CN209225776U - Buffer structure and panel packing device - Google Patents
Buffer structure and panel packing device Download PDFInfo
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- CN209225776U CN209225776U CN201822182483.8U CN201822182483U CN209225776U CN 209225776 U CN209225776 U CN 209225776U CN 201822182483 U CN201822182483 U CN 201822182483U CN 209225776 U CN209225776 U CN 209225776U
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- buffer
- substrate tablet
- escape groove
- protrusion
- buffer substrate
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Abstract
The utility model provides a kind of buffer structure, is held between two pieces of panels, and panel includes display end and circuit board, and circuit board is equipped with protrusion, and buffer structure includes: the first buffer substrate tablet, has the first relief portion for avoiding protrusion；Second buffer substrate tablet is set on the first buffer substrate tablet, has the second relief portion for avoiding protrusion；Third buffer substrate tablet is set on the second buffer substrate tablet.The utility model additionally provides a kind of panel packing device, including cabinet and multiple above-mentioned buffer structures arranged in the box body, multiple buffer structures are stacked.Buffer structure provided by the utility model can avoid element and connector on circuit board so that the panel end of heap poststack and the stack height at circuit board end be it is identical, increase the stacking the piece number of panel, reduce shipment and delivery cost.
Description
Technical field
The utility model belongs to display packing technical field, is to be related to a kind of buffer structure and panel packet more specifically
Assembling device.
Background technique
Currently, panel industry commonly uses the shipment mode of foam box dress panel, by taking liquid crystal display panel as an example, liquid crystal display panel is logical
Cross the COF (Chip On Flex, or, Chip On Film, flip chip) and PCB (Printed Circuit of side
Board, printed circuit board) it is connected, wherein there is the component and connector of various height, some connectors are higher on circuit board
Cause the height at panel circuit board end when stacking to be greater than the height at panel end, causes circuit board end to tilt or overturn, even
COF bending is caused to take off skin.
Utility model content
The purpose of this utility model is to provide a kind of buffer structures, excessive to solve circuit board end height when panel stacks
The technical issues of.
In order to achieve the above purposes, the technical solution adopted by the utility model is: provides a kind of buffer structure, is held on two
Between block panel, the panel includes display end and circuit board, and the circuit board is equipped with protrusion, and the buffer structure includes:
First buffer substrate tablet has the first relief portion for avoiding the protrusion；
Second buffer substrate tablet is set on first buffer substrate tablet, has the second relief portion for avoiding the protrusion；
Third buffer substrate tablet is set on second buffer substrate tablet.
Optionally, the protrusion includes the first protrusion with the first height, with the second protrusion of the second height and tool
There is the third protrusion of third height；First relief portion is for avoiding first protrusion, the second protrusion and third protrusion, institute
Stating the second relief portion has for avoiding second protrusion and third protrusion, the third buffer substrate tablet for avoiding the third
The third relief portion of protrusion；
Wherein, first height is less than second height, and second height is less than the third height.
Optionally, the length of first buffer substrate tablet and third buffer substrate tablet is less than the length of second buffer substrate tablet, described
First buffer substrate tablet and third buffer substrate tablet end between the circuit board and the display end close to one end of the circuit board
Any position.
Optionally, first buffer substrate tablet and third buffering chip architecture are identical and be symmetrically set in second buffer substrate tablet
Opposite sides, second buffer substrate tablet is for covering the display end, the circuit board and for connecting the display end
And the flip chip of the circuit board, first buffer substrate tablet and the third buffer substrate tablet are for covering the display end and described
Flip chip.
Optionally, first relief portion includes three the first escape groove, and second relief portion includes three second and keeps away
Allow slot, the third relief portion includes three third escape groove；
Wherein, first first escape groove, first second escape groove and first third evacuation
Slot perforation；
Second first escape groove, second second escape groove and second third escape groove are passed through
It is logical；
Third first escape groove, third second escape groove and the third third escape groove are passed through
It is logical.
Optionally, first relief portion includes three the first escape groove, and second relief portion includes two second and keeps away
Allow slot, the third relief portion includes a third escape groove；
Wherein, first first escape groove, first second escape groove and the third escape groove penetrate through；
Second first escape groove is penetrated through with second second escape groove.
Optionally, first buffer substrate tablet for there is first buffer layer with the side of the panel attachment, described the
Three buffer substrate tablets are used to have second buffer layer with the side of the panel attachment.
Optionally, the first buffer layer is in tooth form, and the second buffer layer is in tooth form.
Optionally, first buffer substrate tablet, second buffer substrate tablet and the third buffer substrate tablet are made of foamed material.
The utility model additionally provides a kind of panel packing device, including cabinet and to be set to the case intracorporal multiple
Above-mentioned buffer structure, multiple buffer structures are stacked.
The beneficial effect of buffer structure provided by the utility model is: the buffer structure of the utility model is slow by first
Punching, the design of the second buffer substrate tablet and third buffer substrate tablet, the first buffer substrate tablet have the first relief portion for avoiding protrusion, and second
Buffer substrate tablet has the second relief portion for avoiding protrusion, in this way, tying in vanning when placing a buffering between two panels
Structure, then the first relief portion can avoid protrusion, and the second relief portion can also avoid protrusion, so that upper layer circuit board will not be by lower layer
The protrusion of circuit board is padded, and the stack height of heap poststack display end and circuit board is identical, so that circuit board end be prevented to stick up
It rises or overturns, it is therefore prevented that COF (Chip On Flex, or, Chip On Film) bends or takes off skin, and then increases panel
The piece number is stacked, shipment and delivery cost is reduced.In addition, the panel packing device of the utility model is made by the setting of above-mentioned buffer structure
When obtaining using the panel packing device package panel, panel stacking is smooth, increases panel and stacks the piece number, reduces shipment and delivery cost.
Detailed description of the invention
It, below will be to embodiment or the prior art in order to illustrate more clearly of the technical scheme in the embodiment of the utility model
Attached drawing needed in description is briefly described, it should be apparent that, the accompanying drawings in the following description is only that this is practical new
Some embodiments of type for those of ordinary skill in the art without any creative labor, can be with
It obtains other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of buffer structure provided by the embodiment of the utility model；
Fig. 2 is the detailed schematic of Fig. 1 buffer structure；
Fig. 3 is the structural schematic diagram for the buffer structure that another embodiment of the utility model provides；
Fig. 4 is the structural schematic diagram for the buffer structure that the utility model another embodiment provides.
Wherein, each appended drawing reference in figure:
1- buffer structure；2- panel；11 (11a, 11b)-the first buffer substrate tablets；12 (12a, 12b)-the second buffer substrate tablets；13
(13a, 13b)-third buffer substrate tablet；2- panel；21- display end；22- circuit board；23- flip chip；The first protrusion 221-；222-
Second protrusion；223- third protrusion；110 (110a, 110b)-the first relief portion；111- first buffer layer；120(120a,
120b) the-the second relief portion；130 (130a, 130b)-third relief portion；131- second buffer layer；1101a (1101b)-the first is kept away
Allow slot；The-the second escape groove of 1201a (1201b)；1301a (1301b)-third escape groove.
Specific embodiment
In order to which technical problem to be solved in the utility model, technical solution and beneficial effect is more clearly understood, with
Lower combination accompanying drawings and embodiments, the present invention will be further described in detail.It should be appreciated that specific reality described herein
It applies example to be only used to explain the utility model, is not used to limit the utility model.
It should be noted that it can be directly another when element is referred to as " being fixed on " or " being set to " another element
On one element or indirectly on another element.When an element is known as " being connected to " another element, it can
To be directly to another element or be indirectly connected on another element.
It is to be appreciated that term " length ", " width ", "upper", "lower", "front", "rear", "left", "right", "vertical",
The orientation or positional relationship of the instructions such as "horizontal", "top", "bottom" "inner", "outside" is that orientation based on the figure or position are closed
System, is merely for convenience of describing the present invention and simplifying the description, rather than the device or element of indication or suggestion meaning are necessary
It with specific orientation, is constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.
In addition, term " first ", " second " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance
Or implicitly indicate the quantity of indicated technical characteristic.Define " first " as a result, the feature of " second " can be expressed or
Implicitly include one or more of the features.The meaning of " plurality " is two or two in the description of the present invention,
More than, unless otherwise specifically defined.
Also referring to Fig. 1 and Fig. 2, now buffer structure 1 provided by the utility model is illustrated.The buffer structure 1
For being held between two pieces of panels 2 to have the function that buffering.Panel 2 includes display end 21, circuit board 22 and flip chip
23, flip chip 23 are connected between display end 21 and circuit board 22.There are the protrusions such as component and connector on circuit board, delay
Rushing structure 1 includes the first buffer substrate tablet 11, the second buffer substrate tablet 12 and third buffer substrate tablet 13, and the first buffer substrate tablet 11 has convex for avoiding
First relief portion 110 in portion, the second buffer substrate tablet 12 are set on the first buffer substrate tablet 11, and the second buffer substrate tablet 12 has for avoiding protrusion
The second relief portion 120, third buffer substrate tablet 13 be set to the second buffer substrate tablet 12 on.In the present embodiment, in vanning, figure is please referred to
1, the first buffer substrate tablet 11 is bonded with following panel 2, and third buffer substrate tablet 13 is bonded with panel 2 above.
The buffer structure 1 of the utility model is set by the first buffer substrate tablet 11, the second buffer substrate tablet 12 and third buffer substrate tablet 13
Meter, the first buffer substrate tablet 11 have the first relief portion 110 for avoiding protrusion, and the second buffer substrate tablet 12 has for avoiding protrusion
Second relief portion 120, in this way, in vanning, when placing a buffer structure 1 between two panels 2, then the first relief portion 110
Protrusion can be avoided, the second relief portion 120 can also avoid protrusion, so that upper layer circuit board 22 will not be by lower circuit plate 22
Protrusion is padded, and heap poststack display end 21 and the stack height of circuit board 22 are identical, so that 22 end of circuit board be prevented to tilt
Or overturning, it is therefore prevented that COF (Chip On Flex, or, Chip On Film) bends or takes off skin, and then increases panel 2
The piece number is stacked, shipment and delivery cost is reduced.
Referring to Fig. 1, a kind of specific embodiment as buffer structure 1 provided by the utility model, raised part packet
Include the first protrusion 221 with the first height, the second protrusion 222 with the second height and the third protrusion with third height
223.First relief portion 110 is used for avoiding the first protrusion 221, the second protrusion 222 and third protrusion 223, the second relief portion 120
In avoiding the second protrusion 222 and third protrusion 223, third buffer substrate tablet 13 has third relief portion 130, and third relief portion 130 is used
In evacuation third protrusion 223, wherein the first height is less than the second height, and the second height is less than third height, in this way, making electricity
The first protrusion 221, the second protrusion 222 and third protrusion 223 on road plate 22 with different height stratum can be avoided, and be made
Layer circuit board 22 must be gone up will not be padded by the protrusion of lower circuit plate 22, the stack height of heap poststack display end 21 and circuit board 22
It is identical.
Specifically, above-mentioned first relief portion 110 is groove structure or through slot structure referring to FIG. 1 to FIG. 4,；And/or second
Relief portion 120 is groove structure or through slot structure；And/or third relief portion 130 is groove structure or through slot structure.Pass through groove
Or the design of through slot, the first protrusion 221, the second protrusion 222 and third protrusion 223 are obtained while being avoided
Positioning, to guarantee that circuit board 22 and entire panel 2 stack and stablize.
