CN209131356U - A kind of drying oven heating module - Google Patents
A kind of drying oven heating module Download PDFInfo
- Publication number
- CN209131356U CN209131356U CN201821879610.3U CN201821879610U CN209131356U CN 209131356 U CN209131356 U CN 209131356U CN 201821879610 U CN201821879610 U CN 201821879610U CN 209131356 U CN209131356 U CN 209131356U
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- heating module
- heating
- baffle
- drying oven
- silicon wafer
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Abstract
The utility model discloses a kind of drying oven heating modules, including upper heating module and lower heating module, upper heating module and lower heating module are interlocked, a heating chamber is formed between upper heating module and lower heating module, heating module further includes the heating unit that opposite sides in heating chamber is arranged in, heating module further includes the baffle plate assembly being fixed at below the chain of transmission silicon wafer, baffle plate assembly includes baffle, heating module further includes the first mesh plate for being fixed at the opposite sides of baffle plate assembly, first mesh plate of two sides is separately positioned on the inside of the heating unit of corresponding side, and a channel is all had between heating unit.The drying oven heating module structure is simple, when carrying out heating, drying to silicon wafer, hot wind acts on silicon wafer after translateral first mesh plate below baffle, can avoid hot wind in this way and directly acts on silicon wafer, and silicon wafer is heated evenly, to can guarantee the heating, drying effect of silicon wafer.
Description
Technical field
The utility model relates to manufacture of solar cells technical fields, and in particular to a kind of drying oven heating module.
Background technique
The solar battery of HIT and HJT structure be exactly deposited on crystal silicon chip one layer of undoped hydrogenation non crystal silicon film and
One layer of doped hydrogenated amorphous silicon film opposite with crystalline silicon dopant species improves P-N section performance, has higher conversion effect
Rate and lower photo attenuation.
In existing solar battery preparation process, drying silicon wafer is directly heated by the heat that heating fluorescent tube issues,
This heating, drying mode, hot wind directly acts on silicon wafer, and silicon wafer uneven heating is even, to can cause to the performance of silicon wafer
Certain influence.
Utility model content
The purpose of this utility model is to provide a kind of improved drying oven heating module for the problems of the prior art.
In order to achieve the above objectives, the technical solution adopted in the utility model is:
A kind of drying oven heating module, including upper heating module and lower heating module, the upper heating module and it is described under
Heating module is interlocked, and a heating chamber, the heated mould are formed between the upper heating module and the lower heating module
Group further includes the heating unit that opposite sides in the heating chamber is arranged in, and the heating module further includes being fixed at biography
Baffle plate assembly below the chain of defeated silicon wafer, the baffle plate assembly include baffle, and the heating module further includes being fixed at
First mesh plate of the opposite sides of the baffle plate assembly, first mesh plate of two sides are separately positioned on the institute of corresponding side
The inside of heating unit is stated, and all has a channel between the heating unit.
Preferably, plane where the baffle is parallel to the bottom surface of the lower heating module, the lower end surface of the baffle with
There is spacing, the heating module further includes wind wheel, and the wind wheel is rotatably set between the bottom surface of the lower heating module
It sets in the space between the lower end surface of the baffle and the bottom surface of the lower heating module.
Further, the heating module further includes the motor for driving the wind wheel rotation, and the motor setting exists
The outside of the heating chamber, and the motor shaft of the motor is connect across the bottom of the lower heating module with the wind wheel.
Preferably, plane where first mesh plate of two sides is each perpendicular to plane where the baffle.
Preferably, the baffle plate assembly further includes more supports being supported between the baffle and the lower heating module
Bar, the upper end of the every support rod are fixedly connected with the baffle, and the lower end of the every support rod adds down with described
The bottom surface of thermal module is mutually fixedly connected.
Preferably, multiple first mesh are provided on first mesh plate, multiple first mesh are described first
It is uniformly distributed on mesh plate.
Preferably, the heating module further includes the second mesh plate for being fixed at the top of the heating chamber, institute
The top that the second mesh plate is located at silicon wafer is stated, multiple second mesh, second mesh plate are provided on second mesh plate
Underface is provided with the first area of silicon wafer and underface and does not place the second area of silicon wafer, multiple second mesh are equal
Cloth is distributed at the second area of second mesh plate.
Preferably, the inner cavity of the upper heating module is in down big up small pyramidal structure.
Preferably, the heating module further includes the bracket for being used to support the chain, and the bracket is fixed at institute
It states on baffle.
Preferably, the heating module further includes the attemperator for being coated on the outside of the heating chamber.
Due to the application of the above technical scheme, the utility model has the advantage that this is practical new compared with prior art
The drying oven heating module structure of type is simple, and when carrying out heating, drying to silicon wafer, hot wind is translateral first below the baffle
Silicon wafer is acted on after mesh plate, hot wind is can avoid in this way and directly acts on silicon wafer, and silicon wafer is heated evenly, thus
It can guarantee the heating, drying effect of silicon wafer.
Detailed description of the invention
Fig. 1 is the schematic diagram of internal structure of the drying oven heating module of the utility model；
Fig. 2 is the outline drawing of the drying oven heating module of the utility model.
Specific embodiment
The technical solution of the utility model is further elaborated with reference to the accompanying drawing.
As depicted in figs. 1 and 2, the drying oven heating module of the utility model includes lower heating module 1 and upper heating module
2。
Upper heating module 2 and lower heating module 1 are interlocked, and form one between upper heating module 2 and lower heating module 1 and add
Hot chamber, the heating module further include the heating unit 3 being arranged in heating chamber.In the present embodiment, heating unit 3, which uses, to be added
Heat pipe, heating tube are separately positioned on the opposite sides of heating chamber.
Heating module further includes baffle plate assembly, and baffle plate assembly includes baffle 401 and support rod 402.Baffle 401 is arranged in parallel
In the top of the bottom surface of lower heating module 1, and there is a spacing between the bottom surface of lower heating module 1, when chain 11 drives silicon
When piece 100 is entered in heating chamber, baffle 401 is located at the lower section of silicon wafer 100.Support rod 402 be supported on baffle 401 and it is lower plus
Between the bottom surface of thermal module 1, on the upper end fixed setting baffle 401 of support rod 402, the lower end fixation of support rod 402 is set
It sets on the bottom surface of lower heating module 1.
Heating module further includes the first mesh plate 5, and the first mesh plate 5 is respectively fixedly disposed at the opposite sides of baffle 401,
And the first mesh plate 5 of two sides is located at the inside of the heating unit 3 of corresponding side, and between corresponding heating unit 3
With a distance, 5 place plane of the first mesh plate is perpendicular to 401 place plane of baffle.
Multiple first mesh are provided on first mesh plate 5, multiple first mesh divide uniformly at intervals on the first mesh plate 5
Cloth.
Heating module further includes the second mesh plate 6, and the second mesh plate 6 is located at the top of heating chamber, when chain 11 drives
When silicon wafer 100 is entered in heating chamber, the second mesh plate 6 is located at the top of silicon wafer 100, and is spaced one between silicon wafer 100
Set a distance.
Multiple second mesh are provided on second mesh plate 6, there is the second mesh plate 6 underface to be provided with silicon wafer 100
First area and underface do not place the second area of silicon wafer 100, and multiple second mesh are uniformly distributed on the second mesh plate 6
At second area.
Heating module further includes wind wheel 7, wind wheel 7 be rotatably arranged in baffle 401 and lower heating module 1 bottom surface it
Between be formed by space, wind wheel 7 is rotatably arranged, so that heat produced by heating unit 3 can be 7 turns through wind wheel
It is dynamic to form hot wind and flowed in heating chamber to be heated to silicon wafer 100.
Heating module further includes the motor 8 for driving wind wheel 7 to rotate, and the outside of heating chamber, motor is arranged in motor 8
The bottom that 8 motor shaft passes through lower heating module 1 is connect with wind wheel 7, so that wind wheel 7 be driven to rotate.
The inner cavity of upper heating module 2 is in down big up small pyramidal structure, opens up exhaust outlet at the top of upper heating module 2
201, exhaust outlet 201 is connected with the inner cavity of upper heating module 2, external air exhausting device at exhaust outlet 201.
Heating module further includes the attemperator 9 for being coated on the outside of heating chamber, and in the present embodiment, attemperator 9 is adopted
Use heat insulation foam.
Heating module further includes the bracket 10 for being used to support chain 11, and bracket 10 is fixed on baffle 401, in this way,
It can be by baffle 401 come supporting silicon chip transmitting device.
By the setting of above structure, hot wind flows in heating chamber when being heated by heating unit 3 to silicon wafer 100
Dynamic path are as follows:
Heat caused by heating unit 3 is radiated between baffle 401 and the bottom surface of lower heating module 1 and is formed by first
In space；Wind wheel 7 rotate when, formed hot wind, due to the blocking of baffle 401, avoidable hot wind directly act on silicon wafer 100 to
The performance of silicon wafer 100 is influenced, the hot wind being blocked is flowed to the two sides of heating chamber, and along the first mesh plate 5 of every side and is added
Channel between hot cell 3 flows up；Then the sky for placing silicon wafer 100 is flowed out to through the first mesh on the first mesh plate 5
Between in, to act on silicon wafer 100, hot wind, which is used, acts on 100 table of silicon wafer through the first mesh on the first mesh plate 5
Face, rather than act directly on 100 surface of silicon wafer, so that silicon wafer 100 is uniformly heated；Then hot wind continues up
Flowing, enters between upper heating module 2 and the second mesh plate 6 through the second mesh on the second mesh plate 6 and is formed by sky
In, since the setting position of the second mesh on the second mesh plate 6 has been staggered silicon wafer 100, in this way, can prevent heat losses from making
Obtaining silicon wafer 100 cannot be sufficiently heated；Add finally, hot wind is discharged to from the air outlet 201 at the top that upper heating module 2 is arranged in
The outside of hot chamber.It is specifically detailed in shown in the arrow in attached drawing 1.
The above embodiments are only for explaining the technical ideas and features of the present invention, and its object is to allow be familiar with technique
Personage can understand the content of the utility model and be implemented, do not limit the protection scope of the present invention,
All equivalent change or modifications according to made by the spirit of the present invention essence, should all cover in the protection scope of the utility model
It is interior.
Claims (10)
1. a kind of drying oven heating module, including upper heating module and lower heating module, the upper heating module and it is described lower plus
Thermal module is interlocked, and a heating chamber, the heating module are formed between the upper heating module and the lower heating module
It further include the heating unit that opposite sides in the heating chamber is set, it is characterised in that: the heating module further includes solid
Baffle plate assembly below the chain of transmission silicon wafer is set calmly, and the baffle plate assembly includes baffle, and the heating module further includes
It is fixed at the first mesh plate of the opposite sides of the baffle plate assembly, first mesh plate of two sides is separately positioned on pair
The inside of the heating unit of side is answered, and all has a channel between the heating unit.
2. drying oven heating module according to claim 1, it is characterised in that: plane where the baffle is parallel to described
The bottom surface of lower heating module has spacing, the heating between the lower end surface of the baffle and the bottom surface of the lower heating module
Mould group further includes wind wheel, and the lower end surface of the baffle and the bottom surface of the lower heating module is rotatably arranged in the wind wheel
Between space in.
3. drying oven heating module according to claim 2, it is characterised in that: the heating module further includes for driving
The motor of the wind wheel rotation, the outside of the heating chamber is arranged in the motor, and the motor shaft of the motor passes through institute
The bottom for stating lower heating module is connect with the wind wheel.
4. drying oven heating module according to claim 1, it is characterised in that: flat where first mesh plate of two sides
Face is each perpendicular to plane where the baffle.
5. drying oven heating module according to claim 1, it is characterised in that: the baffle plate assembly further includes being supported on institute
State more support rods between baffle and the lower heating module, the upper end of the every support rod and the fixed company of the baffle
It connects, the lower end of the every support rod is mutually fixedly connected with the bottom surface of the lower heating module.
6. drying oven heating module according to claim 1, it is characterised in that: be provided on first mesh plate multiple
First mesh, multiple first mesh are uniformly distributed on first mesh plate.
7. drying oven heating module according to claim 1, it is characterised in that: the heating module further includes fixed setting
The second mesh plate on the top of the heating chamber, second mesh plate are located at the top of silicon wafer, second mesh plate
On be provided with multiple second mesh, second mesh plate has that underface is provided with the first area of silicon wafer and underface is not put
The second area of silicon wafer is set, multiple second mesh are uniformly distributed at the second area of second mesh plate.
8. drying oven heating module according to claim 1, it is characterised in that: the inner cavity of the upper heating module is in lower big
Upper small pyramidal structure.
9. drying oven heating module according to claim 1, it is characterised in that: the heating module further includes being used to support
The bracket of the chain, the bracket are fixed on the baffle.
10. drying oven heating module according to claim 1, it is characterised in that: the heating module further includes being coated on
The attemperator of the outside of the heating chamber.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821879610.3U CN209131356U (en) | 2018-11-15 | 2018-11-15 | A kind of drying oven heating module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821879610.3U CN209131356U (en) | 2018-11-15 | 2018-11-15 | A kind of drying oven heating module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209131356U true CN209131356U (en) | 2019-07-19 |
Family
ID=67245212
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821879610.3U Active CN209131356U (en) | 2018-11-15 | 2018-11-15 | A kind of drying oven heating module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209131356U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110411193A (en) * | 2019-08-29 | 2019-11-05 | 苏州南北深科智能科技有限公司 | A kind of solar battery HIT or HJT technique curing oven |
-
2018
- 2018-11-15 CN CN201821879610.3U patent/CN209131356U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110411193A (en) * | 2019-08-29 | 2019-11-05 | 苏州南北深科智能科技有限公司 | A kind of solar battery HIT or HJT technique curing oven |
| CN110411193B (en) * | 2019-08-29 | 2024-03-15 | 苏州南北深科智能科技有限公司 | Solar cell HIT or HJT process curing oven |
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