CN208984303U - A kind of printed circuit board through-hole solder joint leak inductance device - Google Patents
A kind of printed circuit board through-hole solder joint leak inductance device Download PDFInfo
- Publication number
- CN208984303U CN208984303U CN201821911273.1U CN201821911273U CN208984303U CN 208984303 U CN208984303 U CN 208984303U CN 201821911273 U CN201821911273 U CN 201821911273U CN 208984303 U CN208984303 U CN 208984303U
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- China
- Prior art keywords
- printed circuit
- circuit board
- pedestal
- workpiece
- sealing ring
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Links
- 229910000679 solder Inorganic materials 0.000 title claims abstract description 30
- 238000007789 sealing Methods 0.000 claims abstract description 65
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 claims abstract description 39
- 238000001914 filtration Methods 0.000 claims abstract description 25
- 238000003466 welding Methods 0.000 description 13
- 238000001514 detection method Methods 0.000 description 11
- 238000010586 diagram Methods 0.000 description 9
- 238000000034 method Methods 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 5
- 238000000354 decomposition reaction Methods 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 230000005611 electricity Effects 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 230000035945 sensitivity Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000035772 mutation Effects 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The utility model relates to a kind of printed circuit board through-hole solder joint leak inductance devices, and printed circuit board, shut-off valve and baroceptor including being welded with workpiece, further include pedestal, sealing filtration device, air-path interface.The whole outer profile that workpiece is located at printed circuit back pad is various shapes, shut-off valve one end is mutually fixed with air-path interface, the shut-off valve other end and one end of baroceptor are mutually fixed, the other end of baroceptor and the screw hole of pedestal are mutually fixed, the filter screen of sealing filtration device is arranged in a circle deep gouge of base wall lower end, sealing ring below filter screen is placed in the back side of printed circuit board, sealing ring surrounds the pad that workpiece is located at printed circuit back, and the pad that workpiece is located at printed circuit back is enclosed in the chamber of pedestal.The utility model realizes the printed circuit board through-hole solder joint leak inductance to different size and size, easy to operate, quick, False Rate zero, and checkability greatly improves.
Description
Technical field
The utility model relates to a kind of printed circuit board through-hole solder joint leak inductance devices, for detecting printed circuit board
Whether there is or not solder skip points for the workpiece of welding.
Background technique
The lifeline " product quality " of enterprise is the core of enterprise development, it has also become the common recognition of each enterprise, enterprise
Product quality determines the vital values of the product in the market, and no quality will lose the vigor of product, so that market is lost,
Benefit is lost, development opportunity is lost.
The development that electronic product is advanced by leaps and bounds, is related to all trades and professions and family, the welding quality of electronic product workpiece it is good
Bad is basis and the key link for embodying product quality, and it is most serious in printed circuit board welding that solder skip and scolding tin, which do not block welding hole,
The problem of one of, often a workpiece welding quality goes wrong, consequence as one can imagine, will cause the failure of entire project,
Very big loss can be caused to enterprises and individuals, so, as the manufacturing enterprise of electronic product, matter is welded to electronic product workpiece
The detection of amount is quite paid attention to as primary link.
There are two types of the prior art is general to the solder joint detection means of printed circuit board through-hole workpiece:
One kind is examined for artificial range estimation, and the quality of welding spot of workpiece is examined by manually estimating, and shortcoming is, artificial to examine
Low efficiency is tested, missing inspection is easy to happen.
Another kind is AOI vision inspections, is taken pictures by camera butt welding point, examines the shape of solder joint, the method is most
Suitable for the workpiece using Reflow Soldering, wave-soldering or manipulator welding, because the above welding method solder joint conformity is high, one
Denier discovery shape has mutation, can be detected whether by artificial emphasis as bad solder joint, AOI to artificial solder joint analysis ability very
It is low, because artificial solder joint conformity is poor, even if still having factors can shadow using the welding of Reflow Soldering, wave-soldering or manipulator
The judgement of AOI butt welding point is rung, in the actual production process, device sensitivity is improved, wrong report can be generated, there is still a need for use at this time
Artificial range estimation determines；Device sensitivity is reduced, and can generate and fail to report, the testing result of AOI, which can not become, judges that though-hole solder joint is
It is no by the fully filled sufficient and necessary condition of scolding tin.
