CN209009162U - Novel silicon chip packing box - Google Patents
Novel silicon chip packing box Download PDFInfo
- Publication number
- CN209009162U CN209009162U CN201821689602.2U CN201821689602U CN209009162U CN 209009162 U CN209009162 U CN 209009162U CN 201821689602 U CN201821689602 U CN 201821689602U CN 209009162 U CN209009162 U CN 209009162U
- Authority
- CN
- China
- Prior art keywords
- guide sleeve
- pressing plate
- mandril
- spring
- support
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model provides a novel silicon chip packing box, which comprises a left pressing plate, a left ejector pin, a left spring, a left guide sleeve, an upper supporting plate, a right spring, a right ejector pin, a right pressing plate and a right guide sleeve, wherein the left pressing plate is fixed on the lower end surface of the left ejector pin through a bolt, the left ejector pin is arranged at the middle part in the left guide sleeve, the left spring is welded on the upper side surface in the left guide sleeve, the lower end of the left spring is connected with the left ejector pin, the left guide sleeve is fixed at the left part of the lower end surface of the upper supporting plate, the upper supporting plate is fixed at the upper part in the packing box body at the upper side surface of the left bracket, the right spring is welded on the upper side surface in the right guide sleeve, the lower end of the right spring is connected with the right ejector pin, the right ejector pin is arranged in the right guide sleeve, the right pressing plate, the practicability is strong and the stability is good.
Description
Technical field
The utility model is a kind of novel silicon slice packing case, belongs to silicon wafer packing technique field.
Background technique
Silicon wafer positioning clamping can not easily be caused silicon wafer by silicon wafer packing case in the prior art during transportation
Offset influences stability when silicon wafer transport, so being badly in need of wanting a kind of novel silicon slice packing case to solve the above-mentioned problem.
Utility model content
In view of the deficienciess of the prior art, the utility model aim is to provide a kind of novel silicon slice packing case, to solve
The problems mentioned above in the background art, the utility model is structurally reasonable, silicon wafer good positioning effect, practical, and stability is good.
To achieve the goals above, the utility model is achieved through the following technical solutions: a kind of novel silicon slice packet
Vanning, including apparatus main body and silicon wafer positioning mechanism, described device main body include packaging cabinet and hermatic door, the sealing
Door is connected through hinge activity in packaging cabinet leading flank right station, on the silicon wafer positioning mechanism is arranged in packing case body
Portion position, the silicon wafer positioning mechanism include left support, left pressing plate, left mandril, left spring, left guide sleeve, upper backup pad, right bullet
Spring, right mandril, right pressing plate, right support and right guide sleeve, the left support and right support bilateral symmetry are fixed in packing case body
On left side and right side, the left pressing plate is bolted on left mandril lower end surface, and the left mandril is mounted on a left side and leads
Middle part in set, the left spring is welded in left guide sleeve on upper side, and left spring lower end is connected with left mandril, and the left side is led
Set is fixed on upper backup pad lower end surface left part position, and the upper backup pad is fixed on top in the packing case body of left support upper side
Position, the right spring is welded in right guide sleeve on upper side, and right lower spring end is connected with right mandril, the right mandril peace
In right guide sleeve, the right pressing plate is bolted on right mandril lower end surface, and the right guide sleeve is mounted on upper backup pad
Lower end surface right part.
Further, the hermatic door front end face medium position is equipped with transparent windows.
Further, described four edges and corners in packaging cabinet lower end surface are mounted on adjusting foot, and the adjusting foot passes through lock
Tight bolt is connected with packaging cabinet.
Further, the left support and right support cross section are L-shaped, and the left support is identical as right support specification.
Further, elastic buffering pad, the elasticity are mounted on the left pressing plate lower end surface and right pressing plate lower end surface
Cushion is connected with left pressing plate and right pressing plate respectively by screw.
Further, the upper backup pad is fixed on upper position in packing case body by tie down screw.
The utility model has the beneficial effects that a kind of novel silicon slice packing case of the utility model, because the utility model adds
Left support, left pressing plate, left mandril, left spring, left guide sleeve, upper backup pad right spring, right mandril, right pressing plate, right support and
Right guide sleeve, which is placed on silicon wafer on left support and right support, then pushes silicon wafer, and silicon wafer squeezes left clamp and right clamping plate,
Under left spring and the effect of right recoil of spring power, left clamp and right clamping plate are closely pasted with silicon wafer respectively for left clamp and right clamping plate
It closes, and then silicon wafer is fixed on left support and right support by left clamp and right clamping plate, to realize the fast clamp function of silicon wafer
Can, stability when silicon wafer transport is improved, solving original silicon wafer packing case can not be by silicon wafer positioning clamping, in transportational process
In easily silicon wafer is caused to shift, influence silicon wafer transport when stability the problem of, the utility model is structurally reasonable, silicon wafer positioning
Effect is good, practical, and stability is good.
