CN208967858U - Electromagnetic oven - Google Patents

Abstract

The utility model provides an induction cooker, which comprises a bottom shell (1), a coil panel (3), a circuit board assembly (4), a heat radiation fan (5) and a panel (2); the bottom shell (1) and the panel (2) jointly enclose a cavity capable of accommodating the coil panel (3), the circuit board assembly (4) and the heat dissipation fan (5); the circuit board assembly (4) comprises a circuit board (41) and a radiator (42), the heat dissipation fan (5) is located on the side of the radiator (42), an air inlet hole (10) is formed in the side wall, close to the heat dissipation fan (5), of the bottom shell (1), a heat dissipation plate (40) is arranged below the heat dissipation fan (5), the heat dissipation plate (40) is formed by extending the part of the radiator (42) towards the lower portion of the heat dissipation fan (5), and therefore the heat dissipation efficiency of the induction cooker is improved.

Description

Electromagnetic oven

Technical field

The utility model relates to field of home appliance technology more particularly to a kind of electromagnetic ovens.

Background technique

Electromagnetic oven have many advantages, such as heating quickly, the flames of anger, safe ready, it is more and more popular with consumers and recognize It can.

Electromagnetic oven specifically includes that the panel that bottom case, coil panel, circuit board assemblies, cooling fan and lid are located on bottom case； Bottom case and panel surround the cavity that can accommodate coil panel, circuit board assemblies and cooling fan jointly.In electromagnetic oven work, line Enclosing disk and circuit board assemblies etc. is main heater element, and cooling fan is used to radiate for heater element, wherein circuit board assemblies Including circuit board and radiator, radiator is contacted with the electronic component on circuit board, and the heat transfer of electronic component is extremely Radiator.Cooling wind outside electromagnetic oven enters in electromagnetism furnace chamber under the action of cooling fan from the air inlet hole of bottom case, Then radiator, circuit board and coil panel are blowed to, to realize heat dissipation.

However, leading to the radiating efficiency of electromagnetic oven since the heat dissipation area of the radiator of the electromagnetic oven of the prior art is smaller It is lower.

Utility model content

In order to solve the problems, such as at least one mentioned in background technique, the utility model provides a kind of electromagnetic oven, Neng Gouti The radiating efficiency of high electromagnetic oven.

To achieve the goals above, the utility model provides a kind of electromagnetic oven, including bottom case, coil panel, circuit board assemblies, The panel that cooling fan and lid are located on the bottom case；The bottom case and the panel surround jointly can accommodate the coil The cavity of disk, the circuit board assemblies and the cooling fan；The circuit board assemblies include circuit board and radiator, institute The side that cooling fan is located at the radiator is stated, the bottom case offers air inlet on the side wall of the cooling fan Hole, be provided with heat sink below the cooling fan, and the heat sink is that the radiator is partially toward the radiation air The lower section of machine extends and is formed.

The electromagnetic oven of the utility model, by the way that heat sink is arranged in the lower section of cooling fan, and heat sink is radiator The lower section for being partially toward cooling fan extends and is formed, that is, heat sink and radiator are integrally formed, to increase radiator Heat dissipation area, that is, increase the heat dissipation area of electromagnetic oven, to improve the heat dissipation effect of electromagnetic oven, extend in electromagnetic oven The service life of electronic component.Moreover, because air inlet hole is provided on the side wall of close cooling fan of bottom case, by that will dissipate Hot plate is arranged below cooling fan, while increasing heat dissipation area, not influencing air inlet, so that the space of bottom case is had Effect utilizes, and will not influence the setting of other components electromagnetic oven Nei.

Optionally, the heat sink is bonded with the inner bottom wall of the bottom case.

By the way that heat sink to be bonded with the inner bottom wall of bottom case, so that the flowing of the wind entered from air inlet hole is more suitable Freely, heat dissipation effect is further improved.

Optionally, there is gap between the lower surface of the heat sink and the inner bottom wall of the bottom case；

The range in the gap is 0.3mm~5mm.

In this way setting so that from air inlet hole enter wind flowing it is more smooth, further improve heat dissipation effect.

Optionally, the heat sink includes: by the radiator to bend downward the bending part formed and by the bending Portion is towards the extension extended to form below the cooling fan；

The extension is close or is bonded the inner bottom wall of the bottom case.

It avoid heat sink can to cooling fan effectively, guarantee effective outlet air of cooling fan；And And by forming bending part, the extension path of heat sink can be extended, that is, further increase heat dissipation area；In addition make to be located at and dissipate Extension below air-heater can close or fitting bottom case inner bottom wall, further ensure enter from air inlet hole it is distinguished and admirable Dynamic smoothness, further improves heat dissipation effect.

Optionally, the radiator includes the heat-radiating substrate being arranged on the circuit board and is arranged in the heat dissipation base Radiating fin on plate；

The bending part is bent downward by the part of the heat-radiating substrate and/or the radiating fin and is formed.

Optionally, the range of the difference in height between the extension and the main part of the heat-radiating substrate is 3mm~15mm.

