CN209057438U - A kind of waterproof multi-fin cooling fin - Google Patents

Abstract

The utility model relates to technical field of heat dissipation more particularly to a kind of waterproof multi-fin cooling fins for being conducive to electronic element radiating.Including bottom plate, fin, plate upper surface is equipped with several vertical fins perpendicular to the base plate, uniform intervals between fin；2-4 profile groove is equipped between fin；The arrangement of the fin Structural assignments high in the low both sides in center；The two sides of fin are equipped with the ripple glaze of horizontal projection；A nanometer carbon coating is coated in the upper surface of cooling fin；The back side of bottom plate is equipped with the point glue groove of protrusion.The application between fin by designing profile groove, together with the air duct between fin, forms the air duct of vertical and horizontal, increases heat dissipation；Surface sprays nanometer carbon coating, using coating heat loss through radiation, recycles the air flow area when fin increase heat dissipation of ripple glaze, mitigates heat dissipation sheet weight；The position overleaf contacted simultaneously with chip is designed for edge sealing, can play the effect of waterproof and airtightness is stronger, heat is absorbed by cooling fin entirely, and effect is more preferable.

Description

A kind of waterproof multi-fin cooling fin

Technical field

The utility model relates to technical field of heat dissipation more particularly to a kind of more fins of waterproof for being conducive to electronic element radiating Formula cooling fin.

Background technique

Electronic component at work, has part electric energy and is converted to thermal energy.Make electronic device work under high temperature environment, drop The low efficiency of electronic device, reduces service life.Electronic product radiating mode main body is divided into two kinds at present: conducting and right Stream.Because electronic equipment is more and more frivolous, do not have setting fan to carry out active heat removal.I.e. in the confined situation of convection current Under, it only radiates by heat transfer, makes the reduction of integral heat sink rate, effect is unobvious, to allow heating electronic component one Straight work at high operating temperatures, is unfavorable for normal use.With the development of science and technology, radiator is also in compliance with the rule developed to lightweight Rule, also steps up cooling requirements, and traditional heat dissipation sheet weight is big, it is more to take up space, and heat dissipation effect is bad, is not able to satisfy electronics The light-weighted development need of device, and with chip chamber only by contacting or thermally conductive glue connection, waterproof performance are bad.

Utility model content

The technical problems to be solved in the utility model is that traditional heat dissipation sheet weight is big, it is more to take up space, and heat dissipation effect is bad, The light-weighted development need of electronic device it is not able to satisfy, and with chip chamber only by contacting or thermally conductive glue connection, waterproof performance are bad.

To solve the above problems, the utility model provides a kind of waterproof multi-fin cooling fin, by designing between fin Profile groove together with the air duct between fin, forms the air duct of vertical and horizontal, increases heat dissipation；Surface sprays nanometer carbon coating, utilizes Coating heat loss through radiation recycles the air flow area when fin increase heat dissipation of ripple glaze, mitigates heat dissipation sheet weight；Exist simultaneously The position that the back side is contacted with chip is designed for edge sealing, can play the effect of waterproof and airtightness is stronger, heat is entirely by cooling fin It absorbs, effect is more preferable.

In order to achieve the above objectives, the utility model discloses a kind of waterproof multi-fin cooling fin, including bottom plate, fin, Bottom plate is mental section, and upper surface is equipped with several vertical fins perpendicular to the base plate, and uniform intervals between fin are spaced 3- 5mm, is divided into airflow channel, and the narrow meeting of fin layout reduces radiating efficiency so that free convection is lowered, and is spaced to become larger and then can Because fin tails off cooling surface area is reduced, and gap size will affect the caloradiance of nanometer carbon coating reflection, Route is reflected, so determining that suitable fin separation is most important；It is equipped with 2-4 profile groove between fin, fin is divided into several rows, Longitudinal airflow channel is not only formed between adjacent fin, and forms lateral profile groove, increases the sky of heat flowing Between and direction, flow the heat stream in environment more and quickly under the promotion of air pressure, without being stopped, producing on an equal basis The heat dissipation performance of product can be effectively improved under product volume；The arrangement of the fin Structural assignments high in the low both sides in center, in low fin Top form return airway, heat ray and thermal current can reflect to form reflux and coarse because of space wall because of heat-dissipating space wall Refraction is formed, to increase the utilization rate of fin heat-delivery surface, reaches the mesh for not influencing heat dissipation effect while mitigating weight 's；The two sides of the fin are equipped with the ripple glaze of horizontal projection, the flow area of air when ripple glaze increases heat dissipation on the one hand, And then increasing heat radiation area, enhance heat dissipation effect, on the other hand cooperates with nanometer carbon coating, it can be by ripple glaze thickness, close The adjustment of degree etc. adjusts reflection, the refraction route of caloradiance, reaches optimal heat dissipation effect；In the waterproof multi-fin The upper surface of cooling fin is coated with a nanometer carbon coating, be uniformly provided on the thermal dispersant coatings heat is switched to it is infrared short in 3-40 microns The heat conversion layer of wave；Using the contact heating device that the thermal dispersant coatings are direct or indirect, heat is converted into infrared intermediate waves Form carries out active heat removal；Compared with prior art, it can satisfy radiating efficiency and radiator volume made to become small and exquisite；Bottom plate The back side be equipped with protrusion point glue groove, for point a conductive glue, by cooling fin and chip airtight connection, waterproof performance is more preferable, together When heat will not loss, all absorbed by cooling fin, more preferably to the protection of chip.