Detailed description of the invention
Upon reading the detailed description of non-limiting embodiments with reference to the following drawings, other spies of the utility model
Sign, objects and advantages will become more apparent upon:
Fig. 1 is a kind of structural schematic diagram of novel silicon slice packing case of the utility model；
Fig. 2 is the structural schematic diagram of silicon wafer positioning mechanism in a kind of novel silicon slice packing case of the utility model；
In figure: 1- silicon wafer positioning mechanism, 2- packaging cabinet, 3- hermatic door, 101- left support, 102- left pressing plate, 103- are left
Mandril, 104- left spring, the left guide sleeve of 105-, 106- upper backup pad, the right spring of 107-, the right mandril of 108-, 109- right pressing plate, 110-
The right guide sleeve of right support, 111-.
Specific embodiment
To be easy to understand the technical means, creative features, achievement of purpose, and effectiveness of the utility model, below
In conjunction with specific embodiment, the utility model is further described.
Fig. 1 and Fig. 2 are please referred to, the utility model provides a kind of technical solution: a kind of novel silicon slice packing case, including device
Main body and silicon wafer positioning mechanism 1, apparatus main body include that packaging cabinet 2 and hermatic door 3, hermatic door 3 are connected by hinge activity
It connects in packaging 2 leading flank right station of cabinet.
For the setting of silicon wafer positioning mechanism 1 in packaging 2 internal upper part position of cabinet, silicon wafer positioning mechanism 1 includes left support 101, a left side
Pressing plate 102, left mandril 103, left spring 104, left guide sleeve 105, upper backup pad 106, right spring 107, right mandril 108, right pressing plate
109, right support 110 and right guide sleeve 111, left support 101 and 110 bilateral symmetry of right support are fixed on left side in packaging cabinet 2
On face and right side, left pressing plate 102 is bolted on left 103 lower end surface of mandril, and left mandril 103 is mounted on left guide sleeve
Middle part in 105, left spring 104 is welded in left guide sleeve 105 on upper side, and 104 lower end of left spring is connected with left mandril 103
It connects, left guide sleeve 105 is fixed on 106 lower end surface left part position of upper backup pad, and upper backup pad 106 is fixed on 101 upper side of left support
2 internal upper part position of packaging cabinet, right spring 107 is welded in right guide sleeve 111 on upper side, and 107 lower end of right spring and right
Mandril 108 is connected, and right mandril 108 is mounted in right guide sleeve 111, and right pressing plate 109 is bolted on right 108 lower end of mandril
On face, right guide sleeve 111 is mounted on 106 lower end surface right part of upper backup pad, in use, operating personnel first places silicon wafer to left branch
In frame 101 and right support 110, silicon wafer is then pushed backward, silicon wafer moves backward on left support 101 and right support 110, silicon wafer
Left clamp and right clamping plate are moved backward while squeezing, left clamp drives left mandril 103 to move up in left guide sleeve 105, right folder
Strip is moved right mandril 108 and is moved up in right guide sleeve 111, and left mandril 103 moves up compression left spring 104, right mandril 108
The right spring 107 of compression is moved up, after silicon wafer is completely placed on left support 101 and right support 110, left pressing plate 102 and the right side
Under left spring 104 and the effect of right 107 elastic force of spring, left clamp and right clamping plate are fitted closely with silicon wafer pressing plate 109 respectively, into
And silicon wafer is fixed on left support 101 and right support 110 by left clamp and right clamping plate, to realize the fast clamp function of silicon wafer
Can, improve stability when silicon wafer transport.
3 front end face medium position of hermatic door is equipped with transparent windows, and operating personnel is observed by transparent windows and packed
The placement situation of silicon wafer in cabinet 2.
Packaging cabinet 2 lower end surface four edges and corners are mounted on adjusting foot, adjust foot and pass through clamping screw and packaging cabinet 2
It is connected, the placing height of packaging cabinet 2 can be adjusted by adjusting foot.
Left support 101 and 110 cross section of right support are L-shaped, and left support 101 is identical as 110 specification of right support.
It is mounted on elastic buffering pad on 102 lower end surface of left pressing plate and 109 lower end surface of right pressing plate, elastic buffering pad passes through spiral shell
Nail is connected with left pressing plate 102 and right pressing plate 109 respectively, and left clamp and right clamping plate are sprung back in left spring 104 and right spring 107
Under power effect, the elastic buffering pad in left clamp and right clamping plate is fitted closely with silicon wafer, improves left clamp and right clamping plate
Buffer protection.
