CN209013190U - A kind of ceramic wafer that can be improved burner thermal efficiency, reduce waste gas content - Google Patents
A kind of ceramic wafer that can be improved burner thermal efficiency, reduce waste gas content Download PDFInfo
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- CN209013190U CN209013190U CN201821592320.0U CN201821592320U CN209013190U CN 209013190 U CN209013190 U CN 209013190U CN 201821592320 U CN201821592320 U CN 201821592320U CN 209013190 U CN209013190 U CN 209013190U
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- ceramic wafer
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Abstract
The utility model relates to ceramic wafer processing technique fields, disclose a kind of ceramic wafer that can be improved burner thermal efficiency, reduce waste gas content, including ceramic wafer ontology, are provided with venthole on ceramic wafer ontology；The diameter that venthole is located at ceramic wafer ontology burning surface one end is greater than the diameter far from ceramic wafer ontology burning surface one end；One end that venthole is located at ceramic wafer ontology burning surface is provided with ellipse chamfering；It is arranged between each venthole in side where ceramic wafer ontology burning surface fluted.This can improve burner thermal efficiency, the ceramic wafer of reduction waste gas content can effectively reduce combustion gas in the flow velocity of outlet, keep fuel gas buring more abundant, exhaust gas discharge is reduced while improving the thermal efficiency.
Description
Technical field
The utility model relates to ceramic wafer processing technique fields, in particular to a kind of to improve burner thermal efficiency, reduce
The ceramic wafer of waste gas content.
Background technique
Ceramic wafer used in infrared burner at present, on its surface, rule is dispersed with several honeycomb ventholes；By bee
Nest ceramics plate surface is improved to the staggered solid type of ripple by simple plane formula, it is possible to increase specific surface area and burning face
Product, it is combustion-supporting to play the role of better accumulation of heat.But in the prior art, venthole is mostly straight tube shape, and upper and lower diameter is consistent, and
Venthole outlet port is arc-shaped transition, and after combustion gas reaches burning surface, speed will not slow down, and causes to burn insufficient,
The thermal efficiency is low, and content of CO in smoke is more than 800PPM, the exceeded bad problem of CO occurs.
Utility model content
The utility model proposes a kind of ceramic wafers that can be improved burner thermal efficiency, reduce waste gas content, solve existing skill
Fuel gas buring is insufficient in art, leads to the problem that the thermal efficiency is low, waste gas content is high.
In order to solve the above-mentioned technical problem, the technical solution of the utility model is, a kind of to improve burner thermal efficiency, drop
The ceramic wafer of low waste gas content, including ceramic wafer ontology are provided with venthole on the ceramic wafer ontology；The venthole is located at
The diameter of described ceramic wafer ontology burning surface one end is greater than the diameter far from described ceramic wafer ontology burning surface one end；It is described
One end that venthole is located at the ceramic wafer ontology burning surface is provided with ellipse chamfering；The ceramic wafer ontology burning surface
It is arranged between each venthole in the side at place fluted.
Further, the venthole is evenly arranged with multiple on the ceramic wafer ontology.
Further, diameter of the venthole far from described ceramic wafer ontology burning surface one end is 1.1-1.3mm.
Further, the pattern draft of the venthole is 5-15 °.
By adopting the above technical scheme, it is fired due to venthole from far from ceramic wafer ontology burning surface one end to ceramic wafer ontology
The diameter for burning surface one end becomes larger, in the shape of a trumpet, can reduce combustion gas in the flow velocity of outlet, venthole is located at ceramic wafer sheet
The one end on volumetric combustion surface is set as ellipse chamfering, prolongs air mixture in the reaction time of ceramic wafer ontology burning surface
It is long, it burns more abundant, to further improve the thermal efficiency, reduces exhaust gas discharge.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is that a kind of ceramic wafer cross-section structure that can be improved burner thermal efficiency, reduce waste gas content of the utility model shows
It is intended to；
Fig. 2 is that a kind of ceramic wafer stereochemical structure that can be improved burner thermal efficiency, reduce waste gas content of the utility model is shown
It is intended to.
In figure: 1- ceramic wafer ontology, 2- venthole, 3- chamfering, 4- pattern draft, 5- groove.