Summary of the invention
Situation and existing deficiency in view of the prior art, the utility model provide a kind of printed circuit board through-hole solder joint leakage
Detection device is welded, present apparatus pedestal is placed in printed wire back by sealing filtration device, and workpiece is located at printing electricity
The pad of road back is enclosed in the chamber of pedestal, when scolding tin is filled up completely full printed circuit board welding hole and workpiece tube leg
When gap, the chamber of pedestal becomes an airtight chamber because be not filled by be fully welded the pipe leg gap of tin quantity of gas leakage it is long-range
In the normal quantity of gas leakage of airtight chamber, so being realized by the detection indoor pressure change of closed chamber to printed circuit board
Upper though-hole solder joint is welded with the judgement of no solder skip.
By the detection of the present apparatus, can fast and accurately judge on printed circuit board though-hole solder joint whether there is or not solder skip problem,
Without manually estimating judgement, False Rate zero.
To achieve the above object, used technical solution is the utility model: a kind of printed circuit board through-hole solder joint leakage
Detection device, printed circuit board, shut-off valve and baroceptor including being welded with workpiece are welded, workpiece is located at printed circuit backboard
The whole outer profile of face pad is various shapes, it is characterised in that: further includes pedestal, sealing filtration device, air-path interface；
The pedestal be it is rectangular-shaped, the upper surface of pedestal is equipped with screw hole, constitutes opening by base wall for a circle below pedestal
Rectangular chamber, a circle deep gouge is equipped on the base wall end face of rectangular chamber opening direction, screw hole communicates with rectangular chamber；
The sealing filtration device is made of filter screen and sealing ring；
The filter screen is rectangular sheet shape, is equipped with several filter hole at the middle part of filtering wire side, whole along several filter hole
One circle sealing ring of bonding, the whole outer profile of several filter hole are distributed in a circle sealing ring on filtering wire side outside external profile
In profile；
The overall profile of sealing ring is identical as the whole outer profile that workpiece is located at printed circuit back pad, and is greater than
The whole outer profile of pad；
Described shut-off valve one end is mutually fixed with air-path interface, and the shut-off valve other end and one end of baroceptor are mutually fixed,
The other end of baroceptor and the screw hole of pedestal are mutually fixed, and the filter screen of the sealing filtration device is arranged in base wall lower end
One circle deep gouge in, the sealing ring below filter screen is placed in the back side of printed circuit board, and workpiece is located at printed circuit by sealing ring
The pad of back surrounds, and the pad that workpiece is located at printed circuit back is enclosed in the chamber of pedestal.
The beneficial effects of the utility model are: the utility model is suitable for the printed circuit board through-hole of different size and size
Solder joint leak inductance, the outer contour shape of pedestal are standards, and the ring recess on pedestal is also standard, sealing filtration device mistake
The outer contour shape of strainer with a ring recess of pedestal be it is corresponding, the overall profile of the sealing ring of sealing filtration device is according to print
Brush route plate shape and workpiece to be measured are located at the whole outer contour shape of printed circuit back pad and determination, sealing
The quantity of several filter hole and position are to be distributed in sealing ring profile according to sealing ring Internal periphery on the filter screen of filter device
Internal, the printed circuit board different shape sum number, it can be achieved that different size and size is converted by sealing filtration device
The though-hole solder joint of amount carries out leak inductance, easy to operate, quick, has saved testing cost.
The cost of implementation of the utility model is far below the equipment cost of AOI, and testing result is not by solder joint shape and illumination
It influences, can fast and accurately judging the workpiece welded on printed circuit board, whether there is or not solder skip problems, determine without artificial range estimation, accidentally
Sentencing rate is zero, and checkability greatly improves.
When large-scale continuous production, is not also influenced by human subjective's factor and fatigue factor, had to testing result
Objectivity.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the cross-sectional view of the utility model；
Fig. 3 is the structural decomposition diagram of the utility model；
Fig. 4 is the bottom view of the utility model pedestal；
Fig. 5 is the sealing filtration device schematic diagram that the utility model sealing ring is rectangle；
Fig. 6 is the decomposition diagram of Fig. 5；
Fig. 7 is the sealing filtration device schematic diagram that the utility model sealing ring is L shape；
Fig. 8 is the decomposition diagram of Fig. 7；
Fig. 9 is the sealing filtration device schematic diagram that the utility model sealing ring is "+" font；
Figure 10 is the decomposition diagram of Fig. 9；
Figure 11 is the coordinate diagram of the utility model chamber internal and external pressure difference and testing time.
Specific embodiment
As shown in Figure 1 to 11, a kind of printed circuit board through-hole solder joint leak inductance device, including it is welded with workpiece 4-1
Printed circuit board 4, shut-off valve 5 and baroceptor 6, workpiece 4-1 is located at the whole foreign steamer of 4 back side pad of printed circuit board
Exterior feature is various shapes, further includes pedestal 1, sealing filtration device 2, air-path interface 3.
Pedestal 1 be it is rectangular-shaped, the upper surface of pedestal 1 is equipped with screw hole 1-1, is made of out for a circle base wall below pedestal 1
The rectangular chamber 1-2 put, on the base wall end face of rectangular chamber 1-2 opening direction be equipped with one circle deep gouge 1-3, screw hole 1-1 with
Rectangular chamber 1-2 is communicated.
Sealing filtration device 2 is made of filter screen 2-1 and sealing ring 2-2.
Filter screen 2-1 is rectangular sheet shape, several filter hole 2-1-1 is equipped at the middle part in the face filter screen 2-1, along several mistakes
One circle sealing ring 2-2 of bonding, the whole foreign steamer of several filter hole 2-1-1 on filtering wire side outside filter opening 2-1-1 entirety outer profile
Exterior feature is distributed in the profile of a circle sealing ring 2-2.
The overall profile of sealing ring 2-2 is located at the whole outer profile phase of 4 back side pad of printed circuit board with workpiece 4-1
Together, and greater than the whole outer profile of pad.
5 one end of shut-off valve and 3 phase of air-path interface are fixed, 5 other end of shut-off valve and one end of baroceptor 6 is mutually solid
It is fixed, the other end of baroceptor 6 and the screw hole 1-1 of pedestal 1 are screwed together, by the filter screen 2-1 of sealing filtration device 2
For spiral-lock in a circle deep gouge 1-3 of 1 wall lower end of pedestal, the sealing ring 2-2 below filter screen 2-1 is placed in the back of printed circuit board 4
Face, sealing ring 2-2 surround the workpiece 4-1 pad for being located at 4 back side of printed circuit board, and workpiece 4-1 is located at printing electricity
The pad at 4 back side of road plate is enclosed in the chamber 1-2 of pedestal 1.
Workpiece 4-1 be located at the whole outer profile of 4 back side pad of printed circuit board shape be L shape or "+" font or
Rectangular or square or rectangle or parallelogram or pentagon or hexagon or triangle it is trapezoidal fan-shaped or round or
The arbitrary geometrical plane figure such as ellipse.
The shape of the whole outer profile of sealing ring 2-2 be L shape or "+" font or rectangular or square or rectangle or
Parallelogram or pentagon or hexagon or triangle is trapezoidal or fan-shaped or the arbitrary geometrical plane such as round or ellipse
Figure.
Embodiment 1, as shown in Figure 5, Figure 6, when workpiece 4-1 to be measured is located at the entirety of 4 back side pad of printed circuit board
When outer contour shape is rectangular-shaped, the overall profile for the circle sealing ring 2-2 being bonded on sealing filtration device 2 is also rectangle
Shape, and be greater than the rectangular-shaped of pad, sealing ring 2-2 is placed in the back side of printed circuit board 4, and rectangular-shaped sealing ring 2-2 is by work
The rectangular-shaped pad that part 4-1 is located at 4 back side of printed circuit board surrounds, and rectangular-shaped pad is enclosed in pedestal 1
Chamber 1-2 in.
Embodiment 2, as shown in Figure 7 and Figure 8, when workpiece 4-1 to be measured is located at the entirety of 4 back side pad of printed circuit board
When outer contour shape is L shape shape, the overall profile for the circle sealing ring 2-2 being bonded on sealing filtration device 2 is also L shape
Shape, and it is greater than the L shape shape of pad, sealing ring 2-2 is placed in the back side of printed circuit board 4, and the sealing ring 2-2 of L shape shape will
The pad that workpiece 4-1 is located at the L shape shape at 4 back side of printed circuit board surrounds, and the pad of L shape shape is enclosed in base
In the chamber 1-2 of seat 1.
Embodiment 3, as shown in Figure 9 and Figure 10, when workpiece 4-1 to be measured is located at the whole of 4 back side pad of printed circuit board
When external chamfered shape is "+" word shape, the overall profile for the circle sealing ring 2-2 being bonded on sealing filtration device 2 is also
"+" word shape, and it is greater than the "+" word shape of pad, sealing ring 2-2 is placed in the back side of printed circuit board 4, "+" word shape
Sealing ring 2-2 the pad of the workpiece 4-1 "+" word shape for being located at 4 back side of printed circuit board is surrounded, and by "+" word
The pad of shape is enclosed in the chamber 1-2 of pedestal 1.
A kind of detection method of printed circuit board through-hole solder joint leak inductance device, steps are as follows:
Air-path interface 3 is linked together with pneumatic supply, printed circuit board 4 is fixed in tooling, movement mechanism is passed through
By the compacting of this detection device on printed circuit board 4, it is placed in this detection device by the sealing ring 2-2 below filter screen 2-1
The back side of printed circuit board 4 makes sealing ring 2-2 that the workpiece 4-1 pad for being located at 4 back side of printed circuit board is enclosed in sealing ring
In 2-2, and it is in the pad of workpiece 4-1 in the sealing space of 1 chamber of pedestal, at this time T=0, chamber 1-2 internal and external pressure difference P
=0；
Start pneumatic supply, opens shut-off valve 5, the air pressure that pneumatic supply generates passes sequentially through shut-off valve 5 and baroceptor 6 adds
Enter in the chamber 1-2 of pedestal 1, change chamber 1-2 internal and external pressure difference P, as P >=P0, closes shut-off valve 5, i.e. T0 moment,
Chamber 1-2 internal and external pressure difference is P0, and measuring chamber 1-2 internal and external pressure difference by baroceptor 6 at the T1 moment is P1, if P1
>=PS then shows chamber 1-2 good seal, while showing that the pad of detected 4 workpiece 4-1 of printed circuit board is sealed by scolding tin
It is stifled, solder skip situation is not present, that is, the pad for being detected 4 workpiece 4-1 of printed circuit board is qualified；On the contrary, if P1 < PS, table
The pad of bright 4 workpiece 4-1 of detected printed circuit board then shows the welding of 4 workpiece 4-1 of printed circuit board there are solder skip place
It is spot welded unqualified, removes printed circuit board 4 and be transferred to defective products treatment process.
In Figure 11:
P: for chamber internal and external pressure difference；
P0: to use pneumatic supply to change chamber internal and external pressure difference, initial chamber internal and external pressure difference is established；
P1: after time passage △ T, chamber internal and external pressure difference；
△T=T1-T0
PS: for for judging the chamber internal and external pressure difference threshold value of sealing space seal degree；
T: for the testing time；
T0: for the time point for establishing initial chamber internal and external pressure difference；
T1: for the time point of sealing space seal degree in detection chambers.
Pneumatic supply in the above method is to need to generate stable specific air pressure, specific gas according to the difference of detection process
Briquetting is containing positive air pressure or negative pressure or ambient atmosphere pressure.
Claims (2)
1. a kind of printed circuit board through-hole solder joint leak inductance device, including be welded with workpiece (4-1) printed circuit board (4),
Shut-off valve (5) and baroceptor (6), the whole outer profile that workpiece (4-1) is located at printed circuit board (4) back side pad is more
Kind shape, it is characterised in that: further include pedestal (1), sealing filtration device (2), air-path interface (3)；
The pedestal (1) be it is rectangular-shaped, the upper surface of pedestal (1) is equipped with screw hole (1-1), is a circle below pedestal (1) by pedestal
Wall constitutes open rectangular chamber (1-2), and a circle deep gouge is equipped on the base wall end face of rectangular chamber (1-2) opening direction
(1-3), screw hole (1-1) are communicated with rectangular chamber (1-2)；
The sealing filtration device (2) is made of filter screen (2-1) and sealing ring (2-2)；
The filter screen (2-1) is rectangular sheet shape, is equipped with several filter hole (2-1-1) at the middle part in the face filter screen (2-1), edge
One circle sealing ring (2-2) of bonding, several filter hole (2-1- on filtering wire side outside the whole outer profile of several filter hole (2-1-1)
1) whole outer profile is distributed in the profile of a circle sealing ring (2-2)；
The overall profile of sealing ring (2-2) is located at the whole outer profile phase of printed circuit board (4) back side pad with workpiece (4-1)
Together, and greater than the whole outer profile of pad；
Described shut-off valve (5) one end is mutually fixed with air-path interface (3), one end of shut-off valve (5) other end and baroceptor (6)
Mutually fixed, the other end of baroceptor (6) is mutually fixed with the screw hole (1-1) of pedestal (1), the sealing filtration device (2)
Filter screen (2-1) is arranged in circle deep gouge (1-3) of pedestal (1) wall lower end, the sealing ring (2-2) of filter screen (2-1) below
It is placed in the back side of printed circuit board (4), workpiece (4-1) is located at the pad packet at printed circuit board (4) back side by sealing ring (2-2)
It surrounds, and the pad that workpiece (4-1) is located at printed circuit board (4) back side is enclosed in the chamber (1-2) of pedestal (1).
2. a kind of printed circuit board through-hole solder joint leak inductance device according to claim 1, it is characterised in that:
The overall profile of the sealing ring (2-2) is L shape or "+" font or rectangular or square or rectangle or parallel four
Side shape or pentagon or hexagon or triangle is trapezoidal or fan-shaped or round or ellipse.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821911273.1U CN208984303U (en) | 2018-11-20 | 2018-11-20 | A kind of printed circuit board through-hole solder joint leak inductance device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821911273.1U CN208984303U (en) | 2018-11-20 | 2018-11-20 | A kind of printed circuit board through-hole solder joint leak inductance device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208984303U true CN208984303U (en) | 2019-06-14 |
Family
ID=66791273
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821911273.1U Withdrawn - After Issue CN208984303U (en) | 2018-11-20 | 2018-11-20 | A kind of printed circuit board through-hole solder joint leak inductance device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208984303U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109238586A (en) * | 2018-11-20 | 2019-01-18 | 汇德新创（天津）科技有限公司 | A kind of printed circuit board through-hole solder joint leak inductance device and detection method |
-
2018
- 2018-11-20 CN CN201821911273.1U patent/CN208984303U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109238586A (en) * | 2018-11-20 | 2019-01-18 | 汇德新创（天津）科技有限公司 | A kind of printed circuit board through-hole solder joint leak inductance device and detection method |
| CN109238586B (en) * | 2018-11-20 | 2023-12-01 | 汇德新创（天津）科技有限公司 | Device and method for detecting missing welding of welding spots of through hole of printed circuit board |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20190614 Effective date of abandoning: 20231201 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20190614 Effective date of abandoning: 20231201 |
|
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |