CN209012819U

CN209012819U - LED filament

Info

Publication number: CN209012819U
Application number: CN201821331795.4U
Authority: CN
Inventors: 江涛
Original assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Current assignee: Jiaxing Super Lighting Electric Appliance Co Ltd
Priority date: 2017-01-13
Filing date: 2017-12-14
Publication date: 2019-06-21
Anticipated expiration: 2027-12-14
Also published as: CN209012818U

Abstract

The utility model discloses a kind of LED filament, the LED filament includes: multiple LED chips, is electrically connected with each other；Two electrodes, each described electrode are electrically connected a corresponding LED chip；Light conversion layer, the at least two sides and the electrode, the part electrode for covering the LED chip are exposed except the light conversion layer, and the light conversion layer includes a top layer and a base, the base covers a surface of the LED chip, and the top layer covers another surface of the LED chip；The electrode includes hole, and the base or top layer pass through described hole and extend to the other end of described hole.The utility model has preferable bending performance, heat dissipation effect and light-out effect.

Description

LED filament

This case is submission on December 14th, 2017 Patent Office of the People's Republic of China, application No. is 201721745812.4, utility model names The referred to as divisional application of " LED filament and LEDbulb lamp ".

Technical field

The utility model relates to lighting areas, and in particular to a kind of LED filament.

Background technique

LED has environmental protection, energy saving, high efficiency and long-life advantage, therefore is generally taken seriously in recent years, gradually takes For the status of traditional lighting lamps and lanterns.However shining for Conventional LED light sources has directive property, unlike conventional lamp can make big wide-angle The illumination of range.Therefore, LED is applied to conventional lamp, depending on the type of lamps and lanterns, and has corresponding challenge.

In recent years, a kind of that LED light source can be allowed to shine similar to conventional tungsten silk bulb lamp, reach the LED of 360 ° of full angles illumination Filament is increasingly by the attention of industry.The production of this LED filament be by plurality of LEDs chip concatenation be fixed on it is a piece of narrow elongated Glass substrate on, then to wrap up whole branch glass substrate mixed with the silica gel of fluorescent powder, then carry out electrical connection and can be completed.So And such filament is in the upright bar being soldered in light bulb, it is necessary to respectively weld one by one, manufacture craft is cumbersome.Moreover, because Using electric welding mode, the performance and size requirement to material are more stringent, and there are the risks of rosin joint.

Application No. is 201420699840.7 to disclose a kind of LED filament that complete cycle is luminous comprising is mixed with fluorescent powder Substrate, at least one LED chip being installed on substrate, and the packaging plastic being covered on the chip, solve using glass The light-emitting uniformity of glass or sapphire substrate not disadvantage strong and at high cost, but do not disclose and how to improve substrate and packaging plastic Bond strength.

Present application is advanced optimized to above-mentioned application case, and the light conversion layer progress especially for layer structure is excellent Change, promoted layer structure between and the bond strength between layer structure and electrode.

Utility model content

The present invention provides a kind of LED filament, the LED filament includes:

Multiple LED chips, are electrically connected with each other；

Two electrodes, each described electrode are electrically connected a corresponding LED chip；

Light conversion layer, at least two sides and the electrode, the part electrode for covering the LED chip are exposed the light and are turned It changes except layer, the light conversion layer includes a top layer and a base, and the base covers a surface of the LED chip, described Top layer covers opposite another surface covered by the base of the LED chip；

The electrode includes hole, and the base or top layer pass through described hole and extend to the other end of described hole. The adhesive force between electrode and light conversion layer can be increased, to improve the mechanical strength between electrode and light conversion layer.

Further, the top layer and the base, the base and the electrode or the top layer and the electrode Contact surface is rough surface.Rough surface has preferable heat dissipation effect.

Further, the top layer and the base, the base and the electrode or the top layer and the electrode Contact surface is wave surface.LED chip is placed in wave plane, thus has different light directions, the illumination of LED filament compared with Uniformly.

Further, the top layer further extends to the surface of the base by described hole, this surface is described The contact surface of base and the top layer.

Further, the light conversion layer includes phosphor gel, and the phosphor gel extends to the electrode, and then extends To the surface of the base, this surface is the contact surface of the top layer and the base.

Further, the electrode is coated by the light conversion layer, and the electrode is riveted together with the light conversion layer. To which the mechanical strength between electrode and light conversion layer be improved.

Further, the base includes phosphor gel, and the phosphor gel extends to each electrode, and from described hole Worn on one side to opposite another side.

Further, each electrode is coated by the base, and the base is together with the electrode rivet.

Further, the top layer includes phosphor gel, and the phosphor gel extends to each electrode, and from described hole Worn on one side to opposite another side.

Further, the electrode is coated by the top layer, and the top layer and the electrode are riveted together.

Further, the electrode includes at least one bonding pad and at least one auxiliary member, and described hole is distributed in institute State bonding pad and the auxiliary member.

Further, the base includes phosphor gel, and the phosphor gel extends to the auxiliary member, and from the hole It is worn on one side to opposite another side in hole.

Further, the electrode have around the LED chip at least two sides, the electrode include two auxiliary members and Bonding pad a, wherein auxiliary member is extended and combined with the bonding pad at L-shaped by the side of the bonding pad.

Further, the electrode have two bonding pads and transition region, the transition region between the bonding pad, The width of the bonding pad is greater than the transition region.

Further, the filament width is W, and the width of the bonding pad of the electrode is 1/4W to W, the mistake of the electrode The width for crossing area is 1/10W to 1/5W.Since the transition region of electrode has thinner width, so that electrode is easier with filament Deformation is bent, the risk for influencing and being easy broken string close to the gold thread stress of electrode tip is reduced.

Further, the electrode coated by the top layer coated by the base or simultaneously by the base with it is described Top layer coats jointly.

Further, the electrode, the LED chip are respectively positioned on base or the top layer or the electrode, the LED Chip is respectively different to be in base or top layer.Electrode is arranged in the base or the top layer, in the processing procedure process of LED filament In, base, which can turn, makes electrode towards upper, to be easier to be electrically connected to LED chip.

Further, the electrode includes two auxiliary members and a bonding pad, and the auxiliary member is respectively connected to the connection The opposite sides in area, the auxiliary region and the bonding pad form U-shaped.

Further, the electrode includes an auxiliary member, and the auxiliary member is connected to the center of the bonding pad, described T shape is collectively formed in auxiliary member and the bonding pad.

Further, the auxiliary member of the electrode extends by the entire bonding pad, and the width of the auxiliary member It can be gradually reduced by the free end for being connected to fixing end towards the opposite side of the bonding pad.

Further, the fixing end of the auxiliary member can be aligned the entire bonding pad and the base, the auxiliary member Trapezoidal or triangle or semicircle.

A kind of LED filament, the LED filament include

Multiple LED chips are lined up array and are electrically connected with each other；

Light conversion layer, at least two sides and the electrode, the part electrode for covering the LED chip are exposed the light and are turned It changes except layer, the electrode includes hole, and the light conversion layer is by described hole connection electrode to reinforce light conversion layer and two It is interelectrode secured.

Further, the contact surface of the light conversion layer and the electrode is rough surface.

Further, the contact surface of the light conversion layer and the electrode is wave surface.

Further, the electrode is coated by the light conversion layer, and the light conversion layer extends to institute by described hole State electrode.

Further, the light conversion layer worn on one side to opposite another side from described hole.

Further, the light conversion layer includes phosphor gel, and the phosphor gel extends to the electrode and from described Hole is worn on one side to opposite another side.

Further, the electrode is coated by light conversion layer, and light conversion layer and electrode are riveted together.

Further, the electrode includes at least one bonding pad and at least one auxiliary member, and described hole is distributed in institute State auxiliary member.

Further, it is coated described in the auxiliary member by light conversion layer, the light conversion layer is extended to by described hole In each auxiliary member.

Further, the light conversion layer includes phosphor gel, and the phosphor gel extends to the auxiliary member, and From being worn on one side to opposite another side for described hole.

The utility model penetrates said structure design, has reached one of beneficial effect as described below or any combination thereof:

(1) base or top layer extend to the other end from one end of hole, can increase attached between electrode and light conversion layer Put forth effort, to improve the mechanical strength between electrode and light conversion layer；

(2) contact surface of top layer and the base, the base and the electrode or the top layer and the electrode is thick Rough surface, thus LED filament has preferable heat dissipation effect；

(3) transition region of electrode has thinner width, so that electrode is easier to bend deformation with filament, reduces close The gold thread stress of electrode tip influences and is easy the risk of broken string；

(4) conducting wire between electrode and the LED chip at array both ends can be supported and protect by auxiliary member, filament The obdurability at both ends is available to be obviously improved；LED filament can be bent into diversified curve, electrode and LED chip it Between conducting wire breakage risk reduce.When such LED filament with exquisite curve shines, LEDbulb lamp can generate excellent Light-out effect.

Detailed description of the invention

Fig. 1 show LEDbulb lamp according to an embodiment of the invention along the longitudinal sectional drawing of central axis；

Fig. 2 show the exploded view of LEDbulb lamp according to an embodiment of the invention；

Fig. 3 show the structure after electric isolution component, LED lamp panel and radiator according to an embodiment of the invention assemble Schematic diagram；

Fig. 4 show electric isolution component according to an embodiment of the invention along the longitudinal sectional drawing of central axis；

Fig. 5 show the exemplary light distribution light distribution curve of LEDbulb lamp according to an embodiment of the invention；

Fig. 6 show the structure after electric isolution component, LED lamp panel and radiator according to another embodiment of the present invention assemble Schematic diagram；

Fig. 7 show electric isolution component according to another embodiment of the present invention along the longitudinal sectional drawing of central axis；

Fig. 8 show longitudinal sectional drawing of the electric isolution component along central axis of another embodiment according to the present invention；

Fig. 9 show the schematic diagram of LED lamp panel according to an embodiment of the invention；

Figure 10 show longitudinal sectional drawing of the electric isolution component along central axis of another embodiment according to the present invention；

Figure 11 show longitudinal sectional drawing of the electric isolution component along central axis of another embodiment according to the present invention；

Figure 12 show the schematic diagram that adhesive film is coated between lamp housing and radiator according to an embodiment of the invention；

Figure 13 show the lamp housing according to an embodiment of the invention for being coated with reflectance coating and cuts open along the longitudinal direction of central axis Face figure

Figure 14 A is the structural schematic diagram of the first embodiment of the LEDbulb lamp of the utility model；

Figure 14 B is the structural schematic diagram of the second embodiment of the LEDbulb lamp of the utility model；

Figure 14 C is the structural schematic diagram of the 3rd embodiment of the LEDbulb lamp of the utility model；

Figure 15 A is the three-dimensional partial cutaway schematic of the LED filament first embodiment of the utility model；

Figure 15 B is the partial cutaway schematic of the position 15B-15B in Figure 15 A；

Figure 16 A to Figure 16 E is the diagrammatic cross-section of the LED filament of multiple embodiments of the utility model；

Figure 17 A-17Q is the bottom view of the LED filament of multiple embodiments of the utility model；

Figure 17 R is the partial cross-sectional view of the LED filament of one embodiment of the utility model；

It is respectively the LED filament and the plane of one embodiment of its assistant strip of the utility model shown in Figure 18 A and Figure 18 B Schematic diagram and stereoscopic schematic diagram；

It is respectively the LED filament of the utility model and putting down for another embodiment of its assistant strip shown in Figure 18 C and Figure 18 D Face schematic diagram and stereoscopic schematic diagram；

Figure 18 E show the stereoscopic schematic diagram of the LED filament of the utility model and another embodiment of its assistant strip；

Figure 19 A show the schematic cross-section of the different embodiments of the LED filament of the utility model from Figure 19 B；

Figure 20 A to Figure 20 D is the schematic cross-section of the LED filament of the utility model difference embodiment；

Figure 21 A and Figure 21 B is respectively the sectional view and schematic diagram of the LED filament of one embodiment of the utility model, figure 21A show the section at the line segment 21A-21A of Figure 21 B；

Figure 21 C to Figure 21 I is the schematic diagram of the LED filament of multiple embodiments of the utility model；

Figure 22 A show the perspective view of the LED filament of one embodiment of the utility model；

Figure 22 B to Figure 22 E is the part truncation schematic diagram of the LED filament of multiple embodiments of the utility model；

Figure 23 A show the schematic diagram of the conductive structure embodiment for connecting LED filament annular in shape of the utility model；

Figure 23 B is the schematic cross-section marked when being inserted into conducting bracket at sp in Figure 23 A；

Figure 24 A to Figure 24 C show the schematic diagram of the embodiment of the LEDbulb lamp of the utility model；

Figure 25 A is partial cross section's enlarged diagram of the first embodiment of the lamp housing of the utility model；

Figure 25 B is partial cross section's enlarged diagram of the second embodiment of the lamp housing of the utility model；And

Figure 25 C is partial cross section's enlarged diagram of the 3rd embodiment of the lamp housing of the utility model.

Specific embodiment

It is understandable to enable the above objects, features, and advantages of the utility model to become apparent, with reference to the accompanying drawing with tool Body embodiment is described in detail the embodiments of the present invention.

A kind of LEDbulb lamp is provided according to one embodiment of present invention, please refers to Fig. 1 to Fig. 6, wherein Fig. 1 is shown Longitudinal sectional drawing of the LEDbulb lamp according to an embodiment of the invention along central axis；Fig. 2 show one according to the present invention The exploded view of the LEDbulb lamp of embodiment；Fig. 3 show electric isolution component according to an embodiment of the invention, LED lamp plate And the structural schematic diagram after radiator assembly；Fig. 4 show electric isolution component according to an embodiment of the invention along central axis The longitudinal sectional drawing of line；And Fig. 5 show the exemplary light distribution curve of LEDbulb lamp according to an embodiment of the invention Figure.

Referring initially to Fig. 1 and Fig. 2.LEDbulb lamp according to the present embodiment include lamp cap 1, pedestal 2, LED drive power 3, Radiator 4, is electrically isolated component 6a and lamp housing 7 at LED lamp panel 5.

One end of pedestal 2 is socketed in lamp cap 1, and the other end of pedestal 2 is assemblied in the one end of radiator 4 far from lamp housing 7 simultaneously It is socketed in radiator 4.In one embodiment, the end that pedestal 2 and radiator 4 socket-connect can be equipped with buckle structure, pedestal 2 It can be fastened and connected with radiator 4.There is electrical communication structure, so that the LED driving being set in radiator 4 in pedestal 2 Power supply 3 can be electrically connected with lamp cap 1.

LED drive power 3 is installed between pedestal 2 and radiator 4.One end (input of the LED drive power 3 close to pedestal 2 End) there is input lead 31, input lead 31 is electrically connected via pedestal 2 and lamp cap 1.The close heat dissipation of LED drive power 3 One end (output end) of device 4 has output lead 32, and output lead 32 is formed via radiator 4 and LED lamp panel 5 and is electrically connected. In this way, electric current is conducting to the input lead 31 of LED drive power 3 by lamp cap 1, then by being connected after 3 transformation of LED drive power To the output lead 32 of LED drive power 3, and then LED lamp panel 5 is supplied, lights the LED light source 51 in LED lamp panel 5 luminous.

In some other embodiments, output lead 32 is substituted, one end of the close radiator 4 of LED drive power 3 can be with Columnar protrusions are set, and through conductive processing, this columnar protrusions is connected to conducting glass-fiber-plate for the top outer surface of the columnar protrusions, conducting Glass-fiber-plate is electrically connected with LED lamp panel 5 in turn.In this way, electric current is conducting to the input lead of LED drive power 3 by lamp cap 1 31, then the columnar protrusions by being conducting to LED drive power 3 after 3 transformation of LED drive power, using conducting glass-fiber-plate supply LED lamp panel 5 lights the LED light source 51 in LED lamp panel 5 luminous.In these embodiments, LED drive power 3 and LED lamp panel 5 electrical connections can be completed by welding procedure, i.e., be welded in LED lamp panel 5 on the columnar protrusions of LED drive power 3.

Referring next to Fig. 1 and Fig. 2.The one end of radiator 4 far from lamp housing 7 and pedestal 2 are socketed, the other end far from lamp cap 1 It is connected with LED lamp panel 5.Through hole 42 is offered on radiator 4.32 phase of output lead of through hole 42 and LED drive power 3 It is corresponding, and the output lead 32 of LED drive power 3 can run through this through hole 42 up and down.This sunset foretell, through hole 42 also with The through hole 52 opened up in LED lamp panel 5 is corresponding, so that the output lead 32 of LED drive power 3 can sequentially pass through corresponding pass through Perforation 42 and through hole 52 and LED lamp panel 5, which are formed, to be electrically connected.In addition, radiator 4 is equipped with admittedly far from that one end of lamp cap 1 Determine portion 43, the fixed part 53 being arranged on the fixed part 43 and LED lamp panel 5 and the fixed part 68 being electrically isolated in component 6a are opposite It answers, is connected so that being electrically isolated component 6a with LED lamp panel 5 and radiator 4.

LED lamp panel 5 is installed in radiator 4 close to one end of lamp housing 7, and LED lamp panel 5 can first be covered with electric isolution component 6a It is located in reconfiguration and radiator 4 together.LED lamp panel 5 can be round.At least one LED can be installed in LED lamp panel 5 Light source 51.LED light source 51 can be traditional bracket, rubber shell external form or wafer-level package (Chip ScalePackage) or It is the structure of other encapsulation.In addition, through hole 52 is passed through with radiator 4 as described above, offering through hole 52 in LED lamp panel 5 It perforates 42 corresponding.The output lead 32 of LED drive power 3 can sequentially pass through through hole 42 and through hole 52 and LED lamp panel 5 Form electrical connection.In addition, as described above, be provided with fixed part 53 in LED lamp panel 5, the fixed part of fixed part 53 and radiator 4 Fixed part 68 in 43 and electric isolution component 6a is corresponding, so that being electrically isolated component 6a and LED lamp panel 5 and radiator 4 It is connected.

In one embodiment, above-mentioned through hole 42 regards the output lead of LED drive power 3 with the number of through hole 52 It substantially can be hole corresponding with two output leads 32 of positive and negative electrode depending on 32 number.If LED drive power 3 Also have the function of adjust 51 brightness of LED light source Dimming or other schemes need to increase electrical connection circuit, then conducting wire with And the number for the hole that is corresponding to it can also increase therewith.

Be electrically isolated component 6a socket-connect with LED lamp panel 5 so that the charging member and external electrical in the LED lamp panel 5 every From.Being electrically isolated component 6a may include being electrically isolated unit 6.It is electrically isolated on unit 6 and offers with the light source 51 in LED lamp panel 5 relatively The through-hole 67 ' answered, the light that LED light source 51 is issued pass through these through-holes 67 '.When electric isolution component 6a and LED lamp panel After 5 sockets, it is electrically isolated unit 6 and is covered in LED lamp panel 5, so that the outside of the charging member in LED lamp panel 5 and LED lamp panel 5 Electrical isolation.In one embodiment, electric isolution unit 6 can be with high reflectivity by polycarbonate (PC) etc. Plate is electrically isolated made of electrically insulating material.

Being electrically isolated component 6a can also include light processing unit 61, and light processing unit 61 can be such that LED light source 51 is issued The radiation direction of light changes.After being electrically isolated component 6a and LED lamp panel 5 and being socketed, light processing unit 61 be arranged on electricity every On unit 6, in other words, it is electrically isolated unit 6 and is placed between light processing unit 61 and LED lamp panel 5.Light processing unit 61 can also be body formed with electric isolution unit 6-.

As shown in Figure 3 and Figure 4, light processing unit 61 Overall View is slightly cup-shaped.Light processing unit 61 includes bottom of a cup 6101, cup body 6103 and cup top 6102, cup body 6103 are formed between bottom of a cup 6101 and cup top 6102.Although it is to be understood that Cup-shaped light processing unit 61 is described as having cup top 6102 herein, however, it is understood that in fact, the top of light processing unit 61 It is airbreak, boundary line is seen from longitudinal profile.In the present embodiment, the outer diameter of bottom of a cup 6101 be preferably 16mm~ 20mm, the outer diameter on cup top 6102 are preferably 25mm~29mm.In one embodiment, the lateral surface sideline of cup body 6103 is linear And it forms an angle between the extended surface of bottom of a cup 6101.In one example, which can be 51 degree~73 degree.However, It should be understood that the lateral surface of cup body 6103 is also possible to be conducive to reflective other shapes.

Being electrically isolated component 6a can also include extension 66.Extension 66 is from the 6101 periphery edge of bottom of a cup of light processing unit 61 Cup body 6103 extend outwardly and annular in shape be installed on light processing unit 61.At least one through-hole is offered on extension 66 67.Radially ring is located on extension 66 through-hole 67.These through-holes 67 are corresponding with the LED light source 51 in LED lamp panel 5. Correspondingly, these through-holes 67 are also corresponding with the through-hole 67 ' being electrically isolated on unit 6.LED light is sheathed on when being electrically isolated component 6a After plate 5, the meeting of LED light source 51 in LED lamp panel 5 is extended leading in portion 66 across corresponding through-hole 67 ' on unit 6 is electrically isolated It entangles in hole 67.

In the present embodiment, through-hole 67 can uniformly arrange along the outside of cup body 6013, and but it is not limited to this.Through-hole 67 can To be the shapes such as rectangular opening, circular hole.The depth of each through-hole 67 can be suitable or bigger with the height of LED light source 51.At one In embodiment, the depth of each through-hole 67 can be the 100%~120% of the height of LED light source 51, to ensure that through-hole 67 accords with Light transmittance needed for closing.In addition, the cross-sectional area of each through-hole 67 can be suitable or bigger with the bottom area of LED light source 51. In one embodiment, the cross-sectional area of through-hole 67 can be the 100%~120% of the bottom area of LED light source 51, so that The light that LED light source 51 is issued will not be stopped by through-hole 67.

The mode of LED light source 51 is entangled by the through-hole 67 of extension 66, LED light source 51 is located on the outer of cup body 6103 Side, therefore, when LED light source 51 lights luminous, the light issued can be distributed on the outside of the cup body 6103 of light processing unit 61. It should be noted that in the present embodiment, the lateral surface of cup body 6103 is equipped with reflective surface, so that the light that LED light source 51 is issued Line reflection and towards the lateral direction of cup body 6103 so that the light emitting region distribution of LED light source 51 is greater than 180 degree.

As previously mentioned, 6101 outer diameter of bottom of a cup of light processing unit 61 is preferably 16mm to 20mm, the cup of light processing unit 61 Pushing up 6102 outer diameters is preferably 25mm to 29mm.If 6102 outer diameter of cup top is greater than 29mm, the LED light source in entire LED lamp panel 5 After 51 light, blackening can be generated at the top of lamp housing 7, although can satisfy requirement of the standard to LEDbulb lamp light distribution, Influence the lighting effect of LEDbulb lamp entirety.Furthermore as previously mentioned, the lateral surface sideline of cup body 6103 and prolonging for bottom of a cup 6101 The angle for stretching face can be 51 degree to 73 degree.If angle is less than 51 degree, although can satisfy standard to bulb lamp light emitting region The requirement of distribution, but the light efficiency of LEDbulb lamp entirety can reduce.

With continued reference to Fig. 4, fixed part 68 can also be arranged in the bottom of a cup 6101 of light processing unit 61 by being electrically isolated component 6a. Fixed part 68, which may pass through, is electrically isolated unit 6, and then can be with the fixed part on the fixed part 53 and radiator 4 in LED lamp panel 5 43 is fixed, so that being electrically isolated component 6a can be connected with LED lamp panel 5 and in turn with radiator 4.It should be understood that electricity every Can only have from component 6a and be electrically isolated unit 6 (that is, not including light processing unit 61), in this case, it is possible to being electrically isolated Fixed part 68 is set on unit 6.

In one embodiment, fixed part 68, fixed part 53 and fixed part 43 can be the buckle structure matched, with reality Now it is electrically isolated being fastened and connected for component 6a and LED lamp panel 5 and radiator 4.However, it should be understood that being electrically isolated component 6a, LED lamp panel 5 and radiator 4 can also fix or connect by other means, for example, being connected by screw or silica gel.

When electric isolution component 6a is set-located by fixed part 68 and LED lamp panel 5, the through-hole 67 on extension 66 is proper Corresponding LED light source 51 in LED lamp panel 5 is entangled well.In general, LED lamp panel 5 is equipped with pad, conducting wire etc. Charging member to be electrically connected with LED drive power 3, and also is provided with active or passive block in LED drive power 3, this Sample, after lamp housing 7 is broken, user readily accesses the charging member in LEDbulb lamp and electric shock accidents occurs.In this implementation In example, being electrically isolated unit 6, extension 66 and fixed part 68 can be used electrical isolation design, entirely be electrically isolated component 6a energy as a result, The charging member in LED lamp panel 5 is enough blocked, even if charging member in LED lamp panel 5 will not be exposed after lamp housing 7 is broken, because This, because touching these charging members electric shock accidents will not occur for user.

Referring back to Fig. 1 and Fig. 2, lamp housing 7 is installed in one end that radiator 4 deviates from pedestal 2.Lamp housing 7 can pass through bonding Film is connected with radiator 4.

It is illustrated above LEDbulb lamp according to an embodiment of the invention.According to the LEDbulb lamp of the present embodiment, Light distribution experimental data is as shown in Figure 5.The light distribution of the LEDbulb lamp is in 0 °~135 ° sections as can be seen from Figure 5, 90.5% light intensity measurement (cd) and the average value of all measured values are not more than 25%, the requirement that is above standard (that is, 0 °~135 ° sections, 90% light intensity measurement (cd) cannot be differed with the average value of all measured values more than 25%).In addition, From Fig. 5 it can also be seen that the luminous flux in 135 °~180 ° of sections accounts for the 5.3%-9.5% of total light flux, this is wanted also above standard Ask (that is, in 135 °~180 ° sections, luminous flux should be no less than 5% total light flux).

With reference to Fig. 6 and Fig. 7, LEDbulb lamp according to another embodiment of the present invention is discussed.Fig. 6 show basis The structural schematic diagram being electrically isolated after component, LED lamp panel and radiator assembly of another embodiment of the present invention；Fig. 7 show basis Another embodiment of the present invention is electrically isolated component along the longitudinal sectional drawing of central axis.

The arrangement of LEDbulb lamp in the present embodiment in addition to the LED light source 51 being electrically isolated in component 6b and LED lamp panel 5 Mode is different from the arrangement mode for being electrically isolated component 6a and LED light source 51 of LEDbulb lamp discussed above with reference to Fig. 1~5 Except, remaining component and connection type can be identical as in above-described embodiment, these remaining components include lamp cap 1, pedestal 2, LED drive power 3, radiator 4, LED lamp panel 5 and lamp housing 7.

In order to clear and concise, only these same components are briefly described herein.One end of pedestal 2 is socketed in lamp cap 1 Interior, the other end of pedestal 2 is assemblied in the one end of radiator 4 far from lamp housing 7 and is socketed in radiator 4.LED drive power 3 fills It is located inside pedestal 2 and radiator 4.LED drive power 3 has input lead 31 close to one end of pedestal 2, and input lead 31 passes through It is electrically connected by pedestal 2 and lamp cap 1.One end of the close radiator 6 of LED drive power 3 has output lead 32, output lead 32 form electrical connection via radiator 4 and LED lamp panel 1.The one end of radiator 4 far from lamp housing 7 and pedestal 2 are socketed, far from lamp First 1 other end is connected with LED lamp panel 5.LED lamp panel 5 be installed in radiator 4 close to one end of lamp housing 7 and with electric isolution group Part 6b phase is arranged.Lamp housing 7 is installed in one end that radiator 4 deviates from pedestal 2.

The electrics isolution component 6a for being electrically isolated component 6b and previous embodiment of the present embodiment the difference is that: electric isolution Component 6b includes light processing unit 62, and to substitute light processing unit 61, and light processing unit 62 is in the medial surface of its cup body 6203 Equipped with reflective surface；Be electrically isolated component 6b do not include extension 66 and be opened on extension 66 through-hole 67, but in light processing The bottom of a cup 6201 of unit 62 offers at least one through-hole 67 corresponding with LED light source 51.LED light source in LED lamp panel 5 The 51 radial insides for being located on cup body 6203.The reflective surface of 6203 medial surface of the cup body setting of light processing unit 62 makes The reflection of light that LED light source 51 is issued and towards the interior direction of cup body 6203, to achieve the purpose that optically focused.

Specifically, being electrically isolated component 6b may include being electrically isolated unit 6.It is electrically isolated on unit 6 and offers several through-holes 67 ', the through-hole and the light source 51 in LED lamp panel 5 that these through-holes 67 ' correspond to bottom, the light that LED light source 51 is issued Across these through-holes 67 '.After being electrically isolated component 6b and LED lamp panel 5 is socketed, it is electrically isolated unit 6 and is covered in LED lamp panel 5, So that the charging member in LED lamp panel 5 is isolated with the external electrical of LED lamp panel 5.Equally, being electrically isolated unit 6 can be by such as Plate is electrically isolated made of the electrically insulating materials with high reflectivity such as polycarbonate (PC).

With reference to Fig. 6 and Fig. 7, being electrically isolated component 6b may include light processing unit 62, and light processing unit 62 can make LED light source The radiation direction of 51 light issued changes.After being electrically isolated component 6b and LED lamp panel 5 is socketed, light processing unit 62 can Be electrically isolated on unit 6 with setting, in other words, be electrically isolated unit 6 be placed in light processing unit 62 and LED lamp plate 5 it Between.Equally, light processing unit 62 can also be body formed with electric isolution unit 6-.

The slightly cup-shaped structure of container of 62 Overall View of light processing unit, including bottom of a cup 6201, cup body 6203 and cup top 6202, wherein cup body 6203 is formed between bottom of a cup 6201 and cup top 6202.It should be understood that although cup-shaped light processing unit 61 exists This is described as having cup top 6202, however, it is understood that boundary line is in fact, the top of light processing unit 62 is airbreak See from longitudinal profile.In the present embodiment, the outer diameter of bottom of a cup 6201 is preferably 37mm~40mm, this range is and LED The optimum size range that lamp plate 5 cooperates.In the present embodiment, the medial surface of cup body 6203 is equipped with reflective surface, each LED light source 51 light issued are by the reflective surface reflection of the medial surface of cup body 6203 and towards the interior direction of cup body.In one embodiment In, the medial surface sideline of cup body 6203 is linear and forms an angle between the extended surface of bottom of a cup 6201.In one example, The angle can be 45 degree~75 degree, to reach optimal spotlight effect.However, it should be understood that the medial surface of cup body 6203 can also be with It is the other shapes conducive to optically focused.

The bottom of a cup 6201 of light processing unit 62 offers several and LED light source 51 close to the inner peripheral of cup body 6203 Corresponding through-hole 67.It should be understood that these through-holes 67 are also corresponding with the through-hole 67 ' being electrically isolated on unit 6.Through-hole 67 and logical The number in hole 67 ' is consistent with the number of LED light source 51 in LED lamp panel 5.In one embodiment, LED light source 51 and logical The number in hole 67,67 ' is preferably 4~12, and but it is not limited to this.After electric isolution component 6b is sheathed on LED lamp plate 5, LED Through-hole 67 ' of the meeting of LED light source 51 on electric isolution unit 6 on lamp plate 5, and by the bottom of a cup of light processing unit 62 6201 Corresponding through-hole 67 entangles.

Similarly, through-hole 67 can be the shapes such as rectangular opening, circular hole.The depth of each through-hole 67 can be with LED light source 51 Height it is suitable or bigger.In one embodiment, the depth of each through-hole 67 can be the 100% of the height of LED light source 51 ~120%.In addition, the cross-sectional area of each through-hole 67 can be suitable or bigger with the bottom area of LED light source 51.In a reality It applies in example, the cross-sectional area of through-hole 67 can be the 100%~120% of the bottom area of LED light source 51.

The mode of LED light source 51 is entangled by the through-hole 67 opened up in bottom of a cup 6201, LED light source 51 is located on cup body 6203 Inside, therefore, when LED light source 51 lights luminous, the light that is issued can be along 6203 inside of cup body of light processing unit 62 Distribution.It should be noted that in the present embodiment, the medial surface of cup body 6203 is equipped with reflective surface, so that LED light source 51 is sent out Light out is reflected towards the interior direction of cup body 6203, is less than so that the light emitting region of LED light source 51 is distributed 120 degree.Increase spotlight effect in addition, can also refill on the inside of light processing unit 62 equipped with a condenser.

With continued reference to Fig. 6 and Fig. 7, fixed part can also be arranged in the bottom of a cup 6201 of light processing unit 62 by being electrically isolated component 6b 68.Fixed part 68, which may pass through, is electrically isolated unit 6, and then can be with consolidating on the fixed part 53 and radiator 4 in LED lamp panel 5 It is fixed to determine portion 43, so that being electrically isolated component 6b can be connected with LED lamp panel 5 and in turn with radiator 4.Equally, it answers Understanding, electric isolution unit 6 (that is, not including light processing unit 62) can only be had by being electrically isolated component 6a, in this case, it is possible to Fixed part 68 is set on being electrically isolated unit 6.In addition, fixed part 68, fixed part 53 and fixed part 43 can be the card matched Buckle structure is electrically isolated being fastened and connected for component 6b and LED lamp panel 5 and radiator 4 to realize.It is electrically isolated component 6b, LED lamp panel 5 Also it can fix or connect by other means with radiator 4, for example, being connected by screw or silica gel.

When electric isolution component 6b is set-located by fixed part 68 and LED lamp panel 5, through-hole 67 entangles LED light just Corresponding LED light source 51 on plate 5.In general, LED lamp panel 5 is equipped with the charging member of pad, conducting wire etc., To be electrically connected with LED drive power 3, and active or passive block also is provided in LED drive power 3, in this way, in lamp housing 7 After broken, user readily accesses the charging member in LEDbulb lamp and electric shock accidents occurs.In the present embodiment, electricity every Electrical isolation design can be used from unit 6 and fixed part 68, being entirely electrically isolated component 6b as a result, can block in LED lamp panel 5 Charging member, even if charging member in LED lamp panel 5 will not be exposed, and therefore, user will not be because connecing after lamp housing 7 is broken It contacts these charging members and electric shock accidents occurs.

It should be noted that in the above two embodiments, dependent on the structure for being electrically isolated component 6a or 6b, LED lamp plate LED light source 51 on 5 is located on the outside or inside of the cup body 6103,6203 of light processing unit 61,62.However, the disclosure LEDbulb lamp can also use different designs.

LEDbulb lamp according to another embodiment of the present invention is discussed below with reference to Fig. 8.Fig. 8 is shown according to this hair Bright another embodiment is electrically isolated component along the longitudinal sectional drawing of central axis.

The arrangement of LEDbulb lamp in the present embodiment in addition to the LED light source 51 being electrically isolated in component 6c and LED lamp panel 5 Electric isolution component 6a, 6b of the LEDbulb lamp discussed in mode and above example and the arrangement mode of LED light source 51 are different Except, remaining component and connection type can be identical as in above-described embodiment, and details are not described herein.

The main difference of electric isolution component 6a, 6b of the electric isolution component 6c and previous embodiment of the present embodiment are in In: being electrically isolated component 6c includes light processing unit 63, and the cup body 6303 of light processing unit 63 is non-linear cambered surface, bottom of a cup 6301 be airbreak；LED light source 51 in LED lamp panel 5 is located on the lower section of light processing unit 63.It should be understood that in the present embodiment In, bottom of a cup 6301 is airbreak, i.e., does not have bottom of a cup 6301 actually.The boundary line indicated in Fig. 8 with 6301 is only longitudinal Embodiment in section.It is shown in fig. 8 in addition, being electrically isolated the electric isolution unit 6 that component 6c includes lower than bottom of a cup 6301, But it is arranged between LED light source 51 and cup body 6303 in fact, being electrically isolated unit 6.Although furthermore, it is to be understood that in this cup body 6303 in arc surfaced, however cup body 6303 also can be designed as other shapes.

Specifically, in one embodiment, the cambered surface lateral surface of cup body 6303 is equipped with reflective surface.As electric isolution component 6c When being socketed with LED lamp panel 5, the light processing unit 63 for being electrically isolated component 6c is located at 51 top of LED light source of LED lamp panel 5, i.e. LED LED light source on lamp plate 5 is located on 63 lower section of light processing unit, so that single 51 part of LED light source each of in LED lamp panel 5 Be exposed to light processing unit 63 the outside of cup body 6303, partially immediately below 63 cup body of light processing unit 6303, partial denudation exists 6303 inside of cup body of optical treatment list towering 63.In this way, LED light source 51 is exposed to 6303 outside of cup body of light processing unit 63 The light that part is issued is via the reflective surface reflection of 6303 lateral surface of cup body and towards the outside of cup body 6303；At light The light that the 6303 underface part of cup body of reason unit 63 is issued is due to the refraction of cup body 6303 and along cup body 6303 itself Cambered surface and the bottom of to pushing up outside remittance abroad；Be exposed to light that the part of the inside of cup body 6303 of light processing unit 63 is issued by Blocked in no bottom of a cup 6301 and directive lamp housing 7 directly up.Therefore, the light that each LED light source 51 is issued will divide to three A direction.

In addition, as shown in figure 8, the electric isolution component 6c in the present embodiment can also be in the bottom of a cup of light processing unit 63 Fixed part 68 is set below 6301 periphery, is connected so that being electrically isolated component 6c with LED lamp panel 5 and radiator 4.Together Sample, it should be appreciated that electric isolution unit 6 (that is, not including light processing unit 63) can only be had by being electrically isolated component 6c, in this situation Under, fixed part 68 can be set on being electrically isolated unit 6.

In the present embodiment, by the cambered surface design of the cup body 6303 of light processing unit 63, cup body lateral surface reflective surface The cup body 6303 of design and light processing unit 63 is located at the design of 51 top position of LED light source, can effectively allow LED light The light emitting region distribution in source 51 is greater than 180 degree.

As previously mentioned, bottom of a cup 6301 hollows out, and light processing unit 63 may be disposed at the top of LED light source 51, so that There are three the light-out effects of directionality after the light that LED light source is issued is handled via light processing unit 63.In another implementation In example, 6301 physical presence of bottom of a cup, and in this case, by by light processing unit 63 be arranged above LED light source 51 with So that a part of exposed outside in cup body 6303 of each LED light source 51, a part is in the underface of cup body 6303, each The light that the part in the exposed outside in cup body 6303 of LED light source 51 issues the reflective surface for having 6303 lateral surface of cup body is reflected and Towards the outside of cup body 6303, and will be along cup body 6303 itself by the light that the part of the underface in cup body 6303 issues Cambered surface and the bottom of to pushing up outside remittance abroad.In this way, the light that LED light source 51 is issued has two after handling via light processing unit 63 The light-out effect of each and every one directionality.

In addition, the outer diameter of the bottom of a cup 6301 of light processing unit 63 and the extension arc length of cup body 6303 can also foundations The lighting demand of LEDbulb lamp designs.For example, by adjusting the outer diameter and cup of the bottom of a cup 6301 of light processing unit 63 The extension arc length of body 6303, such as when design 6301 outer diameter of bottom of a cup is smaller, LED light source 51 is exposed to the outside of cup body 6303 Area will be larger, alternatively, design cup body 6303 extension arc length or angle make cup body 6303 shelter from LED light The light that source 51 is issued is more, then the light that the light that LED light source 51 is issued is reflected through the reflective surface of 6303 lateral surface of cup body Line is more, and the brightness of reflection light can be corresponding larger.

As described above, one group of 51 ring-type of LED light source in above embodiments is arranged in LED lamp panel 5.In some embodiments In, two groups of LED light sources also can be set in LED lamp panel 5, form two cyclic annular arrangements, as shown in Figure 9.Have two in LED lamp panel 5 Group LED light source, one group with the diagram of label 51, another group with the diagram of label 511.This two groups of LED light source 51,511 surrounds LED The center of lamp plate 5 is with ring-type arrangement, wherein LED light source 511 is close to the center of LED lamp panel 5, and LED light source 51 is close to LED lamp panel 5 edge.In addition, the part of the arrangement LED light source 511 of LED lamp panel 5 is more a little than the part for arranging LED light source 51 shown in Fig. 9 It is upward, with be electrically isolated component to cooperation.

The LEDbulb lamp that two groups of LED light arrangement as shown in Figure 9 is utilized is discussed below with reference to Figure 10-11.Figure 10 It is respectively shown in Figure 11 and is electrically isolated component along the longitudinal sectional drawing of central axis for embodiment according to the present invention.

As shown in Figure 10, the LEDbulb lamp in the present embodiment is in addition to the LED in electric isolution component 6d and LED lamp panel 5 Electric isolution component 6a, 6b, 6c and LED light source of the LEDbulb lamp discussed in the arrangement mode and above example of light source 51 Except 51 arrangement mode is different, remaining component and connection type can be identical as in above-described embodiment, no longer superfluous herein It states.

In the present embodiment, being electrically isolated component 6d includes light processing unit 64, and cup body 6403 is non-linear cambered surface, Through-hole 67 corresponding with the LED light source 511 in LED lamp panel 5 is offered in bottom of a cup 6301.It may be noted that being electrically isolated on unit 6 Offer through-hole 67 ' corresponding with the LED light source 511 in LED lamp panel 5.Although furthermore, it is to be understood that being in this cup body 6403 Arc surfaced, however cup body 6403 also can be designed as other shapes.

In one embodiment, reflective surface only is set on 6403 lateral surface of cup body.In this case, as electric isolution component 6d When being set in LED lamp panel 5 as shown in Figure 9, first group of LED light source 511 is located on the inside of cup body 6403.First group of LED The light that light source 511 issues can pass through the corresponding through-hole 67 ' and through-hole 67 for being electrically isolated and opening up in unit 6 and bottom of a cup 6403, directly Connect directive lamp housing 7.In addition, second group of LED light source 51 is located at 64 lower section of optical treatment portion, so that the LED light source in the group 51 Divide 6403 outside of cup body for being exposed to optical treatment portion 64, partially in the underface of cup body 6403.At this point, LED light source 51 is exposed The light that part in 6403 outside of cup body of light processing unit 64 is issued is anti-via the reflective surface of 6403 lateral surface of cup body It penetrates and towards the lateral direction of cup body 6403；LED light source 51 is located at the part immediately below the cup body 6403 of light processing unit 64 The light issued along cup body 6403 itself cambered surface and the bottom of to pushing up outside remittance abroad.

It should be understood that all settable reflective surface on 6403 lateral surface of cup body and medial surface.In this case, as above identical, it is right In first group of LED light source 51 for being located at 64 lower section of optical treatment portion, each LED light source 51 is exposed to the cup of light processing unit 64 The light that the part in the outside of body 6403 is issued is via the reflective surface reflection of 6403 lateral surface of cup body and towards cup body 6403 Lateral direction, the light that the part that LED light source 51 is located at 6403 underface of cup body of light processing unit 64 is issued is along cup body 6403 cambered surface and the bottom of to pushing up outside remittance abroad.Meanwhile the LED light source 511, Mei Geguang of the inside for being located on cup body 6403 The light that source 511 issues is by the reflection of the reflective surface of the medial surface through cup body 6403 and towards the interior direction of cup body 6403.It is this Arrangement, can bring another lighting effect.

In addition it is also possible to which reflective surface only is arranged on the medial surface of cup body 6403.In this case, for being located on cup body The LED light source 511 of 6403 inside, the light that each light source 511 issues will be emitted directly toward lamp housing 7.Meanwhile for being located at optics The LED light source 51 of the lower section of processing unit 64, the light that each light source 51 issues by along the cambered surface of cup body 6403 itself from bottom Xiang Dingxiang Outer remittance abroad.This arrangement can bring another lighting effect.

Next another embodiment that the LEDbulb lamp of two groups of LED light arrangement as shown in Figure 9 is utilized is discussed, please join Examine Figure 12.

It includes light processing unit 65 that component 6e is electrically isolated in the present embodiment, and the side sideline of cup body 6503 is straight line, Through-hole 67 corresponding with the LED light source 511 in LED lamp panel 5 is offered in bottom of a cup 6501.It is also wrapped in addition, being electrically isolated component 6e Extension 66 is included, through-hole 67 corresponding with the LED light source 51 in LED lamp panel 5 is offered on extension 66.In LED lamp panel 5 LED light source 51,511 can be located on simultaneously optical treatment portion 64 cup body 6403 outside and inside.It may be noted that being electrically isolated single Also offer through-hole 67 ' corresponding with the LED light source 511 in LED lamp panel 5 in member 6, these through-holes 67 ' also with bottom of a cup 6501 And the through-hole 67 on extension 66 is corresponding.Furthermore, it is to be understood that although the side sideline in this cup body 6503 is linearly, However cup body 6503 also can be designed as other shapes.

In one embodiment, reflective surface only is set on 6503 lateral surface of cup body.In this case, as electric isolution component 6e When being set in LED lamp panel 5 as shown in Figure 10, first group of LED light source 511 is located on the inside of cup body 6503.First group of LED The light that light source 511 issues can pass through the corresponding through-hole 67 ' and through-hole 67 for being electrically isolated and opening up in unit 6 and bottom of a cup 6503, directly Connect directive lamp housing 7.In addition, second group of LED light source 51 is located on the outside of cup body 6503, so that the light that LED light source 51 issues By the reflective surface reflection of cup body lateral surface towards the lateral direction of cup body.

It should be understood that reflective surface can be respectively provided on 6503 lateral surface of cup body and medial surface.In this case, ring is set LED light source 511 in the inside of cup body 6503, the light that each LED light source issues court by the reflective surface reflection through medial surface To the interior direction of cup body 6503.Meanwhile the LED light source 51 in the outside for being located on cup body 6503, each LED light source hair Light out is by the reflective surface reflection through medial surface and towards the lateral direction of cup body 6503.This arrangement can be brought another Kind lighting effect.

In addition, reflective surface only can also be arranged in the medial surface of cup body 6503.In this case, for being located on cup body The LED light source 511 of 6503 inside, the light that each LED light source issues will be reflected through the reflective surface of 6503 medial surface of cup body and Towards the interior direction of cup body 6503.Meanwhile the LED light source 51 in the outside for being located on cup body 6503, each LED light source hair Light out will be along the straight sided of cup body 6503 itself and the bottom of to the outside remittance abroad in top.This arrangement can bring another Lighting effect.

