CN209125611U - Finishing module and chemical-mechanical grinding device - Google Patents

Abstract

The utility model relates to a kind of finishing module and chemical-mechanical grinding device, the finishing module includes: conditioner discs, for modifying the burnishing surface of polishing pad, the burnishing surface of the polishing pad is made to keep roughness；Fixed disk has a joint face, for adsorbing the back side of the conditioner discs；Detection unit, comprising: the first end of pipeline, the pipeline forms confined space between the pipeline, fixed disk and the conditioner discs back side when the fixed disk is adsorbed in the back side of the conditioner discs through the fixed disk；Fluid box is connect with the second end of the pipeline, for providing liquid into the pipeline；Flow sensor is set on the pipeline, for detecting the flow in the pipeline.The finishing module can detect in time whether conditioner discs fall.

Description

Finishing module and chemical-mechanical grinding device

Technical field

The utility model relates to field of semiconductor devices more particularly to a kind of finishing modules and chemical-mechanical grinding device.

Background technique

As semi-conductor industry develops rapidly, the size of electronic device is gradually reduced, to wanting for the surface smoothness of wafer It asks and has reached nanoscale.When minimum feature size reaches 0.25 μm or less, it is necessary to carry out global planarizartion.The common overall situation is flat Smoothization technology includes chemically mechanical polishing (CMP) technology, and the figure that wafer can be met simultaneously from processing performance and speed adds Work requirement.

In the prior art, in common chemically mechanical polishing (CMP) system include polishing pad, conditioner discs and fixed disk, Described in polishing pad for placing polished wafer.The conditioner discs are set to above the polishing pad, are used for and the throwing The contact of light pad, friction, to keep the roughness of the polishing pad, the fixed disk is for installing conditioner discs.The conditioner discs are set It is placed in above the polishing pad, when the conditioner discs are fallen, can pound and fall on polishing pad, influence subsequent ground Journey.Once and conditioner discs are fallen, and when being placed with wafer on the polishing pad, be will cause the damage of wafer, are influenced the production of wafer Rate.

Utility model content

Technical problem to be solved by the utility model is to provide a kind of finishing module and chemical-mechanical grinding device, energy The exception for enough detecting conditioner discs reduces conditioner discs and falls the damage to wafer.

To solve the above-mentioned problems, the utility model provides a kind of finishing module, comprising: conditioner discs are thrown for modifying The burnishing surface of light pad makes the burnishing surface of the polishing pad keep roughness；Fixed disk has a joint face, described for adsorbing The back side of conditioner discs；Detection unit, comprising: the first end of pipeline, the pipeline runs through the fixed disk, when the fixed disk is inhaled When investing the back side of the conditioner discs, confined space is formed between the pipeline, fixed disk and the conditioner discs back side；Liquid Case is connect with the second end of the pipeline, for providing liquid into the pipeline；Flow sensor is set to the pipeline On, for detecting the flow in the pipeline.

Optionally, the detection unit further includes sealing ring, is sheathed on the junction of the pipeline Yu the fixed disk, makes It is tightly connected between the pipeline and the fixed disk.

Optionally, the sealing ring includes at least one of O-ring seal, lip-type packing.

Optionally, the detection unit includes fluid infusion case, is connected to the fluid box, for supplementing into the fluid box Liquid.

Optionally, valve is provided on the connecting line between the fluid infusion case and the fluid box.

Optionally, it is provided with liquid level sensor in the fluid box, for detecting the liquid level of the liquid in the fluid box.

Optionally, the valve is connect with the liquid level sensor, for reaching when the liquid level in the fluid box When setting height, closed state is switched to.

Optionally, the fixed disk includes magnetic absorption component, adsorbs the conditioner discs by the magnetic absorption component.

Optionally, further include alarm unit, connect with the flow sensor, for being detected when the flow sensor When fluid flow in pipeline is greater than the set value, alarm signal is sent.

Specific embodiment of the present utility model also provides a kind of chemical-mechanical grinding device, comprising: any of the above-described institute The finishing module and controller stated, the controller are connected to the flow sensor of the finishing module, for working as the flow When the flow that sensor detects is greater than the set value, controls the chemical-mechanical grinding device and stop working.

The finishing module of the utility model includes detection unit, and the pipeline including running through the fixed disk, the pipeline is consolidated Confined space is formed between price fixing and the conditioner discs back side；It further include fluid box for being passed through liquid into the pipeline, When the conditioner discs are fallen, it will lead to liquid in pipeline and flow, can detecte and repair by fluid flow in detection pipeline Whether whole disk falls.

Detailed description of the invention

Fig. 1 is the structural schematic diagram of the finishing module of one specific embodiment of the utility model.

Specific embodiment

With reference to the accompanying drawing to the specific embodiment party of finishing module provided by the utility model and chemical-mechanical grinding device Formula elaborates.

Referring to FIG. 1, the structural schematic diagram of the finishing module for one specific embodiment of the utility model.

The finishing module includes: conditioner discs 102, fixed disk 101 and detection unit.

The conditioner discs 102 make the burnishing surface of the polishing pad keep roughness for modifying the burnishing surface of polishing pad.

In a specific embodiment, the conditioner discs 102 including matrix and are set to one side surface of described matrix Finishing sword.Described matrix is disc, is made of at least one of metallic nickel, cobalt, titanium, iron, copper etc..The finishing sword by Multiple abrasive grains are constituted, the abrasive grain include diamond, cubic boron nitride, polycrystalline diamond, polycrystal cubic boron nitride, At least one of CVD gas-phase grown diamond.In fact, those skilled in the art can according to need the setting finishing Abrasive grain on disk 102, it is only necessary to guarantee the abrasive grain have certain hardness, can with the polishing pad friction with Guarantee the roughness of the polishing pad.

The fixed disk 101 has a joint face, for adsorbing the back side of the conditioner discs 102.Specifically, described solid Price fixing 101 includes a magnetic absorption component, for adsorbing the conditioner discs 102 by magnetic absorption component.Due to the finishing Disk 102 with polishing pad for being in contact, to keep the roughness of the polishing pad, so the conditioner discs 102 often with it is described Polishing pad friction is lost larger, it is often necessary to change, when the conditioner discs 102 pass through magnetic absorption component and the conditioner discs 102 when being connected, and the conditioner discs 102 are easy to disassemble.

The detection unit includes pipeline 103, fluid box 104 and flow sensor 105.The first end of the pipeline 103 Through the fixed disk 101, when the fixed disk 101 is adsorbed in the back side of the conditioner discs 102, the pipeline 103 is fixed Disk 101 and the conditioner discs form confined space between 102 back side；The fluid box 104, second with the pipeline 103 End connection, for providing liquid into the pipeline 103；The flow sensor 105 is set on the pipeline 103, is used for Detect the fluid flow in the pipeline 103.In this specific embodiment, the fluid box 104 is water tank, for holding Ionized water.In other specific embodiments, the fluid box 104 can also hold other liquid.

In the case where being tightly fastened between the fixed disk 101 and conditioner discs 102, the pipeline 103, fixed disk 101 And the confined space between the conditioner discs 102 is complete, and liquid flowing will not be generated in the pipeline 103, the flow passes The flow that sensor 105 detects is 0；When conditioner discs 102 move, the pipeline 103, fixed disk 101 and institute will lead to The confined space stated between conditioner discs 102 is destroyed, and is occurred between the conditioner discs 102, pipeline 103 and the conditioner discs 102 Leak, so as to cause liquid flowing occurs in the pipeline 103, flow sensor 105 detects that fluid flow is greater than 0, at this time It is considered that conditioner discs 102 are abnormal, will be fallen from fixed disk 101, or fallen from the fixed disk 101.

In a specific embodiment, the finishing module further includes an alarm unit, with the flow sensor 105 Connection, when the flow sensor 105 detects that the fluid flow in the pipeline 103 is greater than the set value, triggers the report Alert unit sends alarm signal.The preset value is 0 or slightly larger than 0.

In a specific embodiment, the flow sensor 105 is also used to be connected to chemical-mechanical grinding device machine Platform, when the flow sensor 105 detects that fluid flow is greater than preset value in pipeline 103, board stops working, to keep away The conditioner discs fallen that omit cause to damage to wafer.

In the specific embodiment, the detection unit further includes sealing ring 106, is sheathed on the first of the pipeline 103 The outer surface at end fits with the outer surface of the pipeline 103, so that close between the pipeline 103 and the fixed disk 101 Envelope connection avoids liquid in pipeline 103 from flowing out from the gap between the pipeline 103 and the fixed disk 101.The sealing ring 106 include at least one of O-ring seal, lip-type packing.In fact, those skilled in the art can as needed rationally Type and the position of the sealing ring 106 are set.

In the specific embodiment, the detection unit further includes fluid infusion case 107, is connected to the fluid box 104, is used for Liquid is supplemented into the fluid box 104.When the liquid level of liquid in the fluid box 104 is too low, pipe described in no normal direction will lead to Liquid is provided in road 103, needs to supplement liquid into the fluid box 104 by fluid infusion case 107.

It is additionally provided with valve 108 on connecting line between the fluid infusion case 107 and the fluid box 104, for controlling Connected state between the fluid infusion case 107 and the fluid box 104.When needing the feeding-in liquid into the fluid box 104, Open the valve 108；When liquid is enough in the fluid box 104, the valve 108 is closed.It can in the fluid infusion case 107 To be provided with water pump, pumping liquid in Xiang Suoshu fluid box 104.

In the specific embodiment, it is also provided with liquid level sensor in the fluid box 104, for detecting the liquid The liquid level of the inside liquid of body.The liquid level sensor is additionally coupled to the valve 108, for according to the liquid level sensor Testing result controls the switch state of the valve 108.Specifically, when the liquid level in the fluid box 104 is lower than setting height When, it controls the valve 108 and opens, the pipeline connection between the fluid infusion case 107 and the fluid box 104, the fluid infusion case 107 into fluid box 104 feeding-in liquid；When the liquid level of the liquid reaches setting value, controls the valve 108 and close, institute The pipeline stated between fluid infusion case 107 and fluid box 104 interrupts, and the fluid infusion case 107 stops the feeding-in liquid into fluid box 104. The liquid level sensor can be the various liquid levels such as fibre optic liquid level sensor, ultrasonic liquid level sensor, laser liquid-level sensor Any one in sensor.The setting height of the liquid level is higher than the connection between the pipeline 103 and the fluid box 104 End, when in order to gap occur between the conditioner discs 102 and fixed disk 101, the influent into pipeline, so that the pipe Liquid generates flowing in road.

Specific embodiment of the present utility model also provides a kind of chemical-mechanical grinding device, including above-mentioned specific embodiment party The finishing module provided in formula.The finishing module of the chemical-mechanical grinding device can detect conditioner discs position in time It falls.The chemical-mechanical grinding device further includes a controller, and the flow that the controller is connected to the finishing module passes Sensor is immediately controlled the chemical-mechanical grinding device and stops when the flow that the flow sensor detects is greater than the set value It only works, so that conditioner discs be avoided to fall the wafer on damage grinding pad.

The above is only the preferred embodiment of the utility model, it is noted that for the common skill of the art Art personnel can also make several improvements and modifications without departing from the principle of this utility model, these improvements and modifications Also it should be regarded as the protection scope of the utility model.

Claims (10)

1. a kind of finishing module characterized by comprising

Conditioner discs make the burnishing surface of the polishing pad keep roughness for modifying the burnishing surface of polishing pad；

Fixed disk has a joint face, for adsorbing the back side of the conditioner discs；

Detection unit, comprising:

The first end of pipeline, the pipeline runs through the fixed disk, when the fixed disk is adsorbed in the back side of the conditioner discs, Confined space is formed between the pipeline, fixed disk and the conditioner discs back side；

Fluid box is connect with the second end of the pipeline, for providing liquid into the pipeline；

Flow sensor is set on the pipeline, for detecting the flow in the pipeline.

2. finishing module according to claim 1, which is characterized in that the detection unit further includes sealing ring, is sheathed on The junction of the pipeline and the fixed disk makes to be tightly connected between the pipeline and the fixed disk.

3. finishing module according to claim 2, which is characterized in that the sealing ring includes O-ring seal, lip packing At least one of circle.

4. finishing module according to claim 1, which is characterized in that the detection unit further includes fluid infusion case, is connected to The fluid box, for supplementing liquid into the fluid box.

5. finishing module according to claim 4, which is characterized in that the connection between the fluid infusion case and the fluid box Valve is provided on pipeline.

6. finishing module according to claim 5, which is characterized in that be provided with liquid level sensor in the fluid box, use In the liquid level for detecting the liquid in the fluid box.

7. finishing module according to claim 6, which is characterized in that the valve is connect with the liquid level sensor, is used In when the liquid level in the fluid box reaches setting height, closed state is switched to.

8. finishing module according to claim 1, which is characterized in that the fixed disk includes magnetic absorption component, is passed through The magnetic absorption component adsorbs the conditioner discs.

9. finishing module according to claim 1, which is characterized in that further include alarm unit, with the flow sensor Connection, for sending alarm signal when the flow sensor detects that the fluid flow in pipeline is greater than the set value.

10. a kind of chemical-mechanical grinding device characterized by comprising finishing as claimed in any one of claims 1-9 wherein Component and controller, the controller are connected to the flow sensor of the finishing module, for examining when the flow sensor When the flow measured is greater than the set value, controls the chemical-mechanical grinding device and stop working.