CN209052775U - A kind of sn-bi alloy electroplanting device - Google Patents
A kind of sn-bi alloy electroplanting device Download PDFInfo
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- CN209052775U CN209052775U CN201821308194.1U CN201821308194U CN209052775U CN 209052775 U CN209052775 U CN 209052775U CN 201821308194 U CN201821308194 U CN 201821308194U CN 209052775 U CN209052775 U CN 209052775U
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- rectifier
- bismuth
- electroplating bath
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- tin
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Abstract
The utility model provides a kind of sn-bi alloy electroplanting device, with electroplating bath, the anode of electroplanting device is connected with metal sheet tin and bismuth metal plate, metal sheet tin and bismuth metal plate are connected separately with the first rectifier and the second rectifier, and the first rectifier and the second rectifier are respectively used to change the current value on metal sheet tin and bismuth metal plate.First rectifier and the second rectifier are connected with programmable logic controller, using programmable logic controller according to the control of the concentration of bismuth ion in electroplate liquid and tin ion to the input current value of metal sheet tin and bismuth metal plate, it can be to avoid under same electric current, bismuth metal is easier to be oxidized dissolution compared with metallic tin and enters in electroplate liquid and then be reduced in electroplating cathode, leads on metal wire rod that tin bi content does not meet the case where plating requires in coating.
Description
Technical field
The utility model belongs to electroplating technology, and in particular to a kind of sn-bi alloy electroplanting device.
Background technique
Tin is a kind of argenteous metal, nontoxic, has good welding and ductility etc., in electronic component, track
It is widely used in the plate of road frequently as tin plating protective layer, but metallic tin has the shortcomings that fatal, it is lower than subzero 13 degree
At a temperature of, it just tarnishes, becomes dark gray, be finally fragmented into powder, is i.e. generation " tin pest ".Meanwhile " tin pest " is not caught
Sheet tin, once and there is the tin of " tin pest " to contact, can also generate the spot of grey and gradually " rotten " falls.
A kind of production method of existing tin bismuth alloy tin bismuth alloy coated copper clad steel wire, this method plate the surface of copper covered steel wire
Sn-bi alloy sn-bi alloy, effectively prevent the generation of " tin pest ", but this method by electroplate liquid using methane sulfonic acid bismuth come
Metal bismuth ion is provided, and methane sulfonic acid bismuth is a kind of Organic Chemicals, in production, transport, storage and when for producing,
The risk polluted the environment is very big and higher cost.To avoid having in the prior art using methane sulfonic acid bismuth using gold
Belong to the anode of tin and bismuth metal together as plating when and tin and bismuth required for production sn-bi alloy sn-bi alloy, but metal are provided
Tin element is different from the dissolution potential of metal bismuth element, and under same current potential, bismuth metal is not easy to be oxidized and dissolve into compared with metallic tin
The proportional imbalance for entering in electroplate liquid, and then being reduced in electroplating cathode.
Utility model content
Therefore, the technical problem to be solved by the present invention is to overcome in the prior art to be to overcome existing plating
Sn-bi alloy alloying technology prevents metallic tin and bismuth element from quilt simultaneously because of metal tin element and bismuth element dissolution potential difference
Oxidation dissolution enters electroplate liquid, and to maintain, sn-bi alloy ion concentration is stable in electroplate liquid and then thus obtained tin bismuth is caused to close
The problem of gold plate unstable quality, and then a kind of sn-bi alloy electroplanting device is provided.
The utility model provides a kind of sn-bi alloy electroplanting device, has electroplating bath, interior to be equipped with electroplate liquid, for place
Cathode object to be plated in the electroplate liquid is electroplated；
It is characterized in that, being equipped with metal sheet tin and bismuth metal plate in the electroplating bath as anode；
Further include the first rectifier and the second rectifier, the anode of first rectifier and the second rectifier respectively with institute
It states metal sheet tin to connect with the bismuth metal plate, is respectively used to change the electric current on the metal sheet tin and the bismuth metal plate
Value；
Programmable logic controller (PLC) is connected with first rectifier and second rectifier respectively, and according to institute
The control of the concentration of bismuth ion and tin ion in electroplate liquid is stated to the input current value of the metal sheet tin and the bismuth metal plate.
It is equipped with concentration sensor in the electroplating bath, is placed in the electroplate liquid, for measuring bismuth in the electroplate liquid
The concentration of ion and tin ion.
The concentration sensor is connected with the programmable logic controller (PLC), for the concentration data of measurement to be transferred to institute
State programmable logic controller (PLC).
The bismuth metal plate is divided into different electroplating baths from the metal sheet tin, and passes through conductive titanium plate and the electricity
Coating bath is fixedly connected.
The electroplating bath is equipped with anode connection terminal, and the anode connection terminal is connected with the conductive titanium plate.
The object to be plated is metal wire rod, the metal wire rod and first rectifier and second rectifier
Cathode is connected.
The electroplating bath is set side by side with multilayer along short transverse, and the electroplating bath both ends are equipped with godet roller for changing institute
State direction and/or the driving metal wire rod of metal wire rod.
The both ends of the metal wire rod are equipped with actinobacillus device and take-up, the take-up and/or the godet roller
The metal wire rod is driven to move in the electroplating bath.
Further include plating pretreatment mechanism, is set between the electroplating bath and the actinobacillus device comprising oil removing
Device, ultrasonic water cleaning device and oxide layer device, the object to be plated enter the electroplating bath before from the plating
Pass through in pretreatment mechanism.
Further include plating post-processing mechanism, plating post-processing mechanism be set to the electroplating bath and the take-up it
Between, the surface for having plated object is handled.
Technical solutions of the utility model have the advantages that
1. sn-bi alloy electroplanting device provided by the utility model, there is electroplating bath, be equipped in electroplating bath metal sheet tin and
For bismuth metal plate as anode, metal sheet tin is connected with bismuth metal plate is connected separately with the first rectifier and the second rectifier, and first
Rectifier and the second rectifier are respectively used to change the current value on metal sheet tin and bismuth metal plate.First rectifier and second whole
Stream device is connected with programmable logic controller, using programmable logic controller according to the dense of bismuth ion in electroplate liquid and tin ion
Degree control, can be to avoid under same electric current to the input current value of metal sheet tin and bismuth metal plate, and bismuth metal is compared with metallic tin
It is easier to be oxidized dissolution to enter in electroplate liquid and then be reduced in electroplating cathode, leads on metal wire rod in coating tin bi content not
Meet the case where plating requires.
2. sn-bi alloy electroplanting device provided by the utility model, it is equipped with concentration sensor in electroplating bath, is placed in plating
In liquid, concentration sensor is connected with programmable logic controller (PLC), for the concentration data of measurement to be transferred to programmable logic control
Device processed.The concentration of bismuth ion and tin ion in real-time detection electroplate liquid is realized, and adjustment anode is electric in real time according to testing result
Stream.
3. sn-bi alloy electroplanting device provided by the utility model, electroplating bath are set side by side with multilayer along short transverse, electricity
Coating bath both ends are equipped with godet roller for changing the direction of metal wire rod.The electroplating bath of multi-tier arrangement can be in a limited space to gold
Belong to wire rod and realizes repeatedly plating, it is ensured that electroplating effect, while the occupied space of equipment is also reduced, so that the compact height of production line
Effect.
Detailed description of the invention
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of the sn-bi alloy electroplanting device in embodiment 1；
Fig. 2 is structural schematic diagram in electroplating bath in embodiment 1.
Description of symbols:
1- metal wire rod；2- electroplating bath；3- plating pretreatment mechanism；4- plating post-processing mechanism；5- actinobacillus device；6- is received
Line apparatus；7- godet roller；The first rectifier of 21-；The second rectifier of 22-；23- metal sheet tin；24- bismuth metal plate；25- is programmable
Logic controller.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, originally
Field those of ordinary skill every other embodiment obtained without making creative work belongs to practical
Novel protected range.
