CN209045531U - A kind of semiconductor chip package - Google Patents
A kind of semiconductor chip package Download PDFInfo
- Publication number
- CN209045531U CN209045531U CN201820601704.8U CN201820601704U CN209045531U CN 209045531 U CN209045531 U CN 209045531U CN 201820601704 U CN201820601704 U CN 201820601704U CN 209045531 U CN209045531 U CN 209045531U
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- Prior art keywords
- semiconductor chip
- layer
- circuit board
- wiring
- weld pad
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/18—High density interconnect [HDI] connectors; Manufacturing methods related thereto
Abstract
The present disclosure discloses a kind of semiconductor chip packages comprising: semiconductor chip；Circuit board has the wiring pattern being made of at least one trace and/or weld pad；Wire structures again, for drawing the positive weld pad of the semiconductor chip, at least part of the wire structures again is distributed on the circuit board；Encapsulating structure, for encapsulating the semiconductor chip, circuit board and wire structures again.The circuit board of the disclosure includes feature as example complicated more circuit designs, these features can be embedded into the encapsulating structure of assembling, to which the performance of entire encapsulating structure can be improved, so that the interconnection between semiconductor chip and routing circuit becomes internal structure, so as to shorten circuit paths.
Description
The disclosure requires the preferential of the patent application of September 15th No.10201707613W in Singapore's proposition in 2017
Power, is hereby incorporated by reference its full text.
Technical field
This disclosure relates to semiconductor chip packaging field, in particular to a kind of semiconductor chip package.
Background technique
With the development of semiconductor technology, the size of chip is smaller and smaller, and the I/O pin density of chip surface is also increasingly
Height, fan-out package are come into being, and the highdensity I/O pin of chip is fanned out to the packaging pin for low-density by fan-out package.
Existing fan-out package method specifically includes that offer support plate, and adhesive layer is arranged on support plate, by the front of chip
Mount on adhesive layer, chip be subjected to plastic packaging, remove adhesive layer and support plate later, the front of chip formed again wiring layer,
It is implanted into solder sphere, cutting.
This traditional fan-out package method, due to needing to be routed again after adhering chip, and Board level packaging needs
Disposable processing multi-layered high-density wiring, thus the difficult to govern control of packaging technology will affect the yield after encapsulation；In order to realize that chip seals
The miniaturization of dress, then can have the fine wiring pattern shape formed with high density in wiring layer, fine wiring pattern is described and is easily being routed
Layer generates open circuit or short circuit problem；In addition, if structure is complicated for chip internal circuits, then need to be formed in semiconductor chip front
Than the wiring of comparatively dense, thus can generate leads to difficult wiring because semiconductor chip surface product is too small, additionally, due to wiring
It is excessively intensively easy to cause wiring failure and causes the yield rate of product low, product is also easy in use in this case
Damage.
Utility model content
(1) technical problems to be solved
In order to overcome drawbacks described above of the existing technology, the present disclosure proposes a kind of semiconductor chip packages.
According to one aspect of the disclosure, a kind of semiconductor chip package is proposed comprising: semiconductor chip；Cloth
Line substrate has the wiring pattern being made of at least one trace and/or weld pad；Wire structures again, for drawing described half
At least part of the positive weld pad of conductor chip, the wire structures again is distributed on the circuit board；Encapsulating structure is used
In encapsulating the semiconductor chip, circuit board and wire structures again.
According to another aspect of the present disclosure, it is also proposed that a kind of semiconductor chip package, comprising: the first chip package knot
Structure；At least one second chip-packaging structure, second chip-packaging structure include packaged chip and for drawing
The wire structures again of the weld pad of the chip front side；Wherein, the wire structures again of at least one second chip-packaging structure
It is electrically connected with the articulamentum of the circuit board of the first chip-packaging structure described at least one.
(3) beneficial effect
In semiconductor chip package disclosed in the disclosure, due to being provided with circuit board, it can will need wait seal
The wiring that dress semiconductor chip front is completed, which is transferred on circuit board, to be carried out, during the size and Board level packaging of circuit board
The support plate area used is identical, thereon includes feature as example complicated more circuit designs, these features can be embedding
Enter into the encapsulating structure of assembling, so that the performance of entire encapsulating structure can be improved, so that semiconductor chip and routing circuit
Interconnection between (routing circuit) becomes internal structure, so as to shorten circuit paths；In addition, further
, the fine pitch wirings in wiring layer again are transferred on circuit board and are carried out, reduce again wiring layer open circuit or short circuit it is general
Rate, while the number of plies of wiring layer can be reduced again, realize the purpose of the miniaturization of encapsulation；Further, preforming wiring is provided
Substrate can be tested in advance and be encapsulated again, and the defective unit of tool can be marked, it is ensured that known bad element is not used by, and is suitable for multiple
The encapsulation procedure that miscellaneous degree is high, integration density is high, can not only promote encapsulation procedure body yield, more can effectively be further reduced meaningless
Making material cost.