Referring to Fig. 1, a kind of specific embodiment as buffer structure 1 provided by the utility model, above-mentioned first is slow
Less than the length of the second buffer substrate tablet 13, the first buffer substrate tablet 11 and third buffer substrate tablet 13 lean on the length of punching 11 and third buffer substrate tablet 13
One end of nearly circuit board 22 ends in any position between circuit board 22 and display end 21.Specifically, the second buffer substrate tablet 12 to
It is equal to the length of display end 21, circuit board 22 and flip chip 23 less, offers on second buffer substrate tablet 12 for avoiding the
First groove of two protrusions 222 and third protrusion 223, the first buffer substrate tablet 11 and third buffer substrate tablet 13 are because being not covered in circuit board
So the first protrusion 221, the second protrusion 222 and third protrusion 223 can be avoided completely on 22, such as Fig. 1 on the first buffer substrate tablet 11
Left side forms above-mentioned first relief portion 110 with respect to the part of 12 shortage of the second buffer substrate tablet, likewise, as schemed on third buffer substrate tablet 13
The part third relief portion 130 of opposite second buffer substrate tablet, 12 shortage in 1 left side.The present embodiment is slow by the first buffer substrate tablet 11 and third
The design of the not covering board 22 of punching 13, so that entire buffer structure 1 is simple, it is at low cost；Meanwhile processing is not needed one by one
Groove so that its processing is simple, processing cost is low；In addition, there is no on the second buffer substrate tablet 12 on the position of covering board 22
The weight of three buffer substrate tablets 13 to prevent the second buffer substrate tablet 12 from deforming, and then prevents the second buffer substrate tablet 12 on circuit board 22 the
The extruding of one protrusion 221, and then achieve the effect that protect the first protrusion 221.
Optionally, referring to Fig. 1, a kind of specific embodiment as buffer structure 1 provided by the utility model, above-mentioned
First buffer substrate tablet 11 and 13 structure of third buffer substrate tablet are identical and be symmetrically set in the opposite sides of the second buffer substrate tablet 12, the second buffer substrate tablet
12 are used for cover plate 2, flip chip 23 and circuit board 22, and the first buffer substrate tablet 11 and third buffer substrate tablet 13 are used for cover plate 2
And flip chip 23.The present embodiment is symmetrically designed by the first buffer substrate tablet 11 and third buffer substrate tablet 13, so that the buffer structure 1
Structure is simple, and manufacturing procedure is reduced, and processing cost is low.
Referring to Fig. 1, a kind of specific embodiment as buffer structure 1 provided by the utility model, above-mentioned first is slow
Punching 11, the second buffer substrate tablet 12 and third buffer substrate tablet 13 all be in tabular and successively fitting setting, it is flat design so that
It is completely embedded between first buffer substrate tablet 11, the second buffer substrate tablet 12 and third buffer substrate tablet 13.
Optionally, a kind of specific embodiment as buffer structure 1 provided by the utility model, above-mentioned first buffer substrate tablet
11 are fixed with the second buffer substrate tablet 12 by alite paste, and the second buffer substrate tablet 12 is fixed with third buffer substrate tablet 13 also by alite paste, are led to
Cross that alite paste is fixed to enable to fixation between the first buffer substrate tablet 11, the second buffer substrate tablet 12 and third buffer substrate tablet 13, fitting
Closed seamless gap.
Referring to Fig. 2, a kind of specific embodiment as buffer structure 1 provided by the utility model, above-mentioned first is slow
Punching 11 has first buffer layer 111, and first buffer layer 111 is located at the side on the first buffer substrate tablet 11 for being bonded with panel 2,
First buffer layer 111 is used to increase the resiliency of the first buffer substrate tablet 11, and third buffer substrate tablet 13 is with second buffer layer 131, and second
Buffer layer 131 is located at the side on third buffer substrate tablet 13 for being bonded with panel 2, and second buffer layer 131 is slow for increasing third
The resiliency of punching 13.The utility model is by the design of first buffer layer 111 and second buffer layer 131 so that the buffer structure
1 buffering effect is more preferable, to reduce the cost of buffer structure 1.
Referring to Fig. 2, a kind of specific embodiment as buffer structure 1 provided by the utility model, first buffer layer
111 be in tooth form, by the design of tooth form, so that the buffering effect of first buffer layer 111 is more preferable, likewise, above-mentioned second buffering
Layer 131 is also in tooth form, so that the buffering effect of second buffer layer 131 is more preferable.Certainly, in other implementations of the utility model
In example, according to the actual situation and specific requirement, above-mentioned first buffer layer 111 and second buffer layer 131 can also it is wavy or
Other polymorphic structures do not do unique restriction herein.
Optionally, a kind of specific embodiment as buffer structure 1 provided by the utility model, above-mentioned first buffer substrate tablet
11, the second buffer substrate tablet 12 and third buffer substrate tablet 13 are made of foamed material, and foamed material light weight, pliability is good, has slow
The advantages that punching, sound-absorbing and shock-absorbing, so that 1 buffering effect of buffer structure is fine, panel 2 and battery plate plate will not be damaged, is inhaled simultaneously
Sound is suitble to transport.Certainly, in the other embodiments of the utility model, according to the actual situation and specific requirement, above-mentioned foaming material
Material can also be used the other materials such as foam, foam and be made, and not do unique restriction herein.
The utility model additionally provides a kind of panel packing device, including cabinet and multiple buffer structures 1, buffer structure 1
In cabinet, multiple buffer structures 1 are stacked.The panel packing device of the utility model passes through above-mentioned buffer structure 1
Setting, so that when using the panel packing device package panel 2, panel 2 stacks smooth, increases panel 2 and stacks the piece number, reduces
Shipment and delivery cost.
In another embodiment of the utility model, referring to Fig. 3, above-mentioned first relief portion 110a, the second relief portion
120a and third relief portion 130a structure are identical, and the first relief portion 110a can avoid the first protrusion 221, the second protrusion 222 simultaneously
And third protrusion 223, the second relief portion 120a can avoid the first protrusion 221, the second protrusion 222 and third protrusion 223 simultaneously, the
Three relief portion 130a can avoid the first protrusion 221, the second protrusion 222 and third protrusion 223 simultaneously.The present embodiment is kept away by first
Portion 110a, the second relief portion 120a and the identical design of third relief portion 130a structure are allowed, so that the first relief portion 110a, second
The machining tool and processing program of relief portion 120a and third relief portion 130a structure are identical, so that overtime work cost is reduced, in addition,
First relief portion 110a, the second relief portion 120a and third relief portion 130a structure are identical so that the first buffer substrate tablet 11a, second slow
Punching 12a and third buffer substrate tablet 13a structure are identical, so that the structure of entire buffer structure 1 is simple, the processing is simple, cost
It reduces.
Specifically, referring to Fig. 3, the first relief portion 110a includes three first escape groove 1101a, the second relief portion 120a
It include three third escape groove 1301a including three the second escape groove 1201a, third relief portion 130a；Wherein, first first
Escape groove 1101a, first the second escape groove 1201a and first third escape groove 1301a perforation；Second first evacuation
Slot 1101a, second the second escape groove 1201a and second third escape groove 1301a perforation；The first escape groove of third
The the second escape groove 1201a and third third escape groove 1301a perforation of 1101a, third.Certainly, in the utility model
In other embodiments, according to the actual situation and specific requirement, only there is the second protrusion 222 and third protrusion on foregoing circuit plate 23
223, or there are two the first protrusion 221 and three third protrusions 223, even other situations, above-mentioned first escape groove for tool
The quantity of 1101a, the second escape groove 1201a and third escape groove 1301a also corresponding change.
Optionally, in the present embodiment, because of the first buffer substrate tablet 11a, the second buffer substrate tablet 12a and third buffer substrate tablet 13a structure
It is identical, then the first buffer substrate tablet 11a, the second buffer substrate tablet 12a and 1 3a of third buffer substrate tablet can be integrally formed, i.e., entire buffer structure
The total buffer piece that 1a is one, the total of the first protrusion 221, the second protrusion 222 and third protrusion 223 can be avoided thereon simultaneously by having
Relief portion, total relief portion can be the through slot for being opened in total buffer piece, certainly, in the other embodiments of the utility model, root
According to actual conditions and specific requirement, above-mentioned total relief portion can also be other structures, not do unique restriction herein.
In the another embodiment of the utility model, referring to Fig. 4, the first relief portion 110b includes three the first escape groove
1101b, the second relief portion 120b include two the second escape groove 1201b, and third relief portion 130b includes a third escape groove
1301b；Wherein, first the first escape groove 1101b, first the second escape groove 1201b and third escape groove 1301b are penetrated through；
Second the first escape groove 1101b and second the second escape groove 1201b are penetrated through.Certainly, in other implementations of the utility model
In example, according to the actual situation and specific requirement, only there is the second protrusion 222 and third protrusion 223 on foregoing circuit plate 23, or
There are two the first protrusion 221 and three third protrusions 223, even other situations, above-mentioned first escape groove 1101b, second for tool
The quantity of escape groove 1201b and third escape groove 1301b also corresponding change.
The above is only the preferred embodiments of the present utility model only, is not intended to limit the utility model, all practical at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the guarantor of the utility model within novel spirit and principle
Within the scope of shield.
Claims (10)
1. buffer structure is held between two pieces of panels, the panel includes display end and circuit board, and the circuit board is equipped with
Protrusion, which is characterized in that the buffer structure includes:
First buffer substrate tablet has the first relief portion for avoiding the protrusion；
Second buffer substrate tablet is set on first buffer substrate tablet, has the second relief portion for avoiding the protrusion；
Third buffer substrate tablet is set on second buffer substrate tablet.
2. buffer structure as described in claim 1, which is characterized in that the protrusion includes first with the first height convex
Portion, the second protrusion with the second height and the third protrusion with third height；First relief portion is described for avoiding
First protrusion, the second protrusion and third protrusion, second relief portion are described for avoiding second protrusion and third protrusion
Third buffer substrate tablet has the third relief portion for avoiding the third protrusion；
Wherein, first height is less than second height, and second height is less than the third height.
3. buffer structure as claimed in claim 2, which is characterized in that the length of first buffer substrate tablet and third buffer substrate tablet is small
In the length of second buffer substrate tablet, first buffer substrate tablet and third buffer substrate tablet end in institute close to one end of the circuit board
State any position between circuit board and the display end.
4. buffer structure as claimed in claim 3, which is characterized in that first buffer substrate tablet and the third buffer chip architecture
Opposite sides that is identical and being symmetrically set in second buffer substrate tablet, second buffer substrate tablet is for covering the display end, described
Circuit board and flip chip for connecting the display end and the circuit board, first buffer substrate tablet and the third are slow
Punching is for covering the display end and the flip chip.
5. buffer structure as claimed in claim 2, which is characterized in that first relief portion includes three the first escape groove,
Second relief portion includes three the second escape groove, and the third relief portion includes three third escape groove；
Wherein, first first escape groove, first second escape groove and first third escape groove are passed through
It is logical；
Second first escape groove, second second escape groove and second third escape groove perforation；
Third first escape groove, third second escape groove and the third third escape groove perforation.
6. buffer structure as claimed in claim 2, which is characterized in that first relief portion includes three the first escape groove,
Second relief portion includes two the second escape groove, and the third relief portion includes a third escape groove；
Wherein, first first escape groove, first second escape groove and the third escape groove penetrate through；
Second first escape groove is penetrated through with second second escape groove.
7. buffer structure as described in claim 1, which is characterized in that first buffer substrate tablet is used for and the panel attachment
Side there is first buffer layer, the third buffer substrate tablet for there is second buffer layer with the side of the panel attachment.
8. buffer structure as claimed in claim 7, which is characterized in that the first buffer layer is in tooth form, second buffering
Layer is in tooth form.
9. buffer structure as claimed in any one of claims 1 to 8, which is characterized in that first buffer substrate tablet, described second are delayed
Punching and the third buffer substrate tablet are made of foamed material.
10. a kind of panel packing device, which is characterized in that including cabinet and to be set to the case intracorporal multiple as right is wanted
1 to 9 described in any item buffer structures are sought, multiple buffer structures are stacked.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822182483.8U CN209225776U (en) | 2018-12-21 | 2018-12-21 | Buffer structure and panel packing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822182483.8U CN209225776U (en) | 2018-12-21 | 2018-12-21 | Buffer structure and panel packing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209225776U true CN209225776U (en) | 2019-08-09 |
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ID=67508943
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822182483.8U Active CN209225776U (en) | 2018-12-21 | 2018-12-21 | Buffer structure and panel packing device |
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| Country | Link |
|---|---|
| CN (1) | CN209225776U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109436569A (en) * | 2018-12-21 | 2019-03-08 | 惠科股份有限公司 | Buffer structure and panel packing device |
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2018
- 2018-12-21 CN CN201822182483.8U patent/CN209225776U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109436569A (en) * | 2018-12-21 | 2019-03-08 | 惠科股份有限公司 | Buffer structure and panel packing device |
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