CN209149069U - Chip assembly and toner cartridge - Google Patents
Chip assembly and toner cartridge Download PDFInfo
- Publication number
- CN209149069U CN209149069U CN201822086272.4U CN201822086272U CN209149069U CN 209149069 U CN209149069 U CN 209149069U CN 201822086272 U CN201822086272 U CN 201822086272U CN 209149069 U CN209149069 U CN 209149069U
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- wiring board
- energy
- wave tube
- travelling wave
- storage travelling
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- 238000004146 energy storage Methods 0.000 claims abstract description 68
- 238000009434 installation Methods 0.000 abstract description 11
- 238000012938 design process Methods 0.000 abstract description 2
- 238000003384 imaging method Methods 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000007812 deficiency Effects 0.000 description 2
- 239000010410 layer Substances 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000004020 conductor Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
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- Structure Of Printed Boards (AREA)
Abstract
The utility model relates to print technical field of imaging, more particularly to a kind of chip assembly and with the toner cartridge of the chip assembly, the chip assembly includes wiring board, SMT device and energy-storage travelling wave tube, the SMT device and the energy-storage travelling wave tube respectively with the circuit board electrical connection, the energy-storage travelling wave tube and the SMT device, which are stacked along the thickness direction of the wiring board in the side of the wiring board, to be arranged, it is arranged such, when chip assembly institute's installation space is by limited time, it can be using the wiring board for the small area for being adapted to the installation space size, and energy-storage travelling wave tube and whole SMT device stacks are set on the wiring board, it is designed on wiring board compared to by energy-storage travelling wave tube and SMT device single flat paving, the form for stacking setting can simplify the design process of chip assembly.
Description
Technical field
The utility model relates to print technical field of imaging, more particularly to a kind of chip assembly and there is the chip assembly
Toner cartridge.
Background technique
In consumptive material industry, common wiring board includes rigid circuit board and flexible circuit board, wherein printer material consumption core
Piece generally uses based on rigid circuit board, and small part band head cartridge uses flexible circuit board.It is therein by taking laser printer as an example
The space that can be used in chip on toner cartridge is relatively limited, and essential on the chip being applied thereon includes electricity
The devices such as pond, wafer, resistance, therefore, chip design is more difficult caused by being frequently present of due to installation space deficiency,
That is, the suitable position on the lesser wiring board of area is arranged in all necessary devices under the premise of installation space is limited.
Utility model content
Based on this, it is necessary in view of the above-mentioned problems, provide a kind of chip assembly and toner cartridge, the energy-storage travelling wave tube of the chip and its
He is arranged device by way of layer stack, so that it is necessary to devices can be set to the lesser wiring board of area for institute
On.
On the one hand the utility model provides a kind of chip assembly, including wiring board, SMT device and energy-storage travelling wave tube, described
SMT device and the energy-storage travelling wave tube are respectively with the circuit board electrical connection, and the energy-storage travelling wave tube and the SMT device are along the line
The thickness direction of road plate stacks setting in the side of the wiring board.
The SMT device is mounted on the PCB surface in one of the embodiments, and the wiring board is pasted with
Support plate and fastener are additionally provided on the surface of the SMT device, the energy-storage travelling wave tube is set in the support plate and passes through
The fragmented PCB surface of support plate, the energy-storage travelling wave tube are electrically connected to described by the support plate and the fastener
Wiring board.
Bent angle has been bent to form in the support plate in one of the embodiments,.
The chip assembly further includes the flexible circuit board with the circuit board electrical connection in one of the embodiments,
One end of the flexible circuit board is fixedly arranged on the wiring board, and the other end can be overturn to the top of the wiring board, institute
It states SMT device and is mounted on the flexible circuitry plate surface, the energy-storage travelling wave tube is electrically connected on wiring board and can be to described soft
Property wiring board power supply.
The flexible circuit board is connected to the same of the wiring board with the energy-storage travelling wave tube in one of the embodiments,
On side, the wiring board is provided with chip contacts on the energy-storage travelling wave tube and the one side of the SMT device stack.
The flexible circuit board and the energy-storage travelling wave tube are connected to the route plate thickness in one of the embodiments,
It spends on two opposite sides on direction, and/or, what the chip contacts were set to the flexible circuit board is fixed to route
On the part of plate, and it is located at the flexible circuit board on the one side of the wiring board.
It is installed on the one side of SMT device setting in the flexible circuit board in one of the embodiments,
There is PI stiffening plate.
It is further fixed on the wiring board in one of the embodiments, for being electrically connected the energy-storage travelling wave tube to described
The battery snap of wiring board, the flexible circuit board are fixed to the side surface that the battery snap deviates from the wiring board.
The wiring board is set as rigid circuit board in one of the embodiments, and/or, the energy-storage travelling wave tube is patch
Piece battery.
On the other hand the utility model also provides a kind of toner cartridge, the toner cartridge includes above-mentioned chip assembly.
In said chip component, three-dimensional stack is distributed on energy-storage travelling wave tube and SMT device assist side thickness direction.In this way,
When chip assembly institute's installation space by limited time, can using be adapted to the installation space size small area wiring board, and will
Energy-storage travelling wave tube and whole SMT device stacks are set on the wiring board, are tiled compared to by energy-storage travelling wave tube and SMT device single layer
It is designed on wiring board, the form for stacking setting can simplify the design process of chip assembly.
Detailed description of the invention
Fig. 1 is a kind of structure chart of embodiment of chip；
Fig. 2 is the structure chart of the another embodiment of chip；
Fig. 3 is the structure chart flexible circuit board in Fig. 2 being unfolded to show PI stiffening plate installation position；
Fig. 4 is the view for showing the inverse layer structure of Fig. 3；
Fig. 5 is the structure chart of another embodiment of chip.
Description of symbols
1, wiring board；2, support plate；20, bent angle；3, energy-storage travelling wave tube；4, SMT device；5, flexible circuit board；6, fastener；
60, connecting plate；61, pressing plate；7, PI stiffening plate；8, battery snap；9, chip contacts.
Specific embodiment
It should be noted that it can be installed directly in another group when component is referred to as " being installed in " another component
On part or there may also be components placed in the middle.When a component is considered as " being set to " another component, it be can be directly
It connects and is arranged on another component or may be simultaneously present component placed in the middle.When a component be considered as " being fixed on " another
Component, it, which can be, is directly anchored on another component or may be simultaneously present component placed in the middle.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Term as used herein " and/or " it include one or more related
Listed item any and all combinations.Under the premise of without opposite explanation, the noun of locality " upper and lower " used herein
For being the orientation with reference to shown in attached drawing.
As shown in fig. 1, according to a kind of chip assembly of embodiment of the utility model, including wiring board 1, energy-storage travelling wave tube
3 and SMT device 4, in which: wiring board 1 is preferably rigid circuit board.SMT device 4 can be the electricity for being mounted on circuit board surface
Sub- device, such as resistance, wafer, resistance, inductance, integrated circuit etc..
Along the thickness direction of wiring board 1, the one side of wiring board 1 is used for chip integral installation to other positions, such as
The position of chip is used on toner cartridge；On its another side for mounting SMT device 4, also, wiring board 1 is installed with SMT
Support plate 2 is additionally provided on the one side of device 4.Support plate 2 is fixed on wiring board 1, and is electrically connected with wiring board 1, along the line
The thickness direction of road plate 1, the part plate body of support plate 2 extend to the top of SMT device 4, and energy-storage travelling wave tube 3 is fixed on support plate 2
This part plate body on, this part plate body reliable contacts of energy-storage travelling wave tube 3 and support plate 2, so that in 3 positive and negative anodes of energy-storage travelling wave tube
One pole is electrically connected to wiring board 1 by support plate 2.Chip contacts 9 on chip assembly for communicating with external printer are arranged
In wiring board 1 on the one side that energy-storage travelling wave tube 3 and SMT device 4 stack.Support plate 2 is used to install energy-storage travelling wave tube 3
This part plate body is located at the top of at least partly SMT device 4, in this way, energy-storage travelling wave tube 3 is with SMT device 4 along the thickness of wiring board 1
Direction solid is stacked on the same side of wiring board 1.Compared to tiling installation energy-storage travelling wave tube on the same side of assist side 1
The mode of 3 and SMT device 4, the three-dimensional chip for stacking each device and being formed, is used to install to the chip area of other positions
It is smaller, be conducive to the design of chip.
Embodiment as shown in Figure 1, one end of support plate 2 are fixedly welded on wiring board 1, and the other end is formed as
Free end and the top for extending to SMT device 4 are slightly formed between the lower surface of free end and the SMT device 4 being disposed below
Certain interval, avoids the free end deformation of support plate 2 from damaging the SMT device 4 of lower section by pressure, and energy-storage travelling wave tube 3 is fixed on the free end.
In order to increase the rigidity of support plate 2, bent angle 20 is bent to form in support plate 2, so that energy-storage travelling wave tube 3 props up on free end
It supports more stable.In some embodiments, energy-storage travelling wave tube 3 is set as patch battery, and fastener 6 is additionally provided on wiring board 1,
Including be welded and fixed on wiring board 1 connecting plate 60, extend to the pressing plate 61 of the top of energy-storage travelling wave tube 3 and be connected to the two
Between plate body, the direction of pressing plate 61 towards 2 upper surface of support plate compresses energy-storage travelling wave tube 3, so that energy-storage travelling wave tube 3 is steadily clamped
Between support plate 2 and fastener 6；Connecting plate 60 and wiring board 1 are welded and fixed and conduction, utilizes pressing plate 61 and connecting plate 60, storage
Another pole of energy element 3 is electrically connected on wiring board 1.
It is understood that there are two the effects of support plate 2: one is support energy-storage travelling wave tube 3, allows it to along route
The thickness direction of plate 1 is fragmented, and energy-storage travelling wave tube 3 compresses the SMT device 4 on wiring board 1 when chip assembly being avoided to be pressurized；The second is
In fastener 6 together being electrically connected with wiring board 1 by energy-storage travelling wave tube 3.Support plate 2 is all made of iron plate or other with fastener 6 and can lead
The material of electricity is made, and the connecting plate 60 in support plate 2 and 1 weld of wiring board and fastener 6 is welded and fixed on wiring board 1
Conductive region at so that energy-storage travelling wave tube 3 can power to wiring board 1, and then power to the SMT device 4 on wiring board 1.
As shown in Fig. 2 to Fig. 3, according to the chip assembly of the utility model another embodiment, and shown in Fig. 1
The difference of structure is: energy-storage travelling wave tube 3 is set on wiring board 1.Battery snap 8 is additionally provided on wiring board 1, the battery snap 8
Lower end is welded and fixed on the conductive region on wiring board 1, and battery snap 8 is formed towards wiring board 1 in the top of energy-storage travelling wave tube 3 and supported
The plate body of 3 upper surface of energy-storage travelling wave tube is pressed, so that the conductive region on the lower surface contact wiring board 1 of energy-storage travelling wave tube 3, in this way, storage
One electrode of energy element 3 is electrically connected by battery snap 8 with wiring board 1, another electrode then passes through energy-storage travelling wave tube 3 and route
Conductive region on plate 1 is directly contacted and is electrically connected with wiring board 1.
Battery snap 8 is made of conductive material, one effect is that a pole of energy-storage travelling wave tube 3 is electrically connected to wiring board 1
On, another effect is limited to energy-storage travelling wave tube 3, so that energy-storage travelling wave tube 3 keeps reliable with the conductive region of wiring board 1
Sliding along 1 surface of wiring board and the movement far from 1 surface of wiring board do not occur for contact.
Along 1 thickness direction of wiring board, flexible circuitry is installed on the one side that energy-storage travelling wave tube 3 is installed on wiring board 1
Plate 5, flexible circuit board 5 include the part that is fixed on wiring board 1, and beyond wiring board 1 and can overturn and be folded to wiring board 1
Part on another side.As shown in Figure 4, chip contacts 9 are set on the part of fixing circuit board 1 of flexible circuit board 5,
And it is located at flexible circuit board 5 on the one side of wiring board 1；What SMT device 4 was mounted on flexible circuit board 5 can overturn folding
It is stacked on the part of 1 another side of wiring board.
When the free end of flexible circuit board 5 is bent and extends to the top of battery snap 8, SMT device 4 is by flexible circuit board 5
It is supported in the top of energy-storage travelling wave tube 3.In some embodiments, the free end of flexible circuit board 5 can by gum or its
His fixed form is fixed on the upper surface of battery snap 8, in this way, flexible circuit board 5 does not increase the area of plane of chip entirety.It is soft
Property wiring board 5 and wiring board 1 it is fixed and be electrically connected, the electric energy of energy-storage travelling wave tube 3 can supply power to flexible circuit board by wiring board 1
1, and then power to the SMT device 4 in flexible circuit board 5.
The content with reference to shown in Fig. 3, in order to avoid flexible circuit board 5 causes thereon in switching process because of hardness deficiency
Metal thread breakage causes SMT device 4 breaking or thereon to damage, one be arranged in flexible circuit board 5 away from SMT device 4
Being sticked on side has PI stiffening plate 7, and the position that is sticked, which is subject to, does not interfere the overturning of flexible circuit board 5 to be bent.It is being provided with PI
In the embodiment of stiffening plate 7, flexible circuit board 5 can be bonded admittedly by being located in gum between PI stiffening plate 7 and battery snap 8
Determine to the upper surface of battery snap 8.
In this embodiment, the structure of battery snap 8 is not limited to structure shown in Fig. 3, can will arbitrarily store up
Energy element 3 is electrically connected to the structure of wiring board 1, is configured to its equivalent substitute form.Electricity shown in Fig. 2 and Fig. 3
The metal structure that pond button 8 is integrated, is additionally provided at the position that battery snap 8 is contacted with 3 upper surface of energy-storage travelling wave tube towards energy storage
The structure of 3 upper surface of element protrusion, so that energy-storage travelling wave tube 3 is reliably compressed on the conductive region on fitting wiring board 1.
Flexible circuit board 5 and the stickup of battery snap 8 are fixed, also not unique positioning form of flexible circuit board 5, some
In embodiment, flexible circuit board 5 can be not fixed (its nature is shown in Fig. 3) before chip installation, and in installation
After overturn to position shown in Fig. 2, the overturning of flexible circuit board 5 is limited by the other structures of chip assembly installed position
State.
In conjunction with shown in Fig. 5, according to institute in the chip assembly of another embodiment of the utility model, with Fig. 2 and Fig. 3
The chip structure difference shown is: flexible circuit board 5 and energy-storage travelling wave tube 3 are set on the same side of wiring board 1.PI stiffening plate
The fixed form of the upper surface of 7 setting and flexible circuit board 5 and battery snap 8, can be using shown in Fig. 2 and Fig. 3
Mode.In this embodiment, chip contacts 9 are set on the one side that energy-storage travelling wave tube 3 is arranged backwards of wiring board 1.
It is equal that Fig. 1 shows the three-dimensional mode for stacking energy-storage travelling wave tube 3 and SMT device 4, three kinds of modes on wiring board 1 into Fig. 5
The area of plane of wiring board 1 can be reduced, especially when chip assembly is on toner cartridge, for installing the sky of the chip assembly
Between very little, using solid stack by the way of energy-storage travelling wave tube 3 and SMT device 4 are set, the design difficulty of chip assembly can be made to drop
It is low.
On the other hand the utility model also provides a kind of toner cartridge comprising the chip assembly of aforementioned any embodiment,
When the chip assembly is installed on toner cartridge, the chip contacts 9 on chip assembly are contacted with the stitch on printer, so that chipset
Part can be communicated between printer.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of chip assembly, including wiring board (1), SMT device (4) and energy-storage travelling wave tube (3), the SMT device (4) and institute
It states energy-storage travelling wave tube (3) to be electrically connected with the wiring board (1) respectively, which is characterized in that the energy-storage travelling wave tube (3) and the SMT device
Part (4) stacks setting in the side of the wiring board (1) along the thickness direction of the wiring board (1).
2. chip assembly according to claim 1, which is characterized in that the SMT device (4) is mounted on the wiring board
(1) surface is additionally provided with support plate (2) and fastener on the surface for being pasted with the SMT device (4) of the wiring board (1)
(6), the energy-storage travelling wave tube (3) is set on the support plate (2) and by the fragmented wiring board (1) of the support plate (2)
Surface, the energy-storage travelling wave tube (3) are electrically connected to the wiring board (1) by the support plate (2) and the fastener (6).
3. chip assembly according to claim 2, which is characterized in that be bent to form bent angle on the support plate (2)
(20)。
4. chip assembly according to claim 1, which is characterized in that the chip assembly further includes and the wiring board
(1) flexible circuit board (5) being electrically connected, one end of the flexible circuit board (5) is fixedly arranged on the wiring board (1), another
End can be overturn to the top of the wiring board (1), and the SMT device (4) is mounted on the flexible circuit board (5) surface, institute
Energy-storage travelling wave tube (3) is stated to be electrically connected on wiring board (1) and can power to the flexible circuit board (5).
5. chip assembly according to claim 4, which is characterized in that the flexible circuit board (5) and the energy-storage travelling wave tube
(3) it is connected on the same side of the wiring board (1), the wiring board (1) is backwards to the energy-storage travelling wave tube (3) and the SMT
Chip contacts (9) are provided on the one side that device (4) stacks.
6. chip assembly according to claim 4, which is characterized in that the flexible circuit board (5) and the energy-storage travelling wave tube
(3) it is connected on two opposite sides on the wiring board (1) thickness direction, and/or, the chip contacts (9)
It is set to being fixed on the part of wiring board (1) for the flexible circuit board (5), and is located at the flexible circuit board (5) backwards
On the one side of the wiring board (1).
7. chip assembly according to claim 4, which is characterized in that backwards to the SMT device on the flexible circuit board (5)
PI stiffening plate (7) are installed on the one side of part (4) setting.
8. chip assembly according to claim 4, which is characterized in that be further fixed on the wiring board (1) for electrically
The battery snap (8) of the energy-storage travelling wave tube (3) to the wiring board (1) is connected, the flexible circuit board (5) is fixed to the battery
Detain (1) one side surface that (8) deviate from the wiring board.
9. chip assembly described in any one of -8 according to claim 1, which is characterized in that the wiring board (1) is set as
Rigid circuit board, and/or, the energy-storage travelling wave tube (3) is patch battery.
10. a kind of toner cartridge, which is characterized in that the toner cartridge includes chip assembly described in any one of claim 1-9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822086272.4U CN209149069U (en) | 2018-12-12 | 2018-12-12 | Chip assembly and toner cartridge |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822086272.4U CN209149069U (en) | 2018-12-12 | 2018-12-12 | Chip assembly and toner cartridge |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209149069U true CN209149069U (en) | 2019-07-23 |
Family
ID=67289949
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822086272.4U Active CN209149069U (en) | 2018-12-12 | 2018-12-12 | Chip assembly and toner cartridge |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209149069U (en) |
-
2018
- 2018-12-12 CN CN201822086272.4U patent/CN209149069U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 12th Floor, Huachuang Building, No. 511 Jianye Road, Binjiang District, Hangzhou City, Zhejiang Province, 310051 Patentee after: Hangzhou Qijie Technology Co.,Ltd. Country or region after: China Address before: Room 421, floor 4, building 1, No. 1180 Bin'an Road, Binjiang District, Hangzhou City, Zhejiang Province Patentee before: HANGZHOU CHIPJET TECHNOLOGY Co.,Ltd. Country or region before: China |