CN209055902U - A kind of device accelerating computer motherboard heat dissipation - Google Patents
A kind of device accelerating computer motherboard heat dissipation Download PDFInfo
- Publication number
- CN209055902U CN209055902U CN201822084302.8U CN201822084302U CN209055902U CN 209055902 U CN209055902 U CN 209055902U CN 201822084302 U CN201822084302 U CN 201822084302U CN 209055902 U CN209055902 U CN 209055902U
- Authority
- CN
- China
- Prior art keywords
- mainboard
- heat dissipation
- radiator
- computer motherboard
- bottom end
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of devices of acceleration computer motherboard heat dissipation, including mainboard radiator, the two sides of the mainboard radiator are mounted on plum blossom screw, the plum blossom screw has eight, dust filter layer is installed on the inside of the plum blossom screw, the upper and lower side of the mainboard radiator is mounted on the first ventilation opening, one end of the mainboard radiator is equipped with power switch, the bottom end of the power switch is equipped with receiver J-Horner, the bottom end of the receiver J-Horner is equipped with data jack, there are three bottom end data jacks, the other end of the mainboard radiator is equipped with the second ventilation opening, the side of second ventilation opening is equipped with the second socket, the side of second socket is equipped with the first socket, the bottom end of the mainboard radiator is equipped with anti-skidding foundation, there are four the anti-skidding foundation.The utility model makes the device can effectively prevent dust entrance by being provided with a series of structure, and radiating efficiency is high, and it is uniform to radiate.
Description
Technical field
The utility model relates to quartzy plate technical field, specially a kind of device for accelerating computer motherboard heat dissipation.
Background technique
The heat that mechanical or other utensils generate during the work time is shifted in time to avoid influencing what it was worked normally
Device or instrument.Common radiator can be divided into air-cooled, heat-pipe radiator, liquid cooling, semiconductor refrigerating, pressure according to radiating mode
The multiple types such as contracting mechanism cold.High temperature is the formidable enemy of integrated circuit.High temperature not only will lead to system operation shakiness, service life contracting
It is short, it could even be possible to burning certain components.The heat of high temperature is caused to be not from outside computer, but computer-internal, or
It is IC interior that person, which says,.The effect of radiator is exactly then to diffuse to these heat absorptions in cabinet or outside cabinet,
Guarantee that the temperature of machine element is normal.According to the mode for taking away heat from radiator, the radiator of computer can be divided into master
Dynamic heat dissipation and passive heat dissipation.
But the device radiation of existing computer motherboard heat dissipation in the market is uneven, and radiating efficiency is not high；Cause
This, is unsatisfactory for existing demand, and to this, we have proposed a kind of devices of acceleration computer motherboard heat dissipation.
Utility model content
The purpose of this utility model is to provide a kind of devices of acceleration computer motherboard heat dissipation, to solve above-mentioned background skill
The problems such as device radiation of the existing computer motherboard heat dissipation in the market proposed in art is uneven, and radiating efficiency is not high.
To achieve the above object, the utility model provides the following technical solutions: a kind of dress accelerating computer motherboard heat dissipation
It sets, including mainboard radiator, the two sides of the mainboard radiator are mounted on plum blossom screw, and the plum blossom screw has eight
It is a, dust filter layer is installed, it is logical that the upper and lower side of the mainboard radiator is mounted on first on the inside of the plum blossom screw
Air port, one end of the mainboard radiator are equipped with power switch, and the bottom end of the power switch is equipped with receiver J-Horner, institute
The bottom end for stating receiver J-Horner is equipped with data jack, and there are three bottom end data jacks, the other end peace of the mainboard radiator
Equipped with the second ventilation opening, the side of second ventilation opening is equipped with the second socket, and the side of second socket is equipped with
One socket, the bottom end of the mainboard radiator are equipped with anti-skidding foundation, and there are four the anti-skidding foundation, the mainboard heat dissipation dress
The inside set is equipped with computer motherboard, and the two sides of the computer motherboard are mounted on radiator fan protective cover, the heat dissipation
Flabellum is installed on the inside of fan guard, connection cylinder, the inside peace of the connection cylinder are installed on the inside of the flabellum
Equipped with motor.
Preferably, the side of the mainboard radiator is bonded completely with one end of dust filter layer, the mainboard heat dissipation
Device is connected by a snap with dust filter layer.
Preferably, one end of the mainboard radiator is bonded completely with one end of power switch, the mainboard heat dissipation dress
It sets and is sealed with power switch by sealing ring.
Preferably, the bottom end of the mainboard radiator is bonded completely with the upper surface of anti-skidding foundation, the mainboard heat dissipation
Device is fixed with anti-skidding foundation by screw.
Preferably, one end of the flabellum is bonded completely with the side for connecting cylinder, and the flabellum passes through with cylinder is connect
Adhesive connection.
Preferably, the side of the mainboard heat sink interior is bonded completely with the one end for connecting cylinder, and the mainboard dissipates
Thermal is bolted with cylinder is connect.
Compared with prior art, the utility model has the beneficial effects that
1, for the utility model by being mounted on plum blossom screw in the two sides of mainboard radiator, plum blossom screw has eight,
Dust filter layer is installed, the upper and lower side of mainboard radiator is mounted on the first ventilation opening, and mainboard dissipates on the inside of plum blossom screw
One end of thermal is equipped with power switch, and the bottom end of power switch is equipped with receiver J-Horner, and the bottom end of receiver J-Horner is equipped with
Data jack, there are three bottom end data jacks, and the other end of mainboard radiator is equipped with the second ventilation opening, the second ventilation opening
Side is equipped with the second socket, and the side of the second socket is equipped with the first socket, so that the device can effectively prevent dust
Into, and radiating efficiency is high.
2, the utility model is by being equipped with computer motherboard, the two sides of computer motherboard in the inside of mainboard radiator
It is mounted on radiator fan protective cover, flabellum is installed on the inside of radiator fan protective cover, connection circle is installed on the inside of flabellum
Cylinder, connects and is equipped with motor on the inside of cylinder, so that the radiating rate of computer motherboard is fast, and it is uniform to radiate.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the side structure schematic diagram of the utility model；
Fig. 3 is the half section structure diagram of the utility model.
In figure: 1, dust filter layer；2, plum blossom screw；3, the first ventilation opening；4, power switch；5, receiver J-Horner；6, number
According to socket；7, mainboard radiator；8, radiator fan protective cover；9, the first socket；10, the second socket；11, motor；12, it calculates
Mainboard；13, flabellum；14, anti-skidding foundation；15, cylinder is connected；16, the second ventilation opening.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.
Fig. 1-3 is please referred to, a kind of embodiment provided by the utility model: a kind of device accelerating computer motherboard heat dissipation,
Including mainboard radiator 7, the two sides of mainboard radiator 7 are mounted on plum blossom screw 2, and plum blossom screw 2 has eight, plum blossom spiral shell
The inside of nail 2 is equipped with dust filter layer 1, and the upper and lower side of mainboard radiator 7 is mounted on the first ventilation opening 3, mainboard heat dissipation
One end of device 7 is equipped with power switch 4, and the bottom end of power switch 4 is equipped with receiver J-Horner 5, the bottom end installation of receiver J-Horner 5
There is data jack 6, there are three bottom end data jacks 6, and the other end of mainboard radiator 7 is equipped with the second ventilation opening 16, and second
The side of ventilation opening 16 is equipped with the second socket 10, and the side of the second socket 10 is equipped with the first socket 9, so that the device can be with
Effectively prevent dust from entering, and radiating efficiency is high, the bottom end of mainboard radiator 7 is equipped with anti-skidding foundation 14, anti-skidding foundation
There are four 14, the inside of mainboard radiator 7 is equipped with computer motherboard 12, and the two sides of computer motherboard 12 are mounted on heat dissipation
Fan guard 8, the inside of radiator fan protective cover 8 are equipped with flabellum 13, and the inside of flabellum 13 is equipped with connection cylinder 15, even
The inside for connecing cylinder 15 is equipped with motor 11, so that the radiating rate of computer motherboard 12 is fast, and it is uniform to radiate.
Further, the side of mainboard radiator 7 is bonded completely with one end of dust filter layer 1, mainboard radiator 7 with
Dust filter layer 1 is connected by a snap, so that the device effectively avoids dust.
Further, one end of mainboard radiator 7 is bonded completely with one end of power switch 4, mainboard radiator 7 and electricity
Source switch 4 is sealed by sealing ring, so that the device is adapted to complex environment.
Further, the bottom end of mainboard radiator 7 is bonded completely with the upper surface of anti-skidding foundation 14, mainboard radiator 7
It is fixed with anti-skidding foundation 14 by screw, the device is allowed firmly to be fixed on ground.
Further, one end of flabellum 13 is bonded completely with the side for connecting cylinder 15, and flabellum 13 passes through with cylinder 15 is connect
Adhesive connection, so that the rotation that flabellum 13 can be convenient.
Further, the side inside mainboard radiator 7 is bonded completely with the one end for connecting cylinder 15, mainboard radiator
7 are bolted with cylinder 15 is connect, and radiator fan is firmly fixed.
