CN209169113U - A kind of semiconductor processing equipment - Google Patents
A kind of semiconductor processing equipment Download PDFInfo
- Publication number
- CN209169113U CN209169113U CN201822144351.6U CN201822144351U CN209169113U CN 209169113 U CN209169113 U CN 209169113U CN 201822144351 U CN201822144351 U CN 201822144351U CN 209169113 U CN209169113 U CN 209169113U
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- fixedly connected
- shell
- processing
- wall
- semiconductor
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Abstract
The utility model discloses a kind of semiconductor processing equipments, including processing shell, the processing outer casing inner wall side is fixedly connected with adjusting motor, the first driving gear is rotatably connected to by output shaft on front side of the adjusting motor, the processing outer casing inner wall bottom is fixedly connected with guiding trestle, the guiding trestle end surface slidably connects activity bar, activity bar outer wall side is fixedly connected with passive rack gear, the passive rack gear is meshed with the first driving gear, adjustment frame is fixedly connected at the top of the activity bar, vaporising device is fixedly connected at the top of the adjustment frame, the processing outer shell outer wall side upper end is fixedly connected with auxiliary tank, the utility model relates to semiconductor processing technology fields.Achieve the purpose that be evaporated semiconductor plated film, adjustable plated film distance, so that plated film is more uniform, and device has the function of adjustable plated film distance, more meets the requirement of user, expands the scope of application.
Description
Technical field
The utility model relates to semiconductor processing technology field, specially a kind of semiconductor processing equipment.
Background technique
Semiconductor manufacturing process is formed by testing after wafer manufacture, wafer test, chip package and encapsulation.After plastic packaging,
Sequence of operations is also carried out, such as rear solidification, rib cutting and molding, plated film and printing technique, semiconductor evaporation coating are to make
Coating Materials heating volatilization is attached to the surface of semiconductor element, forms film plating layer, but existing semiconductor coated film process equipment
Be unable to adjust the distance between Coating Materials and semiconductor element so that device there are certain plated film limitations.
Utility model content
(1) the technical issues of solving
In view of the deficiencies of the prior art, the utility model provides a kind of semiconductor processing equipment, provides a kind of double
Conductor is evaporated the semiconductor processing equipment of plated film, adjustable plated film distance.
(2) technical solution
In order to achieve the above object, the utility model is achieved by the following technical programs: a kind of semiconductor processing equipment,
Including processing shell, the processing outer casing inner wall side is fixedly connected with adjusting motor, passes through output on front side of the adjusting motor
Axis is rotatably connected to the first driving gear, and the processing outer casing inner wall bottom is fixedly connected with guiding trestle, the guiding trestle
End surface slidably connects activity bar, and activity bar outer wall side is fixedly connected with passive rack gear, the passive rack gear with
First driving gear is meshed, and adjustment frame is fixedly connected at the top of the activity bar, is fixedly connected with steaming at the top of the adjustment frame
Transmitting apparatus, the processing outer shell outer wall side upper end are fixedly connected with auxiliary tank, and the auxiliary chamber interior wall side upper end rotation connects
It is connected to adjusting shaft, the shaft that adjusts runs through processing shell far from one end of auxiliary tank and extends to the inside of processing shell,
One end that the adjusting shaft is located at processing interior of shell is fixedly connected with vacuum chuck, and the vacuum chuck suction inlet is connected with half
Conductor element, the adjusting shaft outer surface are fixedly connected with driven gear, and the auxiliary chamber interior wall bottom, which is fixedly connected with, to be turned
To device, the transfer output end is connect with driven gear.
Preferably, the processing outer casing inner wall two sides lower end is fixedly connected with bracing ring, the bracing ring inner surface and tune
Whole frame outer surface is slidably connected.
Preferably, the processing outer casing inner wall two sides upper end is connected with material collecting board by support base, and described half
Conductor element and material collecting board are respectively positioned on right above vaporising device.
Preferably, the vaporising device includes evaporation shell, and the evaporation outer casing inner wall bottom is fixedly connected with heat-insulated material
Material, heat-barrier material top center position are fixedly connected with crucible, and the crucible top extends to evaporation shell exterior, described
Crucible outer wall lower end is fixedly connected with electric heating tube, and the evaporation outer casing bottom two sides are fixedly connected with adjustment frame.
Preferably, the transfer includes steering motor, and the steering motor side is rotatably connected to by output shaft
Drive rod, the drive rod are fixedly connected with the second driving gear, second driving tooth far from the end surface of steering motor
Wheel is meshed with driven gear.
(3) beneficial effect
The utility model provides a kind of semiconductor processing equipment.Have it is following the utility model has the advantages that
(1), the semiconductor processing equipment is fixedly connected with adjusting motor by processing outer casing inner wall side, adjusts motor
Front side is rotatably connected to the first driving gear by output shaft, and processing outer casing inner wall bottom is fixedly connected with guiding trestle, is oriented to
Bracket end surface slidably connects activity bar, and activity bar outer wall side is fixedly connected with passive rack gear, passive rack gear and first
Driving gear is meshed, and adjustment frame is fixedly connected at the top of activity bar, and vaporising device is fixedly connected at the top of adjustment frame, and processing is outer
Shell outer wall side upper end is fixedly connected with auxiliary tank, and auxiliary chamber interior wall side upper end is rotatably connected to adjusting shaft, adjusts shaft
One end far from auxiliary tank runs through processing shell and extends to the inside of processing shell, and adjusting shaft, which is located at, processes interior of shell
One end is fixedly connected with vacuum chuck, and vacuum chuck suction inlet is connected with semiconductor element, adjusts shaft outer surface and is fixedly connected with
Driven gear, auxiliary chamber interior wall bottom are fixedly connected with transfer, and transfer output end connect with driven gear, reaches
It is evaporated the purpose of plated film, adjustable plated film distance to semiconductor, adjusts electrical power rotation, adjusts motor and drives passive tooth
Item moves up and down, and passive rack gear, which moves up and down, can adjust the distance between vaporising device and semiconductor element, and then change plated film
Effect, the Coating Materials inside electric heating tube electrified regulation crucible inside vaporising device, Coating Materials volatilization, the plating of volatilization
Membrane material is attached to the surface of semiconductor element, carries out plated film to semiconductor element, and transfer can band in coating process
Dynamic semiconductor element constantly rotates, and semiconductor element is made constantly to replace the side of plated film, realize semiconductor element while rotation while
Plated film, so that plated film is more uniform, and device has the function of adjustable plated film distance, more meets the requirement of user, expands
The scope of application.
Detailed description of the invention
FIG. 1 is a schematic structural view of the utility model；
Fig. 2 is partial enlarged view at A in the utility model Fig. 1；
Fig. 3 is the utility model vaporising device structural schematic diagram.
In figure: 1 processing shell, 2 adjust motor, 3 first driving gears, 4 guiding trestles, 5 activity bars, 6 passive rack gears, 7
Adjustment frame, 8 vaporising devices, 81 evaporation shells, 82 heat-barrier materials, 83 crucibles, 84 electric heating tubes, 9 auxiliary tanks, 10 adjust shafts,
11 driven gears, 12 vacuum chucks, 13 semiconductor elements, 14 transfers, 141 steering motors, 142 drive rods, 143 second masters
Moving gear, 15 bracing rings, 16 material collecting boards.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Please refer to Fig. 1-3, the utility model provides a kind of technical solution: a kind of semiconductor processing equipment, including processing are outer
Shell 1, processing 1 inner wall side of shell, which is fixedly connected with, adjusts motor 2, adjusts and is rotatably connected to the by output shaft on front side of motor 2
One driving gear 3, processing 1 inner wall bottom of shell are fixedly connected with guiding trestle 4, and 4 end surface of guiding trestle slidably connects
Activity bar 5,5 outer wall side of activity bar are fixedly connected with passive rack gear 6, and passive rack gear 6 is meshed with the first driving gear 3, living
It is fixedly connected with adjustment frame 7 at the top of dynamic item 5, vaporising device 8 is fixedly connected at the top of adjustment frame 7, is processed on 1 outer wall side of shell
End is fixedly connected with auxiliary tank 9, and 9 inner wall side upper end of auxiliary tank, which is rotatably connected to, adjusts shaft 10, adjusts shaft 10 far from auxiliary
It helps one end of case 9 through processing shell 1 and extends to the inside of processing shell 1, adjust shaft 10 and be located inside processing shell 1
One end is fixedly connected with vacuum chuck 12, and 12 suction inlet of vacuum chuck is connected with semiconductor element 13, and it is solid to adjust 10 outer surface of shaft
Surely it is connected with driven gear 11,9 inner wall bottom of auxiliary tank is fixedly connected with transfer 14,14 output end of transfer and passive
Gear 11 connects, and has achieved the purpose that be evaporated semiconductor plated film, adjustable plated film distance.
Processing 1 inner wall two sides lower end of shell is fixedly connected with bracing ring 15,15 inner surface of bracing ring and 7 outer surface of adjustment frame
It is slidably connected, improves the stability of device.
It processes 1 inner wall two sides upper end of shell and material collecting board 16,13 He of semiconductor element is connected with by support base
Material collecting board 16 is respectively positioned on right above vaporising device 8, and the Coating Materials in crucible 83 can not be fully utilized, Partial coatings material
Material, which is wasted, to be volatilized and is trapped on material collecting board 16, and 16 pairs of waste Coating Materials of material collecting board are collected, and are reduced
Coating cost, 16 material of material collecting board are identical as the material of Coating Materials.
Vaporising device 8 includes evaporation shell 81, and evaporation 81 inner wall bottom of shell is fixedly connected with heat-barrier material 82, heat-insulated material
Expect that 82 top center positions are fixedly connected with crucible 83, is extended at the top of crucible 83 outside evaporation shell 81, under 83 outer wall of crucible
End is fixedly connected with electric heating tube 84, and evaporation 81 two sides of the bottom of shell are fixedly connected with adjustment frame 7, and electric heating tube 84, which can be powered, to be added
Hot crucible 83 makes the Coating Materials in crucible 83 heat volatilization.
Transfer 14 includes steering motor 141, and 141 side of steering motor is rotatably connected to drive rod by output shaft
142, drive rod 142 is fixedly connected with the second driving gear 143, the second driving gear far from the end surface of steering motor 141
143 are meshed with driven gear 11, and driving driven gear 11 rotates, and vacuum chuck 12 and semiconductor element 13 is driven to rotate, will
The side of 13 plated film of semiconductor element carries out plated film.
In use, placing Coating Materials in crucible 83, vacuum chuck 12 draws semiconductor element 13, to semiconductor element
13 are positioned, and are adjusted the energization rotation of motor 2, are adjusted motor 2 and passive rack gear 6 is driven to move up and down, passive rack gear 6 moves up and down
Adjustable the distance between vaporising device 8 and semiconductor element 13, and then change the effect of plated film, the electricity inside vaporising device 8
Coating Materials inside 84 electrified regulation crucible 83 of heating tube, Coating Materials volatilization, the Coating Materials of volatilization are attached to semiconductor
The surface of element 13 carries out plated film to semiconductor element 13, and transfer 14 can drive semiconductor element in coating process
13 constantly rotations, the steering motor 141 of transfer 14, which is powered, to be rotated, and the drive of steering motor 141 can drive 11 turns of driven gear
Dynamic, driven gear 11 drives vacuum chuck 12 and semiconductor element 13 to rotate, and makes the side of the constantly replacement plated film of semiconductor element 13
Face realizes that the plated film in rotation of semiconductor element 13, the Coating Materials in crucible 83 can not be fully utilized, Partial coatings material
Material, which is wasted, to be volatilized and is trapped on material collecting board 16, and 16 pairs of waste Coating Materials of material collecting board are collected, material
16 material of collecting board is identical as the material of Coating Materials.
It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality
Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation
In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to
Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those
Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment
Intrinsic element.In the absence of more restrictions.By sentence " element limited including one ..., it is not excluded that
There is also other identical elements in the process, method, article or apparatus that includes the element ".
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of semiconductor processing equipment, including processing shell (1), it is characterised in that: processing shell (1) the inner wall side is solid
Surely it is connected with and adjusts motor (2), the first driving gear (3), institute are rotatably connected to by output shaft on front side of the adjusting motor (2)
It states processing shell (1) inner wall bottom to be fixedly connected with guiding trestle (4), guiding trestle (4) end surface slidably connects
Activity bar (5), activity bar (5) the outer wall side are fixedly connected with passive rack gear (6), and the passive rack gear (6) is main with first
Moving gear (3) is meshed, and is fixedly connected with adjustment frame (7) at the top of the activity bar (5), fixed at the top of the adjustment frame (7) to connect
It is connected to vaporising device (8), processing shell (1) the outer wall side upper end is fixedly connected with auxiliary tank (9), the auxiliary tank (9)
Inner wall side upper end, which is rotatably connected to, adjusts shaft (10), and described one end for adjusting shaft (10) separate auxiliary tank (9), which is run through, to be added
Work shell (1) and the inside for extending to processing shell (1), described adjust shaft (10) are located at the internal one end of processing shell (1)
It is fixedly connected with vacuum chuck (12), vacuum chuck (12) suction inlet is connected with semiconductor element (13), the adjusting shaft
(10) outer surface is fixedly connected with driven gear (11), and auxiliary tank (9) the inner wall bottom is fixedly connected with transfer (14),
Transfer (14) output end is connect with driven gear (11).
2. a kind of semiconductor processing equipment according to claim 1, it is characterised in that: processing shell (1) inner wall two
Side lower end is fixedly connected with bracing ring (15), and bracing ring (15) inner surface is slidably connected with adjustment frame (7) outer surface.
3. a kind of semiconductor processing equipment according to claim 1, it is characterised in that: processing shell (1) inner wall two
Side upper end is connected with material collecting board (16) by support base, and the semiconductor element (13) and material collecting board (16) are equal
Right above vaporising device (8).
4. a kind of semiconductor processing equipment according to claim 1, it is characterised in that: the vaporising device (8) includes steaming
It sends out shell (81), evaporation shell (81) the inner wall bottom is fixedly connected with heat-barrier material (82), heat-barrier material (82) top
Portion middle position is fixedly connected with crucible (83), and evaporation shell (81) outside, the crucible are extended at the top of the crucible (83)
(83) outer wall lower end is fixedly connected with electric heating tube (84), the evaporation shell (81) two sides of the bottom and adjustment frame (7) fixed company
It connects.
5. a kind of semiconductor processing equipment according to claim 1, it is characterised in that: the transfer (14) includes turning
To motor (141), steering motor (141) side is rotatably connected to drive rod (142), the drive rod by output shaft
(142) end surface far from steering motor (141) is fixedly connected with the second driving gear (143), second driving gear
(143) it is meshed with driven gear (11).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822144351.6U CN209169113U (en) | 2018-12-20 | 2018-12-20 | A kind of semiconductor processing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822144351.6U CN209169113U (en) | 2018-12-20 | 2018-12-20 | A kind of semiconductor processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209169113U true CN209169113U (en) | 2019-07-26 |
Family
ID=67344391
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822144351.6U Expired - Fee Related CN209169113U (en) | 2018-12-20 | 2018-12-20 | A kind of semiconductor processing equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209169113U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110735113A (en) * | 2019-11-13 | 2020-01-31 | 深圳市凯合达智能设备有限公司 | semiconductor coating equipment convenient to clean |
| CN114156214A (en) * | 2022-01-06 | 2022-03-08 | 广东技术师范大学 | Efficient packaging hardware for electronic chip |
-
2018
- 2018-12-20 CN CN201822144351.6U patent/CN209169113U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110735113A (en) * | 2019-11-13 | 2020-01-31 | 深圳市凯合达智能设备有限公司 | semiconductor coating equipment convenient to clean |
| CN114156214A (en) * | 2022-01-06 | 2022-03-08 | 广东技术师范大学 | Efficient packaging hardware for electronic chip |
| CN114156214B (en) * | 2022-01-06 | 2023-05-23 | 广东技术师范大学 | Efficient packaging hardware for electronic chip |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190726 Termination date: 20191220 |