Upper backup pad 106 is fixed on packaging 2 internal upper part position of cabinet by tie down screw, convenient for the fast of upper backup pad 106
Speed is fixed.
The basic principles and main features of the present invention and the advantages of the present invention have been shown and described above, for
For those skilled in the art, it is clear that the present invention is not limited to the details of the above exemplary embodiments, and without departing substantially from this
In the case where the spirit or essential attributes of utility model, the utility model can be realized in other specific forms.Therefore, no matter
From the point of view of which point, the present embodiments are to be considered as illustrative and not restrictive, and the scope of the utility model is by institute
Attached claim rather than above description limit, it is intended that will fall within the meaning and scope of the equivalent elements of the claims
All changes are embraced therein.It should not treat any reference in the claims as limiting related right
It is required that.
In addition, it should be understood that although this specification is described in terms of embodiments, but not each embodiment is only wrapped
Containing an independent technical solution, this description of the specification is merely for the sake of clarity, and those skilled in the art should
It considers the specification as a whole, the technical solutions in the various embodiments may also be suitably combined, forms those skilled in the art
The other embodiments being understood that.
Claims (6)
1. a kind of novel silicon slice packing case, including apparatus main body and silicon wafer positioning mechanism (1), it is characterised in that: described device
Main body includes that packaging cabinet (2) and hermatic door (3), the hermatic door (3) are connected through hinge activity before packing cabinet (2)
Side right station；
In packaging cabinet (2) internal upper part position, the silicon wafer positioning mechanism (1) includes a left side for silicon wafer positioning mechanism (1) setting
Bracket (101), left pressing plate (102), left mandril (103), left spring (104), left guide sleeve (105), upper backup pad (106), right bullet
Spring (107), right mandril (108), right pressing plate (109), right support (110) and right guide sleeve (111), the left support (101) with
Right support (110) is symmetrically fixed on packaging cabinet (2) interior left side and right side, and the left pressing plate (102) passes through spiral shell
Bolt is fixed on left mandril (103) lower end surface, and the left mandril (103) is mounted on middle part, the left spring in left guide sleeve (105)
(104) it is welded on left guide sleeve (105) interior upper side, and left spring (104) lower end is connected with left mandril (103), the left side
Guide sleeve (105) is fixed on upper backup pad (106) lower end surface left part position, and the upper backup pad (106) is fixed on left support (101)
Packaging cabinet (2) internal upper part position of upper side, the right spring (107) are welded on right guide sleeve (111) interior upper side, and right
Spring (107) lower end is connected with right mandril (108), and the right mandril (108) is mounted in right guide sleeve (111), the right pressure
Plate (109) is bolted on right mandril (108) lower end surface, and the right guide sleeve (111) is mounted under upper backup pad (106)
End face right part.
2. a kind of novel silicon slice packing case according to claim 1, it is characterised in that: in hermatic door (3) front end face
Portion position is equipped with transparent windows.
3. a kind of novel silicon slice packing case according to claim 1, it is characterised in that: packaging cabinet (2) lower end surface
Four edges and corners are mounted on adjusting foot, and the adjusting foot is connected by clamping screw with packaging cabinet (2).
4. a kind of novel silicon slice packing case according to claim 1, it is characterised in that: the left support (101) and right branch
Frame (110) cross section is L-shaped, and the left support (101) is identical as right support (110) specification.
5. a kind of novel silicon slice packing case according to claim 1, it is characterised in that: left pressing plate (102) lower end surface
Be mounted on elastic buffering pad on right pressing plate (109) lower end surface, the elastic buffering pad by screw respectively with left pressing plate
(102) and right pressing plate (109) is connected.
6. a kind of novel silicon slice packing case according to claim 1, it is characterised in that: the upper backup pad (106) passes through
Tie down screw is fixed on packaging cabinet (2) internal upper part position.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821689602.2U CN209009162U (en) | 2018-10-16 | 2018-10-16 | Novel silicon chip packing box |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821689602.2U CN209009162U (en) | 2018-10-16 | 2018-10-16 | Novel silicon chip packing box |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209009162U true CN209009162U (en) | 2019-06-21 |
Family
ID=66839104
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821689602.2U Expired - Fee Related CN209009162U (en) | 2018-10-16 | 2018-10-16 | Novel silicon chip packing box |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209009162U (en) |
-
2018
- 2018-10-16 CN CN201821689602.2U patent/CN209009162U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190621 Termination date: 20211016 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |