this utility model is to provide a kind of ACF to press adsorption device, can be realized preferably to press ACF glue-line and is attached to
On glass substrate.
As above design, the technical scheme adopted by the utility model is
A kind of ACF pressure adsorption device, including thermal head and pedestal, the pedestal are located at below the thermal head and can carry
Glass substrate, is provided with ACF material strip between the thermal head and the pedestal, the ACF presses adsorption device further include:
Machine and glue removing structure is set to the pedestal side, is configured as extending between the thermal head and the pedestal, with
Remove the ACF glue-line of the residue glue and the ACF material strip initial end on the pedestal.
Further, the machine and glue removing structure includes actuator and sticky removing component, and the actuator is able to drive the sticky removing
Component moves back and forth.
Further, the sticky removing component is provided with adhered layer towards the thermal head side, and the adhered layer is configured
For the ACF glue-line for matching ACF material strip initial end described in sticky removing with the thermal head, the sticky removing component is towards the pedestal one
Side is provided with hairbrush.
Further, the sticky removing component is provided with adhered layer towards the thermal head side, and the adhered layer is configured
For the ACF glue-line for matching ACF material strip initial end described in sticky removing with the thermal head, the sticky removing component is towards the pedestal one
Side is provided with scraper.
Further, the sticky removing component is provided with adhered layer towards the thermal head side, and the adhered layer is configured
For the ACF glue-line for matching ACF material strip initial end described in sticky removing with the thermal head, the sticky removing component is towards the pedestal one
Side is provided with absorbent module, and the absorbent module is configured as absorbing the residue glue on the pedestal.
It further, further include ACF conveying mechanism, the ACF conveying mechanism includes being respectively arranged at the pedestal two sides
Roller and fixing, and setting traction clip between the roller and the fixing, the traction clip is configured
To be drawn the ACF material strip by the roller to the fixing.
It further, further include cutting mechanism, the cutting mechanism is set between the roller and the pedestal, and energy
Enough glue-lines by the ACF material strip are cut off.
It further, further include heating mechanism, the heating mechanism is set to the free end of the thermal head.
It further, further include that control mechanism and the cephalomotor driving mechanism of the hot pressing, the driving machine can be driven
Structure, machine and glue removing structure are electrically connected to the control mechanism.
The utility model has the beneficial effects that
The utility model proposes ACF press adsorption device, by be arranged machine and glue removing structure, can ACF press adsorption device carry out just
Beginningization extend between thermal head and pedestal when operating and removes the ACF glue-line of ACF material strip initial end, not only easy to operate, work
Make high-efficient, guarantee that the positive normal pressure of subsequent ACF glue-line is attached, avoids ACF glue-line pressure attached bad, and can be by the residue glue on pedestal
Or foreign matter removes, and avoids the residue glue on pedestal that substrate is caused to tilt, the pressure for influencing ACF glue-line is attached.
Detailed description of the invention
Fig. 1 is the schematic diagram for the ACF pressure adsorption device that the utility model embodiment one provides；
Fig. 2 is the schematic diagram for the sticky removing component that the utility model embodiment one provides；
Fig. 3 is the schematic diagram for the sticky removing component that the utility model embodiment two provides；
Fig. 4 is the schematic diagram for the sticky removing component that the utility model embodiment three provides.
In figure:
1, thermal head；2, pedestal；3, ACF material strip；
41, actuator；42, sticky removing component；421, support plate；422, adhered layer；423, hairbrush；424, scraper；425, it inhales
Attached component；
51, roller；52, fixing；53, clip is drawn；
6, cutting mechanism.
Specific embodiment
The technical issues of to solve the utility model, the technical solution of use and the technical effect that reaches are clearer,
Further illustrate the technical solution of the utility model below with reference to the accompanying drawings and specific embodiments.It is understood that
Specific embodiment described herein is used only for explaining the utility model, rather than the restriction to the utility model.In addition it also needs
It is noted that illustrating only part relevant to the utility model for ease of description, in attached drawing and not all.
Fig. 1 is the schematic diagram of ACF pressure adsorption device provided in this embodiment.As shown in Figure 1, present embodiments providing one kind
ACF presses adsorption device, for pressing attached ACF glue-line on liquid crystal display panel or printed circuit board.It includes thermal head that the ACF, which presses adsorption device,
1, pedestal 2 and machine and glue removing structure.Wherein pedestal 2 is located at 1 lower section of thermal head, is used for bearing substrate, and between pedestal 2 and thermal head 1
It is provided with ACF material strip 3, ACF material strip 3 is anisotropic conductive film (Anisotropic Conductive Film), and ACF expects
The ACF glue-line for including peeling paper and being pasted on peeling paper with 3, and in the initial end of ACF material strip 3, the length of peeling paper is big
In the length of ACF glue-line.ACF material strip 3 can be attached on glass substrate by thermal head 1.Machine and glue removing structure is set to pedestal 2 one
Side can extend between thermal head 1 and pedestal 2, to remove the ACF glue-line of 3 initial end of residue glue and ACF material strip on pedestal 2.
By the way that machine and glue removing structure is arranged, adsorption device can be pressed to extend into thermal head 1 and pedestal when initializing in ACF
The ACF glue-line of 3 initial end of ACF material strip is removed between 2, not only easy to operate, work efficiency is high, guarantees subsequent ACF glue-line
Positive normal pressure is attached, avoid ACF glue-line pressure it is attached bad, and can by pedestal 2 residue glue or foreign matter remove, avoid on pedestal 2
Residue glue causes substrate to tilt, and the pressure for influencing ACF glue-line is attached.
As shown in Figure 1, machine and glue removing structure includes actuator 41 and the sticky removing component 42 for being connected to 41 output end of actuator, driving
Part 41 is able to drive the reciprocating motion of sticky removing component 42, and in the present embodiment, actuator 41 can be cylinder or other being capable of band
The structure that dynamic sticky removing component 42 moves reciprocatingly.
Specifically, sticky removing component 42 includes support plate 421, support plate 421 is provided with adhered layer towards 1 side of thermal head
422, adhered layer 422 is configured as matching the ACF glue-line of 3 initial end of sticky removing ACF material strip, 42 court of sticky removing component with thermal head 1
It is provided with to 2 side of pedestal except glue part.In the present embodiment, adhered layer 422 can be for being capable of sticky removing except film, cavernous body etc.
The structure of ACF glue-line, except glue part is hairbrush 423.When ACF pressure adsorption device initializes, actuator 41 drives sticky removing
Component 42 is extend between thermal head 1 and pedestal 2 along the upper surface of pedestal 2, and hairbrush 423 is by the residue glue sticky removing on pedestal 2, simultaneously
By on pedestal 2 impurity or the cleaning such as foreign matter.The pressure of ACF material strip 3 is attached on sticky removing component 42 by 1 downward actuation of subsequent thermal head,
For sticky removing component 42 by the ACF glue-line sticky removing of initial end, subsequent actuator 41 drives the gradually homing of sticky removing component 42, sticky removing group
Hairbrush 423 on part 42 again cleans pedestal 2, and residue that may be present on pedestal 2 is cleared away, and guarantees on pedestal 2
There is no residue, the pressure for influencing subsequent ACF glue-line is attached.
As shown in Figure 1, ACF pressure adsorption device further includes ACF conveying mechanism, ACF conveying mechanism includes being respectively arranged at bottom
The roller 51 and fixing 52 of 2 two sides of seat, and traction clip 53 is provided between roller 51 and fixing 52, draw clip
53 are configured as drawing ACF material strip 3 to fixing 52.Traction clip 53 can press adsorption device to carry out initialization behaviour in ACF
ACF material strip 3 is drawn by roller 51 to fixing 52 when making, and is clamped by fixing 52, due to the length of peeling paper
Greater than ACF material strip 3, therefore the part that fixing 52 clamps is peeling paper, avoids ACF material strip 3 from contacting with fixing 52, makes
ACF material strip 3 is obtained to be adhered in fixing 52.
In addition, ACF pressure adsorption device further includes cutting mechanism 6, cutting mechanism 6 is set between roller 51 and pedestal 2, energy
It is enough to cut off ACF glue-line, but do not cut off peeling paper.The ACF presses adsorption device when initializing, and traction clip 53 will
ACF material strip 3 is drawn from roller 51 to fixing 52, so that ACF material strip 3 is between thermal head 1 and pedestal 2.Cutting mechanism 6
ACF glue-line can be cut off, subsequent thermal head 1 acts, until completing once to initialize or press attached operation, cutting mechanism 6 is
The prior art, details are not described herein.
