CN209184621U - A kind of router with multi-layer heat dissipation function - Google Patents
A kind of router with multi-layer heat dissipation function Download PDFInfo
- Publication number
- CN209184621U CN209184621U CN201822227557.5U CN201822227557U CN209184621U CN 209184621 U CN209184621 U CN 209184621U CN 201822227557 U CN201822227557 U CN 201822227557U CN 209184621 U CN209184621 U CN 209184621U
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- heat dissipation
- heat sink
- adhesive tape
- thermal conductive
- conductive silicon
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Abstract
The utility model discloses a kind of router with multi-layer heat dissipation function, including shell, wiring board and operating die, operating die installation is electrically connected in the circuit board and with wiring board；It is installed on shell, enclosure interior is equipped with heat sink, and heat sink is equipped with multiple thermal conductive silicon adhesive tape；Multiple thermal conductive silicon adhesive tape are arranged along the width direction of heat sink；Thermal conductive silicon adhesive tape extends along the length direction of heat sink；The surface of multiple thermal conductive silicon adhesive tape forms installation end face, and the wiring board is mounted on installation end face；The bottom wall of shell is equipped with multiple heat dissipation cavitys；Multiple heat dissipation cavitys are arranged along the width direction of shell；Multiple heat dissipation cavitys are located at the lower section of heat sink；The bottom end of heat dissipation cavity is equipped with multiple heat sink strips, and heat sink strip extends along the length direction of heat dissipation cavity；Multiple heat sink strips are intervally arranged along the width direction of heat dissipation cavity.The router with multi-layer heat dissipation function of the utility model, good heat dispersion performance.
Description
Technical field
The utility model relates to router field more particularly to a kind of routers with multi-layer heat dissipation function.
Background technique
Currently, with the arrival of information age, universal, the people's lives of the wireless terminals such as computer, tablet computer, mobile phone
It is increasingly be unable to do without network, to the network equipment, higher requirements are also raised, thus requirement of the people to router is higher and higher,
And the heat dissipation performance of router is vital.But existing router heat dissipation performance is poor, is easy to cause internal work
Make wafer damage, and the preferable router of heat dissipation effect mainly opens up heat release hole on shell, is easy equally also to be easy into dirt
Damage operating die.
Utility model content
For overcome the deficiencies in the prior art, the purpose of this utility model is to provide a kind of with multi-layer heat dissipation function
Router, good heat dispersion performance.
The purpose of this utility model is implemented with the following technical solutions:
A kind of router with multi-layer heat dissipation function, including shell, wiring board and operating die, operating die installation
It is electrically connected in the circuit board and with wiring board；It is installed on shell, enclosure interior is equipped with heat sink, and heat sink is equipped with multiple
Thermal conductive silicon adhesive tape；Multiple thermal conductive silicon adhesive tape are arranged along the width direction of heat sink；Length direction of the thermal conductive silicon adhesive tape along heat sink
Extend；The surface of multiple thermal conductive silicon adhesive tape forms installation end face, and the wiring board is mounted on installation end face；The bottom wall of shell is equipped with
Multiple heat dissipation cavitys；Multiple heat dissipation cavitys are arranged along the width direction of shell；Multiple heat dissipation cavitys are located at the lower section of heat sink；It dissipates
The bottom end of hot cavity is equipped with multiple heat sink strips, and heat sink strip extends along the length direction of heat dissipation cavity；Multiple heat sink strips are empty along heat dissipation
The width direction of chamber is intervally arranged.
Preferably, heat sink is equipped with multiple heat release holes；Multiple heat release holes are intervally arranged along the width direction of heat sink；It dissipates
One end of hot hole is connected to the lower section of thermal conductive silicon adhesive tape；The other end of heat release hole is connected to the top of heat dissipation cavity.
Preferably, the two sides of shell are equipped with thermovent；The bore of thermovent is gradually increased from the inside to the outside.
Preferably, the inside of the thermovent is equipped with dustproof membrane.
Preferably, multiple through-holes are equipped with inside the thermal conductive silicon adhesive tape；One end of through-hole is connected to the table of thermal conductive silicon adhesive tape
Face；The other end of through-hole is connected to heat sink.
Preferably, the section of the thermal conductive silicon adhesive tape is semicircular arc.
Compared with prior art, the utility model has the beneficial effects that: it can be directly by operating die equipped with heat conductive silica gel
And wiring board generate heat guide to the heat dissipation cavity of housing bottom, through radiate cavity shed, in this way, heat-conducting effect compared with
It is good, and can prevent dust from entering enclosure interior.At the same time, multiple heat sink strips, multiple heat sink strips are additionally provided in heat dissipation cavity
The heat that can also accelerate heat dissipation cavity inside sheds, and heat dissipation effect is more preferable.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the cross-sectional view of the thermal conductive silicon adhesive tape of the utility model.
In figure: 10, shell；11, radiate cavity；111, heat sink strip；12, thermovent；121, dustproof membrane；20, operating die；
30, heat sink；31, heat release hole；40, thermal conductive silicon adhesive tape；41, through-hole；50, wiring board.
Specific embodiment
In the following, being described further in conjunction with attached drawing and specific embodiment to the utility model:
A kind of router with multi-layer heat dissipation function as shown in Figure 1 and Figure 2, including shell 10, operating die 20
And wiring board 50, operating die 20 are installed in assist side 50, and are electrically connected with wiring board 50.It is equipped with inside shell 10
Heat sink 30, heat sink 30 are equipped with multiple thermal conductive silicon adhesive tape 40, make multiple thermal conductive silicon adhesive tape 40 along the width side of heat sink 30
To arrangement, and each thermal conductive silicon adhesive tape 40 can extend along the length direction of heat sink 30.Above-mentioned multiple thermal conductive silicon adhesive tape 40
Surface forms installation end face, and wiring board 50 is mounted on installation end face.In addition, the bottom wall of shell 10 is equipped with multiple heat dissipation cavitys
11；Multiple heat dissipation cavitys 11 are arranged along the width direction of shell 10；Multiple heat dissipation cavitys 11 are located at the lower section of heat sink 30.
When on the basis of the said structure, using the router with multi-layer heat dissipation function of the utility model, operating die
The heat that 20 work and wiring board 50 generate can be guided directly through multiple thermal conductive silicon adhesive tape 40, and be transferred to heat dissipation cavity 11,
The cavity 11 that radiated sheds, in this way, heat-conducting effect is preferable, and can prevent dust from entering inside shell 10.At the same time, it is radiating
Multiple heat sink strips 111 are additionally provided in cavity 11, the heat that multiple heat sink strips 11 can also accelerate inside heat dissipation cavity 11 sheds, radiates
Effect is more preferable.
It should be noted that the material system of above-mentioned heat sink and heat sink strip by good heat dispersion performances such as brass or bronze
At.And the mode that heat sink and heat sink strip can be welded or are bonded is fixed on shell.In addition, above-mentioned thermal conductive silicon adhesive tape
It is made of heat conductive silica gel material, is bonded with glue.In addition, above-mentioned operating die and wiring board are to route in the prior art
The operating die of device, wiring board are common terminal plate, integrate working line, can be bought by existing market.
Preferably, multiple heat release holes 31 are equipped on above-mentioned heat sink 30, multiple heat release hole 31 is along heat sink 30
Width direction is intervally arranged.One end of heat release hole 31 is specifically set to be connected to the lower section of thermal conductive silicon adhesive tape 40；Heat release hole 31 it is another
End is connected to the top of heat dissipation cavity 11.In this way, the heat of heat conductive silica gel guidance can be guided through heat release hole 31, heat is made to shed more
Fastly, radiating efficiency is higher.
Preferably, also thermovent 12 can be equipped in the two sides of shell 10；The bore of thermovent 12 gradually increases from the inside to the outside
Greatly, in this way, cross-ventilation inside the bootable shell 10 of thermovent 12 of two sides, accelerates heat dissipation.And the bore of thermovent 12 by
It is interior to outer to be gradually increased, large diameter end can the guidance outside air of larger area enter, and bore small end can then be such that air adds
Speed enters, while can also reduce the entrance of dust.
More particularly, the inside of thermovent 12 is equipped with dustproof membrane 121, allows the entrance of air-flow, while blocking dirt again
Soil enters, and radiating dustproof effect is more preferable.Dustproof membrane is made of diaphragm in the prior art, and diaphragm is also to be bonded on shell.
Preferably, multiple through-holes 41 are equipped with inside thermal conductive silicon adhesive tape 40, one end of through-hole 41 is connected to thermal conductive silicon adhesive tape
40 surface；The other end of through-hole 41 is connected to heat sink 30.I.e. thermal conductive silicon adhesive tape 40 can be carried out from own physical characteristic
It is thermally conductive, while can also be thermally conductive by being carried out in its internal through-hole 41 i.e. structure, radiating efficiency is higher.
Preferably, the section of thermal conductive silicon adhesive tape 40 is semicircular arc, in this way, semicircular arc-shaped reduce and operating die 20
Contact, reduces the contact surface with operating die 20, and the heat dissipation of operating die 20 is more preferable.
It will be apparent to those skilled in the art that can make various other according to the above description of the technical scheme and ideas
Corresponding change and deformation, and all these changes and deformation all should belong to the protection of the utility model claims
Within the scope of.
Claims (6)
1. a kind of router with multi-layer heat dissipation function, including shell, wiring board and operating die, operating die are mounted on
It is electrically connected on wiring board and with wiring board；It is installed on shell, which is characterized in that enclosure interior is equipped with heat sink, heat sink
It is equipped with multiple thermal conductive silicon adhesive tape；Multiple thermal conductive silicon adhesive tape are arranged along the width direction of heat sink；Thermal conductive silicon adhesive tape is along heat sink
Length direction extend；The surface of multiple thermal conductive silicon adhesive tape forms installation end face, and the wiring board is mounted on installation end face；Shell
Bottom wall be equipped with multiple heat dissipation cavitys；Multiple heat dissipation cavitys are arranged along the width direction of shell；Multiple heat dissipation cavitys are located at heat dissipation
The lower section of plate；The bottom end of heat dissipation cavity is equipped with multiple heat sink strips, and heat sink strip extends along the length direction of heat dissipation cavity；Multiple heat dissipations
Item is intervally arranged along the width direction of heat dissipation cavity.
2. as described in claim 1 with the router of multi-layer heat dissipation function, which is characterized in that heat sink is equipped with multiple dissipate
Hot hole；Multiple heat release holes are intervally arranged along the width direction of heat sink；One end of heat release hole is connected to the lower section of thermal conductive silicon adhesive tape；
The other end of heat release hole is connected to the top of heat dissipation cavity.
3. as described in claim 1 with the router of multi-layer heat dissipation function, which is characterized in that the two sides of shell are equipped with scattered
Hot mouth；The bore of thermovent is gradually increased from the inside to the outside.
4. as claimed in claim 3 with the router of multi-layer heat dissipation function, which is characterized in that set on the inside of the thermovent
There is dustproof membrane.
5. as described in claim 1 with the router of multi-layer heat dissipation function, which is characterized in that inside the thermal conductive silicon adhesive tape
Equipped with multiple through-holes；One end of through-hole is connected to the surface of thermal conductive silicon adhesive tape；The other end of through-hole is connected to heat sink.
6. as described in claim 1 with the router of multi-layer heat dissipation function, which is characterized in that the thermal conductive silicon adhesive tape is cut
Face is semicircular arc.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822227557.5U CN209184621U (en) | 2018-12-26 | 2018-12-26 | A kind of router with multi-layer heat dissipation function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822227557.5U CN209184621U (en) | 2018-12-26 | 2018-12-26 | A kind of router with multi-layer heat dissipation function |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209184621U true CN209184621U (en) | 2019-07-30 |
Family
ID=67378080
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822227557.5U Active CN209184621U (en) | 2018-12-26 | 2018-12-26 | A kind of router with multi-layer heat dissipation function |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209184621U (en) |
-
2018
- 2018-12-26 CN CN201822227557.5U patent/CN209184621U/en active Active
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