CN209229409U - It is a kind of being capable of the flexible LED mould group that deformation occurs - Google Patents
It is a kind of being capable of the flexible LED mould group that deformation occurs Download PDFInfo
- Publication number
- CN209229409U CN209229409U CN201822260529.3U CN201822260529U CN209229409U CN 209229409 U CN209229409 U CN 209229409U CN 201822260529 U CN201822260529 U CN 201822260529U CN 209229409 U CN209229409 U CN 209229409U
- Authority
- CN
- China
- Prior art keywords
- flexible
- flexible led
- mould group
- deformation occurs
- thermal conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
The utility model discloses it is a kind of can the flexible LED mould group that deformation occurs, which includes a flexible LED substrate and the LED lamp bead array that is arranged on flexible LED substrate, and flexible LED substrate is mounted on a flexible thermal conductive silicon offset plate；Flexible heat conductive silica gel intralamellar part is provided with a plurality of rigidity spring side by side, and lower end surface is provided with several T-type straight troughs, is formed with U-type groove between every two adjacent T-type straight trough；Radiating piece is plugged on each T-type straight trough.The flexible LED mould group of the utility model can bend camber and deformation occurs, and flexible LED mould group can also be bent camber installation, can be cooperated a variety of different lampshades with Plane Installation.Flexible thermal conductive silicon offset plate curved arc ability is good, with thermally conductive function, heat is directed on aluminium radiator, the radiating efficiency of increased LED.Spring is molded in flexible thermal conductive silicon offset plate, spring is rigidity spring, and rigidity spring has screen resilience, so that flexible thermal conductive silicon offset plate is formed support force, jackknifing phenomenon will not occur.
Description
Technical field
The utility model relates to LED technology field, particularly relate to it is a kind of being capable of the flexible LED mould that deformation occurs
Group.
Background technique
It include substrate, integrated installation in existing LED light device in several LED chips on the substrate etc..Wherein,
The substrate it is usually used be hard, can not free bend material, and its extend property it is poor.Further, since LED illumination fills
It is limited to set inner space, and substrate can not free bend, so as to cause the limited amount of LED chip on substrate, power is smaller, nothing
Method meets the illumination in the place having higher requirements for brightness.
Traditional LED panel is all relatively fixed, and the lampshade of cooperation is fixed, and cannot arbitrarily convert in cover size.
Therefore, in view of the above-mentioned problems, it is necessary to propose further solution.
Utility model content
Aiming at the shortcomings in the prior art, the technical problem to be solved by the present invention is to provide one kind to occur
The flexible LED mould group of deformation.
In order to solve the above technical problems, the utility model is realized by following scheme: it is a kind of can that deformation occurs be soft
Property LED module, the LED module include a flexible LED substrate and the LED lamp bead array that is arranged on the flexible LED substrate,
The flexible LED substrate is mounted on a flexible thermal conductive silicon offset plate；
The flexibility heat conductive silica gel intralamellar part is provided with a plurality of rigidity spring side by side, and lower end surface is provided with several T-types
Straight trough is formed with U-type groove between every two adjacent T-type straight trough；
Radiating piece is plugged on each T-type straight trough.
Further, the flexible LED substrate is circuit board, is fixed by screws in the flexible thermal conductive silicon offset plate
On.
Further, the flexible LED substrate can bend camber, outer surface and in the gap of LED lamp bead array
Place is provided with cambered surface straight trough.
Further, the rigidity spring is fixed on flexible heat conductive silica gel intralamellar part by injection molding.
Further, the radiating piece is aluminium radiator, and inserted terminal is provided with the T-type protrusive board with the cooperation of T-type straight trough,
Lower end is arranged to U-shaped folder mouth.
Further, two of the U-shaped folder mouth opposite side walls form inner concave arc surface, and oral area chamfering is at open-like shape.
Further, two broadside sides of the flexible thermal conductive silicon offset plate are provided with the metal spiral shell for connecting lampshade
Column, the metallic stud are to be fixed on flexible thermal conductive silicon offset plate side by injection molding, are provided with internal screw thread.
Further, the flexible LED substrate is FPC substrate.
Compared with the existing technology, the beneficial effects of the utility model are:
1. the flexible LED mould group of the utility model can bend camber and deformation occurs, flexible LED mould group can be with plane
Installation can also bend camber installation, can cooperate a variety of different lampshades.
2. flexible thermal conductive silicon offset plate curved arc ability is good, with thermally conductive function, heat is directed on aluminium radiator, is increased
LED radiating efficiency.
3. aluminium radiator has good heat sinking function, it is plugged in together by T-type protrusive board and T-type straight trough, installation is fast
Speed, radiating efficiency are high.
4. being molded with spring in flexible thermal conductive silicon offset plate, spring is rigidity spring, and rigidity spring has screen resilience, makes
Flexible thermal conductive silicon offset plate forms support force, and jackknifing phenomenon will not occur.
5. being provided with cambered surface straight trough on the flexible LED substrate of the utility model, with buffer function, flexible LED is prevented
Substrate squeezes to form slight crack.
6. the flexible LED substrate of the utility model uses FPC flexible base board, flexibility is good, has good curved arc
Can, it is not easily broken.
Detailed description of the invention
Fig. 1 is the structural schematic diagram that the utility model flexibility thermal conductive silicon offset plate and radiating piece separate.
Fig. 2 is the left end enlarged drawing of Fig. 1.
Fig. 3 is a side schematic view of the utility model flexible LED mould group.
Fig. 4 is the structural schematic diagram in Fig. 1 after flexible thermal conductive silicon offset plate grafting radiating piece.
Fig. 5 is the pre- clamp bracket bar schematic diagram of the utility model radiating piece.
Fig. 6 is the structural schematic diagram after the group embowment of the utility model flexible LED mould.
Fig. 7 is that Fig. 6 installs the structural schematic diagram after lampshade.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
The advantages of clearly and completely describing, enabling the utility model and feature are easier to be readily appreciated by one skilled in the art, thus to this
The protection scope of utility model is more clearly defined.Obviously, the utility model described embodiment is only
The utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, this field is common
Technical staff's every other embodiment obtained without making creative work belongs to the utility model protection
Range.
Embodiment 1: the specific structure of the utility model flexible LED mould group is as follows:
Please refer to attached drawing 1-7, the utility model it is a kind of can the flexible LED mould group that deformation occurs, which includes
One flexible LED substrate 5 and the LED lamp bead array 6 being arranged on the flexible LED substrate 5, the flexible LED substrate 5 are installed
On a flexible thermal conductive silicon offset plate 4；
The flexibility thermal conductive silicon offset plate 4 is internally provided with a plurality of rigidity spring 3 side by side, and lower end surface is provided with several T
Type straight trough 2 is formed with U-type groove between every two adjacent T-type straight trough 2；
Radiating piece 1 is plugged on each T-type straight trough 2.
A kind of optimal technical scheme of the present embodiment: the flexible LED substrate 5 is circuit board, is fixed by screws in
On the flexibility thermal conductive silicon offset plate 4.
A kind of optimal technical scheme of the present embodiment: the flexible LED substrate 5 can bend camber, outer surface and
The gap location of LED lamp bead array 6 is provided with cambered surface straight trough 7.
A kind of optimal technical scheme of the present embodiment: the rigidity spring 3 is fixed on flexible thermal conductive silicon offset plate 4 by injection molding
It is internal.
A kind of optimal technical scheme of the present embodiment: the radiating piece 1 is aluminium radiator, and inserted terminal is provided with and T-type
The T-type protrusive board of straight trough cooperation, lower end is arranged to U-shaped folder mouth.
A kind of optimal technical scheme of the present embodiment: the opposite side wall of two of the U-shaped folder mouth forms inner concave arc surface, oral area
Chamfering is at open-like shape.
A kind of optimal technical scheme of the present embodiment: two broadside sides setting of the flexibility thermal conductive silicon offset plate 4 is useful
In the metallic stud of connection lampshade 9, which is to be fixed on flexible 4 side of thermal conductive silicon offset plate by injection molding, is provided with
Internal screw thread.
A kind of optimal technical scheme of the present embodiment: the flexible LED substrate 5 is FPC substrate.
Embodiment 2:
As shown in figure 5, the clamping opening of aluminium radiator has the function of that connecting bracket bar 8, cradling piece 8 are fixed on other mounting racks
On, since the aluminium radiator of the utility model is provided with multiple, can according to need, cradling piece 8 clamps in place,
It can be clamped on radiating element with multiple supporting rods, keep connection more firm.
Embodiment 3:
Spring is molded in flexible thermal conductive silicon offset plate, spring is rigidity spring, and rigidity spring has screen resilience, makes soft
Property thermal conductive silicon offset plate formed support force, jackknifing phenomenon will not occur.
Embodiment 4:
As shown in fig. 7, the good flexible LED mould group of curved arc is stamped lampshade 9, lampshade 9 is fixed by screws in flexible LED mould group
Opening face after curved arc.
Embodiment 5:
Flexible LED mould group can not also embowment, the lampshade of plane can be mounted directly, spring is rigidity bullet
Spring can be by flexible LED module support at plane with support force.
The flexible LED mould group function of the utility model is more, as follows:
1. the flexible LED mould group of the utility model can bend camber and deformation occurs, flexible LED mould group can be with plane
Installation can also bend camber installation, can cooperate a variety of different lampshades.
2. flexible thermal conductive silicon offset plate curved arc ability is good, with thermally conductive function, heat is directed on aluminium radiator, is increased
LED radiating efficiency.
3. aluminium radiator has good heat sinking function, it is plugged in together by T-type protrusive board and T-type straight trough, installation is fast
Speed, radiating efficiency are high.
4. being molded with spring in flexible thermal conductive silicon offset plate, spring is rigidity spring, and rigidity spring has screen resilience, makes
Flexible thermal conductive silicon offset plate forms support force, and jackknifing phenomenon will not occur.
5. being provided with cambered surface straight trough on the flexible LED substrate of the utility model, with buffer function, flexible LED is prevented
Substrate squeezes to form slight crack.
6. the flexible LED substrate of the utility model uses FPC flexible base board, flexibility is good, has good curved arc
Can, it is not easily broken.
Above description is merely a prefered embodiment of the utility model, is not intended to limit the patent model of the utility model
Enclose, equivalent structure or equivalent flow shift made by using the description of the utility model and the drawings, or directly or
It connects and is used in other relevant technical fields, be also included in the patent protection scope of the utility model.
Claims (8)
1. one kind can the flexible LED mould group that deformation occurs, which includes a flexible LED substrate (5) and is arranged in institute
State the LED lamp bead array (6) on flexible LED substrate (5), it is characterised in that: the flexible LED substrate (5) is mounted on a flexibility
On thermal conductive silicon offset plate (4)；
The flexibility thermal conductive silicon offset plate (4) is internally provided with a plurality of rigidity spring (3) side by side, and lower end surface is provided with several T
Type straight trough (2) is formed with U-type groove between every two adjacent T-type straight trough (2)；
Radiating piece (1) is plugged on each T-type straight trough (2).
2. one kind according to claim 1 being capable of the flexible LED mould group that deformation occurs, it is characterised in that: the flexible LED
Substrate (5) is circuit board, is fixed by screws on the flexible thermal conductive silicon offset plate (4).
3. one kind according to claim 1 being capable of the flexible LED mould group that deformation occurs, it is characterised in that: the flexible LED
Substrate (5) can bend camber, the outer surface and gap location in LED lamp bead array (6) is provided with cambered surface straight trough (7).
4. one kind according to claim 1 being capable of the flexible LED mould group that deformation occurs, it is characterised in that: the rigidity bullet
Spring (3) is fixed on flexible thermal conductive silicon offset plate (4) inside by injection molding.
5. one kind according to claim 1 being capable of the flexible LED mould group that deformation occurs, it is characterised in that: the radiating piece
It (1) is aluminium radiator, inserted terminal is provided with the T-type protrusive board with the cooperation of T-type straight trough, and lower end is arranged to U-shaped folder mouth.
6. one kind according to claim 5 being capable of the flexible LED mould group that deformation occurs, it is characterised in that: the U-shaped folder mouth
Two opposite side walls form inner concave arc surface, and oral area chamfering is at open-like shape.
7. one kind according to claim 1 being capable of the flexible LED mould group that deformation occurs, it is characterised in that: the flexibility is led
Two broadside sides of hot silica gel plate (4) are provided with the metallic stud for connecting lampshade (9), which is to pass through injection molding
It is fixed on flexible thermal conductive silicon offset plate (4) side, is provided with internal screw thread.
8. one kind described in -7 any one being capable of the flexible LED mould group that deformation occurs according to claim 1, it is characterised in that:
The flexible LED substrate (5) is FPC substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822260529.3U CN209229409U (en) | 2018-12-29 | 2018-12-29 | It is a kind of being capable of the flexible LED mould group that deformation occurs |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822260529.3U CN209229409U (en) | 2018-12-29 | 2018-12-29 | It is a kind of being capable of the flexible LED mould group that deformation occurs |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209229409U true CN209229409U (en) | 2019-08-09 |
Family
ID=67509909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822260529.3U Active CN209229409U (en) | 2018-12-29 | 2018-12-29 | It is a kind of being capable of the flexible LED mould group that deformation occurs |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209229409U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110412544A (en) * | 2019-08-23 | 2019-11-05 | 上海禾赛光电科技有限公司 | Laser transmitting system and laser radar including the laser transmitting system |
| CN112377828A (en) * | 2020-11-04 | 2021-02-19 | 江苏智慧光彩光电科技有限公司 | LED flexible filament |
-
2018
- 2018-12-29 CN CN201822260529.3U patent/CN209229409U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110412544A (en) * | 2019-08-23 | 2019-11-05 | 上海禾赛光电科技有限公司 | Laser transmitting system and laser radar including the laser transmitting system |
| CN112377828A (en) * | 2020-11-04 | 2021-02-19 | 江苏智慧光彩光电科技有限公司 | LED flexible filament |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101469819A (en) | LED lamp | |
| CN209229409U (en) | It is a kind of being capable of the flexible LED mould group that deformation occurs | |
| CN102235595A (en) | Light-emitting diode (LED) lamp | |
| CN103133895A (en) | Light emitting diode (LED) lighting device and manufacturing method thereof | |
| CN103411140A (en) | Manufacturing method of lamp-cover-supporting LED tubular lamp with self-clamping heat transmission substrate | |
| RU2015106001A (en) | METHOD FOR PERFORMING A UNIVERSAL LED BULB AND LED LENS TYPE LAMP WITH LOCKING RING AND LED LAMP | |
| CN201582762U (en) | LED lamp assembly and LED street lamp | |
| CN201336319Y (en) | High-power LED chip soldering copper-aluminum substrate and injection molding encapsulation bracket structure | |
| CN202469923U (en) | Lamp holder of LED (light-emitting diode) fluorescent lamp | |
| CN203442751U (en) | Radiator used for LED (light-emitting diode) module component and LED spotlight applying same | |
| CN102691997A (en) | Radiation device and lighting device provided with same | |
| CN202392754U (en) | Structural section used for LED illumination streetlamp | |
| CN201396620Y (en) | Novel LED lamp | |
| CN205842280U (en) | Radiator attachment structure for LED | |
| CN212902213U (en) | Refrigerator and refrigerator lamp with double-side light emitting | |
| CN201318568Y (en) | Lamp tube with light focusing lampshade | |
| CN208535600U (en) | Light source module group and lamps and lanterns | |
| CN201517761U (en) | LED lamp tube heat radiator | |
| CN201589136U (en) | Swivel LED spot lamp | |
| CN201106835Y (en) | LED illumination device | |
| CN203431738U (en) | Lamp shell for LED lamp | |
| CN201047532Y (en) | Combined section bar LED sending light | |
| CN218768606U (en) | LED display screen sharing type chassis with different dot spacing | |
| CN209893347U (en) | LED lamp chassis convenient for heat dissipation | |
| CN215929280U (en) | Novel high-density integrated light source special-shaped light emitting structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |