CN209188437U - Emission-control equipment is used in semiconductor chip welding - Google Patents

Emission-control equipment is used in semiconductor chip welding Download PDF

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Publication number
CN209188437U
CN209188437U CN201821145959.4U CN201821145959U CN209188437U CN 209188437 U CN209188437 U CN 209188437U CN 201821145959 U CN201821145959 U CN 201821145959U CN 209188437 U CN209188437 U CN 209188437U
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water
water tank
inlet pipe
air inlet
valve body
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蒋伟
金平
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Suzhou Good Ark Electronics Co Ltd
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Suzhou Good Ark Electronics Co Ltd
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Abstract

The utility model discloses a kind of semiconductor chip welding emission-control equipment, water tank including filling water, air compressor machine, air inlet pipe, exhaust pipe, floating ball and valve body, described air inlet pipe one end is embedded in the water tank, this air inlet pipe other end is for being connected to soldering furnace, described exhaust pipe one end is connected to the upper cover of water tank, the exhaust pipe other end is located at the outside of water tank, one air amplifier is installed in the air inlet pipe, it is connected between the air amplifier and air compressor machine by a conduit, one valve is set on the conduit, the valve body is mounted on water tank side wall, water inlet and water outlet are provided on the valve body, spool is provided in the valve body, the other end of the ball lever is connect with the floating ball being located on liquid level, slow gas outlet one end below liquid level is connected to air inlet pipe.The residual that the utility model can reduce rosin composition in exhaust gas causes the pollution to environment, and structure is simply easy to install, and energy automatic feeding water, good seal performance is not easy spilling water, and cleaning process is simple.

Description

Emission-control equipment is used in semiconductor chip welding
Technical field
The utility model relates to a kind of semiconductor chip welding emission-control equipments, belong to exhaust gas treatment technology neck Domain.
Background technique
Currently, semiconductor element manufacturing enterprise can have an impact the exhaust gas of environment after using soldering furnace, in order to exhaust gas It is handled, it usually needs be equipped with emission-control equipment, the structure of existing equipment is complex and because of the main component in exhaust gas For rosin not soluble in water, it can often cause the cleaning of equipment pipe difficult because of the condensation of rosin, in emission-control equipment The time not only consumed after use to the cleaning of pipeline is long, and disassembly difficulty is big, and existing equipment can not achieve the function of automatic feeding water Certain influence can be also resulted on the production efficiency of enterprise, and above-mentioned technical problem how to be overcome to become those skilled in the art's effort Direction.
Summary of the invention
The purpose of the utility model is to provide a kind of semiconductor chip welding emission-control equipment, semiconductor chip welderings It connecing and causes pollution to environment with the residual that emission-control equipment can reduce rosin composition in exhaust gas, structure is simply easy to install, Energy automatic feeding water, good seal performance are not easy spilling water, and easy to use, cleaning process is simple, advantage of lower cost.
In order to achieve the above objectives, the technical solution adopted in the utility model is: at a kind of semiconductor chip welding exhaust gas Device, including water tank, air compressor machine, air inlet pipe, exhaust pipe, floating ball and valve body are managed, described air inlet pipe one end is embedded in the water tank In vivo, this air inlet pipe other end is for being connected to soldering furnace, and described exhaust pipe one end is connected to the upper cover of water tank, and exhaust pipe is another One end is located at the outside of water tank;
One air amplifier is installed in the air inlet pipe, is connected between the air amplifier and air compressor machine by a conduit It is logical, a valve is set on the conduit;
The valve body is mounted on water tank side wall, and water inlet and water outlet are provided on the valve body, is set in the valve body It is equipped with spool, the inner end of a valve rod is connected with the spool, and one end that the valve rod outer end is pierced by valve body and a ball lever is hinged, The other end of the ball lever is connect with the floating ball being located on liquid level;
Slow gas outlet one end below liquid level is connected to air inlet pipe, and the other end is sealed end, this slow gas outlet Several fine ventholes are provided on side wall;
When floating ball is with water level decreasing to the first liquid level, the ball lever for connecting floating ball is transported upwards with the spool in moving valve It is dynamic, it is discharged into water in water tank from water outlet;
When floating ball rises to the second liquid level with water level, the ball lever for connecting floating ball is blocked with the spool in moving valve into water The path of mouth and water outlet, water stopping are discharged into water tank from water outlet;The height of first liquid level of the water tank is lower than the The height of two liquid levels.
Further improved scheme is as follows in above-mentioned technical proposal:
1. in above scheme, the air amplifier is installed on the upper cover of water tank and the junction of air inlet pipe.
2. in above scheme, the valve is manually-operated gate.
3. in above scheme, the floating ball is stainless steel floating ball.
4. in above scheme, the valve body is to thicken brass body.
5. in above scheme, the slow gas outlet is in water tank bottom with snakelike arrangement.
6. in above scheme, the upper cover is transparent force-bearing plate.
Due to the application of the above technical scheme, the utility model has the advantage that compared with prior art
1, the utility model semiconductor chip welding emission-control equipment, can reduce the residual of rosin composition in exhaust gas The pollution caused to environment is stayed, structure is simply easy to install, and easy to use, cleaning process is simple, and advantage of lower cost greatly reduces The wastings of resources of manpower and material resources;Secondly, the slow gas outlet one end being located at below liquid level is connected to air inlet pipe, the other end is close It blocks, is provided with several fine ventholes on the side wall of this slow gas outlet, Minute pores can help the infiltration of exhaust gas uniformly at the uniform velocity It is contacted thoroughly into water tank with water, gas is avoided directly to rise at the top of water tank because not contacting with water to cause water tank The condensation of top pollutant increases cleaning difficulty.
2, the utility model semiconductor chip welding emission-control equipment, air amplifier are installed on the upper of water tank The junction of lid and air inlet pipe, can prevent the leakage of exhaust gas from causing the pollution to environment;Secondly, its valve is manually-operated gate. The size that air-flow can be manually adjusted keeps the stability of air-flow, guarantees the efficiency of filtering, tail gas can be allow faster Discharge, helps to improve the treatment effeciency of processing unit;Again, floating ball is stainless steel floating ball, is not easy because getting rusty, corroding due to shadow The use of device is rung, and can preferably realize Liquid level function;Again, valve body is to thicken brass body.Brass Castability, processability are higher and slightly lower compared with stainless steel cost, and the technique that can satisfy complicated valve body can also reduce for enterprise Certain cost.
Detailed description of the invention
Attached drawing 1 is the utility model semiconductor chip welding emission-control equipment structural schematic diagram;
In the figures above: 1, water tank;101, upper cover;2, air inlet pipe;3, air amplifier;4, conduit;5, air compressor machine;6, Valve;7, valve body;9, valve rod;10, delay gas outlet;11, ball lever;12, floating ball;13, exhaust pipe;14, water inlet;15, it is discharged Mouthful;16, fine venthole.
Specific embodiment
Embodiment 1: a kind of semiconductor chip welding emission-control equipment, including including water tank 1, air compressor machine 5, air inlet Pipe 2, exhaust pipe 13, floating ball and valve body 7, described 2 one end of air inlet pipe are embedded in the water tank 1, this 2 other end of air inlet pipe is used for It is connected to soldering furnace, described 13 one end of exhaust pipe is connected to the upper cover 101 of water tank 1, and 13 other end of exhaust pipe is located at water tank 1 Outside;
One air amplifier 3 is installed in the air inlet pipe 2, passes through a conduit between the air amplifier 3 and air compressor machine 5 4 are connected to, and a valve 6 is arranged on the conduit 4;
The valve body 7 is mounted on 1 side wall of water tank, and water inlet 14 and water outlet 15 are provided on the valve body 7, described Spool is provided in valve body 7, the inner end of a valve rod 9 is connected with the spool, and 9 outer end of valve rod is pierced by valve body 7 and a floating ball One end of bar 11 is hinged, and the other end of the ball lever 11 is connect with the floating ball 12 being located on liquid level;
Slow 10 one end of gas outlet below liquid level is connected to air inlet pipe 2, and the other end is sealed end, this slow gas outlet Several fine ventholes 16 are provided on 10 side wall;
When floating ball 12 is with water level decreasing to the first liquid level, connect floating ball 12 ball lever 11 with the spool in moving valve to Upper movement is discharged into water in water tank 1 from water outlet 15;
When floating ball 12 rises to the second liquid level with water level, the ball lever 11 of floating ball 12 is connected with the spool resistance in moving valve The path at the mouth of a river 14 and water outlet 15 is broken, water stopping is discharged into water tank 1 from water outlet 15;First liquid of the water tank 1 The height in face is lower than the height of the second liquid level.
Above-mentioned air amplifier 3 is installed on the upper cover 101 of water tank 1 and the junction of air inlet pipe 2;Above-mentioned valve 6 is hand Movable valve;Above-mentioned floating ball 12 is stainless steel floating ball;Above-mentioned valve body 7 is to thicken brass body.
Embodiment 2: a kind of semiconductor chip welding emission-control equipment, including including water tank 1, air compressor machine 5, air inlet Pipe 2, exhaust pipe 13, floating ball and valve body 7, described 2 one end of air inlet pipe are embedded in the water tank 1, this 2 other end of air inlet pipe is used for It is connected to soldering furnace, described 13 one end of exhaust pipe is connected to the upper cover 101 of water tank 1, and 13 other end of exhaust pipe is located at water tank 1 Outside;
One air amplifier 3 is installed in the air inlet pipe 2, passes through a conduit between the air amplifier 3 and air compressor machine 5 4 are connected to, and a valve 6 is arranged on the conduit 4;
The valve body 7 is mounted on 1 side wall of water tank, and water inlet 14 and water outlet 15 are provided on the valve body 7, described Spool is provided in valve body 7, the inner end of a valve rod 9 is connected with the spool, and 9 outer end of valve rod is pierced by valve body 7 and a floating ball One end of bar 11 is hinged, and the other end of the ball lever 11 is connect with the floating ball 12 being located on liquid level;
Slow 10 one end of gas outlet below liquid level is connected to air inlet pipe 2, and the other end is sealed end, this slow gas outlet Several fine ventholes 16 are provided on 10 side wall;
When floating ball 12 is with water level decreasing to the first liquid level, connect floating ball 12 ball lever 11 with the spool in moving valve to Upper movement is discharged into water in water tank 1 from water outlet 15;
When floating ball 12 rises to the second liquid level with water level, the ball lever 11 of floating ball 12 is connected with the spool resistance in moving valve The path at the mouth of a river 14 and water outlet 15 is broken, water stopping is discharged into water tank 1 from water outlet 15;First liquid of the water tank 1 The height in face is lower than the height of the second liquid level.
Above-mentioned slow gas outlet 10 is in water tank bottom with snakelike arrangement;Above-mentioned upper cover 101 is transparent force-bearing plate;Above-mentioned floating ball 12 be stainless steel floating ball;Above-mentioned valve body 7 is to thicken brass body.
When using above-mentioned semiconductor chip welding emission-control equipment, the residual of rosin composition in exhaust gas can be reduced The pollution to environment is caused, structure is simply easy to install, and easy to use, cleaning process is simple, and advantage of lower cost substantially reduces The wasting of resources of manpower and material resources;Secondly, its Minute pores can help exhaust gas uniformly penetrating into water tank and connect with water at the uniform velocity Touching avoids gas from directly rising at the top of water tank because not contacting with water to cause the condensation of pollutant at the top of water tank to increase Add cleaning difficulty;Again, it can prevent the leakage of exhaust gas from causing the pollution to environment;Again, air-flow can be manually adjusted Size, keep the stability of air-flow, guarantee filtering efficiency, tail gas can be allow faster to be discharged, helped to improve The treatment effeciency of processing unit;Again, it is not easy to influence the use of device due to getting rusty, corroding, and can preferably realize Liquid level function;Again, the castability, processability of brass are higher and slightly lower compared with stainless steel cost, can satisfy complexity The technique of valve body also can reduce certain cost for enterprise.
The above embodiments are only for explaining the technical ideas and features of the present invention, and its object is to allow be familiar with technique Personage can understand the content of the utility model and implement accordingly, do not limit the protection scope of the present invention. All equivalent change or modifications according to made by the spirit of the present invention essence, should all cover the protection scope of the utility model it It is interior.

Claims (7)

1. a kind of semiconductor chip welding emission-control equipment, it is characterised in that: water tank (1), pneumatics including filling water Machine (5), air inlet pipe (2), exhaust pipe (13), floating ball (12) and valve body (7), described air inlet pipe (2) one end are embedded in the water tank (1) in, for this air inlet pipe (2) other end for being connected to soldering furnace, described exhaust pipe (13) one end is connected to the upper of water tank (1) It covers (101), exhaust pipe (13) other end is located at the outside of water tank (1);
It is installed an air amplifier (3) on the air inlet pipe (2), passes through one between the air amplifier (3) and air compressor machine (5) Conduit (4) is connected to, and a valve (6) are arranged on the conduit (4);
The valve body (7) is mounted on water tank (1) side wall, is provided with water inlet (14) and water outlet on the valve body (7) (15), it is provided with spool in the valve body (7), the inner end of a valve rod (9) is connected with the spool, and valve rod (9) outer end is worn Valve body (7) and one end of a ball lever (11) are hinged out, the other end of the ball lever (11) and the floating ball being located on liquid level (12) it connects;
Slow gas outlet (10) one end below liquid level is connected to air inlet pipe (2), and the other end is sealed end, this slow gas outlet (10) several fine ventholes (16) are provided on side wall;
When floating ball (12) is with water level decreasing to the first liquid level, the ball lever (11) of floating ball (12) is connected with the spool in moving valve It moves upwards, is discharged into water in water tank (1) from water outlet (15);
When floating ball (12) rises to the second liquid level with water level, the ball lever (11) of floating ball (12) is connected with the spool in moving valve The path of water inlet (14) and water outlet (15) is blocked, water stopping is discharged into water tank (1) from water outlet (15);The water tank (1) height of the first liquid level is lower than the height of the second liquid level.
2. semiconductor chip welding emission-control equipment according to claim 1, it is characterised in that: the air amplification Device (3) is installed on the upper cover (101) of water tank (1) and the junction of air inlet pipe (2).
3. semiconductor chip welding emission-control equipment according to claim 1, it is characterised in that: the valve (6) For manually-operated gate.
4. semiconductor chip welding emission-control equipment according to claim 1, it is characterised in that: the floating ball (12) For stainless steel floating ball.
5. semiconductor chip welding emission-control equipment according to claim 1, it is characterised in that: the valve body (7) To thicken brass body.
6. semiconductor chip welding emission-control equipment according to claim 1, it is characterised in that: the slow gas outlet (10) in water tank bottom with snakelike arrangement.
7. semiconductor chip welding emission-control equipment according to claim 1, it is characterised in that: the upper cover It (101) is transparent force-bearing plate.
CN201821145959.4U 2018-07-19 2018-07-19 Emission-control equipment is used in semiconductor chip welding Active CN209188437U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821145959.4U CN209188437U (en) 2018-07-19 2018-07-19 Emission-control equipment is used in semiconductor chip welding

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821145959.4U CN209188437U (en) 2018-07-19 2018-07-19 Emission-control equipment is used in semiconductor chip welding

Publications (1)

Publication Number Publication Date
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109173601A (en) * 2018-07-19 2019-01-11 苏州固锝电子股份有限公司 Emission-control equipment is used in semiconductor chip welding

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN109173601A (en) * 2018-07-19 2019-01-11 苏州固锝电子股份有限公司 Emission-control equipment is used in semiconductor chip welding

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