CN209150426U - 一种同轴连接器的射频内导体连接结构 - Google Patents
一种同轴连接器的射频内导体连接结构 Download PDFInfo
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- CN209150426U CN209150426U CN201920052012.7U CN201920052012U CN209150426U CN 209150426 U CN209150426 U CN 209150426U CN 201920052012 U CN201920052012 U CN 201920052012U CN 209150426 U CN209150426 U CN 209150426U
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- inner conductor
- gear piece
- coaxial connector
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- 239000004020 conductor Substances 0.000 title claims abstract description 57
- 239000000463 material Substances 0.000 claims description 10
- 229910001369 Brass Inorganic materials 0.000 claims description 8
- 239000010951 brass Substances 0.000 claims description 8
- DMFGNRRURHSENX-UHFFFAOYSA-N beryllium copper Chemical compound [Be].[Cu] DMFGNRRURHSENX-UHFFFAOYSA-N 0.000 claims description 7
- 238000010276 construction Methods 0.000 abstract description 4
- 238000010586 diagram Methods 0.000 description 5
- 235000014676 Phragmites communis Nutrition 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 238000003032 molecular docking Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- 229910000906 Bronze Inorganic materials 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000010974 bronze Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 230000008961 swelling Effects 0.000 description 1
- 238000009864 tensile test Methods 0.000 description 1
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- Coupling Device And Connection With Printed Circuit (AREA)
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CN201920052012.7U CN209150426U (zh) | 2019-01-11 | 2019-01-11 | 一种同轴连接器的射频内导体连接结构 |
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CN201920052012.7U CN209150426U (zh) | 2019-01-11 | 2019-01-11 | 一种同轴连接器的射频内导体连接结构 |
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GR01 | Patent grant | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right |
Effective date of registration: 20200527 Address after: 100176 No. 8 Wenchang Avenue, Beijing economic and Technological Development Zone, Beijing, Daxing District Patentee after: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Address before: 101300 No. 26, A District, Tianzhu Road, Tianzhu Airport Industrial Zone, Beijing, Shunyi District Patentee before: Beijing BBEF Science & Technology Co.,Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20240717 Address after: 100176 4s01, 4th floor, building 1, No.8 courtyard, Wenchang Avenue, Beijing Economic and Technological Development Zone, Daxing District, Beijing Patentee after: Beijing Huacheng Electronics Co.,Ltd. Country or region after: China Address before: 100176 Beijing Daxing District Beijing economic and Technological Development Zone Wenchang Road 8 Patentee before: BEIJING NAURA MICROELECTRONICS EQUIPMENT Co.,Ltd. Country or region before: China |
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TR01 | Transfer of patent right |