Further, the shape of fin is up-narrow and down-wide trapezoid, and base angle is 2-5 °, can force the absorption of lower part Heat is mobile to the thin position in top, improves radiating efficiency.

Further, every row is equipped with 7-15 fin on bottom plate, and the fin of the quantity can satisfy radiating efficiency and again will not The weight for excessively increasing entire cooling fin meets light-weighted requirement.

Further, bottom plate be equipped with several mounting holes, for mutually being fixed with electronic component.

When being radiated using above structure, heat can quickly be transmitted to surface layer nano-carbon layer by bottom plate；Excitation nano carbon Layer in single wall carbon atom and nano-sized carbon ask, carbon nanotubes；Thermal energy is set to be converted into infrared short wavelength emissions into outside air；Tradition Radiator only on the basis of heat transfer more passively go carry out convection current without consider air duct, the application have natural wind or In the case that person artificially blows, the airflow channel between fin accelerates air velocity in channel because the temperature difference increases air pressure difference, Rate of heat dispation is accelerated, that is, increases the access of thermal convection, makes the more quickly flowing under the promotion of air pressure of the heat stream in environment, Without being stopped, at the same its spacing distance setting matched with nanometer carbon coating, for the caloradiance of optimization reflection, Route is reflected, optimal heat dissipation effect is reached；There is the point glue groove of closing cooling fin and chip again simultaneously, waterproof can played Guarantee while effect heat will not loss, all absorbed by cooling fin, more preferably to the protection of chip.

The utility model has the beneficial effects that:

(1) using the design of more fins, increasing heat radiation area, forming convection route, rapid cooling, while fin has height Low design forms return airway in the top of low fin, and heat ray and thermal current can reflect to form reflux because of heat-dissipating space wall Coarse formation refraction with because of space wall, to increase the utilization rate of fin heat-delivery surface, reaches while mitigating weight not Influence the purpose of heat dissipation effect；

(2) it is equipped with profile groove between fin, fin is divided into several rows, it is logical not only to form longitudinal air-flow between adjacent fin Road, and lateral profile groove is formd, the space and direction of heat flowing are increased, heat stream the pushing away in air pressure in environment is made It more and is quickly flowed under dynamic, without being stopped, the heat dissipation performance of product can be effectively improved under equivalents volume；

(3) back side of bottom plate is equipped with the point glue groove of protrusion, for a point conductive glue, by cooling fin and chip airtight connection, Waterproof performance is more preferable, at the same heat will not loss, all absorbed by cooling fin, more preferably to the protection of chip；

(4) two sides of fin are equipped with the ripple glaze of horizontal projection, the flowing of air when ripple glaze increases heat dissipation on the one hand Area, and then increasing heat radiation area enhance heat dissipation effect, on the other hand cooperate with nanometer carbon coating, can pass through ripple glaze thickness The adjustment of degree, density etc. adjusts reflection, the refraction route of caloradiance, reaches optimal heat dissipation effect；

(5) there is nanometer carbon coating, the form that heat is converted into infrared intermediate waves carries out active heat removal；With prior art phase Compare, can satisfy radiating efficiency and radiator volume is made to become small and exquisite.

Detailed description of the invention

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described.It is clear that the accompanying drawings in the following description is this reality Without creative efforts, may be used also for those of ordinary skill in the art with novel some embodiments To obtain other drawings based on these drawings.

Fig. 1 is the positive structure schematic of the utility model；

Fig. 2 is the structure schematic diagram of the utility model；

In figure, bottom plate 1, fin 2, profile groove 3, point glue groove 4.

Specific embodiment

It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described.Obviously, it is retouched The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to The range of the utility model protection.

Embodiment 1:

As shown in Figure 1, a kind of waterproof multi-fin cooling fin, including bottom plate 1, fin 2, bottom plate 1 are mental section, thereon Surface is equipped with several vertically fins 2 vertical with bottom plate 1, and uniform intervals between fin are spaced 3-5mm, is divided into airflow channel, The narrow meeting of fin layout reduces radiating efficiency so that free convection attenuating, and is spaced and becomes larger, and can to dissipate because fin tails off Hotlist area is reduced, and gap size will affect the reflection of the caloradiance of nanometer carbon coating, refraction route, close so determining Suitable fin separation is most important；It is equipped with 2-4 profile groove 3 between fin, fin is divided into several rows, not only between adjacent fin Longitudinal airflow channel is formed, and forms lateral profile groove, the space and direction of heat flowing is increased, makes in environment Heat stream more and quickly flows under the promotion of air pressure, without being stopped, can effectively improve under equivalents volume The heat dissipation performance of product；The arrangement of the fin Structural assignments high in the low both sides in center form return airway in the top of low fin, Heat ray and thermal current can because heat-dissipating space wall reflect to form reflux and because the coarse formation of space wall reflects, to increase fin The utilization rate of piece heat-delivery surface achievees the purpose that not influence heat dissipation effect while mitigating weight；The two sides of the fin 2 Ripple glaze equipped with horizontal projection, the flow area of air when ripple glaze increases heat dissipation on the one hand, and then increasing heat radiation area, increase On the other hand strong heat dissipation effect cooperates with nanometer carbon coating, can adjust hot spoke by the adjustment of ripple glaze thickness, density etc. The reflection of ray, refraction route, reach optimal heat dissipation effect；It is coated with and receives in the upper surface of the waterproof multi-fin cooling fin Rice carbon coating, is uniformly provided with the heat conversion layer that heat is switched to infrared shortwave in 3-40 microns on the thermal dispersant coatings；It uses The direct or indirect contact heating device of the thermal dispersant coatings, the form that heat is converted into infrared intermediate waves carry out active heat removal；With The prior art compares, and can satisfy radiating efficiency and radiator volume is made to become small and exquisite；The back side of bottom plate 1 is equipped with the point of protrusion Glue groove 4, for point a conductive glue, by cooling fin and chip airtight connection, waterproof performance is more preferable, at the same heat will not loss, entirely Portion is absorbed by cooling fin, more preferably to the protection of chip.

The shape of fin 2 is up-narrow and down-wide trapezoid, and base angle is 2-5 °, and the heat of the absorption of lower part can be forced upward The thin position in portion is mobile, improves radiating efficiency.

When being radiated using above structure, heat can quickly be transmitted to surface layer nano-carbon layer by bottom plate；Excitation nano carbon Layer in single wall carbon atom and nano-sized carbon ask, carbon nanotubes；Thermal energy is set to be converted into infrared short wavelength emissions into outside air；Tradition Radiator only on the basis of heat transfer more passively go carry out convection current without consider air duct, the application have natural wind or In the case that person artificially blows, the airflow channel between fin accelerates air velocity in channel because the temperature difference increases air pressure difference, Rate of heat dispation is accelerated, that is, increases the access of thermal convection, makes the more quickly flowing under the promotion of air pressure of the heat stream in environment, Without being stopped, at the same its spacing distance setting matched with nanometer carbon coating, for the caloradiance of optimization reflection, Route is reflected, optimal heat dissipation effect is reached；There is the point glue groove of closing cooling fin and chip again simultaneously, waterproof can played Guarantee while effect heat will not loss, all absorbed by cooling fin, more preferably to the protection of chip.

Embodiment 2:

Every row is equipped with 7-15 fin on bottom plate, and the fin of the quantity can satisfy radiating efficiency again and will not excessively increase whole The weight of a cooling fin meets light-weighted requirement.

Remaining is same as Example 1.

Embodiment 3:

Bottom plate is equipped with several mounting holes, for mutually fixing with electronic component.

Remaining is identical as embodiment 1 or embodiment 2.

Claims (4)

1. a kind of waterproof multi-fin cooling fin, it is characterised in that: including bottom plate, fin, bottom plate is mental section, upper surface Equipped with several vertical fins perpendicular to the base plate, uniform intervals between fin are spaced 3-5mm；2-4 profile groove is equipped between fin； The arrangement of the fin Structural assignments high in the low both sides in center；The two sides of the fin are equipped with the ripple glaze of horizontal projection；Institute The upper surface for stating waterproof multi-fin cooling fin is coated with a nanometer carbon coating；The back side of bottom plate is equipped with the point glue groove of protrusion.

2. waterproof multi-fin cooling fin according to claim 1, it is characterised in that: the shape of fin is up-narrow and down-wide Trapezoid, base angle are 2-5 °.

3. waterproof multi-fin cooling fin according to claim 1, it is characterised in that: every row is equipped with 7-15 fin on bottom plate Piece.

4. waterproof multi-fin cooling fin according to claim 1, it is characterised in that: bottom plate is equipped with several installations Hole.