In addition, ACF pressure adsorption device further includes control mechanism (not shown), heating mechanism (not shown) and drive
Motivation structure (not shown), heating mechanism are set to the free end of thermal head 1, can heat to thermal head 1.Driving mechanism connects
It is connected to thermal head 1, thermal head 1 can be driven to move reciprocatingly in the vertical direction.Heating mechanism, driving mechanism, actuator 41,
Cutting mechanism 6 and traction clip 53 are all connected to control mechanism.Wherein heating mechanism, driving mechanism, traction clip 53, ACF
Conveying mechanism and control mechanism are the prior art, and details are not described herein.
The working principle of ACF pressure adsorption device provided in this embodiment:
When initializing, ACF conveying mechanism movement, ACF material strip 3 is transmitted to roller 51, and traction clip 53 is dynamic
Make, ACF material strip 3 is drawn by roller 51 to fixing 52, and peeling paper is clamped by fixing 52 and makes ACF material strip 3
Positioned at the surface of pedestal 2.
It is then cut out the movement of mechanism 6, ACF glue-line is cut off, is not at this time cut off the peeling paper of ACF material strip 3.
Then actuator 41 drives sticky removing component 42 to extend between thermal head 1 and pedestal 2, and hairbrush 423 will be on pedestal 2
Residue glue sticky removing, while the foreign matter etc. on pedestal 2 being cleared away.1 downward actuation of subsequent thermal head, is attached to adhered layer for ACF glue-line pressure
On 422, subsequent actuator 41 drives the gradually homing of sticky removing component 42, and the hairbrush 423 on sticky removing component 42 is again to pedestal 2
It is cleaned, the foreign matter that may be present of pedestal 2 is cleared away, complete an initialization operation or the attached operation of pressure.And it is pressed in the ACF
Adsorption device work normally when, be by ACF glue-line pressure it is attached on the glass substrate, glass substrate is placed on pedestal 2.
Embodiment two
The ACF of ACF pressure adsorption device and embodiment one kind in the present embodiment presses adsorption device essentially identical, and difference exists
In: the support plate 421 of the sticky removing component 42 of ACF pressure adsorption device is provided with towards 2 side of pedestal except glue part, except glue part is to scrape
Knife 424.The residue glue on pedestal 2 can be removed when actuator 41 drives sticky removing component 42 to act by scraper 424.
Embodiment three
The ACF of ACF pressure adsorption device and embodiment one kind in the present embodiment presses adsorption device essentially identical, and difference exists
In: the sticky removing component 42 of ACF pressure adsorption device is provided with towards 2 side of pedestal except glue part, except glue part is absorbent module 425,
In the present embodiment, absorbent module 425 can absorb bottom by absorbent module 425 for vacuum suction component or Electrostatic Absorption component
Residue glue on seat 2, achievees the purpose that cleaning substructure 2.
Embodiment of above only elaborates the basic principles and features of the present invention, and the utility model is not by above-mentioned reality
The mode of applying limits, and on the premise of not departing from the spirit and scope of the utility model, the present invention has various changes and changes,
These changes and changes fall within the scope of the claimed invention.The utility model requires protection scope is by appended
Claims and its equivalent thereof.
Claims (9)
1. a kind of ACF presses adsorption device, including thermal head (1) and pedestal (2), the pedestal (2) is located at below the thermal head (1)
And can bearing glass substrate, ACF material strip (3) are provided between the thermal head (1) and the pedestal (2), which is characterized in that
The ACF presses adsorption device further include:
Machine and glue removing structure is set to the pedestal (2) side, be configured as extending into the thermal head (1) and the pedestal (2) it
Between, to remove the ACF glue-line of residue glue and the ACF material strip (3) initial end on the pedestal (2).
2. ACF according to claim 1 presses adsorption device, which is characterized in that the machine and glue removing structure include actuator (41) and
Sticky removing component (42), the actuator (41) are able to drive the sticky removing component (42) and move back and forth.
3. ACF according to claim 2 presses adsorption device, which is characterized in that the sticky removing component (42) is towards the hot pressing
Head (1) side is provided with adhered layer (422), and the adhered layer (422) is configured as matching sticky removing institute with the thermal head (1)
The ACF glue-line of ACF material strip (3) initial end is stated, the sticky removing component (42) is provided with hairbrush towards the pedestal (2) side
(423)。
4. ACF according to claim 2 presses adsorption device, which is characterized in that the sticky removing component (42) is towards the hot pressing
Head (1) side is provided with adhered layer (422), and the adhered layer (422) is configured as matching sticky removing institute with the thermal head (1)
The ACF glue-line of ACF material strip (3) initial end is stated, the sticky removing component (42) is provided with scraper towards the pedestal (2) side
(424)。
5. ACF according to claim 2 presses adsorption device, which is characterized in that the sticky removing component (42) is towards the hot pressing
Head (1) side is provided with adhered layer (422), and the adhered layer (422) is configured as matching sticky removing institute with the thermal head (1)
The ACF glue-line of ACF material strip (3) initial end is stated, the sticky removing component (42) is provided with absorbent module towards the pedestal (2) side
(425), the absorbent module (425) is configured as absorbing the residue glue on the pedestal (2).
6. ACF according to claim 1 presses adsorption device, which is characterized in that it further include ACF conveying mechanism, the ACF conveying
Roller (51) and fixing (52) of the mechanism including being respectively arranged at the pedestal (2) two sides, and the roller (51) and institute
It states and is provided with traction clip (53) between fixing (52), the traction clip (53) is configured as the ACF material strip (3)
By the roller (51) traction to the fixing (52).
7. ACF according to claim 6 presses adsorption device, which is characterized in that further include cutting mechanism (6), the cutting machine
Structure (6) is set between the roller (51) and the pedestal (2), and can cut off the ACF glue-line of the ACF material strip (3).
8. ACF according to claim 1 presses adsorption device, which is characterized in that further include heating mechanism, the heating mechanism is set
It is placed in the free end of the thermal head (1).
9. ACF according to claim 1 presses adsorption device, which is characterized in that further include control mechanism and can drive described
The driving mechanism of thermal head (1) movement, the driving mechanism, machine and glue removing structure are electrically connected to the control mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920153115.2U CN209231639U (en) | 2019-01-29 | 2019-01-29 | A kind of ACF pressure adsorption device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920153115.2U CN209231639U (en) | 2019-01-29 | 2019-01-29 | A kind of ACF pressure adsorption device |
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| Publication Number | Publication Date |
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| CN209231639U true CN209231639U (en) | 2019-08-09 |
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ID=67511027
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| CN201920153115.2U Active CN209231639U (en) | 2019-01-29 | 2019-01-29 | A kind of ACF pressure adsorption device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113900292A (en) * | 2021-08-17 | 2022-01-07 | 江苏特丽亮镀膜科技有限公司 | Hot pressing device and process for ACF (anisotropic conductive film) adhesive film connecting structure |
| CN114283686A (en) * | 2021-12-28 | 2022-04-05 | Tcl华星光电技术有限公司 | Manufacturing method of display panel |
-
2019
- 2019-01-29 CN CN201920153115.2U patent/CN209231639U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113900292A (en) * | 2021-08-17 | 2022-01-07 | 江苏特丽亮镀膜科技有限公司 | Hot pressing device and process for ACF (anisotropic conductive film) adhesive film connecting structure |
| US11850834B2 (en) | 2021-08-17 | 2023-12-26 | Jiangsu Telilan Coating Technology Co., Ltd. | Hot-pressing device and process for anisotropic conductive film (ACF) bonding structure |
| CN114283686A (en) * | 2021-12-28 | 2022-04-05 | Tcl华星光电技术有限公司 | Manufacturing method of display panel |
| CN114283686B (en) * | 2021-12-28 | 2023-11-28 | Tcl华星光电技术有限公司 | Manufacturing method of display panel |
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Legal Events
| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 215301 No. 1, Longteng Road, Kunshan Development Zone, Jiangsu, Suzhou Patentee after: Kunshan Longteng Au Optronics Co Address before: 215301 No. 1, Longteng Road, Kunshan Development Zone, Jiangsu, Suzhou Patentee before: Kunshan Longteng Optronics Co., Ltd. |
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| CP01 | Change in the name or title of a patent holder |