Specific embodiment
Specific embodiment of the present utility model is described further with reference to the accompanying drawing.It should be noted that
The explanation of these embodiments is used to help to understand the utility model, but does not constitute the restriction to the utility model.This
Outside, technical characteristic involved in the various embodiments of the present invention described below is as long as they do not conflict with each other
It can be combined with each other.
In conjunction with attached drawing, the present invention will be further described, makes this reality of person of ordinary skill in the field's better implementation
With a kind of novel, ceramic wafer that can be improved burner thermal efficiency, reduce waste gas content of the utility model embodiment, including ceramic wafer
Ontology 1 is provided with venthole 2 on ceramic wafer ontology 1；The diameter that venthole 2 is located at ceramic wafer ontology burning surface one end is greater than
Diameter far from ceramic wafer ontology burning surface one end；One end that venthole 2 is located at ceramic wafer ontology burning surface is provided with ellipse
Round chamfering 3；It is arranged fluted 5 between each venthole in side where ceramic wafer ontology burning surface.
The utility model embodiment venthole 2 is evenly arranged with multiple on ceramic wafer ontology 1；Venthole 2 is far from ceramics
The diameter of 1 burning surface one end of plate ontology is 1.2mm；The pattern draft of venthole is 5.
The utility model embodiment by adopting the above technical scheme, since venthole 2 is from far from 1 burning surface of ceramic wafer ontology
The diameter of one end to 1 burning surface one end of ceramic wafer ontology becomes larger, in the shape of a trumpet, can reduce combustion gas in the stream of outlet
Speed, one end that venthole 2 is located at 1 burning surface of ceramic wafer ontology are set as ellipse chamfering 3, make air mixture in ceramic wafer sheet
The reaction time of 1 burning surface of body extends, and burns more abundant, to further improve the thermal efficiency, reduces exhaust gas discharge, CO is useless
Gas content can reduce by 50% or more, can achieve 400PPM or less.
The embodiments of the present invention is explained in detail in conjunction with attached drawing above, but the utility model is not limited to be retouched
The embodiment stated.For a person skilled in the art, right in the case where not departing from the utility model principle and spirit
These embodiments carry out a variety of change, modification, replacement and modification, still fall in the protection scope of the utility model.
Claims (4)
1. a kind of ceramic wafer that can be improved burner thermal efficiency, reduce waste gas content, it is characterised in that: including ceramic wafer ontology,
Venthole is provided on the ceramic wafer ontology；The diameter that the venthole is located at described ceramic wafer ontology burning surface one end is big
In the diameter far from described ceramic wafer ontology burning surface one end；The venthole is located at the ceramic wafer ontology burning surface
One end is provided with ellipse chamfering；It is provided between each venthole in side where the ceramic wafer ontology burning surface
Groove.
The ceramic wafer that 2. burner thermal efficiency can be improved according to claim 1, reduce waste gas content, it is characterised in that: institute
State venthole be evenly arranged on the ceramic wafer ontology it is multiple.
The ceramic wafer that 3. burner thermal efficiency can be improved according to claim 1, reduce waste gas content, it is characterised in that: institute
Stating diameter of the venthole far from described ceramic wafer ontology burning surface one end is 1.1-1.3mm.
The ceramic wafer that 4. burner thermal efficiency can be improved according to claim 3, reduce waste gas content, it is characterised in that: institute
The pattern draft for stating venthole is 5-15 °.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821592320.0U CN209013190U (en) | 2018-09-28 | 2018-09-28 | A kind of ceramic wafer that can be improved burner thermal efficiency, reduce waste gas content |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821592320.0U CN209013190U (en) | 2018-09-28 | 2018-09-28 | A kind of ceramic wafer that can be improved burner thermal efficiency, reduce waste gas content |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209013190U true CN209013190U (en) | 2019-06-21 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201821592320.0U Active CN209013190U (en) | 2018-09-28 | 2018-09-28 | A kind of ceramic wafer that can be improved burner thermal efficiency, reduce waste gas content |
Country Status (1)
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| CN (1) | CN209013190U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113648804A (en) * | 2020-05-12 | 2021-11-16 | 山东清沂山石化科技有限公司 | Novel in-furnace desulfurization and nitrogen inhibition technical method |
-
2018
- 2018-09-28 CN CN201821592320.0U patent/CN209013190U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113648804A (en) * | 2020-05-12 | 2021-11-16 | 山东清沂山石化科技有限公司 | Novel in-furnace desulfurization and nitrogen inhibition technical method |
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