It is in the description of the present invention, it should be noted that term " center ", "upper", "lower", "left", "right", " perpendicular
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected；Can be directly connected, can also indirectly connected through an intermediary,
It can be the connection inside two elements.For the ordinary skill in the art, above-mentioned art can be understood with concrete condition
The concrete meaning of language in the present invention.
In addition, as long as technical characteristic involved in the utility model different embodiments disclosed below is each other
Not constituting conflict can be combined with each other.
Embodiment 1
The present embodiment provides a kind of sn-bi alloy electroplanting device, structure is as shown in Figure 1, be used as to 1 surface of metal wire rod
Carry out the electroplating processes of sn-bi alloy, including electroplating bath 2, actinobacillus device 5, take-up 6, plating pretreatment mechanism 3 and electricity
Plating posttreatment mechanism 4.Electroplating pool is equipped with electroplate liquid, for the object to be plated in electroplate liquid to be electroplated.In electroplating pool
It is used as anode equipped with metal sheet tin 23 and bismuth metal plate 24, it is whole that metal sheet tin 23 and the connection of bismuth metal plate 24 are connected to first
Flow the anode of device 21 and the second rectifier 22, the first rectifier 21 and the second rectifier 22 be respectively used to change metal sheet tin 23 and
Current value on bismuth metal plate 24.First rectifier 21 and the second rectifier 22 are connected with programmable logic controller, using can
Editorial logic controller is controlled according to the concentration of bismuth ion in electroplate liquid and tin ion to metal sheet tin 23 and bismuth metal plate 24
Input current value, can to avoid under same electric current, bismuth metal compared with metallic tin be easier to be oxidized dissolution enter in electroplate liquid into
And be reduced in electroplating cathode, lead on metal wire rod 1 that tin bi content does not meet the case where plating requires in coating.
It is additionally provided with concentration sensor in electroplating bath 2 in the present embodiment, is placed in electroplate liquid, for in electroplate liquid
The concentration of bismuth ion and tin ion is detected.Concentration sensor is connected with programmable logic controller (PLC) 25, for what will be measured
Concentration data is transferred to programmable logic controller (PLC) 25, realizes the concentration of bismuth ion and tin ion in real-time detection electroplate liquid,
And adjust anode current in real time according to testing result.
In the present embodiment, programmable logic controller (PLC) 25 with it is external exchange be electrically connected, the programmable controller with it is described
It is whole that the first rectifier 21 and second is respectively arranged between metal sheet tin 23 and the programmable controller and bismuth metal plate 24
Device 22 is flowed, is used for AC conversion into corresponding direct current.Programmable logic controller (PLC) 25 and first rectifier 21, institute
It states and sending and receiving for data is completed by RS485 communications protocol between the second rectifier 22, it is of course also possible to use other works
Industry communications protocol, such as: modbus-RTU or modbus-Transmission Control Protocol.
Specifically, the process for controlling electroplated Sn-Bi alloy in the present embodiment is as follows:
Set I in programmable logic controller (PLC) 25Sn、P1、P2And P4The value of parameter measures bismuth ion in electroplate liquid and works as
Preceding concentration simultaneously sets P in programmable logic controller (PLC) 253The value of parameter, programmable logic controller (PLC) 25 is according to IBiWith ISnLetter
Number relational expression calculates IBiValue；
By programmable logic controller (PLC) 25 according to IBiValue exports corresponding current signal；
Programmable logic controller (PLC) 25 controls the first rectifier 21 and the second rectifier 22 is respectively supplied to metal sheet tin 23
Electric current ISnAnd 24 electric current I of bismuth metal plateBi。
Wherein: IBiWith ISnFunctional relation are as follows:
IBi=ISn×P1×P2/P3×P4
In formula: IBiIndicate the input current value on bismuth metal plate 24；ISnIndicate the input current value of metal sheet tin 23；
P1The ratio for indicating input current value and input current value on sheet tin on bismuth plate, it is pre- by programmable logic controller (PLC) 25
First set；
P2The normal concentration for indicating bismuth ion in electroplate liquid, is preset by programmable logic controller (PLC) 25；
P3Indicate the existing concentration of bismuth ion in electroplate liquid；
P4It indicates artificial correction parameter, is traditionally arranged to be 1.
In the present embodiment 1, by the existing concentration of bismuth ion in concentration sensor measurement electroplate liquid, and by the concentration of measurement
Data are transferred directly to programmable logic controller (PLC) 25, and programmable logic controller (PLC) 25 is according to the data and IBiWith ISnFunction
I is calculated in relational expressionBiValue, and according to IBiThe adjustment of value real-time control is supplied on bismuth metal plate 24 by the second rectifier 22
Input current value.
Metal sheet tin 23 in the present embodiment is divided into different electroplating baths 2 from bismuth metal plate 24, can be with metal sheet tin
23 and bismuth metal plate 24 apply different electric currents respectively, avoid and be located at the case where electric current influences each other in same electroplating bath 2 hair
It is raw.
Metal sheet tin 23 and bismuth metal plate 24 are mounted in electroplating pool by conduction titanium plate in the present embodiment, conductive titanium
Plate is fixedly connected with electroplating bath 2.Electroplating bath 2 is equipped with anode connection terminal, and anode connection terminal is connected with conductive titanium plate, benefit
Stable electrical connection can be guaranteed by being connect with conductive titanium plate with connecting terminal.
Metal wire rod 1 in the present embodiment is connect with cathode, specifically, the metal wire rod 1 in the present embodiment is steel wire rod,
And it is equipped with actinobacillus device 5 and take-up 6 at the both ends of metal wire rod 1, actinobacillus device 5 and godet roller 7 drive metal wire rod 1 to exist
It is moved in electroplating bath 2.And it is additionally provided with power control unit on take-up 6, according to the Tensity size tune in metal wire rod 1
The speed of service of whole metal wire rod 1 prevents metal wire rod 1 to be broken.
As shown in Figure 1, the electroplating bath 2 in the present embodiment is set side by side with multilayer along short transverse, 2 both ends of electroplating bath are equipped with
Godet roller 7 is for changing the direction of metal wire rod 1, or the godet roller 7 with driving device can drive the fortune of metal wire rod 1
It is dynamic.The electroplating bath 2 of multi-tier arrangement can realize multiple plating to metal wire rod 1 in a limited space, it is ensured that electroplating effect, simultaneously
The occupied space of equipment is also reduced, so that production line compact efficient.
As shown in Figure 1, the sn-bi alloy electroplanting device in the present embodiment further includes plating pretreatment mechanism 3, it is set to
Between electroplating bath 2 and actinobacillus device 5 comprising degreasing unit, ultrasonic water cleaning device and oxide layer device, metal wire rod
1 enters electroplating bath 2 passes through from plating pretreatment mechanism 3 before, and oil and the oxide layer removal on 1 surface of metal wire rod are kept
1 clean surface of metal wire rod to be plated, it is ensured that the electroplating effect of sn-bi alloy.
As shown in Figure 1, plating post-processing mechanism 4 is additionally provided in the present embodiment between electroplating bath 2 and take-up 6, to
The surface of the metal wire rod 1 of plating is handled.Specifically include electroplate liquid recyclable device, ultrasonic wave water washing, in electroplate liquid and device,
Mold polish device, face protectors, dry tack free device and surface detection apparatus are used for 1 surface of plating metal wire rod
Remaining electroplate liquid clean out, and electroplated layer is protected and is detected, so that final product quality is intact.
As interchangeable embodiment, it can also be not provided with actinobacillus device 5 in the present embodiment, and directly utilize take-up
6 provide power for the movement of metal wire rod 1.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes among the protection scope created still in the utility model.
Claims (10)
1. a kind of sn-bi alloy electroplanting device has electroplating bath (2), interior to be equipped with electroplate liquid, for in the electroplate liquid
In cathode object to be plated be electroplated；
It is characterized in that, being equipped with metal sheet tin (23) and bismuth metal plate (24) in the electroplating bath (2) as anode；
It further include the first rectifier (21) and the second rectifier (22), first rectifier (21) and the second rectifier (22)
Anode is connect with the metal sheet tin (23) and the bismuth metal plate (24) respectively, is respectively used to change the metal sheet tin (23)
With the current value on the bismuth metal plate (24)；
Programmable logic controller (PLC) (25) is connected with first rectifier (21) and second rectifier (22) respectively,
And according to the concentration of bismuth ion and tin ion control in the electroplate liquid to the metal sheet tin (23) and the bismuth metal plate
(24) input current value.
2. a kind of sn-bi alloy electroplanting device according to claim 1, which is characterized in that be equipped in the electroplating bath (2)
Concentration sensor is placed in the electroplate liquid, for measuring the concentration of bismuth ion and tin ion in the electroplate liquid.
3. a kind of sn-bi alloy electroplanting device according to claim 2, which is characterized in that the concentration sensor with it is described
Programmable logic controller (PLC) (25) is connected, for the concentration data of measurement to be transferred to the programmable logic controller (PLC) (25).
4. a kind of sn-bi alloy electroplanting device according to claim 1, which is characterized in that the bismuth metal plate (24) and institute
It states metal sheet tin (23) to be divided into different electroplating bath (2), and is fixedly connected by conductive titanium plate with the electroplating bath (2).
5. a kind of sn-bi alloy electroplanting device according to claim 4, which is characterized in that the electroplating bath (2) is equipped with
Anode connection terminal, the anode connection terminal are connected with the conductive titanium plate.
6. a kind of sn-bi alloy electroplanting device according to claim 1, which is characterized in that the object to be plated is metal wire
Material (1), the metal wire rod (1) are connected with the cathode of the first rectifier (21) and the second rectifier (22).
7. a kind of sn-bi alloy electroplanting device according to claim 6, which is characterized in that the electroplating bath (2) is along height
Direction is set side by side with multilayer, and electroplating bath (2) both ends are equipped with godet roller (7) for changing the side of the metal wire rod (1)
To and/or the driving metal wire rod (1).
8. a kind of sn-bi alloy electroplanting device according to claim 7, which is characterized in that the two of the metal wire rod (1)
End is equipped with actinobacillus device (5) and take-up (6), and the take-up (6) and/or the godet roller (7) drive the metal
Wire rod (1) moves in the electroplating bath (2).
9. a kind of sn-bi alloy electroplanting device according to claim 8, which is characterized in that further include plating pretreatment mechanism
(3), it is set between the electroplating bath (2) and the actinobacillus device (5) comprising degreasing unit, ultrasonic water cleaning device
And oxide layer device, the object to be plated lead to from plating pretreatment mechanism (3) before entering the electroplating bath (2)
It crosses.
10. a kind of sn-bi alloy electroplanting device according to claim 9, which is characterized in that further include plating post-processor
Structure (4), plating post-processing mechanism (4) are set between the electroplating bath (2) and the take-up (6), to having plated object
Surface handled.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821308194.1U CN209052775U (en) | 2018-08-14 | 2018-08-14 | A kind of sn-bi alloy electroplanting device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821308194.1U CN209052775U (en) | 2018-08-14 | 2018-08-14 | A kind of sn-bi alloy electroplanting device |
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| Publication Number | Publication Date |
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| CN209052775U true CN209052775U (en) | 2019-07-02 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111472031A (en) * | 2020-06-05 | 2020-07-31 | 扬昕科技(苏州)有限公司 | Electroplating device and method for manufacturing mold core by using same |
-
2018
- 2018-08-14 CN CN201821308194.1U patent/CN209052775U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111472031A (en) * | 2020-06-05 | 2020-07-31 | 扬昕科技(苏州)有限公司 | Electroplating device and method for manufacturing mold core by using same |
| CN111472031B (en) * | 2020-06-05 | 2021-09-28 | 扬昕科技(苏州)有限公司 | Electroplating device and method for manufacturing mold core by using same |
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