In the above arrangement, can by design cup body 6503 lateral surface or medial surface and the extended surface of bottom of a cup 6501 it Between angle adjust the direction of the light on the outside of cup body.

It should be noted that electric isolution component 6d, 6e in above-described embodiment also can as aforementioned electric isolution component 6b that Sample the bottom of a cup 6401,6501 of light processing unit 64,65 lower section be arranged fixed part 68 so that be electrically isolated component 6d, 6e with LED lamp panel 5 and radiator 4 are connected.It equally, (does not include light processing being electrically isolated component 6c only there is electric isolution unit 6 Unit 64,65) in the case where, can be electrically isolated unit 6 on be arranged fixed part 68.Fixed part 68 can use buckle structure, It is fastened and connected with realizing.

Through-hole when electric isolution component 6d, 6e is set-located by fixed part 68 and LED lamp panel 5, in bottom of a cup 6403 67 or bottom of a cup 6503 and extension 66 on through-hole 67 entangle in LED lamp panel 5 just corresponding two groups of LED light sources 51 or Two groups of LED light sources 51 and 511.In embodiment as above, being electrically isolated unit 6, extension 66 and fixed part 68 can be used electricity absolutely Edge design, the charging member in LED lamp panel 5 can be blocked by being entirely electrically isolated component 6d, 6e as a result, even if after lamp housing 7 is broken, Charging member in LED lamp panel 5 will not be exposed, and therefore, user will not get an electric shock because touching these charging members Accident.

Furthermore, it is to be understood that electric isolution unit 6, light processing unit 61/62/63/64/65, extension in the various embodiments described above Portion 66 and fixed part 68 can be integrally formed.They can be up to 92% or more PC plastic material using reflectivity, can also With the material of high reflectance for being metal material applying surface electroplating processes and being formed.

The signal of adhesive film is coated with shown in Figure 12 between lamp housing according to an embodiment of the invention and radiator Figure.In the above embodiments, in the inner peripheral surface or outer peripheral surface of lamp housing 7 or it can be coated between radiator 4 one layer of adhesive film, The outside of lamp housing 7 is isolated with inside when lamp housing 7 ruptures.

The material of adhesive film 8 can allow organic solvent and carried out reconciliation appropriate based on calcium carbonate or strontium phosphate.At one In embodiment, the constituent of adhesive film 8 includes vinyl-terminated silicone fluid, containing hydrogen silicone oil, dimethylbenzene and calcium carbonate.

In these ingredients, dimethylbenzene is auxiliary agents, when adhesive film 8 is coated in the inner peripheral surface or outer peripheral surface of lamp housing 7 And after solidifying, dimethylbenzene can be vapored away, and effect mainly adjusts viscosity, and then to adjust the thickness of adhesive film.

The selection of the thickness of adhesive film 8 and the total weight of LEDbulb lamp are related.When filling heat-conductive glue (encapsulating in radiator 4 Glue) (contain at least 70% 0.7~0.9W/m*K heat-conducting glue) when, the total weight of LEDbulb lamp is greater than 100 grams, glues at this time The thickness for connecing film 8 can be between 200 μm~300 μm.

When radiator 4 is not injected into heat-conducting glue, the total weight of LEDbulb lamp approximately is less than 80 grams, at this time adhesive film 8 Thickness can be 40 μm~90 μm, such thickness be can produce explosion-proof promotion effect.The lower limit and LED ball of thickness steep The total weight of lamp is related, but must consider explosion-proof problem, and the upper limit of thickness is greater than 300 μm and light transmittance can be made insufficient, increases material Expect cost.

After lamp housing 7 is broken, adhesive film 8 can link together the fragment of lamp housing 7, be not easy to be formed inside perforation lamp housing 7 With external hole, to prevent user from touching electrical body lamp housing 7 inside, to avoid generation electric shock accidents.

In addition, LEDbulb lamp of the invention also optionally coats one layer of diffusion in the inner peripheral surface or outer peripheral surface of lamp housing 7 Film, to reduce granular sensation when user sees LED light source 51.In addition, this diffusion barrier in addition to have the effect of spread light it Outside, moreover it is possible to play the role of electric isolution, so that reducing the risk of user's electric shock when lamp housing 7 ruptures.In addition, this expansion Scattered film can make LED light source 51 when luminous, and light is made to generate diffusion, toward projecting from all directions, avoid the top shape in lamp housing 7 At dark space, the illumination comfort of room for promotion.

The main component of diffusion barrier may include at least one of calcium carbonate, calcium halophosphate activated by antimony andmanganese and aluminium oxide or its group It closes.When being formed by diffusion barrier using calcium carbonate collocation solution appropriate, (will have an opportunity to reach with excellent diffusion and light transmission To 90% or more) effect.In one embodiment, the constituent of diffusion barrier includes calcium carbonate (such as CMS-5000, white Powder), thickener (such as thickener DV-961, milky white liquid) and ceramics activated carbon (such as ceramic active carbon SW-C, nothing Color liquid).The entitled colloidal silicon dioxide denaturing acrylamide acid resin of chemistry of thickener DV-961, is attached at for increasing calcium carbonate Stickiness when 7 inner peripheral surface of lamp housing or outer peripheral surface, component include acrylic resin, silica gel and pure water.

In one embodiment, diffusion barrier is using calcium carbonate as main material, and thickener of arranging in pairs or groups, ceramic active carbon and go from Sub- water is coated on the inner peripheral surface or outer peripheral surface of lamp housing 7 after the mixing of these materials, and the average thickness of coating falls in 20 μm~30 μ Between m, last deionized water be will volatilize, only three kinds of remaining calcium carbonate, thickener and ceramic active carbon substances.When selection is different When the diffusion barrier of material composition, have in one embodiment, diffusion barrier thickness range can be used for 200 μm~300 μm, and Light transmittance controls between 92%~94%, this also has another kind of effect.

In other embodiments, calcium halophosphate activated by antimony andmanganese can also be selected or aluminium oxide is the main material of diffusion barrier, calcium carbonate The partial size of particle is about fallen between 2 μm~4 μm, and the partial size of the particle of calcium halophosphate activated by antimony andmanganese and aluminium oxide about respectively falls in 4 μm Between~6 μm between 1 μm~2 μm.When the claimed range of light transmittance falls in 85%~92%, entirety is main with calcium carbonate The average thickness that the diffusion barrier of material need to coat is about at 20 μm~30 μm, in identical light transmittance requirement range (85%~92%) Under, calcium halophosphate activated by antimony andmanganese is that the average thickness that the diffusion barrier of main material need to coat can fall in 25 μm~35 μm, and aluminium oxide is main material The average thickness that the diffusion barrier of material need to coat can fall in 10 μm~15 μm.If light transmittance demand is higher, such as 92% or more, then It is then needed using calcium carbonate, calcium halophosphate activated by antimony andmanganese or aluminium oxide as the diffusion film thickness of main material thinner.For example, with calcium carbonate for main material The average thickness of its coating of the diffusion barrier of material need to be fallen between 10 μm~15 μm.That is, using field according to LEDbulb lamp It closes, and selects different light transmittance demands, that is, main material, the corresponding formation thickness etc. of the diffusion barrier to be coated may be selected Deng.

In addition, LEDbulb lamp of the present invention also forms the reflection of one layer of thin layer on 7 inner peripheral surface top of lamp housing to the property of can choose Some light at the top of LED light source 51 upwards transmitting to lamp housing 7 is turned to side by film.Reflectance coating 9 can be based on barium sulfate Material, be blended in thickener, 3% ceramic active carbon and deionized water inside.In one embodiment, the concentration of barium sulfate It can be 45%-55%, 9 average thickness of reflectance coating formed at this time is fallen between 20 μm~30 μm.The grain of the particle of barium sulfate Diameter is about fallen between 20 μm~30 μm.When reflectance coating 9 coat average thickness about at 17 μm~20 μm when, light transmittance about may be used Reach 97~98%, that is, about when the side for having 2% light irradiated upwards that can be turned to LEDbulb lamp by reflection.

It should be noted that the purpose of coating reflectance coating 9 is to allow light to strike barium sulfate particle and reflection effect occurs later It answers, there is no need to entire lamp housing 7 is all coated reflectance coating 9.As shown in figure 13, in be to the central axis of lamp housing 7 from lamp cap 1 The heart, reflectance coating 9 by from two side of central axis it is rough it is of the same area in a manner of coat, that is to say, that 9 meeting of reflectance coating after coating In the circular arc camber symmetrical along central axis, and the range being coated with can be between the certain angle of central axis.At one In embodiment, this angle can be 0 degree~60 degree.Preferably, this angle can be 0 degree~45 degree.In addition, when selected anti- Penetrate 9 solution of film concentration it is higher when, 9 thickness of reflectance coating of required coating be then not required to it is too thick, certainly, if light transmittance only needs to reach 95%, that is, have light that 5% irradiates upwards and can be steeped the side of lamp by reflection steering ball LED, sulfuric acid can be used at this time The concentration of barium solution is about 55%~60%, and the thicknesses of layers of reflectance coating is fallen between 25 μm~30 μm.In addition, due in lamp housing Top, the light luminance that light is distributed between 0 degree from center line axis~60 degree are the forms that degree tapers off from 0 degree to 60, therefore, The thicknesses of layers of reflectance coating can by 0 degree from central axis place it is most thick, and slowly outward successively decrease, until 60 degree from central axis it Locate most thin.

LEDbulb lamp shown in Fig. 1 to Figure 13 may include one or more LED filaments, may replace LED lamp panel 5, LED Light source 51 and other related elements.Majority element in LEDbulb lamp with LED filament can be with the LED of Fig. 1 to Figure 13 The element of bulb lamp shares.For example, the lamp housing 7 of LEDbulb lamp shown in Fig. 1 to Figure 13 can be with the LED ball with LED filament The lamp housing for steeping lamp shares.The lamp housing of LEDbulb lamp with LED filament also may include adhesive film 8 as described above and reflection Film 9.Explanation has the LEDbulb lamp of LED filament below.

Figure 14 A and 14B are please referred to, Figure 14 A and 14B are the first embodiment and second embodiment of LEDbulb lamp 20a, 20b Structural schematic diagram.In figure as can be seen that LEDbulb lamp 20a, 20b include lamp housing 12, lamp cap 16, in lamp housing 12 extremely Few two conducting bracket 51a, 51b, the driving circuit 518 in lamp cap and single LED filament 100.

Conducting bracket 51a, 51b are for electrically connecting to two electrodes 506 of LED filament 100, also can be used for supporting LED light The weight of silk 100.Driving circuit 518 is that electric connection conducting bracket 51a, 51b and lamp cap 16, lamp cap 16 are connected to traditional ball When steeping the lamp holder of lamp, lamp holder is to provide lamp cap 16 power supply, and driving circuit 518 is after obtaining power supply from lamp cap 16 to drive this LED filament 100 shines.Due to the LED filament 100 after being specifically designed (record in detail as after) can complete cycle face it is luminous, because This, entire LEDbulb lamp 20a, 20b can generate complete cycle light.In the present embodiment, the setting of driving circuit 518 is steeped in LED ball Within lamp.However, in some embodiments, driving circuit 518 is arranged except LEDbulb lamp.

In the embodiment of Figure 14 A, conducting bracket 51a, 51b but are not limited thereto, visual LED for two The conduction or supportive demand of filament 100 and accelerate.

Lamp housing 12 is to can be used that translucency is preferable or the preferable lamp housing of thermal conductivity, such as, but not limited to glass or plastic lantern Shell.When implementation, it can also be adulterated in lamp housing 12 and plate one layer of yellow film with golden yellow material or lamp housing surface, to inhale in right amount The blue light that receiving portions LED chip 102,104 is issued, to reduce the colour temperature of LEDbulb lamp 20a, 20b emitted light.Production When, the gas in lamp housing 12 can be changed to by the nitrogen and helium or hydrogen and helium that nitrogen or proper proportion mix using vacuum pump The gaseous mixture of gas so that the heat transfer of the air in lamp housing 12 is more preferably, and removes the aqueous vapor of air in lamp housing.It is filled in lamp housing Air in 12, which can be, to be mainly selected from least one in the group as composed by helium, hydrogen, and hydrogen accounts in lamp housing 12 always The percent by volume of capacity can be 5% to 50%, and the air pressure in lamp housing 12 can be 0.4 to 1.0 atmospheric pressure.Lamp housing 12 Above-mentioned setting can be applied to lamp housing 7 shown in Fig. 1 to Figure 13.In addition, lamp housing 12 can also be identical or similar to Fig. 1 to figure Lamp housing 7 shown in 13, such as lamp housing 12 also may include gluing film 8 and reflectance coating 9.Gluing film has explosion-proof purposes.Work as lamp When shell 12 is broken, gluing film can stick together the fragment of lamp housing 12, and lamp housing 12 is avoided to generate notch, internal to prevent user from accidentally touching Element and get an electric shock.Reflectance coating has the purposes of reflection light, and reflectance coating can reflect, such as reflectance coating may be disposed at out light Shi Guang Light is reflexed to the less place of light by the place that line is more concentrated.

In the embodiment of Figure 14 A and 14B, LEDbulb lamp 20a, 20b further includes stem 19 and radiating subassembly 17, stem 19 are set in lamp housing 12, and radiating subassembly 17 is between lamp cap 16 and lamp housing 12 and connects stem 19.In the present embodiment, lamp cap 16 be to be indirectly connected with lamp housing 12 through radiating subassembly 17.In other embodiments, lamp cap 16 can be directly connected to lamp housing 12 and not have There is radiating subassembly 17.LED filament 100 connects stem 19 via conducting bracket 14a, 14b.Stem 19 can be used to substitute LED ball bubble Air in lamp 20b changes the mixed gas of nitrogen and helium into.Thermally conductive function can also be provided in stem 19, will connect stem 19 LED filament 100 heat transfer cause lamp housing 12 except.Radiating subassembly 17 can be the hollow column being open around lamp housing 12, It connects stem 19 and lamp cap 16 and transmitted it be thermally conducted to except LEDbulb lamp 20b.The inside of radiating subassembly 17 can It is installed with driving circuit 518, the gas in the external contact external world of radiating subassembly 17 has conducted heat.It can in the material of radiating subassembly 17 Select metal, ceramics or the high thermal conductivity plastics with good heat conductive effect.Radiating subassembly 17 (together with LEDbulb lamp opening/ Screw socket) material can also be the ceramic material with good heat conductive effect, radiating subassembly 17 can also be integrated with ceramic stem 19 The component of forming, the lamp cap that can so remove LEDbulb lamp from need to be glued with radiating subassembly 17 and increase LED filament 100 and radiate The thermal resistance in path, to have better heat dissipation effect.

Figure 14 A is please referred to, the height of radiating subassembly 17 is L1, and the height at 17 bottom of radiating subassembly to 12 top of lamp housing is The range of the ratio (L1/L2) of L2, L1 and L2 is 1/30 to 1/3.The ratio is smaller, then the light out of LEDbulb lamp 20a, 20b Angle be the light that is issued of bigger, LEDbulb lamp 20a, 20b by radiating subassembly 17 hide we i.e. less and LEDbulb lamp The distribution for the light that 20a, 20b are issued is i.e. closer to complete cycle light.Figure 14 B is please referred to, in the embodiment of Figure 14 B, LED filament 100 be bent into about 270 degree of circle, and 100 ontology of LED filament it is wave-shaped it is convex with it is recessed, and be to maintain that its is wavy Shape.That is, working as the above view, the profile of LED filament 100 presents round；When with side elevation, LED filament 100 profile presents wavy.In different embodiments, when the above view, wave can be presented in the profile of LED filament 100 Shape or petal-shaped；It is wavy or linear when being presented with the profile of side elevation, LED filament 100.In order to more suitably support LED filament 100, LEDbulb lamp 20b further include multiple cantilevers 15, connect and support LED filament 100.In this example, LEDbulb lamp 20b separately may include multiple cantilevers 15, these cantilevers 15 are respectively to be supported in the wavy ontology of LED filament 100 Wave crest at trough at.In the present embodiment, it is about 270 degree that LED filament 100, which is formed by radian,.However, in other realities It applies in example, it is about 360 degree that LED filament 100, which is formed by arc,.In other embodiments, LED bulb lamp 20b may include two or More LED filaments 100.For example, LEDbulb lamp 20b may include two LED filaments 100 and each LED filament is bent into about The arc (semicircle) of 180 degree, the LED filament 100 of the two semicircles will form about 360 degree of circle.By adjustment LED filament 100 It is formed by arc, LED filament 100 can provide complete cycle light.Further, integrated filamentray structure can simplify manufacture and assembly program And reduce overall cost.In the present embodiment, stem 19 includes vertical pole (not labeled), and vertical pole is located at the central axis of lamp cap 16 On or vertical pole be located on the central axis of LEDbulb lamp 20b.

Traditional LED lamp silk usually has substrate, but LED filament 100 does not have any substrate then.Therefore, LED filament 100 It can be convenient for bending to form exquisite curve and changeable shape, connection electrode 506 in the structure and LED filament 100 of electrode 506 With the conducting wire Shi Qiang Tough of LED, therefore LED filament 100 bend when can avoid damage.The details of LED filament 100 is by Yu Houxiang It states.

In some embodiments, cantilever 15 and stem 19 can be coated with the material of high reflection property, such as, but not limited to White material.Further, it is contemplated that heat dissipation characteristics, the material of the high reflection property, which can choose, has together high-heating radiation absorption characteristic Material, such as, but not limited to graphene (Graphene).Specifically, the surface of cantilever 15 and stem 19 can be coated with graphite Alkene film.

Figure 14 C is please referred to, Figure 14 C is the structural schematic diagram of the 3rd embodiment of LEDbulb lamp 20c.Implement according to third Example, LEDbulb lamp 10c include lamp housing 12, connect the lamp cap 16 of lamp housing 12, at least two conducting bracket 51a in lamp housing 12, 51b, driving circuit 518, cantilever 15, stem 19 and single LED filament 100.Driving circuit 518 is electrically connected to conductive branch Frame 51a, 51b and lamp cap 16.The upright bar 19a that stem 19 separately extends perpendicularly to 12 center of lamp housing with one, upright bar 19a are located at lamp cap On 16 central axis or vertical pole 19a is located on the central axis of LEDbulb lamp 20c.Multiple cantilevers 15 are located at vertical pole 19a Between LED filament 100, these cantilevers 15 are used to support LED filament 100 and LED filament 100 can be made to maintain preset song Line and shape.Each cantilever 15 includes opposite first end and second end, and the first end of each suspended wall 15 is connected to upright bar 19a, and the second end of each cantilever 15 is connected to the LED filament 100.

In the present embodiment, the sectional dimension of LED filament 100 can be less than the LED filament 100 in Figure 14 A and Figure 14 B Sectional dimension.The electrode 506 of LED filament 100 is electrically connected to conducting bracket 51a, 51b, to receive from driving circuit 518 Electric power.Connection relationship between electrode 506 and conducting bracket 51a, 51b can be mechanical compression connection, can also be It is welded to connect, the mechanical connection, which can be, first passes through the perforation 506h of electrode 506 (as schemed conducting bracket 51a, 51b Shown in 15A), then the free end of reflexed conducting bracket 51a, 51b, so that conductive branch 51a, 51b clamps electrode 506 and forms electricity Property connection.Welded type connection can be in the way of silver-base alloy weldering, silver soldering, WU weldering etc. conducting bracket 51a, 51b and Electrode 506 connects.

Similar to first and second embodiment shown in Figure 14 A and Figure 14 B, 100 bent of LED filament shown in Figure 14 C At the profile in the top view of Figure 14 C.In the embodiment of Figure 14 C, LED filament 100 is bent to form wavy in side view. The shape of LED filament 100 is novel, and makes to illuminate more uniform.In contrast to the LED bulb lamp with multiple LED filaments, Single LED filament 100 has less contact.On the implementation, single filament 100 only has the contact there are two connection, therefore Reduce a possibility that generating flaw because of welding or mechanical crimp.

In some embodiments, in LEDbulb lamp (such as the LED bulb lamp of the LEDbulb lamp 20b and Figure 14 C of Figure 14 B Four quadrants, i.e. first quartile, the second quadrant, third quadrant and fourth quadrant can be defined in top view 20c).This four The origin of a quadrant may be defined as center (such as the stem 19 of Figure 14 B of the stem or vertical pole of LEDbulb lamp in top view The top center of the vertical pole 19a of the top center or Figure 14 C of vertical pole).LED filament (such as Figure 14 B and Figure 14 C of LEDbulb lamp LED filament 100) can be presented in top view annular structure, shape or profile.It is presented in four quadrants in top view LED filament can have symmetry.For example, LED filament position can be symmetrical with LED filament position second in the part of first quartile The part of quadrant, third quadrant or fourth quadrant.In other words, LED filament be presented in top view first quartile structure, Shape or profile, be presented in top view with LED filament the structure of the second quadrant, third quadrant or fourth quadrant, shape or Profile is symmetrical mutually.The LED filament being presented in four quadrants of top view can be point symmetry (such as according to four-quadrant The origin symmetry of limit) or line is symmetrically (such as symmetrical according to one of two axis of four-quadrant).

The symmetrical structure of LED filament in four quadrants of top view can have the error of 20%-50%, for example, When LED filament first quartile partial symmetry in LED filament when the part of the second quadrant, LED filament first as There is a specified point on the part of limit, and LED filament has one to be symmetrical with the symmetrical of this specified point on the part of the second quadrant Point, this specified point have a first position, this symmetric points has a second position, and first position and the second position can be completely Error that is symmetrical or having 20%-50%.For example, LED filament is in the position of a specified point of the part of first quartile (x₁,y₁), and in the case where full symmetric, LED filament is symmetrical with the symmetrical of this specified point in one of the part of the second quadrant The position of point is (- x₁,y₁)；If in the case where there is 20%-50% error, one in the part of the second quadrant of LED filament The position for being symmetrical with the symmetric points of this specified point is then (- x₂,y₂), wherein x₁With x₂Between may have the difference of 20%-50% Value, and y₁With y₂Between may also have the difference value of 20%-50%.

In addition, length of the LED filament in the wherein part of a quadrant can be approximately equal to LED filament in top view Length in the part of another quadrant.Length of the LED filament in the part of different quadrants can also have the mistake of 20%-50% Difference.Wherein, the length can be the LED filament length that direction extends axially along.

In some embodiments, in LEDbulb lamp (such as the LED bulb lamp of the LEDbulb lamp 20a and Figure 14 C of Figure 14 A Four quadrants can be defined in side view 20c), in this case, vertical pole in LEDbulb lamp (such as Figure 14 C The vertical pole 19a of LEDbulb lamp 20c) it may be defined as Y-axis, and X-axis can then traverse the center of vertical pole, at this time four quadrants Origin then defines the center for founding pole thus, that is, the crosspoint of X-axis and Y-axis.LED filament position is in first quartile and the second quadrant The part of (i.e. two quadrants in top) can be in structure symmetrical (such as symmetrical as the line of line of symmetry using Y-axis).LED filament position exists The part of third quadrant and fourth quadrant (i.e. two quadrants in lower section) can also can be symmetrical in structure (such as using Y-axis as line of symmetry Line it is symmetrical).In addition, in side view, LED filament is presented on the part of two quadrants in top and LED filament is presented on lower section The part of two quadrants be then it is asymmetric, specifically, it is not that LED filament, which is presented on first quartile and the part of fourth quadrant, Symmetrically, and LED filament is presented on the second quadrant and the part of third quadrant is asymmetric.

The symmetrical structure of LED filament in the first quartile and the second quadrant of side view can have 20%-50%'s Error, for example, LED filament has a specified point on the part of first quartile, and LED filament has on the part of the second quadrant One is symmetrical with the symmetric points of this specified point, this specified point has a first position, this symmetric points has a second position, and first Position and the second position can be error that is full symmetric or having 20%-50%.The meaning of error can refer to above herein It records.

In addition, in side view, length of the LED filament in the part of first quartile can be approximately equal to LED filament The length of the part of two quadrant.In side view, length of the LED filament in the part of third quadrant can be approximately equal to LED lamp Length of the silk in the part of fourth quadrant.However, in side view, LED filament is in the part of first quartile or the second quadrant Length can be different from LED filament in the length of third quadrant or the part of fourth quadrant.In some embodiments, in side view In, length of the LED filament in third quadrant or the part of fourth quadrant can be less than LED filament in first quartile or the second quadrant Partial length.In side view, LED filament is in the length or LED filament of the part of first quartile or the second quadrant The length of the part of three quadrant or fourth quadrant can also have the error of 20%-50%.

It please also refer to Figure 15 A and Figure 15 B, Figure 15 A is the three-dimensional partial cutaway of the utility model LED filament first embodiment Face schematic diagram, Figure 15 B are the partial cutaway schematic of the position 15B-15B in Figure 15 A.According to first embodiment, LED filament 100 Including multiple 102,104, at least two electrodes 506 of LED chip and light conversion layer 420, (in a particular embodiment, light is converted Layer can be referred to as glue-line or layer of silica gel), the fluorescent powder 424 in light conversion layer 420 can absorb certain radiation (such as light) and issue light Line.For light conversion layer 420 in this as a kind of envelope body, this envelope body is coated on array made of multiple LED chips 102,104 arrange With at least two sides of electrode 506, a part of each electrode 506 can be exposed at except the envelope body.Wherein, electrode 506 exposes to the open air Part except light conversion layer 420 (envelope body) can be fixed to LED bulb lamp 20a, 20b as shown in figure 14 a to Figure 14 c, On conducting bracket 51a, 51b in 20c.Light conversion layer 420 includes glue 422 and fluorescent powder 424.

LED filament 100 can emit beam, after its electrode 506 is powered (voltage source or current source) with this reality For applying example, the light issued can be essentially 360 degree of the light close to point light source；By the utility model embodiment LED filament is applied to bulb lamp (for example, LEDbulb lamp 20a and 20b of Figure 14 A and Figure 14 B), then can issue complete cycle light (omnidirectional light), is detailed later.

As can be seen that the cross sectional shape of the LED filament 100 of the utility model is rectangle, but LED filament from Figure 15 A 100 cross sectional shape is not limited thereto, and can also be triangle, circle, ellipse, polygon either diamond shape, or even also It is rectangular to can be use, but chamfering or fillet can be used in corner.Section can refer to being located at for the LED filament 100 of Figure 15 A herein The part and expose to the open air that electrode 506 divides into electrode 506 within light conversion layer 420 have been crossed in the end face in left side, this end face Part except light conversion layer 420.

LED chip 102,104 can be single LED chip, be also possible to two LED chips, naturally it is also possible to be to include Plurality of LEDs chip is equal to or more than three LED chips.In the present embodiment, LED chip 102,104 can be un-encapsulated LED grain (LED die).The shape of LED chip can be, but not limited to long strip type, and the chip of long strip type can have less electricity The chance of masking LED emitted light is reduced in pole.In addition, the surface of LED chip 102,104 can plate one layer it is conductive Transparent indium-tin-oxide (Indium Tim Oxide, ITO), the electric current which facilitates LED chip uniformly expands Dissipate distribution and improving luminous efficiency.

LED chip 102,104 may include sapphire substrate or transparent substrate, in this way, the base of LED chip 102,104 Plate will not block the light issued from LED chip 102,104.In other words, LED chip 102,104 can be by LED chip 102,104 every side issues light.

In the present embodiment, such as Figure 15 A institute of the electrical connection between multiple LED chips 102,104 and electrode 506 Show.It is electrically connected with each other between described two or multiple LED chips 102,104, by taking this embodiment as an example, each LED chip 102, 104 are electrically connected for series system, and position is electrically connected in the LED at LED chip 102,104 array both ends in electrode 506 Chip 102.However.The electric connection mode of LED chip 102,104 is not limited thereto, also can be used it is first in parallel after it is concatenated Mode is electrically connected, such as, but not limited to every two LED chip 102,104 it is first in parallel after, chip 102 after each two parallel connections, 104 connect again.

In the present embodiment, electrode 506 is metal electrode, but not limited to this.Electrode 506 correspond to LED chip 102, 104 configurations, and it is electrically connected LED chip 102,104.According to the present embodiment, electrode 506 is the LED chip being configured at after series connection 102, a part at 104 both ends, each electrode 506 exposes to except light conversion layer 420.Electrode 506 corresponds to LED chip 102, the mode of 104 configurations is not limited thereto.Please arrange in pairs or groups Figure 15 A, and electrode 506 can have a perforation in its exposed area 506h is electrically connected when being assembled in LEDbulb lamp, to provide conducting bracket 51a, 51b.

Referring again to Figure 15 A to 15B, according to the present embodiment, electric connection above-mentioned is electrically connected by conducting wire 504 Adjacent LED chip 102,104 and electrode 506, conducting wire 504 can be gold thread, and the routing system of LED encapsulation can be used in conducting wire 504 Gold thread is connected adjacent LED chip 102,104 and electrode 506 by journey, and the processing procedure of this routing can be carried out using Q-type mode Routing.In one embodiment, between adjacent two LED chips 102,104 and in electrode 506 and corresponding LED chip The meeting of conducting wire 504 physical relief between 102 is arched.It can be seen that from Figure 15 B, the shape of the conducting wire 504 is in M font, this M Font conducting wire 504 makes the conducting wire 504 be in non-tight state, provides buffering effect, when LED filament 100 is bent, conducting wire 504 will not be broken.The shape of conducting wire 504 is also not limited to M font, any shape that can slow down tight state can be used, as long as leading The length of line 504 can be greater than length when its self-assembling formation arch, such as S-shaped etc..

Light conversion layer 420 includes glue and wavelength convert particle, is respectively glue 422 and fluorescent powder 424, light in an embodiment Conversion layer 420 is covered in LED chip 102,104 and electrode 506, and makes a part of exposed of two electrodes 506 respectively.This implementation In example, each surface in six faces of LED chip 102,104 is covered with light conversion layer 420, i.e., described six faces are turned by light It changes the covering of layer 420 and can be described as light conversion layer 420 and wrapped up LED chip 102,104, this covering or package can be but not limited to It directly contacts, it is preferred that in the present embodiment, each surface in six faces of LED chip 102,104 directly contacts light and turns Change layer 420.However, light conversion layer 420 can only cover two in 102,104 6 surfaces of each LED chip when implementing A surface implies that light conversion layer 420 directly contacts two surfaces, this two surface directly contacted can be but not limited to figure Top surface or bottom surface in 15B.Likewise, light conversion layer 420 can directly contact two surfaces of two electrodes 506.Further, The one or both sides of LED chip 102,104 can meet place through crystal-bonding adhesive and light conversion layer 420.Fluorescent powder 424 can be using gold Belong to oxide-based fluorescent powder 424, such fluorescent powder 424 has preferable thermal conductivity.Light conversion layer 420 can further comprise dissipating Hot particle (such as oxide nano-particles), to improve heat dissipation effect.

Fluorescent powder 424 in light conversion layer 420 can absorb some form of radiation syndrome and go out light, such as fluorescent powder 424 It absorbs the light of shorter wavelength and issues the light of longer wavelength.In one embodiment, fluorescent powder 424 absorbs blue light and issues Huang After light, this yellow light and unabsorbed blue light, that is, form white light.And six surfaces of aforementioned LED chip 102,104 are all covered It is covered in the embodiment of light conversion layer 420, the absorption of fluorescent powder 424 issues longer after the light for the shorter wavelength that each surface issues The light of wavelength, due to fluorescent powder 424 around each outer surface of LED chip 102,104 to form LED filament 100 Ontology, therefore, each outer surface of the light conversion layer 420 of LED filament 100 can issue mixing light and (be mixed with longer and religion The light of short wavelength).In other words, every side of LED filament 100 can all issue mixed light.

Light conversion layer 420 can make a part of exposed of two electrodes 506.Fluorescent powder 424 can come firmly than glue 422.Fluorescence The size of powder 424 can be 1 μm to 30 μm or 5 μm to 20 μm.The size of identical fluorescent powder 424 is generally also identical.In Figure 15 B In, the why different reason of the sectional dimension of fluorescent powder 424 is that the sectional position of fluorescent powder 424 is different.Glue 422 can be Bright, for example, glue 422 is the suchlike material such as epoxy resin, improved resin or silica gel.

The composition ratio (composition ratio) of fluorescent powder 424 and glue 422 is 1:1 to 99:1, and preferable ratio is 1: 1 to 50:1, this ratio can be weight ratio, be also possible to volume ratio.Figure 22 is please referred to, in this embodiment, 424 ratio of fluorescent powder It as shown in the straight line in Figure 22, is arranged together and connects so that 424 density of fluorescent powder is improved and then contacted with each other greater than glue 422 The fluorescent powder 424 of touching forms thermally conductive pathways (thermally conductive pathways as shown in arrow in Figure 22), says into one, light conversion layer 420 has Thermally conductive pathways are formed by by fluorescent powder 424 that is adjacent and being in contact, the thermally conductive pathways from LED chip 102,104 surfaces to The outer surface of LED filament 100, therefore the hot outside that can be transmitted to light conversion layer 420 that LED chip 102,104 generates, make It obtains LED filament 100 and has the problem of better heat dissipation effect, light conversion layer 420 has also postponed yellow.And the color of fluorescent powder 424 The light efficiency of LEDbulb lamp entirety can so can be improved to 30% to 70% in light conversion ratio, can also increase LED filament 100 Hardness promotes the pliability of LED filament 100, does not need in addition to support LED filament with frame.In addition, general silica gel After forming, surface is more smooth, is unfavorable for the light that LED chip 102,104 is generated with fluorescent powder 424 and penetrates away.In this reality It applies in example, since 424 ratio of fluorescent powder in glue 422 improves, the surface roughness and filament of LED filament 100 can be effectively increased Whole surface area, that is to say, that the whole heat dissipation area of LED filament 100 is effectively increased, so that LED filament 100 has More preferably heat dissipation effect.In addition, also due to the whole surface area of LED filament 100 increases, therefore increase filament surface fluorescent powder The point light source of 424 light conversion, and then promote the luminous efficiency of LEDbulb lamp entirety.In addition, light conversion layer surface can also be various Lens shape, with different optical effects；Or moderately retain gap in light conversion layer, heat dissipation can be promoted.

In the ratio of suitably allotment fluorescent powder 424 and glue 422,100 pliability of LED filament can be adjusted (deflection), imply that young's modulus (Yong ' s Modulus) Y of LED filament 100 can be between 0.1 to 0.3x1010 pa (Pa) between, consider the application of bulb lamp, can adjust the young's modulus of LED filament 100 to 0.15 to 0.25x1010 pa (Pa) Between, such the problem of improving conventional LED light bulb filament easy fracture, but still there is enough rigidity and pliability.

Figure 16 A is please referred to, Figure 16 A is the diagrammatic cross-section of the LED filament 400a of the utility model one embodiment. LED The similar structure and element of filament 400a can refer to LED filament 100 above-mentioned.LED filament 400a includes light conversion layer 420； LED chip 102,104；Electrode 506；And the conducting wire 504 for being electrically connected LED chip Yu LED chip (or electrode).Light turns Layer 420 is changed to be coated on LED chip/electrode at least two sides.Light conversion layer 420 exposes a part of electrode 506.Light conversion Layer 420 can at least have an a top layer 420a and base 420b, respectively as the upper layer and lower layer of filament.In this In embodiment, top layer 420a is coated on the side of LED chip 102,104 Yu electrode 506, and base 420b is coated on LED chip 102,104 with the other side of electrode 506.

The processing procedure that top layer 420a and base 420b can pass through LED filament 400a is distinguished.It, can be in advance in processing procedure Base 420b is formed, LED chip 102,104 and electrode 506 are secondly connected to base 420b by crystal-bonding adhesive 450.Conducting wire 504 It can be formed between LED chip 102,104 and between LED chip 102,104 and electrode 506.The shape of conducting wire 504 There can be bending shape (such as slightly in M font in Figure 16 A) to slow down impact force, also can be more typical arcuation or linear. Thereafter top layer 420a is coated in LED chip 102,104 and electrode 506.The size of top layer 420a is not required to and base 420b is identical.In an embodiment, the area of top layer 420a is slightly less than base 420b.

In the present embodiment, top layer 420a is fluorescent powder glue-line, and base 420b is fluorescent powder film layer.Fluorescent powder glue-line includes Glue 422, fluorescent powder 424 and inorganic oxide nanoparticles 426.Glue 422 can be silica gel or silicone resin.Inorganic oxide nanometer Particle 426 can be aluminium oxide (AL₂O₃), but not limited to this.Fluorescent powder film layer include glue 422 ', fluorescent powder 424 is ' with inorganic oxygen Compound nanoparticle 426 '.Glue 422 and the constituent of glue 422 ' can be different.Glue 422 ' can come firmly than glue 422, In order to which LED chip 102,104 and electrode 506 are configured thereon that.For example, glue 422 can be silicone resin, and glue 422 ' can be with It is the combination of silicone resin and PI glue.The mass ratio of the PI glue of glue 422 ' can be equal to or less than 10%.PI glue can strengthen glue 422 ' Hardness.Inorganic oxide nanoparticles can be aluminium oxide (AL₂O₃) or aluminium nitride, but not limited to this.Inorganic oxide nanometer The size of particle can be 100 to 600 nanometers.Inorganic oxide nanoparticles are conducive to radiate.In some embodiments, part Inorganic oxide nanoparticles can be replaced by inorganic oxide particle, the sizes of these inorganic oxide particles is 0.1 μm To 100 μm.Heat dissipation particle can have different sizes.

Figure 16 B is please referred to, Figure 16 B is the diagrammatic cross-section of the LED filament 400b of another embodiment of the utility model.Figure 16B shows another embodiment of LED filament layer structure.LED filament 400b can be analogous to LED filament 400a.In this implementation In example, 504, two LED chip 102,104, conducting wire top layer 420a are configured at the two sides of base 420b, that is to say, that base 420b is located at the centre of two top layer 420a.Electrode 506 is respectively configured at the both ends of base 420b.Two top layers above and below in figure LED chip 102,104 in 420a can be connected to same electrode 506 by conducting wire 504.In this way, it is more uniform to use light.

Figure 16 C is please referred to, Figure 16 C is the diagrammatic cross-section of the LED filament 400c of the utility model further embodiment.Figure The difference of the LED filament 400b of LED filament 400c and Figure 16 B of 16C is, in the LED filament 400b of Figure 16 B, is located at base The LED chip 102,104 of the opposite sides (being namely located in upper and lower two top layer 420a) of 420b is right each other one by one Neat.In this embodiment, as shown in figure 16 c, (namely it is located at upper and lower two top layers positioned at the opposite sides of base 420b In 420a) LED chip 102,104 be interlaced with each other one by one.Specifically, as shown in Figure 16 C, in base LED chip 102,104 on the upside of 420b is referred to herein as top LED chip group, and LED chip 102 on the downside of base 420b, 104 are referred to herein as lower section LED chip group.On the axial direction of LED filament 400c, the every two phase of top LED chip group Definition has interval between adjacent LED chip 102,104, determines between the every two adjacent LED chip 102,104 of lower section LED chip group Justice has an interval, and electrode 506 and above or below LED chip group two-terminal led chip 102 between also definition have interval.Top Each LED chip 102,104 of LED chip group can be in the immediate lower section LED of alignment in the radial direction of LED filament 400c The interval of chipset, this interval be can between the every two adjacent LED chip 102,104 of lower section LED chip group or It is between electrode 506 and the two-terminal led chip 102 of lower section LED chip group.Vice versa.

As shown in figure 16 c, in one embodiment, on the axial direction of LED filament 400c, top and lower section LED core The length (or the distance at each interval) at each interval of piece group can be less than the length of each LED chip 102,104.? In one embodiment, on the axial direction of LED filament 400c, the length at each interval of top and lower section LED chip group (or the distance at each interval) is the 1/2 of the length of each LED chip 102,104.Each of top LED chip group LED chip 102,104 is more than immediate between the every two adjacent LED chip 102,104 for being overlapped lower section LED chip group Interval, can also overlap to form two adjacent LED chips 102,104 of the lower section LED chip group at this immediate interval A part (such as the length for being overlapped 1/4) of each LED chip 102,104.Interval between LED chip usually will cause With the dark space (dark region) compared with low-light level, however, in the present embodiment, due to one group of LED chipset (such as top or Lower section LED chip group) each of interval can be by the LED chip 102,104 of another group of LED chip group in LED filament 400c's covers in the radial direction, therefore the illumination of LED filament 400c can be more compliant uniform.

In some embodiments, the base 420b between the top of Figure 16 C and lower section LED chip group can be taken by bracket In generation, this bracket can be made of metal or other materials appropriate are made.This bracket can be hollowed out or hollow out is many logical to be formed Hole, therefore, the light that the LED chip 102,104 of top LED chip group is issued can pass through bracket and be mapped to opposite side, instead ?.

Figure 16 D is please referred to, Figure 16 D is the diagrammatic cross-section of the LED filament 400d of another embodiment of the utility model.For Convenient for explanation, the fluorescent powder 424,424 ' of LED filament 400b, 400c as shown in Figure 16 B and 16C is not shown in Figure 16 D With inorganic oxide nanoparticles 426,426 ', but actually LED filament 400d still may include fluorescent powder 424,424 ' with it is inorganic Oxide nano-particles 426,426 '.The LED filament 400d of LED filament 400c, Figure 16 D compared to Figure 16 C further comprises It position can be in face of the top of base 420b under with reflective particle 4264 and light-emitting surface in the scattering particles 4262 in base 420b The LED chip 102,104 of square LED chip group.Scattering particles 4262 can be with scattering light.Scattering particles 4262 may include such as The materials such as metal oxide or metal hydroxides.Reflective particle 4264 can be with reflection light.Reflective particle 4264 may include all Such as aluminium or silver metal.Scattering particles 4262 is spread in entire base 420b.Reflective particle 4264 then concentrates on top LED core Each LED chip 102,104 of piece group and LED chip 102, the 104 immediate intervals for corresponding to lower section LED chip group Between.The light that the LED chip 102,104 of top and lower section LED chip group is issued can be introduced into base 420b, then by Scattering particles 4262 and the scattering of reflective particle 4264 and reflection.It can be passed through towards different directions by the light of scattering and reflection described Interval.As seen in fig. 16d, LED filament 400d includes but is not limited to complex reflection layer 452, and reflecting layer 452 is respectively arranged at often In one 102,104 one side far from base 420b of LED chip, reflected light line can enter base 420b and be dissipated again again Radion 4262 and the scattering of reflective particle 4264 and reflection.In this situation, the illumination of LED filament 400d can be more compliant equal It is even.

According to Figure 16 D, in other embodiments, reflective particle 4264 can be replaced by reflective film.According to Figure 16 D, In other embodiments, reflective particle 4264 or reflective film are not necessary, therefore reflective particle 4264 or reflective film It can be removed from base 420b.

Figure 16 E is please referred to, Figure 16 E is the diagrammatic cross-section of the LED filament 400e of another embodiment of the utility model.Figure The difference of the LED filament 400a of LED filament 400e and Figure 16 A of 16E is that the top layer 420a of the LED filament of Figure 16 E has It is wavy.This wavy top layer 420a includes wave crest 420ac and trough 420at, each wave crest 420ac corresponds respectively to phase Each interval between adjacent two LED chips 102,104, each trough 420at correspond respectively to each LED chip 102,104.Specifically, each wave crest 420ac can LED filament 400e in the radial direction with two neighboring LED core Each interval overlapping between piece 102,104, and each trough 420at can LED filament 400e in the radial direction with The overlapping of each LED chip 102,104.The amount meeting of fluorescent powder 424 and inorganic oxide nanoparticles 426 in wave crest 420ac Greater than the amount of fluorescent powder 424 and inorganic oxide nanoparticles 426 in trough 420at.Therefore, the area corresponding to the interval The brightness in domain can be elevated, and in this situation, the illumination of LED filament 400e can be more compliant uniform.

Figure 17 A to Figure 17 R is please referred to, Figure 17 A to Figure 17 R is respectively the LED filament of multiple embodiments of the utility model Bottom view and schematic cross-section.The shape of electrode (such as electrode 506) is also possible to consider that gold thread connection or filament are curved The structure design rolled over and made.Such as in an embodiment, as shown in Figure 17 A, electrode 506 has bonding pad 5068 and transition Area 5067, bonding pad 5068 is located at the end of electrode 506 and for being electrically connected other assemblies, for example, the bonding pad of electrode 506 5068 can be connected to conducting bracket 51a, 51b as shown in figure 14 a to Figure 14 c.Electrode 506 has two in this embodiment Bonding pad 5068, transition region 5067 is then between bonding pad 5068, for being connected bonding pad 5068.The width of bonding pad 5068 Degree can be greater than transition region 5067, due to needing to form contact on bonding pad 5068, it is therefore desirable to certain width, such as when filament is wide When degree is W, the width of the bonding pad 5068 of electrode 506 can be 1/4W between W, and bonding pad 5068 can be for multiple and its width not It needs consistent；Transition region 5067 to form contact between bonding pad 5068, due to being not required in transition region 5067, and width can be set Fixed thin compared with bonding pad 5068, such as when filament width is W, the width of transition region 5067 can be 1/10W between 1/5W, this When due to electrode 506 transition region 5067 have thinner width so that electrode 506 be easier with filament bend deformation, subtract Few gold thread stress close to electrode tip influences and is easy the risk of broken string.

It in an embodiment, as seen in this fig. 17b, constitutes in multiple LED chips of filament, the LED chip positioned at end It being electrically connected by gold thread with electrode 506, electrode 506 has on top view by three face rings around the shape of the LED chip of the end, And gold thread is not passed through then by the circular one side of electrode 506 in the LED chip 504 of the end and is electrically connected other LED chips, At this time the more multiple chips 504 of gold thread of the LED chip 504 of the end between electrode 506 to each other at a distance from it is short, by elasticity The risk frustrating stress in the wrong and breaking is relatively low.

Figure 17 C is please referred to, Figure 17 C is the bottom view of the LED filament of the utility model one embodiment, wherein in order to Convenient for display technique feature, therefore schema only shows the particular element in LED filament.LED filament include LED chip 102, 104,506, two auxiliary members (being analogous to transition region) 5067 of electrode, conducting wire and light conversion layer (not shown).The LED of the present embodiment Filament is referred to the LED filament (such as LED filament 400a) of previous embodiment.The conducting wire of the present embodiment is referred to aforementioned implementation The conducting wire 504 of example.For example, position is in this array one end in multiple LED chips 102,104 for being arranged in array in LED filament LED chip 102 can be connected to electrode 506 through conducting wire.Light conversion layer is then referred to the light conversion layer of previous embodiment 420.Conducting wire illustrated by previous embodiment, light conversion layer and the connection of other elements and these elements in LED filament Relationship then repeats no more.In the present embodiment, main explanation can focus on the LED chip positioned at end (one end of the array) Conducting wire and auxiliary member 5067 between 102 and electrode 506.

As shown in Figure 17 C, in the present embodiment, each electrode 506 includes bonding pad 5068, and bonding pad 5068 can be used In connection foregoing conducting bracket 51a, 51b.End conducting wire can connect end LED chip 102 and corresponding bonding pad 5068.Each auxiliary member 5067 can be extended to pair by the side of corresponding bonding pad 5068 along the axial direction of LED filament The side for the end LED chip 102 answered, and adjacent to corresponding bonding pad 5068.LED filament in the radial direction, it is each A auxiliary member 5067 can be overlapped at least one conducting wire being located between end LED chip 102 and corresponding bonding pad 5068.At this In embodiment, each auxiliary member 5067 be more than LED filament overlapping in the radial direction be located at end LED chip 102 and Conducting wire between corresponding bonding pad 5068, also further in the LED chip of overlapping end in the radial direction 103 of LED filament A part and a part of the corresponding bonding pad 5068 of overlapping.In the present embodiment, auxiliary member 5067 is not connected to connection Area 5068.In other embodiments, auxiliary member 5067 can connect corresponding bonding pad 5068, in this situation, this auxiliary member 5067 are collectively formed electrode 506 with bonding pad 5068.In some embodiments, each auxiliary member 5067 at least can be in LED light It is conducting wire of the overlapping in the radial direction between corresponding end LED chip 102 and corresponding bonding pad 5068 of silk, corresponding A part of end LED chip 102 and a part of corresponding bonding pad 5068.

In some embodiments, can only have an auxiliary member 5067 in LED filament, this auxiliary member 5067 can be in LED lamp The overlapping in the radial direction one of silk and only one be located at corresponding end LED chip 102 and corresponding bonding pad 5068 it Between conducting wire.In other embodiments, can only have an auxiliary member 5067 in LED filament, this auxiliary member 5067 can be in LED Filament is overlapped all conducting wires in the radial direction, including is located at two end LED chips 102 and connects with corresponding two Two conducting wires between area 5068.In other embodiments, there are two auxiliary member 5067, this two auxiliary members for LED filament tool 5067 can be located at two end LED chips 102 in the overlapping in the radial direction of LED filament respectively connects with corresponding two Two conducting wires between area 5068.In other embodiments, there are two auxiliary member 5067, this two auxiliary members for tool in LED filament 5067 each auxiliary member 5067 is overlapped all conducting wires in LED filament in the radial direction, including is located at two Two conducting wires between end LED chip 102 and corresponding two bonding pads 5068.

Overlapping in the radial direction due to auxiliary member 5067 in LED filament is located at end LED chip 102 and corresponding electrode Conducting wire between 506 bonding pad 5068, to strengthen the bonding strength of LED chip 102 Yu electrode 506.Whereby, electrode The obdurability at the LED filament both ends where 506 can be obviously improved.In this condition, LED filament can be bent to form multiplicity The curve of change there will not be the risk of the conducting wire breakage between electrode 506 and LED chip 102.There is exquisite curve when such When LED filament shines, LEDbulb lamp can generate mirable effect.

The purpose of design of auxiliary member 5067 described further below.Electrode 506 is phase for LED chip 102,104 When big, for example, length of the electrode on the axial direction of LED filament can be 10 to 20 times of the length of LED chip 102.It needs It is noted that.The schema of the utility model is only schematic, therefore electrode 506 and LED chip 102,104 in size significant There is no show difference completely.Due to such difference in size, the rigidity of electrode 506 can be noticeably greater than LED chip 102, 104 rigidity.When LED filament bending, the region where LED chip 102,104 can be bent in submissive mode, but electrode 506 can then be bent with the region where end LED chip 102 in stiff mode, this is because end LED chip 102 and electricity Greatest differences between pole 506 in rigidity and caused by.Specifically, the area where electrode 506 and end LED chip 102 At an angle, this can make the conducting wire between electrode 506 and end LED chip 102 also be bent to form one to domain meeting bent A sharp angle, since 506 relative difficult of electrode is bent, and end LED chip 102 is easier to be bent relatively, therefore Region between electrode 506 and end LED chip 102 can be by overflexing, and stress (as sheared) is concentrated in this region, such as This one, the conducting wire between electrode 506 and end LED chip 102 relatively easy can be broken off breakage.

In order to overcome the problems in electrode 506 and 102 region stress collection of end LED chip, auxiliary member 5067 is at least Meeting is Chong Die in the conducting wire in the radial direction between electrode 506 and end LED chip 102 of LED filament.Radial direction can be vertical In the axial direction of LED filament, also, radial direction can be defined as in the section of the axial direction perpendicular to LED filament On, by any direction extended centrally out in section；Alternatively, radial direction can be defined as being parallel to cutting for LED filament One direction in face.The longitudinal direction that axial direction can be aligned LED filament is vertical；Alternatively, axial direction can be defined as parallel to The direction of the longest edge of LED filament.LED filament is then axially to extend to another electricity by one of electrode 506 Pole 506, and LED chip 102,104 can be axially aligned between electrode 506.LED filament is parallel to its radial direction side To section be not limited to circular shape (this shape can be to be formed by the outer profile in section), this section can be appoint What shape.For example, this section can be ellipse or rectangle.The shape in section is related with optical effect, and the shape in section can be with Have the function of as lens, to adjust the light direction of LED chip.When LED filament bending, electrode 506 and end are concentrated on Stress between LED chip 102 can mainly be applied to this this region along radial direction, and cause this region (or in this region Conducting wire) fail in shear, auxiliary member 5067 at least can with the conducting wire region between electrode 506 and end LED chip 102 weight In the overlapping in the radial direction of LED filament, to strengthen the mechanical strength in this region, avoids this conducting wire and broken because stress is concentrated Damage.

In other embodiments, in order to overcome the problems in electrode 506 and 102 region stress collection of end LED chip, Auxiliary member 5067 may be disposed at a position, so that between a virtual plane trans-electrode 506 and end LED chip 102 Conducting wire when, this virtual plane is also bound to cross auxiliary member 5067.For example, this virtual plane can be LED filament and exist Cross section in the radial direction, in addition, virtual plane is also to cross auxiliary member when crossing corresponding end LED chip 102 5067, and virtual plane is that auxiliary member 5067 can be also crossed when crossing corresponding bonding pad 5068.

Based on above-mentioned setting, auxiliary member 5067 may be used as a kind of reinforced element, can increase electrode 506 and end Conducting wire between the mechanical strength of 102 region of LED chip and avoidable electrode 506 and end LED chip 102 is damaged.Electricity After some embodiments of pole 506 and auxiliary member 5067 are described in.

Figure 17 D is please referred to, Figure 17 D is the bottom view of the LED filament of the utility model one embodiment, wherein in order to Convenient for display technique feature, therefore schema only shows the particular element in LED filament.In this embodiment, end LED core Piece 102 is located at the end for the array that the LED chip 102,104 in LED filament is lined up, and LED chip 102 is connected to through conducting wire Electrode 506.As shown in figure 17d, from the point of view of with bottom view or top view, electrode 506 has can be by thirdly side anulospiral ending LED core The shape of piece 102.In other embodiments, from the point of view of with side view, electrode 506 has can be by thirdly side anulospiral ending LED core The shape of piece 102.In other embodiments, have can be by the shape of its at least two sides anulospiral ending LED chip 102 for electrode 506 Shape.Wherein, it includes two auxiliary members (or transition region) 5067 and one that electrode 506, which is used to three sides of anulospiral ending LED chip 102, A bonding pad 5068.In the present embodiment, as shown in figure 17d, auxiliary member 5067 is connected to bonding pad 5068, thus auxiliary member 5067 belong to a part of electrode 506.In the case, auxiliary member 5067 can be referred to as the transition region of electrode 506.This two auxiliary Assistant piece 5067 the width in the radial direction of LED filament summation be less than bonding pad 5068 LED filament in the radial direction Width.As shown in figure 17d, two auxiliary members 5067 are less than in the summation of width Wt1, Wt2 in the radial direction of LED filament Width Wc in the radial direction of the bonding pad 5068 in LED filament.In the present embodiment, the width Wc of bonding pad 5068 is equal to base The width of layer 420b (or LED filament).End LED chip 102 by the circular side of electrode 506 is connected through conducting wire To another LED chip, conducting wire between electrode 506 and end LED chip 102 can shorter than not end LED chip 102, Conducting wire those of between 104.In the case, conducting wire risk damaged due to elastic buckling stress can be lower.

In one embodiment, one or more auxiliary members 5067 are the axial directions by bonding pad 5068 along LED filament Extend.Auxiliary member 5067 understands the end LED chip 102 for being overlapped LED filament in the radial direction in LED filament, also overlapping end Conducting wire between LED chip 102 and bonding pad 5068.The smaller width of auxiliary member 5067 can make it have than bonding pad 5068 It is more flexible, and for another aspect, the end LED that is in the radial direction overlapped LED filament of the auxiliary member 5067 in LED filament Chip 102, also such structure of the conducting wire between overlapping end LED chip 102 and bonding pad 5068, enhances LED chip Connection relationship between 102 and electrode 506.In this way, which the obdurability at the LED filament both ends where electrode 506 can be significant It is promoted.The difference of the auxiliary member 5067 of auxiliary member 5067 and Figure 17 C of Figure 17 D is that the auxiliary member 5067 of Figure 17 C does not connect To bonding pad 5068 and the auxiliary member 5067 of Figure 17 D is then connected to bonding pad 5068.Although the auxiliary member of Figure 17 C and Figure 17 D 5067 have different states, but they are all used as reinforced element, to increase electrode 506 and 102 location of end LED chip The mechanical strength in domain, and avoid the conducting wire between electrode 506 and end LED chip 102 damaged.

Figure 17 E is please referred to, Figure 17 E is the bottom view of the LED filament of the utility model one embodiment, wherein in order to Convenient for display technique feature, therefore schema only shows the particular element in LED filament.In this embodiment, there are two auxiliary Part 5067 can be between the LED chip of overlapping end in the radial direction 102 of LED filament and the bonding pad 5068 of counter electrode 506 Conducting wire.One of two auxiliary members 5067 (as position in Figure 17 E lower section person) be to be connected to corresponding bonding pad 5068, this structure Similar to the auxiliary member 5067 of Figure 17 C；And another auxiliary member 5067 (as position in Figure 17 E top person) if be not connected to pair The bonding pad 5068 answered, on the contrary, this auxiliary member 5067 is extended by the side of bonding pad 5068, this structure is similar to Figure 17 D In auxiliary member 5067.In this embodiment, electrode 506 can the auxiliary member 5067 based on bonding pad 5068 and lower section and be in L Shape.

In some embodiments, can also only one auxiliary member 5067 it is corresponding in the overlapping in the radial direction of LED filament Conducting wire between end LED chip 102 and the bonding pad 5068 of electrode 506.Two of them electrode 506 can there are two conducting wires to distinguish The LED chip 102 at both ends is connected, if an auxiliary member 5067 can be in the radial direction of LED filament if the enough length of auxiliary member 5067 The two conducting wires are overlapped on direction.This single auxiliary member 5067 for corresponding to each electrode also will increase electrode 506 and end LED The mechanical strength of 102 region of chip, and avoid the conducting wire between electrode 506 and end LED chip 102 damaged.

Electrode 506 can be fixed in light conversion layer 420, specifically, a part of each electrode 506 can be turned by light It changes layer 420 to seal, top layer 420a can be divided into light conversion layer 420 and in the case where base 420b, electrode 506 can be by It is enclosed in top layer 420a, is enclosed in base 420b or is enclosed in top layer 420a and base 420b simultaneously.In some embodiments In, electrode 506 is not only to be enclosed, and can also be embedded in the top layer 420a or base 420b of LED filament, can establish in electricity Significant adhesive force between pole 506 and light conversion layer 420.In one embodiment, as previously mentioned, electrode in LED filament 506 structure includes a bonding pad 5068 and two auxiliary members 5067 to surround LED chip 102.Wherein, electrode 506 can wrap Include hole.

Figure 17 F and Figure 17 G are please referred to, Figure 17 F is the electrode 506 and base of the LED filament of the utility model one embodiment Layer 420b, wherein for the ease of display technique feature, therefore schema be not shown the top layer 420a of LED filament, LED chip 102, 104 with conducting wire 504.Figure 17 G is the bottom view of a part of the LED filament of Figure 17 F.In bottom view, LED chip 102 is by base Layer 420b is blocked, thus is to be depicted with dashed lines.Electrode 506 can be in base (or phosphor powder layer), this base can refer to Aforementioned base 420b.In the present embodiment, electrode 506 include hole 506p, hole 506p be distributed in bonding pad 5068 with it is auxiliary In assistant piece 5067.Base 420b is hole 506p to be fitted inside by one end of hole 506p, and as needed, base 420b can be into One step passes through hole 506p until the other end of hole 506p.Base 420b shown in Figure 17 F is not passed through hole 506p, but In other schemes, base 420b may pass through hole 506p and extend to the other end of hole 506p.In Figure 17 F, base 420b Overhead surface upward can pass through surface roughening treatment, because roughened surface, base 420b have preferably thus Heat dissipation effect.As shown in Figure 17 G, from the point of view of the particular figure of LED filament, such as bottom view, either auxiliary member 5067 or The all rectangular shapes of bonding pad 5068.This two auxiliary member 5067 is respectively connected to the opposite sides of bonding pad 5068, LED filament The end LED chip 102 of (or LED chip 102,104 lined up array) is located between the two auxiliary members 5067.The bottom of at On view, U-shaped is collectively formed in the two auxiliary members 5067 and bonding pad 5068.

Please referring to Figure 17 H and Figure 17 I, Figure 17 H and Figure 17 I are the partial bottom view of the LED filament of different embodiments, wherein LED chip 102 is blocked by base 420b, thus is to be depicted with dashed lines.The LED filament of Figure 17 H can refer to the LED light of Figure 17 G Thread, the two main difference is, only one auxiliary member 5067 of the electrode 506 of the LED filament of Figure 17 H.As shown in Figure 17 H, with From the point of view of the particular figure of LED filament, such as bottom view, either auxiliary member 5067 or all rectangular shapes of bonding pad 5068. This single a auxiliary member 5067 is connected to the wherein side of the opposite sides of bonding pad 5068, LED filament (or LED chip 102, 104 arrays lined up) end LED chip 102 be located at the side of this auxiliary member 5067.In the present embodiment, to be regarded the bottom of at From the point of view of figure, end LED chip 102 is Chong Die with auxiliary member 5067.In other embodiments, from the point of view of with bottom view, end LED chip 102 will not be Chong Die with auxiliary member 5067.On the bottom view, L shape is collectively formed in this auxiliary member 5067 and bonding pad 5068.At it In his embodiment, this single auxiliary member 5067 can be connected to the center of bonding pad 5068, and on the bottom view, this auxiliary member 5067 are collectively formed T shape with bonding pad 5068.

The LED filament of Figure 17 I and the difference of the LED filament of Figure 17 H is, the electrode 506 of the LED filament of Figure 17 I it is auxiliary Assistant piece 5067 is extended by entire bonding pad 5068, rather than by the either side of the opposite sides of bonding pad 5068 or two sides Start to extend, and the width of auxiliary member 5067 can by be connected to the fixing end of bonding pad 5068 towards opposite side free end gradually It reduces.The fixing end of auxiliary member 5067 can be aligned entire bonding pad 5068 and base 420b.In other words, auxiliary member 5067 The width of fixing end can be equal to the width of bonding pad 5068 and base 420b.On the bottom view, auxiliary member 5067 is trapezoidal.At it In his embodiment, the auxiliary member 5067 that such width can be gradually decreased by fixing end to free end can also be triangular in shape or half It is round.As shown in Figure 17 I, in this embodiment, end LED chip 102 is Chong Die with auxiliary member 5067 on the bottom view.

In the case where only one auxiliary member 5067 of each electrode 506, the mean breadth of auxiliary member 5067 would generally Less than the mean breadth of bonding pad 5068.Each electrode 506 there are two or more auxiliary member 5067 in the case where, auxiliary The width summation of part 5067 can be less than the width of bonding pad 5068.In Figure 17 G into 17I, conducting wire, which is not shown, to be come, LED core Piece 102 then shows to come with dotted line.

Figure 17 J is please referred to, Figure 17 J is the partial bottom view of the LED filament of another embodiment, wherein 102 quilt of LED chip Base 420b is blocked, thus is to be depicted with dashed lines.The LED filament of Figure 17 J can refer to the LED filament of Figure 17 G, and the two is mainly poor Different to be, each auxiliary member 5067 of two auxiliary members 5067 of the electrode 506 of the LED filament of Figure 17 J can form positive three It is angular.Each of this two auxiliary member 5067 includes bevel edge, and two bevel edges of the two auxiliary members 5067 can face each other, and Two bevel edges of this two auxiliary member 5067 can be close to each other in the fixing end for being connected to bonding pad 5068.In the present embodiment, this Two bevel edges of two auxiliary members 5067 can be, but not limited to be to be connected to each other.The two bevel edges can by fixing end to free end by Gradually away from each other, and this two bevel edge is in free end can contact the opposite sides of base 420b respectively.Two bevel edges of auxiliary member 5067 Vertical range gradually increased by fixing end to free end, auxiliary member 5067 can trim bonding pad 5068 and base 420b, and its Distance of two bevel edges of auxiliary member 5067 between free end can be equal in the width of fixing end, and can also be equal to bonding pad The width of 5068 and base 420b.

Figure 17 K is please referred to, Figure 17 K is the partial bottom view of the LED filament of another embodiment, wherein 102 quilt of LED chip Base 420b is blocked, thus is to be depicted with dashed lines.The difference of the embodiment of Figure 17 K and Figure 17 J is, the auxiliary member of Figure 17 K 5067 bevel edge is not linear but ladder-like.In other embodiments, the bevel edge of auxiliary member 5067 can be curved shape, arch Shape or waveform.

Figure 17 L is please referred to, Figure 17 L is the bottom view of the LED filament of another embodiment of the utility model, wherein for It is convenient for display technique feature, therefore schema only shows the particular element in LED filament.In the present embodiment, each electricity Pole 506 includes bonding pad 5068 and an auxiliary member 5067.Two auxiliary members 5067 of the two electrodes 506 are along LED light The axial direction of silk is aligned the opposite sides of base 420b respectively, and also distinguishes position in LED chip 102, the phase of 104 arrays To two sides.In other words, this two auxiliary member 5067 configures in an interleaved manner.Each auxiliary member 5067 is by corresponding company The beginning of area 5068 is connect, is extended along the axial direction of LED filament.Each auxiliary member 5067 is more than the radial direction in LED filament On direction, and end LED chip 102 and end LED chip 102 and the corresponding bonding pad on the side of corresponding bonding pad 5068 Conducting wire overlapping between 5068, also further with two or more LED chips 102,104 on the side of end LED chip 102 with And two or more conducting wires overlapping between these two or more LED chips 102,104.In the present embodiment, each electricity The auxiliary member 5067 of pole 506 is Chong Die with all LED chips in radial directions, but the auxiliary member 5067 of a certain electrode 506 It is not coupled to another electrode 506.

Figure 17 M is please referred to, Figure 17 M is the bottom view of the LED filament of another embodiment of the utility model, wherein for It is convenient for display technique feature, therefore schema only shows the particular element in LED filament.The embodiment of Figure 17 M and Figure 17 D Difference is that each auxiliary member 5067 of two auxiliary members 5067 of the LED filament of Figure 17 M is not connected to bonding pad 5068.In the present embodiment, auxiliary member 5067 is and end Chong Die with all LED chips 102,104 in radial directions Conducting wire between LED chip 102 and bonding pad 5068 is Chong Die and Chong Die with bonding pad 5068.It is each such as Figure 17 L and Figure 17 M A LED filament tool is there are two auxiliary member 5067, the diameter of each auxiliary members 5067 of the two auxiliary members 5067 in LED filament All conducting wires are overlapped on direction, including be located at two end LED chips 102 and corresponding two bonding pads 5068 it Between two conducting wires.

Figure 17 N is please referred to, Figure 17 N is the bottom view of the LED filament of another embodiment of the utility model, wherein for It is convenient for display technique feature, therefore schema only shows the particular element in LED filament.The embodiment of Figure 17 N and Figure 17 M Difference is that each auxiliary member 5067 of two auxiliary members 5067 of the LED filament of Figure 17 N is separated into multiple segmentations, Multiple segmentations of each auxiliary member 5067 are overlapped with corresponding conducting wire in radial directions respectively.Each auxiliary member 5067 Multiple segmentations in each segmentation two LED chips adjacent with corresponding conducting wire and this conducting wire in radial directions respectively 102,104 overlapping, or in radial directions with the corresponding lead of end, corresponding bonding pad 5068 and corresponding end LED chip overlapping.There is interval between adjacent two segmentation of each auxiliary member 5067, each is spaced in radial direction It is upper to be aligned corresponding LED chip 102,104.In whole LED filament, relative to the region where LED chip 102,104 Speech, the region where conducting wire is usually weakness, therefore multiple segmentations of each auxiliary member 5067 can be used as reinforced element, to mention Rise the mechanical strength in these regions.

Figure 17 O is please referred to, Figure 17 O is the bottom view of the LED filament of another embodiment of the utility model, wherein for It is convenient for display technique feature, therefore schema only shows the particular element in LED filament.The embodiment of Figure 17 O and Figure 17 N Difference is, in multiple segmentations of each auxiliary member 5067 of the LED filament of Figure 17 O, segmentation of the position in end can be connected to Corresponding bonding pad 5068.

Figure 17 P is please referred to, Figure 17 P is the bottom view of the LED filament of another embodiment of the utility model, wherein for It is convenient for display technique feature, therefore schema only shows the particular element in LED filament.The embodiment of Figure 17 P and Figure 17 M Difference is, each auxiliary member 5067 of two auxiliary members 5067 of the embodiment of Figure 17 P not in radial directions with Bonding pad 5068 is overlapped, and is the alignment bonding pad 5068 on the axial direction of LED filament instead.According to Figure 17 P embodiment Configuration, such LED filament can be made relatively thin.

Figure 17 Q is please referred to, Figure 17 Q is the bottom view of the LED filament of another embodiment of the utility model, wherein for It is convenient for display technique feature, therefore schema only shows the particular element in LED filament.The embodiment of Figure 17 Q and Figure 17 D Difference is that the auxiliary member 5067 of Figure 17 Q is not connected to bonding pad 5068, is around three sides of bonding pad 5068 instead.? In the present embodiment, the quantity of the auxiliary member 5067 of Figure 17 Q only one and lined up around all LED chips 102,104 whole A array and bonding pad 5068 (i.e. electrode 506).

Figure 17 C, 17M, 17N, 17P, 17Q auxiliary member 5067 be not connected to corresponding bonding pad 5068, therefore scheme The auxiliary member 5067 of 17C, 17M, 17N, 17P, 17Q can be not belonging to a part of electrode 506, and on the contrary, these auxiliary members 5067 are visually independent element, and its can be it is non-conductive.The auxiliary member 5067 of the embodiment of Figure 17 O is then an example Outside, in multiple segmentations of each of which auxiliary member 5067, position is to be connected to corresponding bonding pad 5068 in the segmentation of end one, And other segmentations are then not coupled to bonding pad 5068.In other words, only the auxiliary member 5067 of some is to belong to correspondence Electrode 506.

In the embodiment of Figure 17 D, in LED chip 102, first of the both ends of 104 arrays and the last one LED core Piece 102 can be entirely within the region between two auxiliary members 5067, in other words, first and the last one LED chip 102 are entirely arranged in the range of electrode 506, that is, the part where electrode 506.In other embodiments, first A can be with the last one LED chip 102 is positioned partially in the range of electrode.

In Figure 17 G and Figure 17 H, auxiliary member 5067 is rectangle, and has consistent width.In other embodiments, auxiliary Assistant piece 5067 can have the width gradually decreased by one end of bonding pad 5068 such as Figure 17 I.

Electrode 506 and LED chip 102,104 are not limited within the same layer.In the embodiment of Figure 17 F to Figure 17 K, electrode 506 be to be set to base 420b, and LED chip 102,104 may be disposed at top layer 420a (not showing in Figure 17 F to Figure 17 K), In this case, in the processing procedure of LED filament, base 420b, which can be turned, makes electrode 506 towards upper, to be easier electricity Property is connected to LED chip.

Figure 17 F and Figure 17 G show embodiment of the electrode in base (such as fluorescent film).As previously mentioned, Figure 17 H is extremely The embodiment of Figure 17 K is also possible to be embedded in the embodiment of the base of electrode.The embodiment such as modified, Figure 17 G to Figure 17 K electricity Pole 506, which can be, to be arranged in top layer, and LED chip is also in top layer (as shown in Figure 16 A).In the case, even if it is electric All in same layer, electrode 506 also be can be set at various height for pole and LED chip.

Figure 17 R is please referred to, Figure 17 R is the partial cross-sectional view of the LED filament of the utility model one embodiment.In Figure 17 R In, the phosphor gel for forming light conversion layer 420 can extend in the hole 506p of electrode 506, as previously described.Phosphor gel can be into One step is passed through the other side that hole 506p extends to electrode 506 by the side of electrode 506, as shown in Figure 17 R.Phosphor gel can connect At least two sides (upside and downside in such as Figure 17 R) of touched electrode 506, that is to say, that electrode 506 can (light turns by phosphor gel Change layer 420) it clamps.In other words, electrode 506 can be fixed by phosphor gel (light conversion layer 420) riveting, and electrode can be improved Mechanical strength between 506 and light conversion layer 420.

Figure 18 A and Figure 18 B are please referred to, the LED filament of respectively the utility model shown in Figure 18 A and Figure 18 B is assisted with it The floor map and stereoscopic schematic diagram of one embodiment of item.(such as Figure 17 L to figure of auxiliary member 5067 of previous embodiment 17Q) also can be used as it is a kind of surround and to be formed close to the side frame of chip 102, to be formed shown in such as Figure 18 A and Figure 18 B Assistant strip 170.

As shown in Figure 18 A and Figure 18 B, in an embodiment, the left and right sides of the chip 102 of LED filament 100 such as Figure 18 A With there is assistant strip 170 shown in Figure 18 B, assistant strip 170 forms side frame, and the outside of assistant strip 170 is directly exposed in light bulb, Assistant strip 170 is copper wire, and 170 adjacent chips 102 of assistant strip and gas directly in contact light bulb, facilitate filament 100 at this time Heat dissipation.The outside of assistant strip 170 is completely exposed in light bulb gas in this embodiment, but can also only be exposed part, and portion Divide and is coated by light conversion layer (not shown).Assistant strip 170 is located at same level and identical height with chip 102 in this embodiment, But it can also optionally be located at different level different height.Assistant strip 170 is close to chip 102 in this embodiment, but can also fit needs In filling light conversion layer between the two or there is gap.Assistant strip 170 is copper wire in this embodiment, is exposed to the portion in light bulb The film (such as aluminium nitride, silicon nitride, carbon nanotubes, graphene) with high-heating radiation rate can be coated with by dividing, in other embodiments In, can by having both the graphene of high-termal conductivity and high-heating radiation rate, nano carbon tube material form assistant strip 170.

Figure 18 C and Figure 18 D are please referred to, the LED filament of respectively the utility model shown in Figure 18 C and Figure 18 D is assisted with it The floor map and stereoscopic schematic diagram of one embodiment of item.Further, assistant strip can have proper shape variation. Figure 18 C and the assistant strip 170 in Figure 18 D are similar with the assistant strip 170 in Figure 18 B with Figure 18 A, but the difference is that its outside With the adjacent teeth portion 1704 in interval.In this embodiment, the teeth portion 1704 of assistant strip 170 towards lateral surface 1704a (reference Figure 18 D) gas in light bulb is contacted, with benefit heat dissipation.And teeth portion 1704 it is adjacent to each other between part (bottom can be filled up by light conversion layer Layer 420b or top layer 420a).Compared to the embodiment of Figure 18 A and Figure 18 B, the assistant strip in this embodiment is thinner, and teeth portion Gap between 1704 may make that light-out effect is more preferable because filling up light conversion layer.Top layer 420a (the dotted line part in figure of light conversion layer Point) and bottom 420b can optionally coat/part coat/completely and not coat teeth portion 1704, in Figure 18 C and Figure 18 D embodiment The assistant strip for being configured at the left side of LED chip 102 almost coats teeth portion 1704, only expose in teeth portion slightly towards lateral surface 1704a；But the assistant strip for being located at right side then exposes more towards lateral surface, the wherein low level face 1704b of 1704 lower half of teeth portion It is contacted with the bottom 420b of light conversion layer, and the high plane 1704c in figure in 1704 upper half of teeth portion exposes and contacts blister There is larger area towards lateral surface 1704a to enable described to have preferably towards lateral surface 1704a for middle gas, teeth portion herein Heat-radiating properties in this embodiment, the teeth portion in figure is located in section locating for LED chip, and but it is not limited to this, teeth portion Section or other sections that LED chip adjoins one another can also be located at.In this embodiment assistant strip be extended continuously it is straight Strip, but can also have spaced a plurality of assistant strips to be discontinuous.In addition, assistant strip as shown in the figure is with circle The strip shape body in section, but not limited to this, assistant strip also can be film or sheet.

Please refer to Figure 18 E, Figure 18 E show the LED filament of the utility model and another embodiment of its assistant strip Stereoscopic schematic diagram.In this embodiment, having multiple assistant strip 170a, these assistant strips 170a in LED filament 100a is laterally It arranges (namely perpendicular to the axial direction of LED filament 100a), and assistant strip 170a and filament electrode 110,112/LED chip 102, electric property does not connect 104/ gold thread 140.Assistant strip 170a is only used as reinforcement filamentray structure to use, and can prevent external force pair In the damage of LED chip 102,104.The visual LED chip 102 of assistant strip 170a, the size of 104/LED filament 100a and weight/ The shape of required LED filament 100a adjusts thickness and quantity, and then achievees the effect that support LED filament 100a.In this reality Apply in example, assistant strip 170a is distributed in top layer and the base of LED filament 100a simultaneously, that is, with Figure 18 E from the point of view of, assistant strip 170a is located at the top and lower section of LED chip 102,104 simultaneously.In other embodiments, these assistant strips 170a can also only position In the base of LED filament 100a, that is, with Figure 18 E from the point of view of, assistant strip 170a is the lower section positioned at LED chip 102,104；Or Person, these assistant strips 170a may be alternatively located at the top layer of LED filament 100a, that is, with Figure 18 E from the point of view of, assistant strip 170a is position In the top of LED chip 102,104.

Figure 19 A and Figure 19 B are please referred to, Figure 19 A show the different embodiments of the LED filament of the utility model from Figure 19 B Schematic cross-section.It is also printed using halftone other than in the way of dispensing about the formation of phosphor gel/fluorescent powder membrane Brush ink-jet (inkjet print) or spraying method are formed.Phosphor powder layer is formed by addition to equally distributed pattern Except, there can also be layered distribution or gradually layer is distributed.In the present embodiment, as shown in Figure 19 A and 19B, respectively two The schematic cross-section of the filament of embodiment.Filament top layer 420a in Figure 19 A is that fluorescent powder 424 forms layered distribution；In figure Two layers of phosphor powder layer is only shown, can also form the layered distribution of more layers by glue 422.Filament top layer 420a in Figure 19 B Fluorescent powder 424 form gradually layer distribution；Gradually layer distribution also can be multilayer for this.

0A to Figure 20 D referring to figure 2., Figure 20 A to Figure 20 D are the section of the LED filament of the utility model difference embodiment Schematic diagram, wherein Figure 20 A to Figure 20 D shows the embodiment about the processing of LED filament surface angle.Figure 20 A's to Figure 20 D LED filament surface has different angles.In these embodiments, the top layer 420a in Figure 20 A, Figure 20 B, Figure 20 C is by dispensing Machine is formed, and can be adjusted by phosphor gel viscosity so that after dispensing the two sides natual subside of top layer 420a and formed with circular arc The surface of shape.The cross section of the base 420b of Figure 20 A is that fluorescent film is formed by quadrangle section after vertically cutting.Figure The cross section of the base 420b of 20B is that fluorescent film is formed by tool after oblique angle is cut or has the cutter cutting of angle design There is the trapezoidal section of bevel edge Sc.The base 420b of Figure 20 C is similar to the base 420b of Figure 20 A, but is located at two sides of figure lower section Angle forms arc chord angle Se by surface treatment.Filament can reach difference by the various ways of above-mentioned Figure 20 A to Figure 20 C Light output surface angle and light-out effect.The base 420b of Figure 20 D is similar to the base 420b of Figure 20 B, but base in Figure 20 D The bevel edge Sc of 420b along reaching on top layer 420a, and the cross section of top layer 420a be then divided into top circular arc portion and side it is oblique Side Sc.In other words, the top layer 420a and base 420b of Figure 20 D can have common bevel edge Sc, two bevel edge Sc to be located at LE lamp The opposite sides of silk.The bevel edge Sc of top layer 420a can be aligned the bevel edge Sc of base 420b.In this situation, top layer 420a is scheming Section in 20D can have arch edge and outer profile composed by two relatively bevel edge Sc.

The thickness of base 420b is smaller than the thickness of top layer 420a.As shown in FIG. 20 A, the thickness T2 of base 420b is less than The thickness T1 of top layer 420a.In some schemes, electrode 506 can be mainly set in base 420b.It is pushed up in base 420b ratio In the case that layer 420a is thin, heat caused by electrode 506 can be easier to be shed by base 420b.In some schemes, LED Chip 102,104 is arranged towards top layer 420a, therefore can penetrate top layer from most of light of LED chip 102,104 420a, for the brightness of top layer 420a, this will lead to base 420b with lower brightness.Thicker top layer 420a tool There is larger amount of light reflection/diffusion particle (such as fluorescent powder), can light be reflected or be spread towards base 420b, and light Relatively thin base 420b can be readily penetrated through, thus may make the brightness uniformity of top layer 420a Yu base 420b.

As shown in Figure 16 A, embedded region of the configuration of LED chip 102,104 between base 420b and top layer 420a is flat On smooth surface, therefore, all LED chips 102,104 are located on this flat surfaces and towards same direction.In other realities It applies in example, as shown in Figure 21 A and Figure 21 B, the configuration of LED chip 102,104 non-planar surface on wavy interface.Top Embedded region (interface) between layer 420a and base 420b is not limited to wavy.In some embodiments, this embedded area Domain can be jagged.In one embodiment, the uper side surface (contact surface of contact top layer 420a) of base 420b can have There is biggish surface roughness, to reach similar effect.

1A and Figure 21 B, Figure 21 A and Figure 21 B are respectively the LED filament 400l of an embodiment of the present invention referring to figure 2. Sectional view and schematic diagram, Figure 21 A show the section at the line segment 19A-19A of Figure 21 B.Such as Figure 16 A, Figure 21 A and Figure 21 B Shown, the LED filament 400l of Figure 21 A and 19B can refer to the LED filament 400l and figure of LED filament 400a, Figure 21 A of Figure 16 A The difference of the LED filament 400a of 16A is the arrangement of LED chip 102,104.The LED chip of the LED filament 400a of Figure 16 A 102,104 be the axial direction alignment along LED filament 400a, and parallel with horizontal plane at base 420b.Contrastively, There is no the axial directions pair of the LED chip 102,104 along LED filament 400l for the LED chip 102,104 of LED filament 400l It together, and with horizontal plane at base 420b is not parallel (referring to Figure 21 A).Multiple LED chips of LED filament 400l 102, each of 104 different angle with respect to the horizontal plane can be respectively provided with.Correspondingly, these LED chips 102,104 Light emission direction may be different from each other.In the case, these LED chips 102,104 are carried and (or penetrate crystal-bonding adhesive 450 Gluing fixes these LED chips 102,104) side of base 420b can not be plane, is continuous uneven instead Surface, this has each LED chip 102,104 of the different location on continuous rough surface herein respectively not Same angle.In different embodiments, a part of LED chip 102,104 in LED filament 400l has relative to the level The first angle in face, and another part LED chip 102,104 in LED filament 400l has the relative to the horizontal plane Two angles.In some embodiments, first angle subtracts second angle equal to 180 degree.In addition, the LED in LED filament 400l Chip 102,104 can also respectively have the different height relative to the horizontal plane.In this way, which LED filament 400l is through its tool There are multiple LED chips 102,104 of the different light emission directions (with respect to the horizontal plane with different angle) with different height, can reach Illuminating effect more evenly, such as can reach complete cycle light.As shown in Figure 21 A and Figure 21 B, base's 420b shape of LED filament 400l As the wavy surface that there is height to rise and fall, LED chip 102,104 is configured on the base 420b that such height rises and falls, and Height fluctuating and the state tilting towards different directions is correspondingly also presented.In this way, which LED filament 400l goes out with wider Angular.That is, if the configuration of LED chip 102,104 is simultaneously not required to from the point of view of using the bottom surface of base 420b as horizontal plane It is parallel to the horizontal plane, but there is the mode of certain angle between horizontal plane to configure, and each LED chip 102,104 Between configuration height/angle/direction also can for difference.In other words, if it is multiple with LED chip 102,104 central points concatenation When LED chip 102,104, being formed by lines can not be straight line, that is to say, that multiple LED chips 102,104 were arranged in Array is not linear type.In addition, the tilt angle of LED chip 102,104 be not limited to shown in schema along filament axis direction (axial direction of LED filament) and have angle tilt, can also have angle in filament width direction (or radial direction) Inclination.Even if internal LED chip 102,104 just has been provided in this way, can make LED filament in the state of no bending The light-emitting angle of multiplicity, to achieve the effect that uniform in light emission.

As shown in Figure 21 A and Figure 21 B, in the present embodiment, LED chip 102,104 is one by one in turn towards the One direction is inclined relative to horizontal with second direction.First direction is relative to each other with second direction.First direction generally can It is biased to one of them in two electrodes 506, and second direction then can generally be biased to another electrode 506.For example, LED core First meeting in piece 102,104 arrays is tilted towards first direction, and second in LED chip 102,104 arrays then can court It is tilted to second direction, and the third in LED chip 102,104 arrays can then be tilted towards first direction, it is such. When LED chip 102,104 is distinctly tilted towards first direction and second direction, LED chip 102,104 can distinctly go out in face of first Light direction D1 and the second light direction D2, as illustrated in fig. 21b.First light direction D1 and the second light direction D2 are directed to not Same direction.Here, so-called light direction (light emission direction) be parallel to the main light-emitting surface of LED chip normal or Say the two in the same direction.

1C referring to figure 2., Figure 21 C are the schematic diagram of the LED filament 400l of another embodiment of the utility model.Implement herein In example, LED chip 102,104 is one by one in turn towards third direction (third light direction D3) and fourth direction (the Four light direction D4) it is inclined relative to horizontal.Third direction opposite to each other and is generally perpendicular to first party with fourth direction To with second direction.Third direction can generally be biased to the wherein side of the opposite sides of LED filament 400l in radial directions, And fourth direction can generally be biased to the wherein other side of the opposite sides of LED filament 400l in radial directions.For example, LED First meeting in chip 102,104 arrays is tilted towards third direction, and second in LED chip 102,104 arrays then can It is tilted towards fourth direction, and the third in LED chip 102,104 arrays can then be tilted towards third direction, it is all such Class.When LED chip 102,104 is distinctly tilted towards third direction and fourth direction, LED chip 102,104 can be distinctly in face of the Three light direction D3 and the 4th light direction D4, as shown in fig. 21 c.First light direction D1, the second light direction D2, third go out Light direction D3 is all directed to different directions from the 4th light direction D4.

1D referring to figure 2., Figure 21 D are the schematic diagram of the LED filament 400l of another embodiment of the utility model.Implement herein In example, every two or more LED chip 102,104 adjacent to each other is defined as one group, and LED chip 102,104 is one group It is inclined relative to horizontal in turn towards third direction and fourth direction with connecing one group.For example, first group of two adjacent LEDs Chip 102,104 can be tilted towards third direction, and second group of two adjacent LED chips 102,104 can incline towards fourth direction Tiltedly, and two adjacent LED chips 102,104 of third group can be tilted towards third direction, such.

1E referring to figure 2., Figure 21 E are the schematic diagram of the LED filament 400l of another embodiment of the utility model.Implement herein In example, LED chip 102,104 is respectively facing first direction, second direction, third direction and fourth direction and with respect to the horizontal plane inclines Tiltedly.And in the present embodiment, LED chip 102,104 be successively in turn towards first direction, second direction, third direction with Fourth direction inclination, but not limited to this.For example, first meeting in LED chip 102,104 arrays is tilted towards first direction, Second in LED chip 102,104 arrays can then tilt towards second direction, the third in LED chip 102,104 arrays It can then be tilted again towards third direction, the 4th in LED chip 102,104 arrays meeting is tilted towards fourth direction, and LED core The 5th in piece 102,104 arrays can tilt again towards first direction, such.In other embodiments, LED chip 102,104 understand tilting towards first direction, second direction, third direction and fourth direction for respective out-of-order.In other implementations In example, LED chip 102,104 can be tilted respectively towards any direction, that is to say, that LED chip 102,104, which can have, does not advise Light direction then.

In Figure 21 A to Figure 21 E, each of these LED chips 102,104 can be tilted towards different directions, but All LED chips 102,104 all can still maintain on the axis of LED filament 400l.But in various embodiments, LED LED chip in filament can not also be arranged on the same axis.1F referring to figure 2., Figure 21 F are another reality of the utility model Apply the schematic diagram of the LED filament 400l of example.In the present embodiment, there is some or all of LED chip 102,104 can be with LED light The radial direction of silk 400l is that rotary shaft is rotated, these LED chips 102,104 rotated through can be in face of being different from radial direction side To direction, thus these LED chips 102,104 rotated through will not maintain on the axis of LED filament 400l.

1G referring to figure 2., Figure 21 G are the schematic diagram of the LED filament 400l of another embodiment of the utility model.In this implementation In example, there is some or all of meeting of LED chip 102,104 in the offset in the radial direction of LED filament 400l and far from LED filament The axis of 400l, thus these LED chips 102,104 deviated are not left on the axis of LED filament 400l.However, partially The light direction of the LED chip 102,104 moved past can still be same as the LED chip 102,104 stayed in LED filament 400l axial direction Light direction, main difference is the offset of exit positions.

1H referring to figure 2., Figure 21 H are the schematic diagram of the LED filament 400l of another embodiment of the utility model.In this implementation In example, LED chip 102,104 can be aligned the axial direction of LED filament 400l and can maintain identical height, but have LED chip 102,104 can carry out clockwise or counterclockwise by rotary shaft of the normal of its respective light-emitting surface.For example, having Some LED chips 102,104 can rotate clockwise 30 degree by rotary shaft of the normal, there is some LED chips 102,104 meetings 60 degree are rotated clockwise by rotary shaft of the normal, and there are some LED chips 102,104 inverse as rotary shaft using the normal Hour hands rotate 60 degree.

1I referring to figure 2., Figure 21 I are the schematic diagram of the LED filament 400l of another embodiment of the utility model.In this implementation In example, there are some LED chips 102,104 that can tilt towards different directions, the LED being tilted over shown in similar Figure 21 A to Figure 21 E Chip 102,104；Have some LED chips 102,104 can LED filament 400l offset in the radial direction and far from LED The axis of filament 400l, similar to the LED chip 102,104 deviated shown in Figure 21 G；There are some LED chips 102,104 It can be rotated using the normal of its light-emitting surface as rotary shaft, the LED chip 102,104 rotated through shown in similar Figure 21 H.According to The embodiment of Figure 21 A to Figure 21 I, LED filament 400l can have more uniform illuminating effect.

It need to be noted that, in all embodiments of the utility model, the LED chip of LED filament can pass through routing engagement (wire bonding) mode manufactures, and the LED chip that such mode makes can be referred to as positive cartridge chip again；In addition, practical at this In novel all embodiments, the LED chip of LED filament also can pass through flip (flip-chip) mode and manufacture, such mode system The LED chip of work can be referred to as flip-chip again.

2A referring to figure 2., Figure 22 A are the perspective view of the LED filament 100 of one embodiment of the utility model.LED lamp Silk 100 includes envelope body 108,102 linear array of LED chip and electrode 506.102 linear array of LED chip is set to envelope body 108 In, when powering through electrode 506,102 linear array of LED chip can shine.Sealing body 108 is elongated structure, preferably It is made of mainly by elastic material, such as silica gel.Envelope body 108 can be fixed shape；If sealing body 108 is with elastic material system In the case where, it is also possible to variable shape.Therefore, in LEDbulb lamp, with or without additional support, Feng Ti 108 It can keep linear posture or curve-like posture (for example, shape of present ribbon or helical spiral).The section for sealing body 108 can To be well-regulated any shape (such as round or polygon) or irregular any shape (such as petal-shaped or star shape). The LED filament 100 of Figure 22 A is referred to LED filament 100,400a, 400l of Figure 15 A to 16E as previously shown, and seals body 108 are referred to light conversion layer 420.

In one embodiment, Feng Ti 108 is single structure.In some embodiments, whole knot is made a general survey of in single structure expression Structure, with consistent chemistry and physical property.If having inseparability in structure, single structure does not need to be to tie It is consistent on structure.In other embodiments, single structure includes first part and second part, and second part, which has, is different from the The property of a part.In other embodiments, Feng Ti 108 includes one group of other divisible layer or the module being linked together, To form the single structure of envelope body.

In the present embodiment, Feng Ti 108 is single structure, and shows a variety of chemistry in other indivisible structures With physical property.Sealing body 108 includes multiple regions (layer) with diacritic property, with entirety needed for reaching LED filament Function.It is to be defined in many ways in these regions (layer) of Feng Tizhong according to its application.2B extremely schemes referring to figure 2. 22E, Figure 22 B to Figure 22 E are the part truncation schematic diagram of the LED filament 100 of the multiple embodiments of the utility model, Figure 22 B to figure The different LED filament layer structures of the utility model difference embodiment are shown respectively in 22E.Such as Figure 22 B, truncated LED filament 100 further vertically (that is, along the light emission direction of the linear array of LED chip 102) are cut, and along The long axis of LED filament 100 is cut into impartial two halves, to show its internal structure.Envelope body 108 region (layer) be by perpendicular to The imaginary plane of the light emission direction of the linear array of LED chip 102 is defined, for example, envelope body 108 includes by a pair of of imaginary plane Three regions (layer) 420w, 420m, 420u of definition, this pair of of imaginary plane divide into upper layer 420u, lower layer for body 108 is sealed The 420w and middle layer 420m between upper layer 420u and lower layer 420w.The linear array of LED chip 102 is only positioned at envelope body Wherein one layer of 108.In other embodiments, the linear array of LED chip 102 is at least in one of layer of envelope body 108 No.In other embodiments, the linear array of LED chip 102 can be located in all layers of envelope body 108.Such as Figure 22 B institute Show, the linear array of LED chip 102 be only positioned at envelope body 108 middle layer 420m, and by middle layer 420m and with upper layer 420u, under Layer 420w separates.In the present embodiment, middle layer 420m includes wavelength conversion member, for the indigo plant for projecting LED chip 102 Light is converted to white light.Upper layer 420u includes cylindrical lenses, makes it upwards for adjusting light beam.Lower layer 420w includes cylindrical lenses, Cylindrical lenses, which are used to adjust light beam, makes it downwards.As shown in Figure 22 B, in the present embodiment, Feng Ti 108 is, for example, light above-mentioned Conversion layer 420, the interface between each layer of Feng Ti 108 can be but not be limited to substantially parallel with LED chip.In other embodiments In, middle layer 420m can have upper layer 420u, lower layer 420w or upper layer 420u and the higher hardness of lower layer 420w, for example, middle layer The concentration degree for the fluorescent powder grain that 420m is embedded in is come more than upper layer 420u, lower layer 420w or upper layer 420u and lower layer 420w It is high.Since the hardness of middle layer 420m is higher, need to bend to maintain required appearance in LEDbulb lamp in LED filament 100 When state, middle layer 420m can protect the linear array of LED chip 102, and so that it will not therefore failures.Upper layer 420u (or lower layer It 420w) can be softer, there was only single LED filament 100 in LEDbulb lamp and when needing to generate complete cycle light, make LED Filament 100 keeps bent state.In other embodiments, middle layer 420m can have upper layer 420u, lower layer 420w or on Layer 420u and the higher heat conductivity of lower layer 420w, for example, the concentration degree of the nano particle mixed in the 420m of middle layer, compares upper layer 420u, lower layer 420w or upper layer 420u and lower layer 420w carry out get Geng Gao.It, can be with since the heat conductivity of middle layer 420m is higher The excessive heat of LED chip 102 is quickly removed, to protect the linear array of LED chip 102, so that it will not therefore deteriorate or burn It ruins.Since upper layer 420u (or lower layer 420w) is separated with the linear array of LED chip 102, in LED chip 102 Cooling aspect, the importance of upper layer 420u (or lower layer 420w) institute role can be come low than middle layer 420m.Work as upper layer The nano particle that 420u (or lower layer 420w) is mixed do not need as middle layer 420m it is so much, the cost of manufacture of LED filament 100 It can more save.Since the linear array of LED chip 102 is only arranged among 420m in middle level, the size of middle layer 420m, It for sealing body 108, needs integrally to consider and could determine, such as light transfer capability, bending and heat conductivity.At other In the case that condition is constant, middle layer 420m is bigger for envelope body 108, then there is LED filament 100 stronger light to convert energy Power and heat conductivity, but there is fewer bending.The section perpendicular to its long axis of LED filament 100 shows middle layer 420m With other layers of envelope body 108.Assuming that R1 is the ratio of the gross area in the area ratio section of middle layer 420m, then R1 preferably by 0.2 to 0.8.And R1 is preferably by 0.4 to 0.6.In different embodiments, can also have between upper layer 420u and lower layer 420w Have a different hardness, for example, when LED filament 100 have been approached round radian bending and with upper layer 420u outwardly (herein outwardly for example Refer to the lamp housing towards LEDbulb lamp), lower layer 420w inwards (for example refers to the stem towards LEDbulb lamp) inwardly herein When, the bending degree (such as curvature) of lower layer 420w is higher than the bending degree of upper layer 420u, and the hardness that can set lower layer 420w at this time is higher than In upper layer 420u, such as an embodiment, upper layer/lower layer's hardness is respectively 45D/35D, and middle layer 420m hardness is 60D.

As shown in Figure 22 B, in one embodiment, middle layer 420m, upper layer 420u and lower layer 420w can be used as conversion layer, use To convert colour temperature.For example, the light of the sending of LED chip 102 can have the first colour temperature, and can when this light passes through middle layer 420m Being converted to has the second colour temperature, and the second colour temperature is less than the first colour temperature, colour temperature of this meaning from the light of LED chip 102 It converted by middle layer 420m.In order to have the function that colour temperature is converted, middle layer 420m can have specific fluorescent powder and other optics Particle, and upper layer 420u and lower layer 420w are also that can have specific fluorescent powder and other optical particles, the fluorescence of different layers The ingredient or component ratio of powder and other optical particles can mutual differences.In addition, the light from middle layer 420m penetrates upper layer again There can be third colour temperature after 420u and lower layer 420w, third colour temperature is less than the second colour temperature, light of this meaning across middle layer 420m Colour temperature further converted by upper layer 420u or lower layer 420w.This first colour temperature, the second colour temperature and third colour temperature are each other not It is identical, in other words, there is a main wavelength from the light of LED chip 102, light passes through middle layer 420m can have separately later One main wavelength, and another primary waves can be had by being then passed through after upper layer 420u or lower layer 420w across the light of middle layer 420m It is long.As shown in Figure 22 B, in the present embodiment, most light is first worn along the light direction of the linear array of LED chip 102 Middle layer 420m is crossed, upper layer 420u or lower layer 420w is then passed through.However, the lateral part of middle layer 420m is directly on envelope body 108 The external world is exposed to, therefore has the light of part without going past upper layer 420u or lower layer 420w, and can be directly through the side of middle layer 420m The external world is projected to part.In the present embodiment, the lateral part of middle layer 420m is not in the linear array of LED chip 102 On light direction, thus only light slightly can directly through middle layer 420m lateral part and project the external world.Due to these Micro- light can be directly through the lateral part of middle layer 420m, thus the whole colour temperature measured outside LED filament 100 can be slightly It is micro- to be greater than third colour temperature.

Such as Figure 22 C, truncated LED filament 100 is further by the horizontal direction (i.e. perpendicularly to LED chip 102 The light emission direction of linear array) it cuts and, and impartial two halves are cut into along the long axis of LED filament 100, to show its internal junction Structure.The layer of envelope body 108 be parallel to the imaginary plane of the light emission direction of linear array of LED chip 102 to be defined, for example, Sealing body 108 includes three layers 420l, 420m, the 420r defined by a pair of of imaginary plane, this pair of of imaginary plane is by 108th area Feng Ti It is divided into right layer 420r, left layer 420l and the middle layer 420m between right layer 420r and left layer 420l.The line of LED chip 102 Property array be only positioned at envelope wherein one layer of body 108.In other embodiments, the linear array of LED chip 102 is at least in envelope body 108 one of layer is no.In other embodiments, the linear array of LED chip 102 can be located at the institute of envelope body 108 Have in layer.As shown in fig. 22 c, the linear array of LED chip 102 is only positioned at the middle layer 420m of envelope body 108, and by middle layer 420m And separate with right layer 420r, left layer 420l.In the present embodiment, middle layer 420m includes wavelength conversion member, is used to LED core The blue light that piece 102 projects is converted to white light.Right layer 420r includes cylindrical lenses, makes it to the right for adjusting light beam.Left layer 420l Including cylindrical lenses, cylindrical lenses, which are used to adjust light beam, makes it to the left.In other embodiments, middle layer 420m can have righter layer 420r, left layer 420l or right layer 420r and the left higher hardness of layer 420l, for example, the fluorescent powder grain that middle layer 420m is embedded in Concentration degree, carry out get Geng Gao than right layer 420r, left layer 420l or right layer 420r and left layer 420l.Due to middle layer 420m hardness compared with Height, therefore when LED filament 100 needs to bend to maintain required posture in LEDbulb lamp, middle layer 420m can protect LED The linear array of chip 102, so that it will not therefore failures.Right layer 420r (or left layer 420l) can be it is softer, in LED ball When there was only single LED filament 100 in bubble lamp and needing to generate complete cycle light, LED filament 100 is made to keep bent state.? In other embodiments, middle layer 420m can have righter layer 420r, left layer 420l or right layer 420r and the higher heat of left layer 420l to pass The property led, for example, the concentration degree of the nano particle mixed in the 420m of middle layer, than right layer 420r, left layer 420l or right layer 420r and a left side Layer 420l carrys out get Geng Gao.Since the heat conductivity of middle layer 420m is higher, it is excessive can quickly to remove LED chip 102 Heat, to protect the linear array of LED chip 102, so that it will not therefore deteriorate or burn.Due to right layer 420r (or left layer 420l) It is to separate with the linear array of LED chip 102, therefore in terms of the cooling of LED chip 102, right layer 420r (or left layer 420l) importance of institute's role can be come low than middle layer 420m.When what right layer 420r (or left layer 420l) was mixed receives Rice grain do not need as middle layer 420m it is so much, the cost of manufacture of LED filament 100 also can be saved more.Due to LED chip 102 Linear array be only arranged in middle level among 420m, therefore the size of middle layer 420m needs whole for sealing body 108 Body, which is considered, to be determined, such as light transfer capability, bending and heat conductivity.In the case where other conditions are constant, middle layer 420m is bigger for envelope body 108, then LED filament 100 has stronger light transfer capability and heat conductivity, but has more Few bending.The section perpendicular to its long axis of LED filament 100 shows middle layer 420m and seals other layers of body 108.Assuming that R2 is the ratio of the gross area in the area ratio section of middle layer 420m, then R2 is preferably by 0.2 to 0.8.And R1 preferably by 0.4 to 0.6.In the present embodiment, the light direction of LED chip 102 is in the same direction with the lateral part of middle layer 420m, therefore is schemed The LED filament 100 of 22C has the lateral part that the more light quantities of LED filament 100 than Figure 22 B are directly through middle layer 420m And project the external world.From the point of view of Figure 22 C, the lateral part of middle layer 420m refer to Figure 22 C upward with part directed downwardly.

As shown in fig. 22 c, in one embodiment, middle layer 420m, right layer 420r and left layer 420l can be used as conversion layer, use To convert colour temperature.For example, the light of the sending of LED chip 102 can have the first colour temperature, and can when this light passes through middle layer 420m Being converted to has the second colour temperature, and the second colour temperature is less than the first colour temperature, colour temperature of this meaning from the light of LED chip 102 It converted by middle layer 420m.In order to have the function that colour temperature is converted, middle layer 420m can have specific fluorescent powder and other optics Particle.In addition, from the light of middle layer 420m penetrate right layer 420r and left layer 420l again after can have third colour temperature, third color Temperature further converted by right layer 420r and left layer 420l less than the second colour temperature, this meaning across the colour temperature of the light of middle layer 420m. This first colour temperature, the second colour temperature and third colour temperature are neither identical each other, and in other words, the light from LED chip 102 has one A main wavelength, light can have another main wavelength after passing through middle layer 420m, and the light across middle layer 420m is then passed through the right side There can be another main wavelength after layer 420r or left layer 420l.Compared to the embodiment of preceding Figure 22 B, Figure 22 C's In embodiment, less light is to initially pass through middle layer 420m along the light direction of the linear array of LED chip 102, is then passed through the right side Layer 420r or left layer 420l.The lateral part of middle layer 420m is directly to expose to the external world on envelope body 108, therefore have the light of part Without going past right layer 420r and left layer 420l, and it is directly through the lateral part of middle layer 420m and projects the external world.In this reality It applies in example, the lateral part of middle layer 420m is just on the light direction of the linear array of LED chip 102, therefore a large amount of light Understand the lateral part directly through middle layer 420m and projects the external world.Since this large amount of light can be directly through middle layer 420m Lateral part, thus third colour temperature can be noticeably greater than in the whole colour temperature that 100 outside of LED filament measures.

Such as Figure 22 D, truncated LED filament 100 is further cut into a fraction and a major part, to show Its internal structure.The fraction is with line CD (that is, central axis of LED filament 100) with rectangle ABCD for rotary shaft rotation 360 degree of part is defined, likewise, the major part is to be rotated by 360 ° to buckle as rotary shaft using line CD using rectangle ABCD Angle after falling the rotation angle of the fraction is defined.The layer for sealing body 108 is that imaginary cylindrical face is defined, this imaginary column The axle center in face is exactly the axle center of LED filament 100.For example, envelope body 108 includes three defined by a pair of coaxial imaginary cylindrical face Layer 420e, 420m, 420o, this pair of of imaginary plane will seal body 108 and divide into core layer 420e, outer layer 420o and be located at core Middle layer 420m between central layer 420e and outer layer 420o.The linear array of LED chip 102 is only positioned at wherein the one of envelope body 108 Layer.In other embodiments, the linear array of LED chip 102 is at least no in one of layer of envelope body 108.At it In his embodiment, the linear array of LED chip 102 can be located in all layers of envelope body 108.As shown in figure 22d, LED chip 102 Linear array be only positioned at the core layer 420e of envelope body 108, and by core layer 420e and with middle layer 420m, outer layer 420o point It separates and.In one embodiment, outer layer 420o includes light diffuser, and light diffuser increases LED by total internal reflection is reduced The light emission rate of chip 102.Middle layer 420m includes wavelength conversion member, and wavelength conversion member is used to the blue light for projecting LED chip 102 Be converted to white light.Core layer 420e includes separator, and separator is to separate by by fluorescent powder grain and LED chip 102, with The heat for avoiding LED chip 102 from generating allows the fluorescent powder grain rapid degradation in wavelength conversion member.Also, separator, which can allow, to be had The middle layer 420m of wavelength conversion member has consistent thickness, and to generate consistent white light, this can allow blue light and fluorescence appropriate combination. In other embodiments, middle layer 420m can have higher compared with core layer 420e, outer layer 420o or core layer 420e and outer layer 420o Hardness, for example, the concentration degree for the fluorescent powder grain that middle layer 420m is embedded in, than core layer 420e, outer layer 420o or core layer 420e and outer layer 420o carry out get Geng Gao.Since the hardness of middle layer 420m is higher, LED filament 100 need bend with When posture needed for maintaining in LEDbulb lamp, middle layer 420m can protect the linear array of LED chip 102, and so that it will not therefore Failure.Core layer 420e (or outer layer 420o) can be it is softer, in LEDbulb lamp only have single LED filament 100 and When needing to generate complete cycle light, LED filament 100 is made to keep bent state.In other embodiments, core layer 420e can have Compared with middle layer 420m, outer layer 420o or middle layer 420m and the higher heat conductivity of outer layer 420o, for example, mixed in core layer 420e The concentration degree of nano particle carrys out get Geng Gao than middle layer 420m, outer layer 420o or middle layer 420e and outer layer 420o.Due to core layer The heat conductivity of 420e is higher, therefore can quickly remove the excessive heat of LED chip 102, to protect the line of LED chip 102 Property array, so that it will not therefore deteriorate or burn.Since middle layer 420m (or outer layer 420o) is the linear battle array with LED chip 102 Column split is come, therefore in terms of the cooling of LED chip 102, middle layer 420m (or outer layer 420o) institute role it is important Property can be come low than core layer 420e.When the nano particle that middle layer 420m (or outer layer 420o) is mixed is not needed as core layer 420e is so much, and the cost of manufacture of LED filament 100 also can be saved more.In another embodiment, outer layer 420o can have in relatively Layer 420m, core layer 420e or middle layer 420m and the higher heat radiation of core layer 420e, for example, mixed in outer layer 420o The concentration degree of grain (such as nano particle, graphene, nano silver, carbon nanotubes and aluminium nitride), than middle layer 420m, core layer 420e or Middle layer 420e and core layer 420e carry out get Geng Gao.These particles, which have, penetrates the higher thermal radiation capability of bonding agent than light, with than The higher heat conductivity of fluorescent powder grain.Since the heat conductivity of outer layer 420o is higher, LED chip can be quickly removed 102 excessive heat, to protect the linear array of LED chip 102, so that it will not therefore deteriorate or burn.Due to middle layer 420m (or Core layer 420e) there is lower thermal radiation capability, therefore aspect, middle layer 420m are cooled down through heat radiation in LED chip 102 The importance of (or core layer 420e) institute role can be come low than outer layer 420o.As middle layer 420m (or core layer 420e) The nano particle mixed do not need as outer layer 420o it is so much, the cost of manufacture of LED filament 100 also can be saved more.These Particle is electrically insulated object, and has heat conductivity more higher than fluorescent powder grain.In other embodiments, in order to enhance LED The ability of filament 100 makes object to be illuminated can be as under ideal or lamp, loyalty shows its color, core layer 420e has compared with middle layer 420m, outer layer 420o or middle layer 420m and the shorter wavelengths of excitation spectrum of outer layer 420o (and/or transmitting light Spectrum), for example, the concentration degree of the fluorescent powder grain mixed in core layer 420e, than middle layer 420m, outer layer 420o or middle layer 420m And outer layer 420o carrys out get Geng Gao.Core layer 420e is to convert for the ultraviolet light for issuing LED chip 102 to visible light. Relatively, other layers (middle layer 420m and outer layer 420o) of LED filament 100 are then the light conversions for issuing core layer 420e For the light with more long wavelength.In one embodiment, the concentration degree of the fluorescent powder grain mixed in core layer 420e, compares middle layer 420m, outer layer 420o or middle layer 420m and outer layer 420o carry out get Geng Gao.In some embodiments, middle layer 420m is optional, in Layer 420m includes the luminescent dye for the light of core layer 420e to be converted into the light of longer wavelength, and compared to core layer The lower fluorescent powder grain of 420e concentration degree, and outer layer 420o includes for the light of core layer 420e is converted into longer wavelength Light luminescent dye, but outer layer 420o does not include any fluorescent powder grain, to keep the higher pliability of LED filament 100. Since the linear array of LED chip 102 is only arranged among core layer 420e, the size of core layer 420e, relative to It seals for body 108, needs integrally to consider and could determine, such as light transfer capability, bending and heat conductivity.Other conditions not In the case where change, core layer 420e is bigger for envelope body 108, then LED filament 100 have weaker light transfer capability with Heat conductivity, but there is higher bending.The section perpendicular to its long axis of LED filament 100 show core layer 420e with Seal other layers of body 108.Assuming that R3 is the ratio of the gross area in the area ratio section of core layer 420e, then R3 preferably by 0.1 to 0.8.And R3 is preferably by 0.2 to 0.5.Due to having wavelength conversion member in the 420m of middle layer, middle layer 420m's Size needs entirety to consider and could determine for sealing body 108, such as light transfer capability, bending and heat conductivity. In the case where other conditions are constant, middle layer 420m is bigger for envelope body 108, then LED filament 100 has stronger light Transfer capability and heat conductivity, but there is lower bending.During the section perpendicular to its long axis of LED filament 100 is shown Other layers of layer 420m and envelope body 108.Assuming that R4 is the ratio of the gross area in the area ratio section of middle layer 420m, then R4 is preferably It is by 0.1 to 0.8.And R4 is preferably by 0.2 to 0.5.

As shown in figure 22d, in one embodiment, middle layer 420m, core layer 420e and outer layer 420o can be used as conversion layer, To convert colour temperature.For example, the light of the sending of LED chip 102 can have the first colour temperature, and when this light passes through core layer 420e Can be exchanged into has the second colour temperature, and the second colour temperature is less than the first colour temperature, color of this meaning from the light of LED chip 102 Temperature converted by core layer 420e.In order to have the function that colour temperature is converted, core layer 420e can have specific fluorescent powder and its His optical particle.In addition, the light from core layer 420e penetrates after the 420m of middle layer again and can have third colour temperature, third colour temperature Less than the second colour temperature, this meaning further converted by middle layer 420m across the colour temperature of the light of core layer 420e.From middle layer The light of 420m can have the 4th colour temperature after penetrating outer layer 420o again, and the 4th colour temperature is less than third colour temperature, this meaning is across middle layer The colour temperature of the light of 420m is further converted by outer layer 420o.This first colour temperature, the second colour temperature, third colour temperature and the 4th colour temperature are each other It is neither identical, in other words, there is the first main wavelength from the light of LED chip 102, light passes through meeting after core layer 420e With the second main wavelength, light can have a main wavelength of third after passing through middle layer 420m, and light eventually pass through outer layer 420o it After can have the 4th main wavelength.In the present embodiment, core layer 420e surrounds LED chip 102 completely, and middle layer 420m is wrapped completely Core layer 420e is enclosed, and outer layer 420o surrounds middle layer 420m completely.In this way, which all light can all pass through core layer in proper order 420e, middle layer 420m and outer layer 420o.The 4th color can be approximately equal in the whole colour temperature that 100 outside of LED filament measures Temperature.

As shown in figure 22e, the difference of the envelope body 108 of envelope body 108 and Figure 22 D of Figure 22 E is, the envelope body 108 of Figure 22 E wraps Two layers 420e, 420o are included, the two layer of 420e, 420o are this imaginary axis as defined in an imaginary axial cylindrical face Core layer 420e and outer layer 420o are divided by body 108 is sealed to cylindrical face.The line array of LED chip 102 is only set to core In layer 420e, and core layer 420e separates 102 line array of LED chip with outer layer 420o.In one embodiment, outside Layer 420o includes light diffuser and wavelength conversion member, and light diffuser increases going out for LED chip 102 by total internal reflection is reduced Light rate, wavelength conversion member are used to the blue light that LED chip 102 projects being converted to white light.In other embodiments, outer layer 420o ratio Core layer 420e comes firmly, to protect LED chip 102.In another embodiment, the heat conductivity of core layer 420e compares outer layer 420o is big, and the excessive heat of LED chip 102 can be removed in the biggish heat conductivity of core layer 420e, to preferably protect LED chip 102 array, so that it will not deteriorate or burn out.Since the array of outer layer 420o and LED chip 102 is separated, outer layer 420o is lower than core layer 420e in the importance through cooling 102 aspect of LED chip of heat transfer.In another embodiment, outer layer The thermal radiation capability of 420o is come well than core layer 420e.102 mistake of LED chip can be removed in the preferable thermal radiation capability of outer layer 420o More heat, to preferably protect the array of LED chip 102, so that it will not deteriorate or burn out.Due to the hot spoke of core layer 420e Penetrate that ability is poor, core layer 420e is lower than outer layer 420o in the importance through cooling 102 aspect of LED chip of heat radiation.Again In one embodiment, in contrast to lamp, in order to enhance the ability that LED filament 100 shows object realistic colour, core layer 420e Compared to outer layer 420o, there is the spectrum (and/or emission spectrum) of excitation on shorter wavelength.It is preferable by heat conductivity La m (such as core layer 420e), can promptly by the outer layer of the heat transfer from LED chip 102 to LED filament 100 (such as Outer layer 420o), and by the high radiant rate of outer layer come the gas promptly by heat release into the lamp housing of LED bulb, and It needs not rely on and light-blocking heat dissipation metal substrate is be easy to cause to make LED filament in conventional process, can reach complete cycle goes out light LED filament light source, and good radiating efficiency can be reached.In the present embodiment, core layer 420e is used to LED chip 102 The position issued is converted to position in the light of visible light in the light of ultraviolet light range.On the contrary, the outer layer of LED filament 100 420o is used to that the light with longer wavelength will be converted to from the light of core layer 420e.In one embodiment, core layer 420e is doped with concentration phosphor particles more higher than outer layer 420o.In some embodiments, outer layer 420o optionally includes glimmering The photoinitiator dye phosphor particles lower than core layer 420e with concentration, fluorescent dye can be used to have from the light of core layer 420e There is the light of longer wavelength.In different embodiments, outer layer 420o can also only include fluorescent dye without including phosphor particles, such as This can keep the height of LED filament 100 flexible.The core layer 420e of 102 array of LED chip is uniquely provided in LED filament 100 Size, relative to entirely envelope body 108 for, be consider integrated demand, such as light transfer capability, bendable folding endurance, with heat transfer Rate, thus determine.For entirely envelope body 108, core layer 420e is bigger, then LED filament 100 has fewer light Transfer capability and pyroconductivity, but can have higher bending.

3A and Figure 23 B referring to figure 2., Figure 23 A show the conductive knot for connecting LED filament annular in shape of the utility model The schematic diagram of structure embodiment, Figure 23 B are the schematic cross-section marked when being inserted into conducting bracket at sp in Figure 23 A.

Figure 23 A is shown in an embodiment, the conductive structure when filament tail end is connected to form ring-type.Figure 23 A is omitted Light conversion layer only shows LED chip and conductive structure.In this embodiment, multiple LED chips 102 and two conducting channels 524 are configured axially along filament, and conducting channel 524 can be the copper foil conducting wire for being printed in base 420b, the end of conducting channel 524 Portion has sheet metal 506p, and sheet metal 506 is at least a part of to protrude from filament envelope body (not shown go out) outside.In this embodiment The sheet metal 506 of two conducting channels 524 is located at different ends, has gold thread 504 between chip 102 and conducting channel 524 It is electrically connected, is formed with multiple protrusion 524a protruded outward in conducting channel 524.When filament headtotail and ring-type is enclosed When being coiled into circle, the sheet metal 506p positioned at 524 one end of conducting channel surround and is electrically connected to the other end of conducting channel 524, The Feng Tike above the other end of conducting channel 524 has inserting slot construction for the insertion of sheet metal 506 at this time, and sheet metal 506 is inserted Enter to be bound to after 524 other end of conducting channel still again with electric welding/conducting resinl or transparent adhesive tape reinforcement joint.Conducting bracket point It is not configured on any protrusion 524a in two conducting channels, at this time as shown in fig. 23b, lug boss 524a is in base The upper outside past from the inside of filament 420b is top layer 420a above lug boss, can have hole 468 in top layer 420a radially along stretching For conducting bracket 51 (conducting bracket 51a, 51b of such as Figure 14 A to Figure 14 C) insertion, the narration of similar aforementioned metal piece is conductive / conducting resinl reinforcement engagement can also be welded after bracket insertion hole.Since the insertion of conducting bracket is led with as LED chip 102/ The gold thread 504 being electrically connected between circuit 524 does not influence conducting channel itself in conducting electricity in axial direction, therefore even if conducting bracket Lead to the abrasion of protrusion because of friction with protrusion, is combined as long as conducting bracket is moved on other protrusions；If The situation of broken string or single LED wafer damage occurs for the gold thread between LED chip and conducting channel, also there was only the LED chip It does not shine, without influencing whether shining for whole cluster of lamps, ornamental silk.

In above-described embodiment, gold thread 504 is also substitutable for self-conductive circuit 524 along the printed circuit cable of stretching, at this time LED chip 102 can be inverted structure.Gold thread 504 and protrusion 524a can be a part in conducting channel 524, also can be It is respectively formed.Protrusion 524a and/or gold thread 504 can be transparent printed circuit, such as ITO, graphene, carbon nanotubes etc., by It is radially along stretching in protrusion and gold thread, the amount of bow compared to conducting channel 524 is smaller, therefore allows bending resistance smaller Ito thin film formed.Protrusion/gold thread also has the function of from filament inside leading thermal energy toward on the outside of filament at this time.In above-mentioned In embodiment, protrusion can be formed above hole 568 and be inserted into for conducting bracket；Do not have one end of sheet metal 506p in conducting channel On can have slot for sheet metal 506 insertion；But it is also not limited to this, can also be propped up conduction in production filament process Frame/sheet metal connection is welded after on lug boss/conductive electric wire directly formation top layer 402a.In addition conducting bracket/sheet metal Front end can also have it is T-shaped or hook-shaped.

In addition, conducting bracket is formed on protrusion in above-described embodiment, but conducting channel can also not have protrusion Portion, and conducting bracket is formed on any point of conducting channel 524.In above-described embodiment, sheet metal 506 is only configured at conduction The wherein one end of circuit 524, but it is not limited to this, and sheet metal 506 is also configured in two ends of conducting channel 524, and Sheet metal 506 on both ends can have male and female connected structure.

In above-described embodiment, unnotched ring filament can be formed.In addition, conducting bracket can be formed in appointing for filament At one, without in the two-end-point end to end for being limited to filament, therefore the substantially freedom degree of hand lamp silk configured in one piece.In addition, being located at convex Hole above the portion of rising can also be inserted into the cantilever to filament supports other than being inserted into for conducting bracket, and cantilever is also at this time It can reach the effect for promoting heat dissipation.

4A to Figure 24 C referring to figure 2., Figure 24 A to Figure 24 C show the embodiment of the LEDbulb lamp of the utility model Schematic diagram.In order to improve the light efficiency performance of LEDbulb lamp 1, lamp housing 12 must have preferable transparency and heat-conducting effect, because This, the present embodiment is preferred using glass lamp housing, and the plastic lamp housing for furthermore having high light transmission and high thermal conductivity effect also may be selected.And it examines Consider demand of the market segment to low color temperature bulb lamp, it can be as film 121 as shown in fig. 24 a, formed on lamp housing 12 to adjust color Temperature, it is preferable that the film 121 is the thin film (or metal spraying) in 12 inner surface spraying plating of lamp housing；Certain film It can be one layer of golden yellow film in the outer surface spraying plating of lamp housing 12；In addition to the above two ways, the film 121 is also It may is that when manufacturing lamp housing 12, appropriateness adulterates colorant in 12 raw material of lamp housing, whereby, the film 121 of the lamp housing 12 can The light that the micro absorption part LED chip of appropriateness is issued, to downgrade the colour temperature performance of LEDbulb lamp 1, when LED chip issues Light when being blue light, the film can be golden yellow film；Certainly, the color of the film 121 can be according to LED chip The corresponding adjustment of luminescent color.It should be further noted that film can also be avoided using in 12 inner surface sputtered film of lamp housing It falls off, and does not have to other heating schedule.By the way of the sputtered film of lamp housing outer surface, have the effect of reducing fingerprint, Lamp housing aesthetics is improved, while increasing the uniformity on lamp housing surface.Or lamp housing also can be the lamp housing of cloudy surface or mirror surface.

In the production process, stem and lamp housing generally use blanking sealing mode to traditional bulb lamp, that is, work as glass material Loudspeaker stem when covering the opening in glass lamp housing and being sintered sealing, in order to avoid the sintering thawing of lamp housing and stem is not filled Divide and core column horn mouth-shaped is irregular, the two is caused to seal untight problem, the open end of lamp housing can be arranged longer And form redundant side, the redundant side after the completion of sintering, can Automatic-falling become blanking, when serious waste material and technique Between.In addition, the wall thickness of traditional mode lamp housing and stem is substantially the same, there is a problem of that docking is inaccurate and is sintered insufficient.For This, the present invention, which provides an embodiment, can solve problem above.Specifically, as shown in fig. 24b, the lamp housing 12 and core of bulb lamp 1 Column 19 is glass material, and the two abandons traditional blanking sealing, and uses docking sealing mode, in order to facilitate stem 19 compared with Readily the opening 12 of insertion lamp housing 12 realizes docking, can set different thickness for the wall thickness of stem 19 and lamp housing 12. Preferably, the present embodiment is bigger than the wall thickness of stem using the wall thickness of lamp housing 12, in this way when lamp housing 12 and the sintering docking of stem 19 When, since stem 19 is relatively thin, it is easily deformed and is conveniently docked with lamp housing 12；Further, since the wall thickness of lamp housing 12 is thicker, work as heating When can to have more sufficient glass to melt be glass metal to condense with stem 19, sealing effect is good, and also there is no need to be arranged at this time The redundant side of lamp housing, and then raw material are saved, it reduces costs.

In another embodiment, as shown in Figure 24 C, upright bar 19a (such as Figure 14 C can also be not provided in LEDbulb lamp Shown in upright bar 19a), cantilever 15 can be fixed on stem 19 or lamp plate at this time, reduce upright bar for going out the influence of light.It is excellent Selection of land, the quantity of the cantilever 15 can be 3 to 5, and certain particular number is not limited thereto, and designer can adjust as needed It is whole.

5A to 25C referring to figure 2., Figure 25 A are partial cross section's enlarged diagram of the first embodiment of lamp housing of the invention, Figure 25 B is partial cross section's enlarged diagram of the second embodiment of lamp housing of the invention, and Figure 25 C is the third of lamp housing of the invention Partial cross section's enlarged diagram of embodiment.As shown in fig. 25 a, lamp housing 12 includes glue-line 12a and diffusion barrier 12b, and glue-line 12a Between lamp housing 12 and diffusion barrier 12b, glue-line 12a can fastness between enhanced diffustion film 12b and lamp housing 12.Diffusion barrier 12b It then can be used for spreading and penetrate the light of lamp housing 12, make LEDbulb lamp 10c, 10d that can there is lighting effect more evenly.Except this it Outside, diffusion barrier 12b can be also attached directly on lamp housing 12 without glue-line 12a, and diffusion barrier 12b can be attached to the outer of lamp housing 12 Side or inside.In other embodiments, diffusion barrier 12b can also be substituted with toning film, the adjustable LEDbulb lamp 10c of toning film, The colour temperature for the light that 10d is issued；Alternatively, diffusion barrier 12b can have both the function of adjustment colour temperature, such as light is added in diffusion barrier 12b Transformational substance, the smooth transformational substance can be wavelength convert particle.

As shown in Figure 25 B, in order to promote the safety of lamp housing, in an embodiment, lamp housing 12 may include gluing film 12c, The gluing film 12c can be attached to the outside or inside of lamp housing 12, and in this present embodiment, the gluing film 12c is located at lamp housing 12 Inside.The material of adhesive film 12c can be calcium carbonate or strontium phosphate, the selection of adhesive film 12c thickness and the weight of LEDbulb lamp It is related.If LEDbulb lamp is provided with radiator, (such as position is between lamp housing 12 and lamp cap 16 shown in Figure 14 A to Figure 14 C Radiating fin group), the 0.7 to 0.9W/m* of at least 70% is contained and when the total weight of radiator is more than 100 grams, in radiator K heat-conducting glue, the thickness of adhesive film 12c will be between 200 microns (μm) to 300 microns (μm) at this time.When radiator is not injected into When heat-conducting glue, about at 80 grams or less, adhesive film 12c's can send out weight with a thickness of 40 microns (μm) to 90 microns (μm) The effect of explosion-proof promotion is waved, the lower limit of thickness and the weight of lamp are related, it must consider explosion-proof problem, and the upper limit is greater than 300 μm Light transmittance can be made insufficient, increase material cost, the combination of materials of adhesive film 12c is mainly calcium carbonate or strontium phosphate, among process Organic solvent of arranging in pairs or groups carries out reconciliation appropriate, and after lamp housing 12 is broken, the fragmentation of lamp housing 12 can be connected to one by adhesive film 12c It rises, is not likely to produce broken hole, accidentally come in contact internally charged body to avoid user, electric shock accidents occurs.

The colour temperature of filament lamp can be adjusted by the collocation of LED chip and the fluorescent powder in phosphor gel/film.Except this it Outside, such as Figure 25 C, in the present embodiment, lamp housing/stem/upright bar also can have the effect of colour temperature adjusts.Such as the master when lamp housing When material is glass, light transformational substance 12d can be added in glass sintering, to form the lamp housing 12 with light transformational substance 12d； Or toning film of the upper coating mixed with light transformational substance on the inside or outside of transparent glass；Stem/upright bar is also such.

Filament lamp can be roughly divided into two kinds of main Types of decoration and illumination according to colour temperature, when filament lamp is main to decorate When purposes, colour temperature can be adjusted to 1700-2700K, averagely drilling color evaluation number (Ra) can be 70-100, preferably 90-100. When filament lamp is to illuminate as main application, colour temperature can be adjusted to 2500-3500K, luminous efficiency can for 80-100 lumen/ Watt, averagely drilling color evaluation number (Ra) can be 60-100, preferably 80-100.Light transformational substance can be such as fluorescent powder, dyestuff (such as nanoparticle of silver compound, gold, titanium, silver cladding gold, golden coated with silver) etc..

In addition it is also possible on the inside of lamp housing (diffusion barrier 12b or coating as shown in Figure 25 A) or outside or stem, It is coated with diffusion barrier in upright bar, increases the diffusion of light.For example, the main component when diffusion barrier can be calcium carbonate, calcium halophosphate activated by antimony andmanganese And aluminium oxide is wherein any, or in which wantonly two kinds of combination or three kinds of combination.When utilization calcium carbonate is main material Solution appropriate of arranging in pairs or groups is formed by diffusion coating, will be with excellent diffusion and light transmission (having an opportunity to reach 90% or more) Effect.When diffusion barrier is coated on the outer surface of lamp housing, radiator below diffusion coating and lamp housing (or lamp cap, plastics Lamp holder) between frictional force increase, and significantly solve the problems, such as that lamp housing falls off.

In the present embodiment, in allotment, the constituent of diffusion coating include calcium carbonate, strontium phosphate (such as CMS-5000, White powder), thickener and ceramics activated carbon (such as ceramic active carbon SW-C, colourless liquid).Specifically, when diffusion applies For layer using calcium carbonate as main material, arrange in pairs or groups thickener, ceramic active carbon and deionized water are coated on the inner peripheral surface of lamp housing after mixing Or on outer peripheral surface, the thickness of coating is fallen between 20 to 300 μm, preferably can be between 20-30 μm.It is formed using this material Diffusion barrier can have about 90% light transmittance, it is however generally that, the range of light transmittance is about 85% to 96%.In addition, this expansion Film is dissipated other than having the effect of spreading light, moreover it is possible to play the role of electric isolution, so that when glass lamp rupture, Reduce the risk of user's electric shock；This diffusion barrier can make light source when luminous, and light is allowed to generate diffusion, past to penetrate from all directions Out, to avoid the formation of dark space, the illumination comfort of room for promotion.In addition, when the diffusion coating of selection different materials ingredient, or When being the diffusion barrier by adjusting different-thickness, available different illuminating effect.

In other embodiments, diffusion coating can also be using calcium carbonate as main material, reflecting material (such as strontium phosphate of arranging in pairs or groups a small amount of Or barium sulfate), thickener, ceramic active carbon and deionized water, after mixing be coated on lamp housing on, the average thickness of coating is fallen in Between 20 to 30 μm.Since the purpose of diffusion barrier is that light is allowed to generate diffusion, phenomenon is diffused for microcosmic, is light through particle The grain diameter size of the reflecting materials such as reflex, strontium phosphate or barium sulfate can be much larger than the partial size of calcium carbonate, and therefore, selection exists A small amount of reflecting material is added in diffusion coating, can effectively increase the diffusion effect of light.

Certainly, in other embodiments, calcium halophosphate activated by antimony andmanganese can also be selected or aluminium oxide is the main material of diffusion coating, carbonic acid The partial size of the particle of calcium is about fallen between 2 to 4 μm, and the partial size of the particle of calcium halophosphate activated by antimony andmanganese and aluminium oxide about respectively falls in 4 Between to 6 μm between 1 to 2 μm, by taking calcium carbonate as an example, when the claimed range of light transmittance falls in 85% to 92%, it is whole with Calcium carbonate is the average thickness that need to coat of diffusion coating of main material about at 20 to 30 μm, in identical light transmittance requirement range Under (85% to 92%), calcium halophosphate activated by antimony andmanganese is that the average thickness that the diffusion coating of main material need to coat can fall in 25 to 35 μm, oxygen The average thickness that changing the diffusion coating that aluminium is main material need to coat can fall in 10 to 15 μm.If light transmittance demand is higher, example Such as 92% or more, then it is then needed using calcium carbonate, calcium halophosphate activated by antimony andmanganese or aluminium oxide as the diffusion coating thickness of main material thinner.

The LED lamp of multiple embodiments of the utility model has been described in.About each thin portion in entire LED lamp Technical characteristic, the various components such as LEDbulb lamp, LED filament, LED filament internal element such as electrode are thin with each element Connection relationship between portion's structure and various components and each element is all taken off house through multiple embodiments and has been revealed, and these technologies are special Sign can individually implement any one, multiple technical characteristics can also be combined implementation.

The utility model has hereinbefore been disclosed with preferred embodiment, and so being familiar with the technology person should be understood that the reality It applies example to be only used for describing the utility model, and is not construed as limitation the scope of the utility model.It should be noted that such as with this Embodiment equivalent variation and displacement, should all be set as being covered by the scope of the utility model.Therefore, the protection of the utility model Range is when being subject to the scope of which is defined in the appended claims.

Claims

1. a kind of LED filament, which is characterized in that the LED filament includes:

Multiple LED chips, are electrically connected with each other；

The light conversion layer is exposed on light conversion layer, at least two sides and the electrode, the part electrode for covering the LED chip Except, the light conversion layer includes a top layer and a base, and the base covers a surface of the LED chip, the top layer Cover opposite another surface covered by the base of the LED chip；

The electrode includes hole, and the base or top layer pass through described hole and extend to the other end of described hole.

2. a kind of LED filament as described in claim 1, which is characterized in that the top layer and the base, the base and institute The contact surface for stating electrode or the top layer and the electrode is rough surface.

3. a kind of LED filament as described in claim 1, which is characterized in that the top layer and the base, the base and institute The contact surface for stating electrode or the top layer and the electrode is wave surface.

4. a kind of LED filament as described in claim 1, which is characterized in that the top layer is further extended through described hole To the surface of the base, this surface is the contact surface of the base and the top layer.

5. a kind of LED filament as claimed in claim 4, which is characterized in that the light conversion layer includes phosphor gel, described glimmering Light arogel extends to the electrode, and then extends to the surface of the base, this surface is connecing for the top layer and the base Contacting surface.

6. a kind of LED filament as described in claim 1, which is characterized in that the electrode is coated by the light conversion layer, described Electrode is riveted together with the light conversion layer.

7. a kind of LED filament as described in claim 1, which is characterized in that the base includes phosphor gel, the fluorescent powder Glue extends to each electrode, and worn on one side to opposite another side from described hole.

8. a kind of LED filament as claimed in claim 7, which is characterized in that each electrode is coated by the base, described Base is riveted together with the electrode.

9. a kind of LED filament as described in claim 1, which is characterized in that the top layer includes phosphor gel, the fluorescent powder Glue extends to each electrode, and worn on one side to opposite another side from described hole.

10. a kind of LED filament as claimed in claim 9, which is characterized in that the electrode is coated by the top layer, the top Layer and the electrode are riveted together.

11. a kind of LED filament as described in claim 1, which is characterized in that the electrode includes at least one bonding pad and extremely A few auxiliary member, described hole are distributed in the bonding pad and the auxiliary member.

12. a kind of LED filament as claimed in claim 11, which is characterized in that the base includes phosphor gel, the fluorescence Arogel extends to the auxiliary member, and worn on one side to opposite another side from described hole.

13. a kind of LED filament as claimed in claim 11, which is characterized in that the electrode has around the LED chip At least two sides, the electrode includes two auxiliary members and bonding pad, wherein an auxiliary member is prolonged by the side of the bonding pad It stretches and is combined with the bonding pad at L-shaped.

14. a kind of LED filament as claimed in claim 11, which is characterized in that the electrode includes two auxiliary members and a connection Area, the auxiliary member are respectively connected to the opposite sides of the bonding pad, and the auxiliary member and the bonding pad form U-shaped.

15. a kind of LED filament as claimed in claim 11, which is characterized in that the electrode includes an auxiliary member, described auxiliary Assistant piece is connected to the center of bonding pad, and T shape is collectively formed in the auxiliary member and the bonding pad.

16. a kind of LED filament as claimed in claim 11, which is characterized in that the auxiliary member is opened by the entire bonding pad Begin to extend, and the width of the auxiliary member can gradually be subtracted by the free end for being connected to fixing end towards the opposite side of the bonding pad It is small.

17. a kind of LED filament as claimed in claim 16, which is characterized in that the fixing end of the auxiliary member is aligned entire institute State bonding pad and the base, the auxiliary member is trapezoidal or triangle or semicircle.

18. a kind of LED filament as described in claim 1, which is characterized in that the electrode has two bonding pads and transition Area, for the transition region between the bonding pad, the width of the bonding pad is greater than the transition region.

19. a kind of LED filament as claimed in claim 18, which is characterized in that the filament width is W, the company of the electrode The width for meeting area is 1/4W to W, and the width of the transition region of the electrode is 1/10W to 1/5W.

20. a kind of LED filament as described in claim 1, which is characterized in that the electrode is coated or described by the top layer Base coats or is coated jointly by base with top layer.

21. a kind of LED filament as claimed in claim 20, which is characterized in that the electrode, the LED chip are respectively positioned on institute It states base or top layer or the electrode, the LED chip is respectively at base and top layer.

22. a kind of LED filament, which is characterized in that the LED filament includes:

Two electrodes, each described electrode are electrically connected a corresponding LED chip；And

The light conversion layer is exposed on light conversion layer, at least two sides and the electrode, the part electrode for covering the LED chip Except, the electrode includes hole, and the light conversion layer connects the electrode by described hole to reinforce the light conversion layer With it is described it is interelectrode securely.

23. a kind of LED filament as claimed in claim 22, which is characterized in that the contact of the light conversion layer and the electrode Face is rough surface.

24. a kind of LED filament as claimed in claim 22, which is characterized in that the contact of the light conversion layer and the electrode Face is wave surface.

25. a kind of LED filament as claimed in claim 22, which is characterized in that the electrode is coated by the light conversion layer, institute It states light conversion layer and the electrode is extended to by described hole.

26. a kind of LED filament as claimed in claim 25, which is characterized in that the light conversion layer is from one side of described hole It wears to opposite another side.

27. a kind of LED filament as claimed in claim 26, which is characterized in that the light conversion layer includes phosphor gel, described Phosphor gel extends to the electrode and worn on one side to opposite another side from described hole.

28. a kind of LED filament as claimed in claim 22, which is characterized in that the electrode include at least one bonding pad and At least one auxiliary member, described hole are distributed in the auxiliary member.

29. a kind of LED filament as claimed in claim 28, which is characterized in that the auxiliary member is coated by the light conversion layer, The light conversion layer is extended in each auxiliary member by described hole.

30. a kind of LED filament as claimed in claim 29, which is characterized in that the light conversion layer includes phosphor gel, described Phosphor gel extends to the auxiliary member, and worn on one side to opposite another side from described hole.