CN209089294U - Solder mask back washing device - Google Patents
Solder mask back washing device Download PDFInfo
- Publication number
- CN209089294U CN209089294U CN201821476277.1U CN201821476277U CN209089294U CN 209089294 U CN209089294 U CN 209089294U CN 201821476277 U CN201821476277 U CN 201821476277U CN 209089294 U CN209089294 U CN 209089294U
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- CN
- China
- Prior art keywords
- service sink
- absorption
- water inlet
- solder mask
- inlet pipe
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model discloses a kind of solder mask back washing device, it include: fermentation vat, flushing tank, first absorption service sink, second absorption service sink and service sink, the fermentation vat, the flushing tank, the first absorption service sink, the second absorption service sink and the service sink are arranged successively connection, wherein the fermentation vat is for solder mask lytic agent after receiving solidification, the opposite two sides of the flushing tank pool wall are equipped with flushing mechanism, the first absorption service sink and the opposite two sides of the second absorption service sink pool wall are respectively equipped with adsorption structure and cleaning structure, the pool wall that the first absorption service sink and the second absorption service sink are equipped with adsorption structure is opposite, the opposite two sides of the service sink pool wall are equipped with cleaning structure.
Description
Technical field
The utility model relates to PCB manufacturing field, in particular to a kind of solder mask back washing device.
Background technique
PCB(Printed Circuit Board, printed circuit board) it is a kind of extremely important electronic component, have and holds
Carry and connect the important function of most electronic components.Under normal conditions, last procedure in PCB production process is
The production of solder mask, and solder mask is coated to the surface of PCB and carries out baking-curing processing.But it is made in a group layer
The PCB product to go wrong again later, needs to be purged solder mask, current practices well is to impregnate PCB after welding resistance
It impregnates 10 minutes or so in 80 DEG C to 90 DEG C, 10% NaOH solution, to destroy the solder mask of aggregated hardening, takes out
PCB surface is cleaned using hydraulic giant afterwards.But for the PCB that solder mask jack process is manufactured, using above-mentioned clear
The method washed+rinsed, it is more difficult to remove ink cured in hole.
Utility model content
To solve the above problems, the utility model provides a kind of solder mask back washing device, solder mask can be carried out clear
It washes and efficiently removes the solder mask having been cured in PCB aperture.
The utility model provides a kind of solder mask back washing device, comprising: fermentation vat, flushing tank, and the first absorption service sink,
Second absorption service sink and service sink, the fermentation vat, the flushing tank, the first absorption service sink, described second inhales
Attached service sink and the service sink are arranged successively connection, wherein the fermentation vat is dissolved for solder mask after accommodating solidification
Agent, the opposite two sides of the flushing tank pool wall are equipped with flushing mechanism, and the first absorption service sink and second absorption are clear
The opposite two sides of wash pool pool wall are respectively equipped with adsorption structure and cleaning structure, the first absorption service sink and second absorption
The pool wall that service sink is equipped with adsorption structure is opposite, and the opposite two sides of the service sink pool wall are equipped with cleaning structure.
A kind of solder mask back washing device provided by the utility model, it can be achieved that PCB solder mask backwash, and high-efficient cleaning
Except the solder mask having been cured in PCB through hole, the quality and efficiency of the backwash of PCB solder mask are improved.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is
Some embodiments of the utility model, for those of ordinary skill in the art, in the premise of not making the creative labor property
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of solder mask back washing device schematic diagram provided by the embodiment of the utility model.
Appended drawing reference: 10 fermentation vats；20 flushing tanks；30 first absorption service sinks；40 second absorption service sinks；50
Service sink；60 clamping transfer structures；61 guide rails；62 idler wheels；63 fixtures；64 to backwash PCB；11 sewage pipe structures；21
First water inlet pipe；22 second water inlet pipes；23 Flushing nozzles；31 first air intake ducts；32 suction nozzles；33 third water inlet pipes；34
Cleaning sprayer；41 second air intake ducts；42 suction nozzles；43 the 4th water inlet pipes；44 cleaning sprayers；51 the 5th water inlet pipes；52 the 6th
Water inlet pipe；53 cleaning sprayers.
Specific embodiment
It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer
Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched
The embodiment stated is a part of the embodiment of the utility model, instead of all the embodiments.Based on the reality in the utility model
Example is applied, every other embodiment obtained by those of ordinary skill in the art without making creative efforts all belongs to
In the range of the utility model protection.
In the description of the present invention, it should be noted that term " center ", " longitudinal direction ", " transverse direction ", "upper", "lower",
The orientation or positional relationship of the instructions such as "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is
It is based on the orientation or positional relationship shown in the drawings, is merely for convenience of describing the present invention and simplifying the description, rather than indicate
Or imply that signified device or element must have a particular orientation, be constructed and operated in a specific orientation, therefore cannot understand
For limitations of the present invention.In addition, term " first ", " second " are used for description purposes only, and should not be understood as instruction or
Imply relative importance.
A kind of solder mask back washing device provided by the embodiment of the utility model, as shown in Figure 1, comprising: include: fermentation vat
10, flushing tank 20, the first absorption service sink 30, the second absorption service sink 40 and service sink 50, fermentation vat 10, flushing tank 20,
First absorption service sink 30, the second absorption service sink 40 and service sink 50 are arranged successively connection, and wherein fermentation vat 10 is for holding
Receive solidification after solder mask lytic agent, the opposite two sides of 20 pool wall of flushing tank be equipped with flushing mechanism, first absorption service sink 30 with
And second the opposite two sides of absorption 40 pool wall of service sink be respectively equipped with adsorption structure and cleaning structure, the first absorption service sink 30 with
The pool wall that second absorption service sink 40 is equipped with adsorption structure is opposite, and the opposite two sides of 50 pool wall of service sink are equipped with cleaning knot
Structure.A kind of solder mask back washing device provided by the embodiment of the utility model, it is molten in systems such as NaOH by more pond co-designs
After liquid impregnates the cured printing ink of dissolution PCB surface, and operation is overlapped with adsorption structure using rinsing, it can efficient backwash removal
The solder mask being had been cured in PCB surface and through-hole.
Optionally, as shown in Figure 1, a kind of solder mask back washing device provided by the embodiment of the utility model further includes PCB
Transfer structure 60 is clamped, clamping transfer structure 60 includes guide rail 61, idler wheel 62 and fixture 63, wherein fixture 63 is for clamping
To backwash PCB64, idler wheel 62 is connect with fixture 63, and drive moves horizontally on guide rail to backwash PCB, and guide rail is located at fermentation vat,
Flushing tank, the first absorption service sink, the top of the second absorption service sink and service sink, and can be mobile in vertical direction.It should
The design for clamping transfer structure, need to drive and move horizontally and vertically move to backwash PCB, realize movement of the PCB between each pond
And " jump ", to realize streamlined operation.
Optionally, as shown in Figure 1, a kind of solder mask back washing device provided by the embodiment of the utility model, fermentation vat 10
Bottom is provided with sewage pipe structure 11, and sewage pipe structure 11 is used to be discharged the glue residue because impregnating dissolution generation, in 10 pond of fermentation vat
Length, width and height are all larger than 800mm.
Optionally, as shown in Figure 1, a kind of solder mask back washing device provided by the embodiment of the utility model, flushing tank 20
The flushing mechanism of pool wall includes: the first water inlet pipe 21 and the second water inlet pipe 22, with the first water inlet pipe 21 and the second water inlet pipe 22
Multiple Flushing nozzles 23 of connection, wherein on the side pool wall equipped with flushing mechanism, including at least 9 of the column arrangement of three rows three
Flushing nozzle 23, the shortest distance is 80mm between Flushing nozzle, and length, width and height are all larger than 800mm in the flushing tank pond.
Optionally, as shown in Figure 1, a kind of solder mask back washing device provided by the embodiment of the utility model, the first absorption
The adsorption structure that service sink 30 is equipped with includes: the first air intake duct 31, the multiple suction nozzles 32 connecting with the first air intake duct 31, multiple suctions
The arrangement of mouth array；The cleaning structure that first absorption service sink 30 is equipped with includes: third water inlet pipe 33, is connected with third water inlet pipe 33
The multiple cleaning sprayers 34 connect, multiple cleaning sprayer array arrangements；Length, width and height are all larger than in first absorption 30 pond of service sink
800mm。
Optionally, as shown in Figure 1, a kind of solder mask back washing device provided by the embodiment of the utility model, the second absorption
The adsorption structure that service sink 40 is equipped with includes: the second air intake duct 41, the multiple suction nozzles 42 connecting with the second air intake duct 41, multiple suctions
The arrangement of mouth array；The cleaning structure that second absorption service sink 40 is equipped with includes: the 4th water inlet pipe 43, is connected with the 4th water inlet pipe 43
The multiple cleaning sprayers 44 connect, multiple cleaning sprayer array arrangements；Length, width and height are all larger than in second absorption 40 pond of service sink
800mm。
Optionally, as shown in Figure 1, a kind of solder mask back washing device provided by the embodiment of the utility model, service sink 50
The cleaning structure that the opposite two sides of pool wall are equipped with includes: the 5th water inlet pipe 51 and the 6th water inlet pipe 52, with the 5th water inlet pipe 51
And the 6th multiple cleaning sprayer 53 for connecting of water inlet pipe 52, the arrangement of cleaning sprayer array, the most short distance between cleaning sprayer
From for 80mm；Length, width and height are all larger than 800mm in service sink pond.
Although more herein used the terms such as a variety of devices, structure, part, it is not precluded using other terms
Possibility.The use of these terms is merely for the convenience of describing and explaining the nature of the invention；It is construed as
Any additional limitation is all contrary to the spirit of the present invention.
Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited
System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should
Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of
Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new
The range of each embodiment technical solution of type.
Claims (7)
1. a kind of solder mask back washing device characterized by comprising fermentation vat, flushing tank, the first absorption service sink, second
Service sink and service sink are adsorbed, the fermentation vat, the flushing tank, the first absorption service sink, second absorption is clearly
Wash pool and the service sink are arranged successively connection, wherein the fermentation vat is for solder mask lytic agent after receiving solidification, institute
The opposite two sides of flushing tank pool wall are stated equipped with flushing mechanism, the first absorption service sink and second absorption service sink pond
The opposite two sides of wall are respectively equipped with adsorption structure and cleaning structure, the first absorption service sink and the second absorption service sink
Pool wall equipped with adsorption structure is opposite, and the opposite two sides of the service sink pool wall are equipped with cleaning structure.
2. solder mask back washing device according to claim 1, which is characterized in that the solder mask back washing device also wraps
PCB clamping transfer structure is included, the clamping transfer structure includes guide rail, idler wheel and fixture, wherein the fixture is for clamping
To backwash PCB, the idler wheel is connect with the fixture, and drive is described to be moved horizontally on the guide rail to backwash PCB, described to lead
Rail is located at the fermentation vat, the flushing tank, the first absorption service sink, the second absorption service sink and the cleaning
The top in pond, and can be mobile in vertical direction.
3. solder mask back washing device according to claim 2, which is characterized in that the immersion bottom of pond portion is provided with blowdown
Pipe structure, length, width and height are all larger than 800mm in the fermentation vat pond.
4. solder mask back washing device according to claim 2, which is characterized in that the flushing of the flushing tank pool wall
Structure includes: the first water inlet pipe and the second water inlet pipe, is connect with first water inlet pipe and second water inlet pipe multiple
Flushing nozzle, wherein on the side pool wall equipped with the flushing mechanism, 9 Flushing nozzles of arrangement are arranged including at least three rows three,
The shortest distance is 80mm between the Flushing nozzle, and length, width and height are all larger than 800mm in the flushing tank pond.
5. solder mask back washing device according to claim 2, which is characterized in that the first absorption service sink was equipped with
The adsorption structure includes: the first air intake duct, the multiple suction nozzles connecting with first air intake duct, the multiple suction nozzle array
Arrangement；The cleaning structure that the first absorption service sink is equipped with includes: third water inlet pipe, is connect with the third water inlet pipe
Multiple cleaning sprayers, the arrangement of the multiple cleaning sprayer array；Length, width and height are all larger than in first absorption service sink pond
800mm。
6. solder mask back washing device according to claim 2, which is characterized in that the second absorption service sink was equipped with
The adsorption structure includes: the second air intake duct, the multiple suction nozzles connecting with second air intake duct, the multiple suction nozzle array
Arrangement；The cleaning structure that the second absorption service sink is equipped with includes: the 4th water inlet pipe, is connect with the 4th water inlet pipe
Multiple cleaning sprayers, the arrangement of the multiple cleaning sprayer array；Length, width and height are all larger than in second absorption service sink pond
800mm。
7. solder mask back washing device according to claim 2, which is characterized in that the opposite two sides of the service sink pool wall
The cleaning structure being equipped with includes: the 5th water inlet pipe and the 6th water inlet pipe, with the 5th water inlet pipe and the described 6th
Multiple cleaning sprayers of water inlet pipe connection, the cleaning sprayer array arrange, and the shortest distance between the cleaning sprayer is
80mm；Length, width and height are all larger than 800mm in the service sink pond.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821476277.1U CN209089294U (en) | 2018-09-10 | 2018-09-10 | Solder mask back washing device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821476277.1U CN209089294U (en) | 2018-09-10 | 2018-09-10 | Solder mask back washing device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209089294U true CN209089294U (en) | 2019-07-09 |
Family
ID=67116186
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821476277.1U Expired - Fee Related CN209089294U (en) | 2018-09-10 | 2018-09-10 | Solder mask back washing device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209089294U (en) |
-
2018
- 2018-09-10 CN CN201821476277.1U patent/CN209089294U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190709 Termination date: 20200910 |