Detailed description of the invention
Fig. 1 is the flow chart to form the semiconductor chip package of the disclosure；
Fig. 2 is the sectional view according to the first support plate of the disclosure；
Fig. 3 is to mount the sectional view after adhesive layer on the first support plate according to the disclosure；
Fig. 4 is the sectional view according to the disclosure on the first support plate after mounting semiconductor chips；
Fig. 5 is the floor map that position mark is arranged on the first support plate according to the disclosure；
Fig. 6 a- Fig. 6 c is the schematic diagram according to the circuit board of one embodiment of the disclosure；
Fig. 7 is the sectional view according to one embodiment of the disclosure after the first support plate mounts circuit board and semiconductor chip；
Fig. 8 is the sectional view formed after the first encapsulated layer according to one embodiment of the disclosure；
Fig. 9 a and Fig. 9 b are the schematic diagrames for being thinned encapsulated layer according to one embodiment of the disclosure；
Fig. 9 c is the schematic diagram that the first support plate and adhesive layer are removed according to one embodiment of the disclosure；
Figure 10 is the flow chart that wire structures are formed again according to one embodiment of the disclosure；
Figure 11 is the sectional view formed after the first insulating layer according to one embodiment of the disclosure；
Figure 12 is the sectional view formed on the first insulating layer after opening according to one embodiment of the disclosure；
Figure 13 is the sectional view formed after the via hole and graphical route being filled according to one embodiment of the disclosure；
Figure 14 is the sectional view for forming pillar on graphical route according to one embodiment of the disclosure；
Figure 15 is the sectional view formed after outermost layer insulating according to one embodiment of the disclosure；
Figure 16 is that two layers of sectional view after wiring layer again is formed according to another embodiment of the disclosure；
Figure 17, Figure 18 a and Figure 18 b are the schematic diagrames cut according to one embodiment of the disclosure to encapsulating structure；
Figure 19 is the sectional view that the encapsulating structure formed according to one embodiment of the disclosure is welded to circuit board；
Figure 20 is to connect showing for other circuit boards by the routing layer of circuit board according to one embodiment of the disclosure with Figure 21
It is intended to.
Specific embodiment
For the purposes, technical schemes and advantages of the disclosure are more clearly understood, below in conjunction with specific embodiment, and reference
The disclosure is further described in attached drawing.
The disclosure primarily directed to present in semiconductor chip Board level packaging structure in the prior art and packaging method
Semiconductor front, which carries out wiring, to be had certain difficulty and semiconductor chip is be easy to cause to damage such problems proposition.The disclosure
Circuit board is provided in semiconductor chip package, it can be by the positive route of semiconductor chip and again in wiring layer extremely
Small part wiring, which is guided on circuit board, to be routed, and is reduced the difficulty of wiring, is increased the stability of route, reduce simultaneously
It is routed the number of plies again, thus reduces encapsulation volume, improves the performance of encapsulation chip；Circuit board can be tested in advance simultaneously,
Energy tabling has defective unit, is marked, and to filter out the unit without defect, and then it is good to improve overall package
Rate.
Fig. 1 is according to the flow chart for forming the semiconductor chip package that the disclosure proposes.Referring to Fig.1, comprising:
Step S1 provides the first support plate 100.
As shown in Fig. 2, the first support plate 100 preferably square or rectangular panel, including first surface and second surface,
First surface is the upper surface of the first support plate 100, and second surface is the lower surface of the first support plate 100, and two surfaces have no essence
Difference, referred to herein as first surface and second surface are just for the sake of both differentiations.First support plate 100 can be metal material,
Such as copper or steel, it is also possible to nonmetallic materials, such as polymer, is in addition also possible to silicon wafer (silicon wafer).?
The first surface of one support plate 100 is by laser or mechanical engraving or drilling, or forms at least one by way of chemical etching
Mark position, the position of these labels correspond to the position that chip is arranged on the first support plate 100, and each label is one corresponding
The position of semiconductor chip, the purpose of setting flag are that semiconductor chip 300 is facilitated accurately to be put on the first support plate 100
It sets.Fig. 5 shows the schematic diagram that chip is placed into the first support plate 100.
Step S2 forms adhesive layer 200 on the surface of the first support plate 100.
As shown in figure 3, the first surface in the first support plate 100 forms adhesive layer 200, will can partly be led by adhesive layer 200
Body chip 300 is mounted on the first surface of support plate 100.Easily peelable material can be used in adhesive layer 200, so that the later period is by support plate
100 peel away with chip 300 packaged on its first surface, such as can be used can make it lose viscosity by heating
Thermal release material.Alternatively, double-layer structure, thermal release material layer and chip adhesive layer, thermal release material can be used in adhesive layer 200
Layer is pasted on support plate 100, can lose viscosity when heated, and then can strip down from support plate 100, and chip adhesive layer
For pasting semiconductor chip 300；And semiconductor chip 300 can be gone after the removing of support plate 100 by chemical cleaning mode
Except chip adhesive layer thereon；Alternatively, adhesive layer 200 can be formed on support plate 100 by the modes such as being laminated, printing.