Working principle: in use, check the service condition of each structure, it, will after moving the device into suitable region
The device can firmly be fixed on ground by anti-skidding foundation 14, and the interface of the device is connected with corresponding device, is pressed
After power switch 4 opens computer, at work, heat dispersal situations are more serious for computer motherboard 12, pass through two radiation airs
The effect of fan can endlessly enter cold wind from dust filter layer 1, and the heat that computer motherboard 12 is distributed passes through the
One ventilation opening 3 and the discharge of the second ventilation opening 16, so that the temperature of computer motherboard 12 lowers.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
Claims (6)
1. a kind of device for accelerating computer motherboard heat dissipation, including mainboard radiator (7), it is characterised in that: the mainboard dissipates
The two sides of thermal (7) are mounted on plum blossom screw (2), and the plum blossom screw (2) has eight, the plum blossom screw (2) it is interior
Side is equipped with dust filter layer (1), and the upper and lower side of the mainboard radiator (7) is mounted on the first ventilation opening (3), the master
One end of plate heat dissipating device (7) is equipped with power switch (4), and the bottom end of the power switch (4) is equipped with receiver J-Horner (5),
The bottom end of the receiver J-Horner (5) is equipped with data jack (6), and there are three bottom end data jacks (6), the mainboard radiator
(7) the other end is equipped with the second ventilation opening (16), and the side of second ventilation opening (16) is equipped with the second socket (10), institute
The side for stating the second socket (10) is equipped with the first socket (9), and the bottom end of the mainboard radiator (7) is equipped with anti-skidding foundation
(14), there are four the anti-skidding foundation (14), the inside of the mainboard radiator (7) is equipped with computer motherboard (12), institute
The two sides for stating computer motherboard (12) are mounted on radiator fan protective cover (8), the inside peace of the radiator fan protective cover (8)
Equipped with flabellum (13), connection cylinder (15), the inside installation of connection cylinder (15) are installed on the inside of the flabellum (13)
There are motor (11).
2. a kind of device for accelerating computer motherboard heat dissipation according to claim 1, it is characterised in that: the mainboard heat dissipation
The side of device (7) is bonded completely with one end of dust filter layer (1), the mainboard radiator (7) and dust filter layer (1)
It is connected by a snap.
3. a kind of device for accelerating computer motherboard heat dissipation according to claim 1, it is characterised in that: the mainboard heat dissipation
One end of device (7) is bonded completely with one end of power switch (4), and the mainboard radiator (7) passes through with power switch (4)
Sealing ring sealing.
4. a kind of device for accelerating computer motherboard heat dissipation according to claim 1, it is characterised in that: the mainboard heat dissipation
The bottom end of device (7) is bonded completely with the upper surface of anti-skidding foundation (14), the mainboard radiator (7) and anti-skidding foundation (14)
It is fixed by screw.
5. a kind of device for accelerating computer motherboard heat dissipation according to claim 1, it is characterised in that: the flabellum (13)
One end be bonded completely with the side for connecting cylinder (15), the flabellum (13) with connect cylinder (15) pass through adhesive connect.
6. a kind of device for accelerating computer motherboard heat dissipation according to claim 1, it is characterised in that: the mainboard heat dissipation
The internal side of device (7) is bonded completely with the one end for connecting cylinder (15), the mainboard radiator (7) with connect cylinder
(15) it is bolted.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822084302.8U CN209055902U (en) | 2018-12-12 | 2018-12-12 | A kind of device accelerating computer motherboard heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201822084302.8U CN209055902U (en) | 2018-12-12 | 2018-12-12 | A kind of device accelerating computer motherboard heat dissipation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209055902U true CN209055902U (en) | 2019-07-02 |
Family
ID=67054964
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201822084302.8U Expired - Fee Related CN209055902U (en) | 2018-12-12 | 2018-12-12 | A kind of device accelerating computer motherboard heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209055902U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111240442A (en) * | 2019-11-09 | 2020-06-05 | 湖南化工职业技术学院 | Computer electronic element cooling device |
-
2018
- 2018-12-12 CN CN201822084302.8U patent/CN209055902U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111240442A (en) * | 2019-11-09 | 2020-06-05 | 湖南化工职业技术学院 | Computer electronic element cooling device |
| CN111240442B (en) * | 2019-11-09 | 2021-03-19 | 湖南化工职业技术学院 | Computer electronic element cooling device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP02 | Change in the address of a patent holder |
Address after: 412000 Hunan province Zhuzhou shifengqu Qing Shi Road No. 2 Patentee after: Hunan chemical industry Career Technical College (Hunan industrial advanced technical school) Address before: 423000 No. 2 Qingshi Road, Shifeng District, Chenzhou City, Hunan Province Patentee before: Hunan chemical industry Career Technical College (Hunan industrial advanced technical school) |
|
| CP02 | Change in the address of a patent holder | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190702 Termination date: 20191212 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |