CN209044627U - Anti-aliasing image-forming component, optical sensor and electronic equipment - Google Patents
Anti-aliasing image-forming component, optical sensor and electronic equipment Download PDFInfo
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- CN209044627U CN209044627U CN201790000314.9U CN201790000314U CN209044627U CN 209044627 U CN209044627 U CN 209044627U CN 201790000314 U CN201790000314 U CN 201790000314U CN 209044627 U CN209044627 U CN 209044627U
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/04—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres
- G02B6/06—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings formed by bundles of fibres the relative position of the fibres being the same at both ends, e.g. for transporting images
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/10—Image acquisition
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- Theoretical Computer Science (AREA)
- Optics & Photonics (AREA)
- Image Input (AREA)
Abstract
The utility model discloses a kind of anti-aliasing image-forming component, optical sensor and electronic equipment.The anti-aliasing image-forming component includes multiple optical transmission fibers, and the optical transmission fiber includes light penetrating object and the non-transmissive layer positioned at the light penetrating object periphery.The optical sensor includes photosensitive unit and the anti-aliasing image-forming component on photosensitive unit.The electronic equipment includes the optical sensor.
Description
Technical field
The utility model relates to photoelectric sensing field more particularly to a kind of anti-aliasing image-forming component, optical sensor and
Electronic equipment.
Background technique
Currently, biometric information sensor, especially fingerprint identification device, have been increasingly becoming the electronic products such as mobile terminal
Standard configuration component.Since optical fingerprint identification device specific capacitance formula fingerprint identification device has stronger penetration capacity, because of this person
More consider by optical fingerprint identification device be applied to mobile terminal.But existing optical fingerprint identification device
When applied to mobile terminal, clear, accurate fingerprint image can not be obtained, needs to improve.
Utility model content
The utility model embodiment aims to solve at least one of the technical problems existing in the prior art.For this purpose, this reality
Need to provide a kind of anti-aliasing image-forming component, optical sensor and electronic equipment with novel embodiment.
The utility model embodiment provides a kind of anti-aliasing image-forming component, including multiple optical transmission fibers, and the light passes
Defeated fiber includes light penetrating object and the non-transmissive layer positioned at the light penetrating object periphery.
Compared with the existing technology, not only structure is simple for the anti-aliasing image-forming component of the utility model embodiment, prepares work
Skill cost reduces, so that the collected biological information of optical sensor is more clear, accurately.
In some embodiments, the non-transmissive layer is formed by coating non-transparent material in the light penetrating object periphery.
In some embodiments, pass through the solidification glue bond of non-transparent material between the multiple optical transmission fiber.
In some embodiments, there is gap between the multiple optical transmission fiber, and the gap filling have it is described
The solidification glue of non-transparent material.
In some embodiments, the gap is realized by vacuum glue pouring and is filled.
In some embodiments, the optical transmission fiber forms the light penetrating object by carrying out wire drawing to an optical wand, and
Non-transparent material is coated in the light penetrating object periphery in drawing process to form.
In some embodiments, the cross section of the light penetrating object is circle.
In some embodiments, the cross-sectional diameter of the light penetrating object is 5~50um.
In some embodiments, the aperture opening ratio of the anti-aliasing image-forming component is greater than or equal to 30%.
In some embodiments, the aperture opening ratio of the anti-aliasing image-forming component is greater than or equal to 50%.
In some embodiments, the light penetrating object includes quartz, glass, plastics, infrared one or more materials.
In some embodiments, an end face of the optical transmission fiber is light incident surface, and other end is light-emitting face.
In some embodiments, it will reflect, and work as from the optical signal that the light incident surface enters the light penetrating object
When optical signal after refraction is mapped to the side of the light penetrating object, absorbed by the non-transmissive layer.
The utility model embodiment provides a kind of optical sensor, including substrate, is arranged over the substrate
Photosensitive unit, the anti-aliasing image-forming component on the photosensitive unit, the anti-aliasing image-forming component be it is above-mentioned any one
The anti-aliasing image-forming component of embodiment.
The utility model embodiment optical sensor is due to the anti-aliasing imaging using above-mentioned any one embodiment
Element, so that the collected biological information of optical sensor is more clear, accurately, and the anti-aliasing image-forming component phase
For the prior art, not only structure is simple, and preparation process cost reduces, but also.
In some embodiments, the length of light penetrating object axial section and the ratio of diameter are greater than in the anti-aliasing image-forming component
Or it is equal to 5, and be less than or equal to 50.
In some embodiments, each photosensitive unit corresponds to multiple optical transmission fibers.
In some embodiments, the axis of optical transmission fiber and the substrate transverse in the anti-aliasing image-forming component.
In some embodiments, the optical sensor is used to acquire the biological characteristic of object above the sensor
Information.
In some embodiments, the biological information includes that fingerprint, palmmprint, vein, blood pressure, heart rate, blood oxygen are dense
The one or more of degree.
The utility model embodiment provides a kind of electronic equipment, the optical profile type sensing including above-mentioned any one embodiment
Device.
In some embodiments, the electronic equipment includes display screen, and the optical sensor is set to display screen
Lower section, and be located in the display area of display screen.
Since the electronic equipment has the optical sensor of any of the above-described embodiment, there is optical profile type sensing
All beneficial effects that device has.In addition, the optical sensor may be disposed at below the display screen of electronic equipment, not only realize
Front obtains the biological information of target object from electronic equipment, so that the positive screen accounting of electronic equipment can
With sufficiently large, be conducive to electronic equipment and develop towards the direction of full screen display.
The additional aspect and advantage of the utility model embodiment will be set forth in part in the description, partially will be under
Become obvious in the description in face, or is recognized by the practice of the utility model embodiment.
Detailed description of the invention
The above-mentioned and/or additional aspect and advantage of the utility model embodiment are from combination following accompanying drawings to embodiment
Description in will be apparent and be readily appreciated that, in which:
Fig. 1 is a kind of structural schematic diagram of existing optical fingerprint sensor；
Fig. 2 is the structural schematic diagram that a photosensitive unit of optical fingerprint sensor is correspondingly arranged the axial section of optical fiber；
Fig. 3 is the cross section structure schematic diagram of the anti-aliasing image-forming component of one embodiment of the utility model；
Fig. 4 is an optical transmission fiber and a photosensitive unit in the optical sensor of one embodiment of the utility model
Axial section structural schematic diagram；
Fig. 5 a is a kind of optical signal schematic diagram of an optical transmission fiber in the anti-aliasing image-forming component of Fig. 3；
Fig. 5 b is another optical signal schematic diagram of an optical transmission fiber in the anti-aliasing image-forming component of Fig. 3；
Fig. 6 is the preparation flow schematic diagram of optical transmission fiber in one embodiment of the utility model；
Fig. 7 is the flow diagram of the preparation method of the anti-aliasing image-forming component of one embodiment of the utility model；
Fig. 8 a is a kind of arrangement architecture of optical transmission fiber in the anti-aliasing image-forming component of one embodiment of the utility model
Schematic diagram；
Fig. 8 b is another arrangement knot of optical transmission fiber in the anti-aliasing image-forming component of one embodiment of the utility model
Structure schematic diagram；
Fig. 9 is the flow diagram of the preparation method of the anti-aliasing image-forming component of another embodiment of the utility model；
Figure 10 is the schematic diagram of the section structure of the optical sensor of one embodiment of the utility model；
Figure 11 is the structure of the optical sensor of the another embodiment of the utility model；
Figure 12 is the electrical block diagram of the optical sensor of another embodiment of the utility model；
Figure 13 is a kind of concrete structure schematic diagram of a photosensitive unit in Figure 12；
Figure 14 is another concrete structure schematic diagram of a photosensitive unit in Figure 12；
Figure 15 is the flow diagram of the preparation method of the optical sensor of one embodiment of the utility model；
Figure 16 is the flow diagram of the preparation method of the optical sensor of another embodiment of the utility model；
Figure 17 is the positive structure schematic of the wafer of one embodiment of the utility model；
Figure 18 is the positive structure schematic of the electronic equipment of one embodiment of the utility model；
Figure 19 be in Figure 18 electronic equipment along the schematic diagram of the section structure of I-I line.
Specific embodiment
The embodiments of the present invention is described below in detail, the example of the embodiment is shown in the accompanying drawings, wherein
Same or similar label indicates same or similar element or element with the same or similar functions from beginning to end.Lead to below
It crosses the embodiment being described with reference to the drawings to be exemplary, is only used for explaining the utility model, and should not be understood as practical to this
Novel limitation.
In the description of the present invention, it should be understood that term " first ", " second " are used for description purposes only, and
It cannot be understood as indicating or implying relative importance or implicitly indicate the quantity of indicated technical characteristic.It defines as a result,
The feature of " first ", " second " can explicitly or implicitly include one or more feature.In the utility model
Description in, the meaning of " plurality " is two or more, unless otherwise specifically defined." contact " or " touch " packet
Include directly contact or mediate contact.For example, the optical sensor hereinafter disclosed, is arranged on the inside of electronic equipment,
Such as the lower section of display screen, then user's finger passes through cover sheet and the display screen mediate contact optical sensor.
In the description of the present invention, it should be noted that unless otherwise clearly defined and limited, term " is pacified
Dress ", " connected ", " connection " shall be understood in a broad sense, for example, it may be being fixedly connected, may be a detachable connection, or integrally
Connection；It can be mechanical connection, be also possible to be electrically connected or can be in communication with each other；It can be directly connected, it can also be in
Between medium be indirectly connected, can be the connection inside two elements or the interaction relationship of two elements.For this field
For those of ordinary skill, the concrete meaning of above-mentioned term in the present invention can be understood as the case may be.
Following disclosure provides many different embodiments or example is used to realize the different structure of the utility model.
In order to simplify the disclosure of the utility model, hereinafter to the component of specific examples and being set for describing.Certainly, they are only
Example, and purpose does not lie in limitation the utility model.In addition, the utility model can in different examples repeat reference numerals
And/or reference letter, this repetition are for purposes of simplicity and clarity, itself not indicate discussed various embodiments
And/or the relationship between setting.In addition, the example of various specific techniques and material that the utility model provides, but this
Field those of ordinary skill can be appreciated that the application of other techniques and/or the use of other materials.
Further, described feature, structure can be incorporated in one or more embodiment party in any suitable manner
In formula.In the following description, many details are provided to provide and fully understand to the embodiments of the present invention.
However, one of ordinary skill in the art would recognize that, without one or more in the specific detail, or using other knots
Structure, constituent element etc. can also practice the technical solution of the utility model.In other cases, it is not shown in detail or describes known knot
Structure or operation are to avoid fuzzy the utility model.
Referring to Fig.1, Fig. 1 is a kind of structural schematic diagram of existing optical fingerprint sensor.A kind of existing optical profile type
Fingerprint sensor identification for electronic equipment, the optical fingerprint sensor 200 are located at the display screen 100 of electronic equipment
Lower section, and be at least partially disposed in the display area of display screen 100.Optical fingerprint sensor 200 includes multiple is arranged
Photosensitive unit 210.When some position (for example, human finger) of object is placed on display screen 100, display screen 100 is sent out
After optical signal out reaches finger, part optical signals are then reflected by finger, part optical signals；Reflected light letter
Optical fingerprint sensor 200 is reached after number passing through display screen 100, the photosensitive unit 210 of optical fingerprint sensor 200 receives
The reflected light signal, and the optical signal received is converted into corresponding electric signal, to be obtained according to the electric signal after the conversion
Obtain the biological information of object.Here biological information for example, fingerprint, palmmprint, vein, blood pressure, heart rate, blood oxygen
The one or more of concentration.Object is such as, but not limited to human body, or the organism of other suitable types.
Since the biological information of object is the intrinsic physiological characteristic of human body, the biological information of object will be made
For the important evidence of object identification, whether user's identity for judging electronic equipment is legal, and then controls electronics and set
It is standby to carry out corresponding operation, such as unlock operation, check data, mobile payment etc..
The electronic equipment referred in the utility model embodiment for example but is not limited to consumer electrical product, household formula
The electronic product of the suitable types such as electronic product, vehicular electronic product, financial terminal product.Wherein, consumer electrical product
For example, mobile phone, tablet computer, laptop, tabletop display, computer all-in-one machine etc..Household formula electronic product is, for example, intelligence
Energy door lock, TV, refrigerator, wearable device etc..Vehicular electronic product is, for example, automatic navigator, vehicle-carrying DVD etc..It is financial whole
Hold product for example ATM machine, the terminal of self-service transacting business etc..
It should be noted that if optical fingerprint sensor further includes light source, then when the optical fingerprint working sensor,
The display screen of electronic equipment can not work.In this way, being not limited to the electronic equipment of the optical fingerprint sensor application
Display screen structure further includes the electronic product without display screen.
Further, since optical signal is after the object reflection of 100 top of display screen, reflected light signal is more and random, then
In addition the spacing between photosensitive unit 210 is very small, therefore the optical signal of the object reflection of 210 top of photosensitive unit may be by
Neighbouring photosensitive unit 210 receives, thus the biological information inaccuracy for causing optical fingerprint sensor 200 to obtain, no
Clearly.In this regard, it has been proposed that solving the problems, such as this using optical fiber structure.As shown in Fig. 2, Fig. 2 is optical fingerprint sensor
One photosensitive unit is correspondingly arranged the structural schematic diagram of the axial section of optical fiber.Optical fiber 220, the light are set on photosensitive unit 210
Fibre 220 includes successively from inside to outside optically denser medium layer 221 and optically thinner medium layer 222, plastic coating 223, optically denser medium layer 221 are
The biggish dielectric layer of refractive index, optically thinner medium layer 222 are that the lesser dielectric layer of refractive index, thus optically denser medium layer 221 and light are dredged
Critical surface L is formed between dielectric layer 222.Due to the refringence of the two sides critical surface L, so that incidence of the optical signal from optical fiber 220
When face S1 enters, only a certain range of optical signal can be totally reflected in critical surface L, until penetrating from the exit facet S2 of optical fiber
Out.Assuming that critical angle when optical fiber is totally reflected is θ, then enter the incidence angle maximum value β of optical fiber plane of incidence S1maxCalculating
Formula is as follows:
Wherein, n0It is the refractive index in air, n1It is the refractive index of optically denser medium layer 221, n2It is optically thinner medium layer 222
Refractive index.Since the refractive index in air is 1, substantial incidence angle maximum value βmaxIt only dredges and is situated between with optically denser medium layer 221 and light
The refractive index of matter layer 222 is related.From the above equation, we can see that incidence angle is less than or equal to incidence angle maximum value βmaxOptical signal can be
Critical surface L is totally reflected, and is projected from the exit facet S2 of optical fiber.
It is found after utility model people research, although above-mentioned optical fiber structure is avoided that greater than incidence angle maximum value βmaxLight
Signal reaches photosensitive unit 210, but the collected biological information of optical fingerprint sensor is still not clear enough, analysis
It is found there are two main causes afterwards: first, the incidence angle maximum value β of optical fiber structuremaxInterference that is excessive, still having part neighbouring
Signal reduces the incidence angle maximum value β of optical fiber structure by changing the refractive index of fiber medium layermaxAlthough optical profile type can be made
Fingerprint sensor collects clearly biological information, but the preparation process cost of the optical fiber structure is also increase accordingly；Its
Two, it is greater than incidence angle maximum value βmaxOptical signal enter optical fiber, by the refraction of optically denser medium layer 221 and optically thinner medium layer 222
Afterwards, it will be reflected on critical surface of the optically thinner medium layer 222 with plastic coating 223, the optical signal after reflection will reenter
Optically denser medium layer 221, and projected from the exit facet S2 of optical fiber.
Therefore, utility model people proposes a kind of new structure, i.e., anti-aliasing image-forming component both can solve preparation process cost
The problem of, and optical sensor can be made to collect apparent, more accurate biological information.
It is the cross section structure signal of the anti-aliasing image-forming component of one embodiment of the utility model referring to Fig. 3 and Fig. 4, Fig. 3
Figure, Fig. 4 is the axis of an optical transmission fiber and a photosensitive unit in the optical sensor of one embodiment of the utility model
Section structural schematic diagram.The anti-aliasing image-forming component 30 includes multiple optical transmission fibers 310, and each optical transmission fiber 310 wraps
Include light penetrating object 311 and the non-transmissive layer 312 positioned at 311 outside of light penetrating object.Light penetrating object 311 is, for example, the fibre in optical fiber structure
Core.Non-transmissive layer 312 is the covering for being formed by light absorbent, and coating the outside of light penetrating object 311, and the non-transmissive layer 312 and thoroughly
It is fitted closely between body of light 311.In order to guarantee fitting closely for non-transmissive layer 312 and light penetrating object 311, after forming light penetrating object 311
Non-transparent material (namely light absorbent) is coated in 311 periphery of light penetrating object, then carries out curing process.Certainly, ground is changed,
Non-transmissive layer 312 and light penetrating object 311 can also be after being independently made, then pass through and compress, fit together.
In some embodiments, which includes metal oxide, charcoal blacking, black ink etc..Wherein, golden
Belong to the metal in oxide and is such as, but not limited to chromium (Cr), nickel (Ni), iron (Fe), tantalum (Ta), tungsten (W), titanium (Ti), molybdenum (Mo)
It is one or more of.
In above-mentioned anti-aliasing image-forming component 30, the both ends of optical transmission fiber 310 are respectively incident end face 301 and outgoing end face
302, optical signal is injected from incident end face 301, is projected from outgoing end face 302, and reach photosensitive unit 32.When optical signal is from incidence
When light penetrating object 311 is injected in end face 301, due to medium difference, which will be reflected, most of light in the optical signal of refraction
Signal will reach on the light penetrating object 311 and critical surface L ' of non-transmissive layer 312, to be absorbed by non-transmissive layer 312；Remaining optical signal
Will be substantially parallel with the axis direction of light penetrating object 311, to project from outgoing end face 302, and reach photosensitive unit 32.
Specifically, referring to Fig. 5 a, Fig. 5 a is a kind of optical signal of an optical transmission fiber in the anti-aliasing image-forming component of Fig. 3
Schematic diagram.It is reflected when an incident optical signal P1 enters incident end face 301, and refracted optical signal P1 ' reaches light penetrating object 311
On the critical surface L ' of non-transmissive layer 312, and absorbed by non-transmissive layer 312.
It is another optical signal signal of an optical transmission fiber in the anti-aliasing image-forming component of Fig. 3 referring to Fig. 5 b, Fig. 5 b
Figure.It is reflected when an incident optical signal P2 enters incident end face 301, and the direction of refracted optical signal P2 ' and light penetrating object 311
Axis direction P3 it is substantially parallel, and from outgoing end face 302 project, received by photosensitive unit 32.
Further, with continued reference to Fig. 4, it is assumed that the width of light penetrating object 311 is D in the axial section of optical transmission fiber 310, high
Degree is H；The medium refraction index of light penetrating object 311 is n in optical transmission fiber 3103, medium refraction index other than optical transmission fiber 310
For n4.According to refraction principle it is found that incidence angle maximum value γmaxCalculation formula it is as follows:
That is, incidence angle is less than or equal to incidence angle maximum value γmaxOptical signal, it is fine optical transport could to be passed through
The light penetrating object 311 of dimension 310, and reach photosensitive unit 32.So for the anti-aliasing effect for improving anti-aliasing image-forming component 30, then
Reduce incidence angle maximum value γmax.By above-mentioned formula (2) it is found that incidence angle maximum value γmaxWith medium refraction index and
The height H of 311 axial section of light penetrating object is related with width D, therefore to reduce incidence angle maximum value γmax, can there are many realize
Method, such as increase the whole height H (it is of course also possible to referred to as thickness) of anti-aliasing image-forming component 30, reduce optical transmission fiber
The width D of 311 axial section of light penetrating object in 310, and reduce the refractive index n3 of light penetrating object 311 in optical transmission fiber 310, increase light
Transmit the refractive index n4 of medium other than fiber 310.Moreover, the structure of the anti-aliasing image-forming component 30 is simple, preparation process cost
It is relatively low.In addition, entering the optical signal of anti-aliasing image-forming component 30 not due to being light-absorbing material layer on the outside of light penetrating object 311
It can be leaked out from side, nor will cause into incidence angle in the optical signal of anti-aliasing image-forming component 30 and be greater than incidence angle maximum
Value γmaxOptical signal projected from outgoing end face 302, and reach photosensitive unit 32.Therefore, the utility model embodiment is anti-
Compared with the existing technology, not only structure is simple for aliasing image-forming component 30, and preparation process cost reduces, so that optical profile type passes
The collected biological information of sensor 300 is more clear, accurately.
In some embodiments, the cross section of light penetrating object 311 is, for example, circle, square, rectangle, ellipse etc.
Deng.And 311 axial section of light penetrating object is rectangle, and the value range of the width D of the axial section is 5~50 μm, Ke Yigen
Factually border service condition and preparation process, it is, for example, 10 μm, 15 μm, 20 μm, 30 μm, 35 μm, 40 μm, 45 μm that the width, which is arranged,
Etc..
In some embodiments, light penetrating object 311 for example including one of materials such as quartz, glass, plastics, infrared or
Multiple material.
It further, is the preparation flow signal of optical transmission fiber in one embodiment of the utility model referring to Fig. 6, Fig. 6
Figure.The preparation process of the optical transmission fiber specifically comprises the following steps:
S101 provides an optical wand；
Barred body of the optical wand for example including one of materials such as quartz, glass, plastics, infrared or multiple material.
S102 carries out wire drawing to optical wand, forms the light penetrating object 311 of optical transmission fiber；
Using wire drawing machine, optical wand is fixed on wire drawing machine top, and be gradually heated to certain temperature, such as 2000 DEG C.Light
One end that stick is located at heated side gradually melts after being heated and rolls up liquid in end, when it hangs down naturally, just forms light and passes
The light penetrating object 311 of defeated fiber.
S103 sprays non-transparent material in the periphery of light penetrating object 311, forms the non-transmissive layer of optical transmission fiber；
In the non-transparent material of periphery even application of the light penetrating object 311 of formation, to form the non-of optical transmission fiber 310
Photosphere 312.Certainly, it is further taken out alternatively, it is also possible to which the light penetrating object 311 of formation is put into the colloidal sol of non-transparent material.
S104 solidifies the non-transmissive layer of optical transmission fiber.
Optical transmission fiber 310 is irradiated using ultraviolet light, so that the non-transmissive layer 312 of the optical transmission fiber 310 solidifies.When
So, ground is changed, it can also be by 310 natural cooling of optical transmission fiber.
It should be noted that the preparation process of above-mentioned optical transmission fiber 310 all carries out under dustfree environment, to guarantee that light passes
The optical quality of defeated fiber 310.In addition, above-mentioned steps S103 and step S102 can be carried out simultaneously, that is, forming light penetrating object 311
While carry out the spraying of non-transparent material.
Further, referring to Fig. 7, Fig. 7 is the preparation method of the anti-aliasing image-forming component of one embodiment of the utility model
Flow diagram.The preparation method of the anti-aliasing image-forming component the following steps are included:
S201 provides multiple optical transmission fibers, which includes light penetrating object and non-on the outside of light penetrating object
Photic zone；
S202 collapses multiple optical transmission fibers, and fixed.
Specifically, such as shown in Figure 6 multiple optical transmission fibers are made in preparation method, are also not necessarily limited to other systems certainly
Preparation Method is made.Manufactured optical transmission fiber includes structure described in the respective embodiments described above, for example including light penetrating object 311 with
And the non-transmissive layer 312 positioned at 311 outside of light penetrating object.Then multiple optical transmission fiber is flocked together again, and fixed.Example
As coated the solidification glue of non-transparent material in multiple optical transmission fiber peripheries, multiple optical transmission fibers being glued in an embodiment
It closes and fixes；Or in another embodiment, by filling non-transparent material in the gap under vacuum environment between optical transmission fiber
Solidification glue, and it is solidified.
Further, after preparing optical transmission fiber 310, multiple optical transmission fibers 310 are gathered according to scheduled arrangement mode
It gathers together, forms anti-aliasing image-forming component 30.In some embodiments, the multiple optical transmission fibers 31 to flock together
Axis is parallel to each other, and passes through the solidification glue bond of non-transparent material between optical transmission fiber 310.Specifically, in the optical transport
310 periphery of fiber coats one layer of solidification glue, then multiple optical transmission fibers 310 are flocked together, and optical transmission fiber 310 is due to outer
Week solidification glue and be adhesively fixed, to form anti-aliasing image-forming component 30.As shown in Figure 8 a, the optical transmission fiber is according to rectangle
The mode of arrangement is arranged.As shown in Figure 8 b, which is arranged according to similar honeycomb structure.Shown in Fig. 8 b
Arrangement architecture with respect to arrangement architecture shown in Fig. 8 a, the gap between optical transmission fiber is smaller.
In some embodiments, when multiple optical transmission fibers 310 flock together, have between optical transmission fiber 310
There is gap, which has the solidification glue of non-transparent material.Specifically, first optical transmission fiber 310 is flocked together, then from
310 one or both ends of optical transmission fiber carry out encapsulating simultaneously, so that solidification glue fills up the gap between optical transmission fiber 310.
Further, which will carry out under vacuum conditions, to avoid influenced in filling process there are bubble it is anti-aliasing at
The optical quality of element 30.
In some embodiments, the aperture opening ratio of above-mentioned anti-aliasing image-forming component 30 is greater than or equal to 30%.Preferably, should
Aperture opening ratio is greater than or equal to 50%.In order to not only guarantee anti-aliasing effect but also enough optical signals be made to pass through anti-aliasing image-forming component
30, a preferred values, such as 55%, 60%, 70% etc. can be chosen according to actual use situation.It should be noted that
The aperture opening ratio of anti-aliasing image-forming component 30 is that transmission region accounts for entire cross-sectional area in the cross section of anti-aliasing image-forming component 30
Percentage.
In some embodiments, non-in non-transparent material and optical transmission fiber 310 in the solidification glue filled in gap
The material of photosphere 312 is consistent.So that the non-transmissive layer 312 of optical transmission fiber 310 merges completely with the solidification glue in gap,
So that the bonding between optical transmission fiber 310 is more stable.
In some embodiments, semi-solid preparation or not solid can also be carried out after above-mentioned steps S103 to non-transmissive layer 312
Change, after multiple optical transmission fibers 310 flock together, then through extrusion process, so that non-transmissive layer 312 is by optical transport
Gap between fiber 310 is filled up.
Further, referring to Fig. 9, Fig. 9 is the preparation side of the anti-aliasing image-forming component of another embodiment of the utility model
The flow diagram of method.On the basis of the above embodiment, further comprise after step S202:
S203, size and thickness as required are cut to fixed optical transmission fiber is collapsed.
In the actual use of anti-aliasing image-forming component, its corresponding size and thickness will be set according to actual use demand
Degree.Such as when applied in optical sensor, the shape of optical sensor may include rectangle, square, circle etc.,
And as previously mentioned, passing through the thickness for adjusting anti-aliasing image-forming component, the incidence angle that can reduce anti-aliasing image-forming component is maximum
Value, to improve the sensing precision of the optical sensor, and preparation process cost reduces.Therefore, make it is anti-aliasing at
When element, after longer optical transmission fiber is collapsed and fixed, then transverse cuts are carried out to it, to obtain required thickness
Anti-aliasing imaging plate.Meanwhile the anti-aliasing imaging plate after transverse cuts is indulged according to the actual size of optical sensor
To cutting, thus the anti-aliasing image-forming component of size needed for obtaining.Here the longitudinally cutting axis referred to along optical transmission fiber
Parallel direction is cut, and transverse cuts refer to is cut along the direction vertical with the axis of optical transmission fiber.
Further, after longitudinally cutting to the optical transmission fiber for collapsing and fixing progress, to avoid optical transmission fiber
Light penetrating object leaks outside and influences optical quality, and one layer of the periphery coating of the anti-aliasing image-forming component in present embodiment after dicing is non-
Translucent material.
In some embodiments, above-mentioned anti-aliasing image-forming component is adjacent to prevent for example applied to optical sensor
The optical signal that receives of photosensitive unit interfere with each other, and influence the sensing precision of optical sensor.Certainly, this it is anti-aliasing at
Element can also be applied in other optical components.
Specifically, 0, Figure 10 is that the cross-section structure of optical sensor of one embodiment of the utility model shows referring to Fig.1
It is intended to.The optical sensor 300 is used to acquire the biological information of the object above sensor, the biological information packet
Include one or more of fingerprint, palmmprint, vein, blood pressure, heart rate, blood oxygen concentration.The optical sensor 300 is for example including lining
Bottom 31, the multiple photosensitive units 32 being arranged on substrate 31, the anti-aliasing image-forming component 30 on photosensitive unit 32.This is anti-mixed
It builds up element 30 to implement referring to the structure that the respective embodiments described above describe, for making incidence angle be less than incidence angle maximum value γmax
Optical signal can pass through to photosensitive unit 32, remaining optical signal is absorbed by anti-aliasing image-forming component 30, thus improve
The sensing precision of optical sensor obtains clearer, more accurate biological information.
In some embodiments, the ratio in anti-aliasing image-forming component 30 between the length and width of light penetrating object axial section
Value range is 5~50, i.e., ratio is greater than or equal to 5, and is less than or equal to 50.Such as 10,15,20,30,40 etc..Pass through
The ratio is set, the incidence angle maximum value of optical transmission fiber in anti-aliasing image-forming component 30 is adjusted, to improve optical sensor
Sensing precision.
In some embodiments, due to the light penetrating object axial section of each optical transmission fiber in the anti-aliasing image-forming component 30
Width is smaller, therefore the corresponding multiple optical transmission fibers of a photosensitive unit 32, so that anti-aliasing image-forming component 30 is placed in sense
It when in light unit 32, does not need to be aligned, to reduce the preparation process cost of optical sensor, and also improve
The sensing precision of optical sensor 300.
Further, above-mentioned optical sensor 300 further includes light source 33, which is for example set on substrate 31,
And be located on the outside of photosensitive region, which is the photosensitive region that multiple photosensitive units 32 are formed.The light source 33 is for issuing
Optical signal of predetermined wavelength, such as white light signal, infrared signal, ultraviolet signal, fluorescence signal etc..
In some embodiments, Figure 11 is please referred to, Figure 11 is the optical profile type sensing of the another embodiment of the utility model
The structure of device 300.In some embodiments, the optical sensor 300 further comprises a packaging body 34, the encapsulation
Body 34 is such as photosensitive unit 32, anti-aliasing for being packaged all devices on the substrate 31 and the substrate 31
Image-forming component 30, light source 33 etc. are packaged.
In some embodiments, multiple photosensitive units 32 on substrate 31 and substrate 31 form photosensitive bare die (die), should
Photosensitive bare die (Die) is semiconductor integrated circuit device.It is for example also formed on the substrate 31 and electrically connects with photosensitive unit 32
The scanline groups and data line group connect, scanline groups are used for transmission scanning drive signal to photosensitive unit 32, to activate photosensitive list
Member 32 executes light sensing, and the electric signal that data line group is used to that photosensitive unit 32 to be executed light sensing and is generated exports.The substrate 31
Such as, but not limited to silicon substrate etc..
Specifically, in some embodiments, Figure 12 is please referred to, Figure 12 is the optics of another embodiment of the utility model
The electrical block diagram of formula sensor.Photosensitive unit 32 is in array distribution, such as matrix is distributed.It is of course also possible to be other
Regular fashion distribution or non-regular distribution.Scanline groups include multi-strip scanning line 303, and data line group includes multiple data lines
304, multi-strip scanning line 303 and multiple data lines 304 intersect setting, and are arranged between adjacent photosensitive unit 32.Example
Such as, multi-strip scanning line G1, G2 ... Gm is laid along Y-direction interval, and multiple data lines S1, S2 ... Sn is spaced laying in X direction.So,
Ground is changed, which does not limit shown in Figure 12 with multiple data lines 304 is vertically arranged, and can also be in one
Determine the setting of angle, such as 30 °, 60 ° etc..In addition, due to the electric conductivity of scan line 303 and data line 304, in intersection
It is isolated between the scan line 303 and data line 304 of position by insulating materials.
It should be noted that above-mentioned scan line 303 and the distribution of data line 304 and the setting of quantity are not limited to
The embodiment enumerated is stated, corresponding scanline groups and data line can be correspondingly arranged according to the difference of the structure of photosensitive pixel
Group.
Further, multi-strip scanning line 303 is all connected with one drive circuit 35, and multiple data lines 304 are all connected at a signal
Manage circuit 36.Driving circuit 35 is transferred to accordingly for providing corresponding scanning drive signal by corresponding scan line 303
Photosensitive unit 32, with activate the photosensitive unit 32 execute light sensing.The driving circuit 35 is formed on substrate 31, certainly may be used
To be electrically connected by flexible circuit board and photosensitive unit 32, that is, connect multi-strip scanning line 303.Signal processing circuit 36 passes through number
The electric signal that corresponding photosensitive unit 32 executes light sensing and generates is received according to line 303, and target is obtained according to the electric signal
The biological information of object.
In some embodiments, optical sensor 300 further includes a controller 37, which drives for controlling
The dynamic corresponding scanning drive signal of circuit output, such as, but not limited to activation photosensitive unit 32 executes light sensing line by line.The control
Device 37 processed is also used to control signal processing circuit 36 and receives the electric signal that photosensitive unit 32 exports, and executes light sensing receiving
After the electric signal that all photosensitive units 32 export, the biological information of target object is generated according to the electric signal.
Further, above-mentioned signal processing circuit 36 and controller 37 may be formed on substrate 31, can also pass through flexibility
Circuit board and photosensitive bare die are electrically connected.
In some embodiments, as shown in figure 13, Figure 13 is the specific structure signal of a photosensitive unit 32 in Figure 12
Figure.The photosensitive unit 32 includes a sensor devices 320 and a switching device 322.The switching device 322 have a control terminal C with
And two signal ends, such as the first signal end Sn1 and second signal end Sn2.Wherein, the control terminal C and scan line of switching device 322
First signal end Sn1 of 304 connections, switching device 322 connects a reference signal L through sensor devices 320, switching device 322
Second signal end Sn2 is connect with data line 304.It should be noted that the photosensitive unit 32 shown in Figure 13 be only used for for example,
It is not limited to other composed structures of photosensitive unit 32.
Specifically, above-mentioned sensor devices 320 are such as, but not limited to photodiode, phototriode, photodiode, light
Resistance, thin film transistor (TFT) any one or it is several.It is negative by applying at the both ends of photodiode by taking photodiode as an example
To voltage, at this point, if when photodiode receives optical signal the photoelectric current with optical signal proportion relation will be generated,
The light signal strength received is bigger, and the photoelectric current of generation is then bigger, the speed of the voltage decline on photodiode cathode
It is faster, therefore by the voltage signal on acquisition photodiode cathode, to obtain the reflection of target object different parts
Light signal strength, and then obtain the biological information of target object.It is understood that in order to increase sensor devices 320
Multiple sensor devices 320 can be set in photosensitive effect.
Further, switching device 322 be such as, but not limited to triode, metal-oxide-semiconductor, in thin film transistor (TFT) any one or
It is several.Certainly, which also may include other kinds of device, and quantity may be 2,3 etc..
By taking 32 structure of photosensitive unit shown in Figure 13 as an example, control terminal C of the grid of the metal-oxide-semiconductor as switching device 322,
The source electrode and drain electrode of metal-oxide-semiconductor is to the first signal end Sn1 and second signal end Sn2 that should be used as switching device 322.The grid of metal-oxide-semiconductor
Pole is connect with scan line 303, and the source electrode of metal-oxide-semiconductor is connect with the cathode of photodiode D1, the drain electrode of metal-oxide-semiconductor and data line 304
Connection.The anode connection reference signal L of photodiode D1, reference signal L is, for example, earth signal or negative voltage signal.
When above-mentioned photosensitive unit 32 executes light sensing, the grid by scan line 303 to thin film transistor (TFT) TFT applies one
Scanning drive signal, to drive metal-oxide-semiconductor to be connected.At this point, data line 304 connects a positive voltage signal, and after metal-oxide-semiconductor conducting, number
The cathode of photodiode D1 is applied to through metal-oxide-semiconductor according to the positive voltage signal on line 304, since the anode of photodiode D1 connects
Ground, therefore the both ends photodiode D1 will apply a backward voltage, so that photodiode D1 is in reverse bias, that is, be in work
Make state.At this point, the reverse current of photodiode D1 increases rapidly when there is optical signal to be irradiated to photodiode D1,
So as to cause the curent change on photodiode D1, the electric current of the variation can be obtained from data line 304.Due to optical signal
Intensity it is bigger, the reverse current of generation is also bigger, therefore according to the current signal got on data line 304, can obtain
The intensity of optical signal, and then obtain the biological information of target object.
In some embodiments, above-mentioned reference signal L can be positive voltage signal, negative voltage signal, earth signal etc..Only
The electric signal provided on data line 304 and reference signal L is wanted to be applied to the both ends photodiode D1, so that photodiode D1
Both ends form backward voltage, to execute light sensing, in the protection scope that the utility model limits.
It is understood that the connection type of metal-oxide-semiconductor and photodiode D1 are not limited in above-mentioned photosensitive unit 32
Connection type shown in Figure 13, or other connection types.For example, as shown in figure 14, the grid G and scan line of metal-oxide-semiconductor
303 connections, the drain D of metal-oxide-semiconductor are connect with the anode of photodiode D1, and the source S of metal-oxide-semiconductor is connect with data line 304.Photoelectricity
The cathode of diode D1 connects positive voltage signal.
Further, referring to Fig.1 5, Figure 15 be one embodiment of the utility model optical sensor preparation method
Flow diagram.The preparation method the following steps are included:
S301 provides a substrate；
Substrate 31 is such as, but not limited to silicon substrate, metal plate, circuit galley etc., it is, of course, also possible to be glass substrate
Equal substrates.
Multiple photosensitive units are formed on the substrate in S302；
The sensor devices 320 and switching device 322 of photosensitive unit 32 are respectively formed on substrate 31.In addition, will also be at this
It is formed data line on substrate 31 and scan line and corresponding circuit structure, such as driving circuit 35, signal processing circuit 36 etc.
Deng.
S303 provides an anti-aliasing image-forming component, and the anti-aliasing image-forming component is fitted on photosensitive unit.
The anti-aliasing image-forming component 30 is made up of the preparation method of the respective embodiments described above, and the anti-aliasing image-forming component
After 30 will be cut according to required size and thickness, then fit on photosensitive unit 32.Certainly, if the anti-aliasing image-forming component
Size and thickness are met the requirements, then do not have to cutting process, be mounted directly on photosensitive unit 32.
Further, referring to Fig.1 6, Figure 16 be another embodiment of the utility model optical sensor preparation side
The flow diagram of method.The preparation method the following steps are included:
S401, provides a wafer, and the wafer includes spaced multiple optical profile type sensing chips；
7, Figure 17 is the positive structure schematic of the wafer of one embodiment of the utility model referring to Fig.1.The wafer 400 packet
The multiple optical profile type sensing circuits of substrate and formation on substrate are included, include multiple spaced sensing chip areas on substrate
410, optical profile type sensing chip is used to form in each sensing chip area 410.The sensing chip area 410 is arranged in array, and phase
Cutting area 420 is formed between adjacent sensing chip area 410.
S402 cuts wafer, obtains multiple optical profile type sensing chips；
Wafer is cut in cutting area, to obtain multiple independent optical profile type sensing chips.
S403 provides an anti-aliasing imaging plate, which includes multiple optical transmission fibers；
Optical transmission fiber item is made according to the preparation method of above-mentioned anti-aliasing image-forming component, i.e., by multiple optical transmission fiber items
It flocks together and fixes to be formed.Say that multiple transmission ribbon laterally cut according to thickness needed for anti-aliasing imaging plate
It cuts, to form anti-aliasing imaging plate.
S404 cuts anti-aliasing imaging plate according to the size and shape of optical profile type sensing chip, with acquisition and institute
State the corresponding anti-aliasing image-forming component of optical profile type sensing chip；
It is longitudinally cutting to the progress of anti-aliasing imaging plate according to the size and shape of optical profile type sensing chip, it obtains anti-aliasing
Image-forming component.Since the anti-aliasing image-forming component is consistent with the size and shape of optical profile type sensing chip, which resists
Aliasing image-forming component does not need to align, and is mounted directly on optical profile type sensing chip.Certainly, which can also be with
It is longitudinally cutting to anti-aliasing imaging plate to form according to the size and shape of the sensing area of optical profile type sensing chip, so save
The cost of anti-aliasing image-forming component.
The anti-aliasing image-forming component is bonded with optical profile type sensing chip, and encapsulates by S405.
Anti-aliasing image-forming component is bonded with optical profile type sensing chip, so that anti-aliasing image-forming component is located at least in optical profile type
Above the sensing area of sensing chip.Then the anti-aliasing image-forming component of fitting is packaged with optical profile type sensing chip, is formed
Optical sensor.
Further, 8 and Figure 19, Figure 18 are the front knots of the electronic equipment of one embodiment of the utility model referring to Fig.1
Structure schematic diagram, Figure 19 be in Figure 18 electronic equipment along the schematic diagram of the section structure of I-I line.The electronic equipment 1 is for example including display
Screen 500 and the optical sensor 300 below display screen 500.The sensing region R2 of optical sensor 300 is located at
Lower position in the local location of the display area R1 of display screen 500, such as display area R1 shown in Figure 18, convenient for singlehanded touching
It touches electronic equipment 1 and carries out fingerprint recognition operation.Certainly, if the size and shape of electronic equipment 1 are different, optical sensor
300 setting position will also change according to actual needs.
It should be noted that the sensing region R2 of optical sensor in actual use, will not be in display screen in Figure 18
In shown, or shown otherwise.
Further, which implements referring to the optical sensor of the respective embodiments described above.In addition,
It is adhesively fixed between the display screen 500 and optical sensor 300 by optical cement.
In some embodiments, be additionally provided with cover sheet 600 above display screen, with to avoid display screen 500 directly with
Object contacts and damages display screen 500.By taking target object is finger as an example, when finger is located at the cover sheet 600 of electronic equipment 1
On, and be located at fingerprint identification region R2 in when, display screen 500 issue optical signal reach finger after will reflect, be reflected back
The optical signal come reaches optical sensor 300 after passing through display screen 500.Optical sensor 300 receives reflected light
Signal, and the optical signal received is converted into corresponding electric signal.Since the valley point and ridge part of finger are to optical signal
Degree of reflection is different, such as valley point is totally reflected optical signal, and ridge part carries out diffusing reflection to optical signal, therefore according to turning
Electric signal after changing obtains the fingerprint image of finger, with the identification of this user for carrying out electronic equipment.
In the description of this specification, reference term " embodiment ", " certain embodiments ", " schematically implementation
What the description of mode ", " example ", " specific example " or " some examples " etc. meant to describe in conjunction with the embodiment or example
Particular features, structures, materials, or characteristics are contained at least one embodiment or example of the utility model.In this explanation
In book, schematic expression of the above terms are not necessarily referring to identical embodiment or example.Moreover, the specific spy of description
Sign, structure, material or feature can be combined in any suitable manner in any one or more embodiments or example.
Although the embodiments of the present invention has been shown and described above, it is to be understood that above-mentioned embodiment party
Formula is exemplary, and should not be understood as limiting the present invention, and those skilled in the art are in the utility model
Above embodiment can be changed, be modified in range, replacement and variant.
Claims (21)
1. a kind of anti-aliasing image-forming component, it is characterised in that: including multiple optical transmission fibers, the optical transmission fiber includes light transmission
Body and non-transmissive layer positioned at the light penetrating object periphery.
2. anti-aliasing image-forming component as described in claim 1, it is characterised in that: the non-transmissive layer is by the light transmission
External week coats non-transparent material and forms.
3. anti-aliasing image-forming component as described in claim 1, it is characterised in that: be to pass through between the multiple optical transmission fiber
The solidification glue bond of non-transparent material.
4. anti-aliasing image-forming component as described in claim 1, it is characterised in that: between having between the multiple optical transmission fiber
Gap, and the gap filling has the solidification glue of the non-transparent material.
5. anti-aliasing image-forming component as claimed in claim 4, it is characterised in that: the gap is filled out by vacuum glue pouring realization
It fills.
6. anti-aliasing image-forming component as described in claim 1, it is characterised in that: the optical transmission fiber is by an optical wand
It carries out wire drawing and forms the light penetrating object, and coat non-transparent material in the light penetrating object periphery in drawing process and form.
7. anti-aliasing image-forming component as claimed in claim 6, it is characterised in that: the cross section of the light penetrating object is circle, just
Rectangular, rectangle, ellipse.
8. anti-aliasing image-forming component as claimed in claim 6, it is characterised in that: the axial section of the light penetrating object is rectangle,
And the width of the axial section is 5~50um.
9. anti-aliasing image-forming component as described in claim 1, it is characterised in that: the aperture opening ratio of the anti-aliasing image-forming component is big
In or equal to 30%.
10. anti-aliasing image-forming component as claimed in claim 9, it is characterised in that: the aperture opening ratio of the anti-aliasing image-forming component
More than or equal to 50%.
11. anti-aliasing image-forming component as described in claim 1, it is characterised in that: the light penetrating object includes quartz, glass, modeling
Material, infrared one or more materials.
12. anti-aliasing image-forming component as described in claim 1, it is characterised in that: an end face of the optical transmission fiber is light
The plane of incidence, other end are light-emitting face.
13. anti-aliasing image-forming component as claimed in claim 12, it is characterised in that: enter the light transmission from the light incident surface
The optical signal of body will reflect, and when the optical signal after refraction is mapped to the side of the light penetrating object, by the non-transmissive layer
It absorbs.
14. a kind of optical sensor, it is characterised in that: including substrate, photosensitive unit over the substrate, position is arranged
In the anti-aliasing image-forming component on the photosensitive unit, the anti-aliasing image-forming component is any one of claim 1-13 institute
The anti-aliasing image-forming component stated.
15. optical sensor as claimed in claim 14, it is characterised in that: light penetrating object axis in the anti-aliasing image-forming component
The length of section and the ratio of diameter are greater than or equal to 5, and are less than or equal to 50.
16. optical sensor as claimed in claim 14, it is characterised in that: it is fine that each photosensitive unit corresponds to multiple optical transports
Dimension.
17. optical sensor as claimed in claim 14, it is characterised in that: optical transport is fine in the anti-aliasing image-forming component
The axis of dimension and the substrate transverse.
18. optical sensor as claimed in claim 14, it is characterised in that: the optical sensor is described for acquiring
The biological information of object above sensor.
19. optical sensor as claimed in claim 18, it is characterised in that: the biological information includes fingerprint, the palm
The one or more of line, vein, blood pressure, heart rate, blood oxygen concentration.
20. a kind of electronic equipment, it is characterised in that: including optical sensor described in any one of claim 14-19.
21. electronic equipment as claimed in claim 20, it is characterised in that: the electronic equipment includes display screen, the optics
Formula sensor is set to below display screen, and is located in the display area of display screen.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2017/119149 WO2019127165A1 (en) | 2017-12-27 | 2017-12-27 | Anti-aliasing imaging element, optical sensor, and electronic device |
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| Publication Number | Publication Date |
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| CN209044627U true CN209044627U (en) | 2019-06-28 |
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| CN201790000314.9U Active CN209044627U (en) | 2017-12-27 | 2017-12-27 | Anti-aliasing image-forming component, optical sensor and electronic equipment |
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| WO (1) | WO2019127165A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108565270A (en) * | 2017-12-27 | 2018-09-21 | 深圳信炜科技有限公司 | Anti-aliasing image-forming component, optical sensor and electronic equipment |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113780035B (en) * | 2020-06-09 | 2024-09-13 | 京东方科技集团股份有限公司 | Display panel and display device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7272248B2 (en) * | 2001-07-16 | 2007-09-18 | Activcard Ireland Limited | Biometric imaging device compensating for non-biometric parameters |
| CN1900949A (en) * | 2005-07-19 | 2007-01-24 | 全量工业股份有限公司 | Full reflection fingerprint identifier |
| US10732771B2 (en) * | 2014-11-12 | 2020-08-04 | Shenzhen GOODIX Technology Co., Ltd. | Fingerprint sensors having in-pixel optical sensors |
| US9811711B2 (en) * | 2015-02-22 | 2017-11-07 | Microsoft Technology Licensing, Llc | Fingerprint detection with transparent cover |
| CN107092892B (en) * | 2017-04-27 | 2020-01-17 | 上海天马微电子有限公司 | Display panel and display device |
| WO2019127164A1 (en) * | 2017-12-27 | 2019-07-04 | 深圳信炜科技有限公司 | Preparation method for anti-aliasing imaging element and optical sensor |
-
2017
- 2017-12-27 WO PCT/CN2017/119149 patent/WO2019127165A1/en active Application Filing
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| CN108565270A (en) * | 2017-12-27 | 2018-09-21 | 深圳信炜科技有限公司 | Anti-aliasing image-forming component, optical sensor and electronic equipment |
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