At least one semiconductor chip 300 is arranged in the predetermined position of the first support plate 100 in step S3.
As shown in Figure 4 and Figure 5, at least one semiconductor chip 300 is mounted on to the first surface 101 of the first support plate 100
On, 300 back side of semiconductor chip upward, just facing towards the first support plate 100.
Semiconductor chip 300 be by being thinned, being cut to a semiconductor crystal wafer, semiconductor chip 300
Front is that the conductive electrode for leading to chip surface by chip internal circuits is constituted, and weld pad or tie point preparation are in these conductive electricity
On extremely.
Before forming adhesive layer 200, semiconductor chip 300 is previously provided in the first surface 101 of the first support plate 100
Paste position 102 semiconductor chip 300 is pasted onto the predetermined position of the first support plate 100 after forming adhesive layer 200
At 102.It also is provided with alignment mark on semiconductor chip 300, to take aim at when pasting with the paste position 102 on the first support plate 100
Quasi- contraposition.The corresponding predetermined position 102 of each semiconductor chip 300.In encapsulation process, semiconductor chip 300 can be with
It is at least one, i.e., mounts at least one semiconductor chip 300 simultaneously on the first support plate 100, be packaged, and completes to seal
After dress, then it being cut at least one packaging body, a packaging body may include at least one semiconductor chip 300, and at least one
The position of a semiconductor chip 300 can be configured according to the needs of actual product.
Step S4 provides preformed circuit board 400 (wiring substrate).
Fig. 6 a is the sectional view of circuit board, and Fig. 6 b and Fig. 6 c are the plan view of circuit board.Referring to Fig. 6 a, Fig. 6 b and figure
6c, it is preferable that the size and shape and first substrate 100 of circuit board 400 are identical, in encapsulation process, circuit board 400
The first surface 101 to first substrate 100 will be mounted by adhesive layer with semiconductor chip 300, set on circuit board 400
At least one opening 401 is set, semiconductor chip 300 is arranged in the aperture position in attachment, if there are also other components
It needs to mount by adhesive layer 200 to the first support plate 100, then circuit board 400 is also required for accommodating the opening of these components
402.The disclosure is not intended to limit mounting order, can first mounting semiconductor chips 300 mount adhesive layer 200 again, can also anti-mistake
Come.
In actual encapsulation process, it is possible to which the area of the first support plate 100 is bigger, and the size of circuit board 400
It is smaller, two or more circuit board 400 also can be used and splice on the first support plate 100, spliced size and the
The surface area of one support plate 100 is identical.At least one opening 401 is set on each circuit board 400 for accommodating semiconductor chip
300, it may also set up other openings 402 for other component to be arranged.
For example, it is 900cm*900cm that a block size, which can be used, when the size of first substrate 100 is 900cm*900cm
Circuit board, the circuit board that nine block sizes are 300cm*300cm also can be used, nine pieces of 100cm* also can be used
The circuit board 400 of one piece of 100cm*900cm and four piece of 200cm*900cm also can be used in the circuit board 400 of 900cm.
The selection of circuit board 400 can be determined according to actual needs, be not limited only to cited by the disclosure
Various situations.But several pieces of circuit boards 400 no matter are used, all there is at least one opening 401 to use on every piece of circuit board 400
In receiving semiconductor chip 300.Circuit board 400 shown in Fig. 6 b, upper opening 401 are only used for accommodating semiconductor chip 300,
Circuit board 400 shown in Fig. 6 c, upper opening 401 is for accommodating semiconductor chip 300, and opening 402 is for accommodating other portions
Part.Fig. 6 b and Fig. 6 c are merely exemplary, and the number and shape of opening 401 and 402 need to be set according to the actual conditions of circuit
It sets.
Circuit board 400 may include multiple identical or different base board units, and each base board unit corresponds at least one partly
Conductor chip 300.
Each circuit board 400 includes at least one routing layer (routing layer) 403 and at least one articulamentum
(connection layer)404。
In example as shown in Figure 6 a, circuit board 400 has upper layer and lower layer routing layer 403,404, upper layer and lower layer routing layer
It is connected between 403,404 by articulamentum 405.Preferably, the articulamentum 405 includes that an at least welding column or one are filled with conduction
The via hole of material, the welding column or the both ends for filling via hole are separately connected the routing layer 403,404.It uses the position of opening 401
In setting semiconductor chip 300, be open 402 position for other component to be arranged.
Circuit board 400, which can be used, has product on sale, can also customize production.Have in routing layer 403,404
Wiring pattern (wiring pattern), wiring pattern includes trace (trace) and/or weld pad (pad), if it is customization cloth
Line substrate is then pre-designed wiring pattern according to the cabling requirement of semiconductor chip 300 on circuit board, exists if it is purchase
Sell product, then the wiring pattern on circuit board is standardized design, be typically only capable to using in wiring pattern partial trace and/
Or weld pad.
It may include again at least partly wiring in wiring layer in the circuit board being provided previously, reduce the difficulty of wiring,
The stability of route is increased, while reducing the wiring number of plies, thus reduces encapsulation volume, improves the performance of encapsulation chip；
Further, circuit board is provided previously can test circuit board in advance, can eliminate choosing and have defective encapsulation unit, be marked
Note to filter out the encapsulation unit without defect, and then improves overall package yield.
The front of semiconductor chip 300 is that the conductive electrode for leading to chip surface by chip internal circuits is constituted, weld pad
And/or tie point preparation is on these conductive electrodes.In the encapsulation process to semiconductor chip 300, in order to realize encapsulation knot
The predetermined function of structure, optionally, it is also necessary to be electrically connected to being established between part of solder pads or tie point.Then it needs at least one
Weld pad and/or tie point are drawn out to encapsulation external use and are attached in other circuit elements.This process is semiconductor chip
Wiring process again.
Being routed again for the prior art is completed in the front of semiconductor chip.The disclosure is routed at least partly again in cloth
It is realized on line substrate.
Step S5, will be in the circuit board 400 setting to the first support plate 100.
Fig. 7 shows the setting of circuit board 400 to the sectional view after the first support plate 100.In the step, by
Preformed alignment mark (label is being not shown in the figure) on first support plate 100 and circuit board 400, by circuit board
400 are registered on the first support plate 100, are pasted circuit board 400 on first support plate 100 by adhesive layer 200.
Due to having pasted semiconductor chip 300 on adhesive layer 200, thus continue paste circuit board 400 when
It waits, it is ensured that circuit board 400 is not exposed to semiconductor chip 300, as shown in Fig. 7, on circuit board 400 in advance
Opening 401 is formed, which can accommodate semiconductor chip 300, the corresponding wiring of each semiconductor chip 300
The opening 401 of substrate 400 is aligned.Alternatively, it is also possible to first mount circuit board 400, then mounting semiconductor chips 300 again.
In order to which more easily by the attachment to the first support plate 100 of circuit board 400, a temporary support plate can be provided,
It is formed on its surface an adhesive layer, circuit board 400 is mounted by way of stickup onto a temporary support plate, is being installed
In the process, by the one of circuit board 400 facing towards the upper surface of the first support plate 100, due to the surface area of temporary support plate and
The surface area of one support plate 100 is identical, and shape is also identical, and the two is aligned and is contacted, and can mount circuit board 400 and arrive adhesive layer
200, then temporary support plate is removed, and remove the adhesive layer on circuit board 400, that is, completes the patch of circuit board 400
Dress.
Temporary support plate and temporary bond layer can be identical as the material of the first support plate 100 and adhesive layer 200.In addition, facing
When support plate be also possible to glass plate, temporary bond layer is also possible to ultraviolet light adhesive layer, just loses when being exposed to ultraviolet light
Viscosity may make temporary support plate to remove.
As described above, it is to mount circuit board 400 first to temporary support plate, is then then transferred to the first load
Plate 100.
It goes forward side by side alternatively, it is also possible to use vacuum tool the first support plate 100 will to be installed to after the absorption of circuit board 400 (hold)
Row pressing, to guarantee that attachment is intact.
Step S6 forms encapsulated layer 500 (Encapsulation layer) on the first support plate 100.
Fig. 8 shows the sectional view after increasing encapsulated layer 500 on the first support plate 100.Forming encapsulated layer 500
When, encapsulating material is filled with the opening on circuit board 400, at least one semiconductor chip 300 and circuit board is sealed
400.As seen from Figure 8, encapsulated layer 500 encloses the upper table at the back side of at least one semiconductor chip 300, circuit board 400
Gap between face and circuit board 400 and semiconductor chip 300, upper surface are a planes.Encapsulated layer 500 has upper
Surface 501.
Lamination (Lamination) epoxy resin film or ABF (Ajinomoto buildup can be used in encapsulated layer 500
Film mode) is formed, can also be by carrying out injection molding (Injection molding), pressure to epoxy resin compound
The mode of mold forming (Compression molding) or transfer formation (Transfer molding) is formed.Encapsulated layer 500 wraps
Include the first surface 501 opposite with the first support plate (upper surface shown in Fig. 10), substantially be in tabular, and with the first support plate 100
Surface it is parallel.
Step S7 thins the first surface 501 of encapsulated layer 500.
In order to reduce the thickness of the product after the completion of last encapsulation, need to thin encapsulated layer 500, it can be by first
Surface 501 carries out mechanical lapping or polishing to be thinned, and Fig. 9 a is the schematic diagram for thinning encapsulated layer 500, and Fig. 9 b is to thin encapsulated layer
Structure chart after 500.The thickness of encapsulated layer 500 can be thinned to the upper surface of circuit board 400, thus exposure circuit board
400 trace and weld pad (the traces and pads).It thins at this and does not damage circuit board in step as far as possible, this is just
Needing circuit board is formed by triturable material, to expose wiring pattern (wiring on the surface of circuit board
Pattern), although wiring pattern can be thinned partially, its performance is not influenced.The example according to shown in figure is routed base
The upper layer routing layer 404 of plate 400 has the wiring pattern formed by trace and weld pad, thins the property that step does not damage the wiring pattern
Energy.Circuit board described in figure has two layers of routing layer, lower layer 403 and upper layer 404.
Step S8 removes the first support plate 100 from encapsulated layer 500.
Fig. 9 c shows the schematic diagram that the first support plate 100 is removed from encapsulated layer 500, after removing the first support plate 100, exposes half
The lower surface in the front 301 of conductor chip 300, the lower surface 502 of encapsulated layer 500 and circuit board 400.It, can in the step
Mechanically directly the one the first support plate 100 of removing, but it is easily damaged encapsulated layer 500, it is preferred that adhesive layer 200 is heat point
From material, by way of heating, so that thermal release material on adhesive layer 200 is reducing viscosity after heated, and then the is removed
One support plate 100, will not damage encapsulated layer 500.
Step S9 forms wire structures again.
Figure 11-16 shows the schematic diagram that wire structures are formed again after removing the first support plate 100.
Figure 10 is according to the flow chart for forming again wire structures in disclosure semiconductor chip packaging method；Such as Figure 10 institute
Show, step S9 further comprises:
Step S901 forms the first insulating layer 600.
Referring to Fig.1 1, after removing the first support plate 100, position where the first support plate 100, that is, semiconductor chip
The first insulating layer 600 is formed on the lower surface in 300 front, circuit board 100 and encapsulated layer 500.Figure 11 is to form first
Sectional view after insulating layer 600.The insulating layer 600 covers the front of semiconductor chip 300, circuit board 100 and encapsulating
The lower surface of layer 500.First insulating layer 600 is by coating paste (coating paste), or injection liquid
The modes such as (spraying (fluid)) or laminated film (lamination film) formed, it is preferable to use material can be
ABF (Ajinomoto Buildup Film) insulating film, polyimides (polyimide) or lead monoxide (PBO).First absolutely
Edge layer 600 needs to be securely adhered to whole surface, and lower surface that circuit board 400 is completely covered, semiconductor chip 300 are just
The lower surface in face and encapsulated layer 500 preferably carries out curing process (curing to it after being provided with the first insulating layer 600 again
Process), such as it can be used high temperature or ultraviolet curing.
Formed insulating layer 600, effect be protect semiconductor chip 300 front and circuit board 400 surface,
Also even curface is provided for subsequent technique.
Step S902 forms at least one opening 601 on the first insulating layer 600.
As shown in figure 12, at least one opening 601 is set on the first insulating layer 600.Opening 601 is used for semiconductor
The positive weld pad coiling of chip 300 to circuit board 400 routing layer 403, and facilitate realize weld pad between circuit connection.Cause
This, the position of at least one opening 601 is arranged in position corresponding at least one the positive weld pad of semiconductor chip 300, and/
Or position corresponding at least one trace (trace) and/or weld pad of routing layer 403 is set.
It can will be in 300 positive weld pad coiling to the routing layer 403 of circuit substrate 400 of semiconductor chip by opening 601
Trace and/or weld pad, semiconductor chip can be realized as by the wiring pattern (wiring pattern) in routing layer 403
300 wiring.
The disclosure without limitation, can be round, ellipse or line style etc. to the shape of opening 601.It can be by using covering
The mode needle drawing first of mould photolithographic exposure (photolithography using mask exposureto pattern) is insulated
Layer 600 is formed simultaneously at least one opening 601, and the material of the first insulating layer 600 is light-sensitive material in this case.Can also it lead to
Laser direct imaging is crossed, using laser irradiation come first insulating layer 600 of needle drawing, each opening 601 is sequentially formed and (once forms one
A opening, sequentially forms), the material of the first insulating layer 600 is laser reactive (laser-reactive) material in this case
Material.
Step S903 is filled via hole (filled vias) 602 and graphical route by forming at least one
(patterned traces) 603 completes wiring.
In order to realize the wiring for completing semiconductor chip 300 by circuit board 400, then need semiconductor chip 300
In positive weld pad coiling to the corresponding trace of circuit board 400 and/or weld pad, that is, will be on the first insulating layer 600 and partly
The corresponding opening 601 of the weld pad of conductor chip 300 is electrically connected to opening corresponding with the trace of circuit board 400 and/or weld pad
601。
Therefore in step 903, as shown in figure 13, conductive material (such as copper) is filled into the first insulating layer 600 first
It in opening 601, needs to be filled up completely, is filled via hole 602 to be formed, such as photoetching and semi-additive electroplating technology can be used
(semi-additive electrolytic plating process) realizes filling.These are filled via hole 602 physically
It is electrically connected to the weld pad of semiconductor chip 300 and trace/weld pad of circuit board 400.Then need are designed according to actual circuit
It wants, the via hole 602 that is filled for needing to be electrically connected is electrically connected on the surface of the first insulating layer 600 by conductive material formation
It connects, to form graphical route 603 on the surface of the first insulating layer 600.The form of graphical route 603 shown in Figure 13 is only
It is exemplary, concrete form needs carry out its circuit according to the concrete function to be realized of packaged semiconductor chip and set
Meter, and it is not limited only to situation shown in Figure 13.
