CN209071337U - PHEMT low-noise amplifier epitaxial structure with multiple quantum wells buffer layer - Google Patents

PHEMT low-noise amplifier epitaxial structure with multiple quantum wells buffer layer Download PDF

Info

Publication number
CN209071337U
CN209071337U CN201820880048.XU CN201820880048U CN209071337U CN 209071337 U CN209071337 U CN 209071337U CN 201820880048 U CN201820880048 U CN 201820880048U CN 209071337 U CN209071337 U CN 209071337U
Authority
CN
China
Prior art keywords
gaas
algaas
layer
multiple quantum
buffer layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201820880048.XU
Other languages
Chinese (zh)
Inventor
蒋建
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xinlei semiconductor technology (Suzhou) Co.,Ltd.
Original Assignee
New Bright Semiconductor Technology (suzhou) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by New Bright Semiconductor Technology (suzhou) Co Ltd filed Critical New Bright Semiconductor Technology (suzhou) Co Ltd
Priority to CN201820880048.XU priority Critical patent/CN209071337U/en
Application granted granted Critical
Publication of CN209071337U publication Critical patent/CN209071337U/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Abstract

The utility model discloses the PHEMT low-noise amplifier epitaxial structures with multiple quantum wells buffer layer.The structure includes GaAs semi-insulating substrate, GaAs-AlGaAs multiple quantum wells buffer layer, AlGaAs lower barrierlayer, InGaAs channel layer, the space AlGaAs separation layer, mixes Si AlGaAs barrier layer, AlAs corrosion barrier layer, the highly doped cap layers of GaAs.For conventional low-noise amplifier PHEMT, PHEMT with GaAs-AlGaAs multiple quantum wells buffer layer can reduce in buffer layer unintentionally doping concentration, the pinch off of channel carrier is cleaner, mutual conductance of the low-noise amplifier in low current can be effectively improved, to be conducive to improve the noise coefficient of low-noise amplifier.

Description

PHEMT low-noise amplifier epitaxial structure with multiple quantum wells buffer layer
Technical field
The utility model relates to a kind of PHEMT low-noise amplifier epitaxial material structure with multiple quantum wells buffer layer, More particularly to a kind of GaAs base PHEMT low-noise amplifier epitaxial material knot with GaAs-AlGaAs multiple quantum wells buffer layer Structure belongs to compound semiconductor materials and device arts.
Background technique
GaAs base pseudomorphic high electron mobility transistor (PHEMT) is a kind of compound semiconductor materials, have high frequency, The features such as high power gain and low noise, thus it is widely used in wireless telecommunications, optical-fibre communications, satellite communication, millimeter wave thunder It reaches and electronic countermeasure etc. is military and civil field.The production of GaAs PHEMT epitaxial material is in entire GaAs industrial chain An important ring, the quality of epitaxial material directly determine the important performance of final product.Conventional low-noise amplifier PHEMT extension Structure mostly does buffer layer with GaAs layers, but since GaAs material band gap is narrow, unintentionally dopant concentration is higher, be easy to cause Pinch off is not clean, and the low current mutual conductance of corresponding low-noise amplifier becomes smaller, and in turn results in low-noise amplifier noise coefficient evil Change.
Therefore designing a kind of buffer layer structure and solving problem above has realistic meaning.
Utility model content
The purpose of this utility model is to propose a kind of GaAs base PHEMT with GaAs-AlGaAs multiple quantum wells buffer layer Low-noise amplifier epitaxial material structure, GaAs-AlGaAs multi-quantum pit structure reduce buffer layer unintentionally doping concentration, have Conducive to the noise coefficient for improving GaAs base PHEMT low-noise amplifier.
The technical solution adopted in the utility model is a kind of PHEMT low-noise amplifier with multiple quantum wells buffer layer Epitaxial material structure, the structure include GaAs semi-insulating substrate (1), GaAs-AlGaAs multiple quantum wells buffer layer (2), AlGaAs Lower barrierlayer (3), the space AlGaAs separation layer (5), mixes Si AlGaAs barrier layer (6), AlAs corruption at InGaAs channel layer (4) Lose barrier layer (7) and the highly doped cap layers of GaAs (8).
Specifically, successively grown on GaAs semi-insulating substrate (1) GaAs-AlGaAs multiple quantum wells buffer layer (2), AlGaAs lower barrierlayer (3), InGaAs channel layer (4), the space AlGaAs separation layer (5), mix Si AlGaAs barrier layer (6), AlAs corrodes barrier layer (7), the highly doped cap layers of GaAs (8).
The GaAs-AlGaAs multiple quantum wells buffer layer (2) is used to be that InGaAs channel layer (4) offer one is smooth Grain boundary, while the influence for GaAs semi-insulating substrate (1) the bottom interface state that disappears, periodicity 15-25, signal period with a thickness ofOverall thickness isExtremely
The AlGaAs lower barrierlayer (3) is constraint channel carrier, and channel carrier is prevented to flow out to substrate direction, Its thickness is
Two-dimensional electron gas is strapped in channel by the InGaAs channel layer (4), with a thickness ofExtremelyIn Group be divided into 0.15 to 0.25.
The space the AlGaAs separation layer (5) is to separate ionized donor impurity and channel carrier, and it is miscellaneous to reduce ionization Matter scattering, with a thickness of
The Si AlGaAs barrier layer (6) of mixing provides free electron for channel.Dopant is Si, doping concentration 5E+ 17cm-3To 2E+18cm-3
AlAs corrosion barrier layer (7) can be such that chemical attack is equably parked in the layer, improve device parameters Uniformity, thickness are
The highly doped cap layers of the GaAs (8) are to provide excellent Ohmic contact, dopant Si, doping for device preparation Concentration is 1E+18 to 6E+18cm-3, with a thickness of
Compared with prior art, the utility model has the advantages that.
GaAs-AlGaAs multiple quantum wells buffering for conventional low-noise amplifier PHEMT, in this structure Layer can reduce in buffer layer unintentionally dopant concentration, and pinch off is cleaner, low current mutual conductance is effectively improved, to be conducive to change The noise coefficient of kind GaAs base PHEMT low-noise amplifier.
Detailed description of the invention
Fig. 1: kind has the GaAs base PHEMT low-noise amplifier epitaxial material of GaAs-AlGaAs multiple quantum wells buffer layer Structure.
In figure: 1, GaAs semi-insulating substrate, 2, GaAs-AlGaAs multiple quantum wells buffer layer, 3, AlGaAs lower barrierlayer, 4, InGaAs channel layer, 5, the space AlGaAs separation layer, 6, mix Si AlGaAs barrier layer, 7, AlAs corrode barrier layer, 8, The highly doped cap layers of GaAs.
Specific embodiment
As shown in Figure 1, a kind of PHEMT low-noise amplifier epitaxial material structure with multiple quantum wells buffer layer, the knot Structure include GaAs semi-insulating substrate (1), GaAs-AlGaAs multiple quantum wells buffer layer (2), AlGaAs lower barrierlayer (3), InGaAs channel layer (4), the space AlGaAs separation layer (5), mix Si AlGaAs barrier layer (6), AlAs corrosion barrier layer (7) and The highly doped cap layers of GaAs (8).
Specifically, successively grown on GaAs semi-insulating substrate (1) GaAs-AlGaAs multiple quantum wells buffer layer (2), AlGaAs lower barrierlayer (3), InGaAs channel layer (4), the space AlGaAs separation layer (5), mix Si AlGaAs barrier layer (6), AlAs corrodes barrier layer (7), the highly doped cap layers of GaAs (8).
The GaAs-AlGaAs multiple quantum wells buffer layer (2) is used to be that InGaAs channel layer (4) offer one is smooth Grain boundary, while the influence for GaAs semi-insulating substrate (1) the bottom interface state that disappears, periodicity 15-25, signal period with a thickness ofOverall thickness isExtremely
The AlGaAs lower barrierlayer (3) is constraint channel carrier, and channel carrier is prevented to flow out to substrate direction, Its thickness is
Two-dimensional electron gas is strapped in channel by the InGaAs channel layer (4), with a thickness ofExtremelyIn Group be divided into 0.15 to 0.25.
The space the AlGaAs separation layer (5) is to separate ionized donor impurity and channel carrier, and it is miscellaneous to reduce ionization Matter scattering, with a thickness of
The Si AlGaAs barrier layer (6) of mixing provides free electron for channel.Dopant is Si, doping concentration 5E+ 17cm-3To 2E+18cm-3
AlAs corrosion barrier layer (7) can be such that chemical attack is equably parked in the layer, improve device parameters Uniformity, thickness are
The highly doped cap layers of the GaAs (8) are to provide excellent Ohmic contact, dopant Si, doping for device preparation Concentration is 1E+18 to 6E+18cm-3, with a thickness of
Specifically epitaxial material growth process is
(1) 25 period GaAs-AlGaAs multiple quantum wells buffer layers, total thickness are grown in GaAs semi-insulating substrate
(2) it then growsThick AlGaAs lower barrierlayer.
(3) it is grown on AlGaAs lower barrierlayerIn0.22Ga0.78As channel layer.
(4) existIn0.22Ga0.78It is grown on As channel layerAl0.22Ga0.78The space As separation layer.
(5) existAl0.22Ga0.78It is grown on As separation layerMix Si Al0.25Ga0.75As barrier layer.
(6) existMix Si Al0.25Ga0.75It is grown on As barrier layerAlAs corrodes barrier layer.
(7) existIt is grown in AlAs corrosion barrier layerHeavy doping GaAs cap layers, doping concentration 6E+18cm-3

Claims (1)

1. the PHEMT low-noise amplifier epitaxial structure with multiple quantum wells buffer layer, it is characterised in that: the structure includes GaAs half Insulating substrate (1), GaAs-AlGaAs multiple quantum wells buffer layer (2), AlGaAs lower barrierlayer (3), InGaAs channel layer (4), The space AlGaAs separation layer (5) mixes SiAlGaAs barrier layer (6), AlAs corrosion barrier layer (7) and the highly doped cap layers of GaAs (8);
GaAs-AlGaAs multiple quantum wells buffer layer (2), AlGaAs lower barrierlayer are successively grown on GaAs semi-insulating substrate (1) (3), InGaAs channel layer (4), the space AlGaAs separation layer (5), mix SiAlGaAs barrier layer (6), AlAs corrosion barrier layer (7), the highly doped cap layers of GaAs (8).
CN201820880048.XU 2018-06-07 2018-06-07 PHEMT low-noise amplifier epitaxial structure with multiple quantum wells buffer layer Active CN209071337U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820880048.XU CN209071337U (en) 2018-06-07 2018-06-07 PHEMT low-noise amplifier epitaxial structure with multiple quantum wells buffer layer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820880048.XU CN209071337U (en) 2018-06-07 2018-06-07 PHEMT low-noise amplifier epitaxial structure with multiple quantum wells buffer layer

Publications (1)

Publication Number Publication Date
CN209071337U true CN209071337U (en) 2019-07-05

Family

ID=67088693

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820880048.XU Active CN209071337U (en) 2018-06-07 2018-06-07 PHEMT low-noise amplifier epitaxial structure with multiple quantum wells buffer layer

Country Status (1)

Country Link
CN (1) CN209071337U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110429128A (en) * 2019-07-30 2019-11-08 厦门市三安集成电路有限公司 A kind of low potential barrier multiple quantum wells high resistance buffer layer epitaxial structure and preparation method thereof

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110429128A (en) * 2019-07-30 2019-11-08 厦门市三安集成电路有限公司 A kind of low potential barrier multiple quantum wells high resistance buffer layer epitaxial structure and preparation method thereof
CN110429128B (en) * 2019-07-30 2022-09-13 厦门市三安集成电路有限公司 Low-barrier multi-quantum-well high-resistance buffer layer epitaxial structure and preparation method thereof

Similar Documents

Publication Publication Date Title
US20050133816A1 (en) III-nitride quantum-well field effect transistors
CN110875387B (en) Semiconductor device and method for forming semiconductor device
JP2005509274A (en) III-nitride high electron mobility transistor (HEMT) with barrier / spacer layer
US20070200142A1 (en) High linear enhancement-mode heterostructure field-effect transistor
WO2004107406A2 (en) Semiconductor electronic devices and methods
JP2000100828A (en) Semiconductor device and manufacture thereof
CN102054862A (en) Antimonide transistor with high electron mobility and manufacturing method thereof
JP2003151996A (en) Electronic device using two-dimensional electronic gas
CN111201609A (en) High electron mobility transistor with adjustable threshold voltage
CN209071337U (en) PHEMT low-noise amplifier epitaxial structure with multiple quantum wells buffer layer
US8975641B1 (en) Transistor having an ohmic contact by gradient layer and method of making the same
CN208336234U (en) A kind of GaAs base MHEMT epitaxial material structure with AlAs corrosion barrier layer
JP2009060042A (en) Semiconductor device
Hsu et al. High performance symmetric double/spl delta/-doped GaAs/InGaAs/GaAs pseudomorphic HFETs grown by MOCVD
CN113284947B (en) Semiconductor transistor epitaxial structure, preparation method thereof and semiconductor transistor
CN102299170B (en) GaAs pseudomorphic high-electron-mobility transistor epitaxy material
CN115332249A (en) Transistor and manufacturing method thereof
JP5119644B2 (en) III-V compound semiconductor epitaxial wafer
CN100350577C (en) Gallium-indium-nitride-arsenide based epitaxial wafer and hetero-field effect transistor using the same, and its manufacturing method
JP2004221363A (en) Epitaxial wafer for high-speed electron mobility transistor
CN113745333A (en) Normally-off gallium oxide based MIS-HEMT device containing delta doped barrier layer and preparation method thereof
US8969882B1 (en) Transistor having an ohmic contact by screen layer and method of making the same
CN106783613B (en) III-V group semiconductor MOSHEMT device and preparation method thereof
CN217881520U (en) Epitaxial structure of transistor
JP2004342742A (en) Semiconductor device for communication apparatus

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: 215151 plant 28, supporting industrial park, export processing zone, No. 666 Jianlin Road, Suzhou high tech Zone, Suzhou, Jiangsu Province

Patentee after: Xinlei semiconductor technology (Suzhou) Co.,Ltd.

Address before: 215151 plant 28, supporting industrial park, export processing zone, No. 666 Jianlin Road, Suzhou high tech Zone, Suzhou, Jiangsu Province

Patentee before: EPI SOLUTION TECHNOLOGY CO.,LTD.

CP01 Change in the name or title of a patent holder