CN209168001U - An embedded computer motherboard that is easy to dissipate heat - Google Patents

Abstract

The utility model discloses an embedded computer mainboard which is convenient for heat dissipation, comprising a casing, a mainboard, a fan and a motor; a backing plate is arranged on the outer lower surface of the casing; The front side of the motherboard is fixed with an operation panel, the fan is installed on the right side and the upper surface of the lower surface of the casing, the left side of the casing is fitted with a heat dissipation plate, and the top of the casing is horizontally opened There is an installation slot inside which is installed the right end of the connecting rod with an "L" shape in longitudinal section, the motor is welded on the bottom end of the connecting rod, and the output end of the motor is connected with a ash sweeping board. The embedded computer motherboard for easy heat dissipation utilizes the outside air to facilitate heat dissipation of the motherboard, and the use of the first dust filter and the second dust filter can prevent dust from entering the interior of the casing and adhering to the motherboard, affecting the normal operation of the motherboard. It can avoid the accumulation of dust on the outside of the heat dissipation plate and affect the ventilation effect.

Description

An embedded computer motherboard that is easy to dissipate heat

technical field

The utility model relates to the technical field of embedded computer motherboards, in particular to an embedded computer motherboard which is convenient for heat dissipation.

Background technique

Embedded motherboards are embedded in the computer and play the role of controlling and processing data. They are the brains of computers. Embedded computer motherboards are often used in devices that do not require high performance but require high stability. With the development of computer technology, the technology to solve the problem of computer heat dissipation is constantly innovating.

For example, the Chinese utility model patent with the authorization announcement number CN206489477U discloses a computer motherboard with a self-heating function, which can effectively increase the air flow inside the computer motherboard prevention box, make the computer motherboard better and faster to dissipate heat, and prevent the computer motherboard from being damaged. Excessive temperature leads to damage to the computer motherboard, which affects people's normal use. Protect the computer motherboard to prevent the computer motherboard from being damaged by vibration. However, when the fan is used to direct the outside air to the vicinity of the motherboard, dust can easily enter the casing. The inside is adhered to the motherboard, which affects the normal operation of the motherboard. Therefore, we propose an embedded computer motherboard that is convenient for heat dissipation, so as to solve the problems mentioned above.

Utility model content

The purpose of the present invention is to provide an embedded computer motherboard that is convenient for heat dissipation, so as to solve the problem that when the existing embedded computer motherboard proposed in the above-mentioned background technology uses a fan to guide the outside air to the vicinity of the motherboard, dust easily enters the casing The inside of the motherboard sticks to the motherboard, which affects the normal operation of the motherboard.

In order to achieve the above purpose, the present utility model provides the following technical solutions: an embedded computer motherboard that is convenient for heat dissipation, including a casing, a motherboard, a fan and a motor, the outer lower surface of the casing is provided with a backing plate, and the The left side of the inner lower surface is welded with a mounting shell with a grid-like structure inside, and the left and right sides of the interior of the mounting shell are provided with slide rails, the main board is clamped inside the slide rail, and the upper and lower surfaces of the main board are All are pasted with thermally conductive silica gel, the front side of the main board is fixed with an operation panel, the fan is installed on the right side and the upper surface of the lower surface of the casing, and the top of the casing is provided with a ventilation hole, and the top of the ventilation hole is A first dustproof net is installed, a heat dissipation plate is installed on the left side of the casing, and a second dustproof net is pasted on the right side of the heat dissipation plate. The top of the casing is horizontally provided with an installation groove, and the installation The slot is located on the left side of the ventilation hole, and the right end of the connecting rod whose longitudinal section is an "L"-shaped structure is installed inside the installation slot, and the right end of the connecting rod is provided with threaded holes at equal intervals, and the motor is welded on the connecting rod. The bottom end of the rod, and the output end of the motor is connected with a ash sweeping board.

Preferably, the top left side of the casing is penetrated with threaded nails, and the casing is fixedly connected to the connecting rod through the threaded nails.

Preferably, the mainboard is provided with heat dissipation holes at equal intervals, and the heat dissipation holes pass through the thermally conductive silica gel.

Preferably, the ventilation hole is obliquely arranged at the top of the casing, and the connection between the ventilation hole and the first dust filter is a snap connection.

Preferably, the interior of the heat dissipation plate has a porous structure, the lateral centerline of the heat dissipation plate coincides with the lateral centerline of the motor, and the ash sweeping plate is in a left-right sliding structure on the left side of the heat dissipation plate.

Preferably, the connection between the operation panel and the casing is a card slot connection, and the operation panel and the main board form a "T"-shaped structure.

Compared with the prior art, the beneficial effects of the present invention are: the embedded computer motherboard which is convenient for heat dissipation, utilizes the outside air to facilitate heat dissipation of the motherboard, and utilizes the first dustproof net and the second dustproof net to prevent dust from entering the machine. The inside of the shell is adhered to the main board, which affects the normal operation of the main board, which can prevent dust from accumulating on the outside of the heat sink and affect the ventilation effect;

1. There are fans, ventilation holes and heat dissipation plates. Under the action of the fans, the ventilation holes and heat dissipation plates make the air flow inside the casing smooth, and the external air is used to facilitate the heat dissipation of the motherboard;

2. A first dust-proof net and a second dust-proof net are provided, the first dust-proof net is installed on the top of the ventilation hole, and the second dust-proof net is pasted on the right surface of the heat dissipation plate. The second dust filter can prevent dust from entering the inside of the casing and adhering to the motherboard, affecting the normal operation of the motherboard;

3. There is a motor and a ash sweeping board. Under the action of the motor, the ash sweeping board rotates on the right surface of the heat sink, and the left side of the heat sink is cleaned with the ash sweeper to prevent dust from accumulating on the outside of the heat sink and affecting ventilation. Effect.

Description of drawings

Fig. 1 is the front view sectional structure schematic diagram of the present utility model;

2 is a schematic diagram of the connection structure of the main board and the casing of the present invention;

Fig. 3 is the side view structure schematic diagram of the utility model;

FIG. 4 is a schematic diagram of the connection structure of the connecting rod and the casing of the present invention.

In the picture: 1. Chassis; 2. Backing plate; 3. Mounting shell; 4. Slide rail; 5. Motherboard; 6. Thermal silica gel; 7. Heat dissipation hole; 8. Fan; 9. Ventilation hole; 10. First Dust filter; 11, heat dissipation plate; 12, second dust filter; 13, installation slot; 14, connecting rod; 15, threaded hole; 16, screw screw; 17, motor; 18, ash sweeper; 19, operation plate.

Detailed ways

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, rather than all the implementations. example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

1-4, the present utility model provides a technical solution: an embedded computer motherboard that facilitates heat dissipation, comprising a chassis 1, a backing plate 2, a mounting shell 3, a slide rail 4, a motherboard 5, a thermally conductive silica gel 6, Heat dissipation hole 7, fan 8, ventilation hole 9, first air filter 10, heat dissipation plate 11, second air filter 12, mounting slot 13, connecting rod 14, threaded hole 15, screw 16, motor 17, dust sweeper The plate 18 and the operation panel 19, the outer lower surface of the casing 1 is provided with a backing plate 2, and the left side of the inner lower surface of the casing 1 is welded with a mounting shell 3 with a grid-like structure inside, and the inner left and right sides of the mounting shell 3 Both sides are provided with slide rails 4, the main board 5 is clamped inside the slide rail 4, and the upper surface and the lower surface of the main board 5 are pasted with thermally conductive silica gel 6, and the inside of the main board 5 is provided with heat dissipation holes 7 at equal intervals, and heat dissipation The hole 7 penetrates the thermally conductive silica gel 6, and the heat dissipation hole 7 and the thermally conductive silica gel 6 are used to make the mainboard 5 dissipate heat quickly. The operation panel 19 is fixed on the front side of the mainboard 5, and the fan 8 is installed on the right side and the upper surface of the lower surface of the casing 1. And the top of the casing 1 is provided with a ventilation hole 9, and the top of the ventilation hole 9 is installed with a first dust filter 10. The connection method is a snap connection. The first dustproof net 10 is used to prevent external dust from entering the interior of the casing 1. The dustproof net 12, the top of the casing 1 is provided with a mounting slot 13 horizontally, and the mounting slot 13 is located on the left side of the ventilation hole 9, and the interior of the mounting slot 13 is installed with a connecting rod 14 with an "L"-shaped structure in its longitudinal section. The right end, and the inner right end of the connecting rod 14 is provided with threaded holes 15 at equal intervals, the motor 17 is welded to the bottom end of the connecting rod 14, and the output end of the motor 17 is connected with a ash sweeping plate 18;

As shown in FIG. 2, the connection between the operation panel 19 and the casing 1 is a slot connection, and the operation panel 19 and the main board 5 form a "T"-shaped structure, and the main board 5 is easily taken out from the inside of the casing 1 by pulling the operation board 19;

As shown in FIG. 4 , a screw 16 penetrates through the top left side of the casing 1 , and the casing 1 is fixedly connected to the connecting rod 14 through the screw 16 , so that the connecting rod 14 can be easily fixed on the outside of the casing 1 , and the interior of the heat dissipation plate 11 It has a porous structure, and the lateral centerline of the heat dissipation plate 11 coincides with the lateral centerline of the motor 17, and the ash sweeping plate 18 is a left-right sliding structure on the left side of the heat dissipation plate 11, which is convenient to adjust the relationship between the ash sweeping plate 18 and the heat dissipation plate 11. distance between.

Working principle: When using the embedded computer motherboard that is convenient for heat dissipation, firstly when the computer is working, the fan 8 with its own battery works on the right side and above the motherboard 5. Under the action of the fan 8, the outside air passes through the interior. The radiating plate 11 with a porous structure flows into the interior of the casing 1, the outside air exchanges heat with the hot air outside the main board 5, and the heat-exchanged air flows out of the casing 1 through the ventilation holes 9, and the outside air enters the casing 1. During the process, the first dustproof net 10 and the second dustproof net 12 keep the dust in the outside air on the outer surfaces of the first dustproof net 10 and the second dustproof net 12, so as to prevent the dust from sticking to the main board 5, Affects the normal operation of the main board 5. During the operation of the components on the main board 5, the thermally conductive silica gel 6 and the heat dissipation holes 7 can quickly remove the heat generated by the components on the main board 5 out of the main board 5;

Since the air flows into the interior of the casing 1 from the heat dissipation plate 11, and then flows out of the interior of the casing 1 through the ventilation holes 9, a lot of dust adheres to the outer surface of the heat dissipation plate 11. When it is necessary to remove the dust on the outer surface of the heat dissipation plate 11 When the motor 17 is turned on, under the action of the motor 17, the dust-sweeping plate 18 rotates on the outer surface of the heat-dissipating plate 11, and the dust on the heat-dissipating plate 11 adheres to the inner surface of the dust-sweeping plate 18. When a lot of dust is attached, remove the screw 16 from the top of the casing 1, slide the connecting rod 14 to the left in the interior of the installation slot 13, and slide the dust-sweeping plate 18 to the left on the left side of the heat dissipation plate 11. Manually remove the dust on the ash sweeping board 18;

When the main board 5 needs to be taken out from the inside of the casing 1, the staff manually pulls the operation panel 19 forward, the main board 5 slides on the inside of the slide rail 4, and slides out from the inside of the casing 1, and the above completes the heat dissipation. A series of operations of the motherboard of the embedded computer, the contents not described in detail in this specification belong to the prior art known to those skilled in the art.

The standard parts used in the utility model can be purchased from the market, the special-shaped parts can be customized according to the description in the specification and the drawings, and the specific connection method of each part adopts the mature bolts, rivets and welding in the prior art. and other conventional means, the machinery, parts and equipment all adopt the conventional models in the prior art, and the circuit connection adopts the conventional connection manner in the prior art, which will not be described in detail here.

Although the present invention has been described in detail with reference to the foregoing embodiments, for those skilled in the art, it is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Within the spirit and principle of the present utility model, any modifications, equivalent replacements, improvements, etc. made shall be included within the protection scope of the present utility model.

Claims (6)

1. An embedded computer motherboard that facilitates heat dissipation, comprising a casing (1), a motherboard (5), a fan (8) and a motor (17), characterized in that: an outer lower surface of the casing (1) is provided with There is a backing plate (2), and a mounting shell (3) with a grid-like structure is welded on the left side of the inner lower surface of the casing (1), and slide rails are provided on the left and right sides of the interior of the mounting shell (3) (4), the main board (5) is engaged with the inside of the slide rail (4), and the upper surface and the lower surface of the main board (5) are pasted with thermally conductive silica gel (6). The front side of the main board (5) An operation panel (19) is fixed, the fan (8) is installed on the right side and the upper surface of the lower surface of the casing (1), and the top of the casing (1) is provided with a ventilation hole (9), and ventilation A first dust filter (10) is installed at the top of the hole (9), a heat dissipation plate (11) is installed on the left side of the casing (1), and a second heat dissipation plate (11) is attached to the right side of the heat dissipation plate (11). The dustproof net (12) is provided with a mounting groove (13) at the top of the casing (1) horizontally, and the mounting groove (13) is located on the left side of the ventilation hole (9), and the interior of the mounting groove (13) The right end of the connecting rod (14) whose longitudinal section is in an "L"-shaped structure is installed, and the right end of the connecting rod (14) is provided with threaded holes (15) at equal intervals, and the motor (17) is welded on the connecting rod ( 14), and the output end of the motor (17) is connected with a ash sweeping board (18). 2. An embedded computer motherboard that is easy to dissipate heat according to claim 1, characterized in that: the top left side of the casing (1) is provided with a threaded screw (16), and the casing (1) is threaded The nail (16) is fixedly connected with the connecting rod (14). 3. An embedded computer motherboard that is easy to dissipate heat according to claim 1, wherein the motherboard (5) is provided with heat dissipation holes (7) at equal intervals, and the heat dissipation holes (7) penetrate through the thermally conductive silica gel (6). 4. An embedded computer motherboard that is easy to dissipate heat according to claim 1, characterized in that: the ventilation hole (9) is obliquely arranged on the top of the casing (1), and the ventilation hole (9) is connected to the first The connection method of the dust filter (10) is snap connection. 5. An embedded computer motherboard that facilitates heat dissipation according to claim 1, characterized in that: the interior of the heat dissipation plate (11) is in a porous structure, and the transverse centerline of the heat dissipation plate (11) is connected to the motor ( 17) of the horizontal center lines coincide, and the ash sweeping plate (18) is a left and right sliding structure on the left side of the heat dissipation plate (11). 6. An embedded computer motherboard that is easy to dissipate heat according to claim 1, characterized in that: the operation panel (19) is connected with the casing (1) in a card slot connection, and the operation panel (19) It forms a "T"-shaped structure with the main board (5).