It may be implemented in this way but be not limited to for example following several situations: semiconductor chip front phase in need
First and second be mutually electrically connected are filled via hole, and 403 corresponding position of routing layer is provided with third and fourth and is filled via hole, the
Three and the 4th is filled via hole is electrically connected by the trace in routing layer 403, can be by utilizing figure in the first surface of insulating layer
Change route and by first be filled via hole and be electrically connected to third and be filled via hole, is filled via hole for second and is electrically connected to third and filled out
Via hole is filled, to realize the first and second electrical connections being filled between via hole, will be needed in the prior art in semiconductor chip
Being routed again for front completion has been transferred on circuit board.
In the disclosure, the corresponding via hole that is filled of semiconductor chip 300 can all be electrically connected to the correspondence of circuit board 400
Be filled via hole, can also partially connect, when part connect when, semiconductor chip 300 front can also complete
Part is routed again.
First insulating layer 600 can be handled by chemical method to further increase the attachment with graphical route 603
Power, be especially in contact with graphical route 603 those exposure surface to be handled by chemical method with further increase with
The adhesive force of graphical route 603.
Step S904 forms weld pad or pillar 604 and second insulating layer 605 on graphical route 603.
It needs to draw at least one weld pad after completing the wiring of semiconductor chip 300 according to step S904, with
It is convenient to be attached with other circuit elements.
As shown in figure 14, at least one weld pad is formed by way of photoetching or plating on the graphical route 603
Or pillar 604, the weld pad or pillar 604 are made of conductive material (such as metal), cross sectional shape is preferably circular, can also
To be other shapes, such as rectangle or square etc., shape and size can be configured according to the actual situation, the disclosure pair
This is with no restriction.The weld pad or pillar 604 and the graphical route 603 carry out physical electrical connection.
Second insulating layer 605 is formed on the first insulating layer 600, second insulating layer 605 encapsulates graphical route completely
603, and thickness can encapsulate the surrounding of weld pad or pillar 604, the surface exposure of weld pad or pillar 604, to facilitate and other electricity
Road is electrically connected.Can by coat paste (coating paste), or injection liquid (spraying (fluid)) or
The modes such as person's laminated film (lamination film) form second insulating layer, and it is preferable to use identical as the first insulating layer 600
Material, such as ABF (Ajinomoto Buildup Film) insulating film, polyimides (polyimide) or lead monoxide
(PBO)。
If second insulating layer 605 is the last layer, other materials may be used, such as welding compound or epoxy form chemical combination
Object (soldermask or epoxy molding compound), preferably progress curing process, such as high temperature or purple can be used
Outside line solidification.
Example shown in figure 15 is formd by the first insulating layer 600, opening 601, the via hole 602 and figure being filled
Change the first wiring layer again that track 603 is formed.But the disclosure is not limited thereto, and according to practical wiring needs, can also be arranged
Second again wiring layer, third again wiring layer ..., N wiring layer again, each the setting of wiring layer is routed again with first again
Layer is similar, for example, wiring layer includes: the side identical with the first insulating layer 600 is formed on the first insulating layer 600 again for formation second
Formula forms second insulating layer, and graphical route 603 is sealed in second insulating layer, over the second dielectric with graphical route 603
Corresponding position forms at least one second opening, is filled to form second and be filled to the second opening using conductive material
Hole is filled via hole to described second and is electrically connected formation second graphical route over the second dielectric, in second graph
Change and form at least one second weld pad or pillar on route, forms third insulating layer over the second dielectric and insulate as outermost layer
Layer, third insulating layer encapsulate the surrounding of second graphical route and the second weld pad or pillar, the table of the second weld pad of exposure or pillar
Face.
Can equally be formed using similar method third again wiring layer ..., N wiring layer again.
After forming the required amount of wiring layer again, outermost layer insulating is re-formed, to complete the encapsulating structure.
Package assembly is divided at least one encapsulation unit by step S10.
Preforming circuit board is first provided, then carries out wiring technique again on chip, due to including on circuit board
The wiring pattern of part wiring layer again, can effectively reduce the probability of wafer damage.
In the step, as shown in figure 17, along cut-off rule 607, is cut, will be assembled by laser or mechanical system
For segmentation of structures at least one encapsulation unit, each encapsulation unit includes at least one semiconductor chip 300.Figure 18 b is shown
The sectional view of encapsulation unit after cutting, wherein the structure of 18b has dielectric layers.
Figure 19 shows the schematic diagram of encapsulation unit when in use, passes through solder 700 in use for encapsulation unit
Upper conductive welding pad or pillar 604 are welded on 800 on substrate or circuit board, are then attached with other circuit original parts.
Referring to the disclosure attached drawing description example, circuit board 400 include routing layer 403,404, routing layer 403,404 it
Between pass through articulamentum connect.The graphical route formed by trace and/weld pad is distributed in routing layer 403,404 individually.
Figure 20 and Figure 21 shows the stack package structure suitable for the disclosure.Encapsulating structure unit as shown in figure 20
10, when the exposure of the top surface of circuit board 400, actively and/or passively element 405 can be connected to circuit board 400
Graphical route in routing layer 404.Second encapsulation unit, can also be attached to by the encapsulating structure unit 10 " as shown in Figure 21
The stacked package that encapsulation unit is realized in the routing layer 404 of the circuit board 400 of first encapsulation unit, can pass through solder 406
Adhered to
The semiconductor chip package that the disclosure proposes is obtained by the above method.
Figure 18 a shows the semiconductor chip package according to one embodiment of the disclosure.8a referring to Fig.1, the semiconductor
Chip-packaging structure includes: semiconductor chip 300, and front is led to the conductive electrode structure of chip surface by chip internal circuits
At being prepared with weld pad or tie point on the conductive electrode；Circuit board 400 has by least one trace and/or weld pad
The wiring pattern of composition；Encapsulated layer 500, for the semiconductor chip 300 and the circuit board 400 to be sealed.
It is formed on the front of the lower surface of encapsulated layer 500, the lower surface of circuit board 400 and semiconductor chip 300
There are wire structures again.Wire structures for being routed semiconductor chip again again, at least part of the wire structures again
It is distributed on circuit board.
In embodiment as shown in figure 18 a, then wire structures have a wiring layer, i.e. the first wiring layer, described first
Wiring layer includes the first insulating layer 600, is provided at least one first opening 601 on first insulating layer 600, and described the
The position of one opening is corresponding at least one positive weld pad of the semiconductor chip 300, and at least with circuit board 400
One trace and/or weld pad are corresponding, are filled at least one described first opening filled with conductive material and as first
Via hole 602 has be used to for two or more first being filled by what conductive material was formed on the first insulating layer
The first graphical route 603 that hole is electrically connected.It include at least one conductive pillar on the first graphical route 603.
The wire structures include second insulating layer 605, and the second insulating layer encapsulates first wiring layer and conductive pillar, cruelly
Reveal the surface of the conductive pillar.In this embodiment, second insulating layer is outermost layer.
The wiring layer of the disclosure is not limited to one layer, can sequentially form N wiring layer, N on first wiring layer
More than or equal to 2, N wiring layer includes N insulating layer, N is open, N is filled via hole, the graphical route of N, when N cloth
It include at least one conductive pillar when line layer is last wiring layer, on the graphical route of N, the wire structures further include N+
1 insulating layer, the N+1 insulating layer encapsulate the N wiring layer and conductive pillar, the surface of the exposure conductive pillar.
The generation type of N wiring layer is similar to the first wiring layer.
Figure 16 shows the case where N is 2, there is two layers of wiring layer, and third insulating layer 606 is outermost layer insulating.
The circuit board 400 includes at least one routing layer 403, includes at least one at least one described routing layer
The wiring pattern that trace and/or weld pad are constituted.In a further embodiment, if the circuit board 400 includes two layers or more
Routing layer 403,404, the circuit board further includes at least one articulamentum 405, described two layers or more of routing layer
It is connected with each other between 403,404 by least one described articulamentum.Preferably, the articulamentum includes an at least welding column or one
It is filled with the via hole of conductive material, the welding column or the both ends for filling via hole are separately connected routing different in the circuit board
Layer.
According to the another further aspect of the disclosure, it is also proposed that a kind of stack type chip packaging structure, comprising: the first chip package
Structure；At least one second chip-packaging structure, second chip-packaging structure include packaged chip and for drawing
The wire structures again of the weld pad of the chip front side out；Wherein, the wire bond again of at least one second chip-packaging structure
Structure is electrically connected with the articulamentum of the circuit board of the first chip-packaging structure described at least one.Second chip-packaging structure
Wire structures again include again wiring layer and conductive pillar, the conduction pillar for will again wiring layer from chip-packaging structure
Draw, it is described conduction pillar on the articulamentum of the circuit board of first chip-packaging structure weld pad or tie point be electrically connected
It connects.First chip-packaging structure and second encapsulating structure can be prepared using method described above.
The semiconductor package of the disclosure can be prepared by the method for packaging semiconductor of foregoing description, herein not
Specific stroke is repeated again.But the disclosure is not limited thereto, by be different from disclosed method be prepared in this
The identical semiconductor package of disclosed structure belongs to the protection scope of the disclosure.
Particular embodiments described above has carried out further in detail the purpose of the disclosure, technical scheme and beneficial effects
Describe in detail bright, it should be understood that the foregoing is merely the specific embodiment of the disclosure, be not limited to the disclosure, it is all
Within the spirit and principle of the disclosure, any modification, equivalent substitution, improvement and etc. done should be included in the protection of the disclosure
Within the scope of.
Claims (14)
1. a kind of semiconductor chip package comprising semiconductor chip, it is characterised in that the semiconductor chip packaging knot
Structure further include: circuit board has the wiring pattern being made of at least one trace and/or weld pad；Wire structures again are used for
The positive weld pad of the semiconductor chip is drawn, at least part of the wire structures again is distributed on the circuit board；
Encapsulating structure, for encapsulating the semiconductor chip, circuit board and wire structures again.
2. semiconductor chip package according to claim 1, which is characterized in that the circuit board includes at least one
Layer routing layer, has the wiring pattern being made of at least one trace and/or weld pad in every layer of routing layer.
3. semiconductor chip package according to claim 2, which is characterized in that between different routing layer by by
The articulamentum connection that conductive material is formed.
4. semiconductor chip package according to claim 3, which is characterized in that the articulamentum includes at least one
Welding column, the welding column correspond to the position of trace and/or weld pad in two layers of routing layer of its connection.
5. semiconductor chip package according to claim 4, it is characterised in that: the circuit board includes at least one
A opening, the opening is for accommodating the semiconductor chip.
6. semiconductor chip package according to claim 5, which is characterized in that the wire structures again include at least
One wiring layer.
7. semiconductor chip package according to claim 6, which is characterized in that the wiring layer is formed in described half
The surface of one routing layer in the front and circuit board of conductor chip.
8. semiconductor chip package according to claim 7, which is characterized in that the wiring layer includes the first wiring
Layer, first wiring layer include lower surface and positive first insulation of the semiconductor chip for being formed in the circuit board
Layer is provided at least one first opening, the position of first opening and the semiconductor core on the first insulating layer
Positive at least one weld pad of piece is corresponding, and corresponding at least one trace of a routing layer and/or weld pad, it is described extremely
Be formed as the first via hole being filled filled with conductive material in few one first opening, formed on the first insulating layer
Have by conductive material formed for two or more first to be filled the first graphical route that via hole is electrically connected.
9. semiconductor chip package according to claim 8, which is characterized in that the wiring layer is routed including N
Layer, the N wiring layer include N insulating layer, and it is graphical that at least one N is open, at least one N is filled via hole, N
Route, the corresponding graphical route of N-1 in position of at least one N opening, N are more than or equal to 2.
10. semiconductor chip package according to claim 9, which is characterized in that in the figure of the last layer wiring layer
Include at least one conductive pillar on shape track, the encapsulating structure includes outermost insulating layer, for encapsulate it is described last
Layer wiring layer and the conductive pillar, the surface of the exposure conductive pillar.
11. semiconductor chip package according to claim 10, it is characterised in that: the encapsulating structure further includes packet
Sealing, for encapsulating the back side of the semiconductor chip and/or the upper surface of circuit board, the upper surface of circuit board is all the way
By the upper surface of layer.
12. semiconductor chip package according to claim 11, it is characterised in that: the wiring diagram of a routing layer
Shape is exposed to outside the encapsulated layer.
13. a kind of semiconductor chip package, comprising:
At least one is such as the described in any item chip-packaging structures of claim 1-12；
At least one second chip-packaging structure, second chip-packaging structure include packaged chip and for drawing
The wire structures again of the weld pad of the chip front side；Wherein,
The wire structures again of at least one second chip-packaging structure and at least one such as any one of claim 1-12 institute
The articulamentum of the circuit board for the chip-packaging structure stated is electrically connected.
14. semiconductor chip package as claimed in claim 13, wherein second chip-packaging structure is such as right
It is required that the described in any item chip-packaging structures of 1-12.
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| CN111952190B (en) * | 2019-05-16 | 2022-07-01 | 矽磐微电子(重庆)有限公司 | Semiconductor packaging method |
| CN110211888A (en) * | 2019-06-14 | 2019-09-06 | 上海先方半导体有限公司 | A kind of embedded fan-out packaging structure and its manufacturing method |
| CN113161249A (en) * | 2021-03-31 | 2021-07-23 | 矽磐微电子(重庆)有限公司 | Semiconductor packaging method and semiconductor packaging structure |
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| CN102612265B (en) * | 2007-11-01 | 2016-05-11 | 大日本印刷株式会社 | The manufacture method of built-in element circuit board, built-in element circuit board |
| KR101297015B1 (en) * | 2011-11-03 | 2013-08-14 | 주식회사 네패스 | Method of manufacturing fan-out semiconductor package using lead frame, semiconductor package thereof, and package on package thereof |
| CN106816416B (en) * | 2015-11-27 | 2020-02-14 | 蔡亲佳 | Semiconductor embedded hybrid packaging structure and manufacturing method thereof |
| CN107123601B (en) * | 2017-05-27 | 2020-03-17 | 华进半导体封装先导技术研发中心有限公司 | High-heat-dissipation device packaging structure and board-level manufacturing method |
| CN109509727B (en) * | 2017-09-15 | 2023-01-31 | Pep创新私人有限公司 | Semiconductor chip packaging method and packaging structure |
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| CN109509727A (en) * | 2017-09-15 | 2019-03-22 | Pep创新私人有限公司 | A kind of semiconductor chip packaging method and encapsulating structure |
| CN109509727B (en) * | 2017-09-15 | 2023-01-31 | Pep创新私人有限公司 | Semiconductor chip packaging method and packaging structure |
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| CN109509727A (en) | 2019-03-22 |
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