That is, being arranged by the height for extending downwardly bending part within the above range, in the certain situation in space Under, the whole extension path of heat sink can be extended, further improve the smoothness of heat dissipation effect and wind flow.

Optionally, the upper surface of the heat sink is additionally provided with radiating fin.

By the way that radiating fin is arranged on heat sink, the radiating efficiency of heat sink can be improved, and then further improve electricity The radiating efficiency of magnetic furnace.

Optionally, heat release hole is offered on the bottom wall of the bottom case, the heat release hole is located at the lower section of the heat sink.

Since the lower section of heat sink has heat release hole, the heat that heat sink absorbs can be from heat release hole Quick diffusing to electromagnetism Outside furnace, to further improve the radiating efficiency of electromagnetic oven.

In addition, when heat sink is bonded with the inner bottom wall of bottom case, that is, heat sink is covered on heat release hole, thus effective While heat dissipation, it can prevent dust, steam, insect etc. from entering in bottom case from heat release hole.

Optionally, the thickness range of the heat sink is 1mm~5mm.

By within the above range, while guaranteeing effectively heat dissipation, saving and being fabricated to the thickness setting of heat sink This, and it is further ensured that heat sink will not impact air inlet.

Optionally, there is spacing between the upper surface of the heat sink and the cooling fan；

The altitude range of the spacing is 5mm~15mm.

By making to form spacing between the upper surface of heat sink and cooling fan, the height of spacing is arranged in above range It is interior, it can effectively ensure that the outlet air of cooling fan.

Optionally, the bottom case includes bottom cover and the upper cover on the bottom cover；

The cooling fan is fixed on the cover.

By the way that cooling fan to be fixed on upper lid, and not it is fixed on bottom cover, therefore that no setting is required on bottom cover is any For fixing the components of cooling fan, the extension of heat sink is caused to interfere to can avoid the components, avoids components It causes gear to set air inlet, improves intake and intake velocity, so that the heat dissipation of electromagnetic oven internal heat generation element is faster, improve electricity The radiating efficiency of magnetic furnace.

Optionally, the cooling fan is connect with the coil panel and/or radiator.

Alternatively, the cooling fan is connected to the lower surface of the panel.

By cooling fan being connected on coil panel and/or radiator or radiator is connected to the lower surface of panel, And be not fixed on bottom case, therefore that no setting is required on bottom case is any for fixing the components of cooling fan, to can avoid The components cause to interfere to the extension of heat sink, and components is avoided to cause gear to set air inlet, improve intake and air inlet speed Degree, so that the heat dissipation of electromagnetic oven internal heat generation element is faster, improves the radiating efficiency of electromagnetic oven.

The construction of the utility model and its other purposes and beneficial effect will be in conjunction with the accompanying drawings to preferred realities Apply the description of example and more obvious and easy to understand.

Detailed description of the invention

In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is Some embodiments of the utility model, for those of ordinary skill in the art, in the premise of not making the creative labor property Under, it is also possible to obtain other drawings based on these drawings.

Fig. 1 is the detonation configuration figure one for the electromagnetic oven that an embodiment of the present invention provides；

Fig. 2 is the detonation configuration figure two for the electromagnetic oven that an embodiment of the present invention provides；

Fig. 3 is the schematic enlarged-scale view in Fig. 2 at I；

Fig. 4 is the schematic diagram of internal structure for the electromagnetic oven that an embodiment of the present invention provides；

Fig. 5 is the sectional view along A-A of Fig. 4；

Fig. 6 is the structural representation of the circuit board assemblies and heat sink for the electromagnetic oven that an embodiment of the present invention provides Figure；

Fig. 7 is the structural schematic diagram of the upper cover for the electromagnetic oven that an embodiment of the present invention provides；

Fig. 8 is the corresponding partial structurtes enlarged drawing of Fig. 7.

Description of symbols:

1-bottom case；

11-bottom covers；

12-upper covers；

10-air inlet holes；

13-exhaust vents；

2-panels；

3-coil panels；

4-circuit board assemblies；

41-circuit boards；

42-radiators；

421-heat-radiating substrates；

422-radiating fins；

423-mounting holes；

40-heat sinks；

401-bending parts；

402-extensions；

5-cooling fans；

50-second connecting portions；

6-fixed structures；

60-linking arms；

61-first connecting portions；

62-glue grooves；

H-difference in height.

Specific embodiment

It is practical new below in conjunction with this to keep the objectives, technical solutions, and advantages of the embodiments of the present invention clearer Attached drawing in type embodiment, the technical scheme in the utility model embodiment is clearly and completely described, it is clear that is retouched The embodiment stated is the utility model a part of the embodiment, instead of all the embodiments.Based on the implementation in the utility model Example, every other embodiment obtained by those of ordinary skill in the art without making creative efforts belong to The range of the utility model protection.

Fig. 1 is the detonation configuration figure one for the electromagnetic oven that an embodiment of the present invention provides；Fig. 2 is that the utility model one is real The detonation configuration figure two of the electromagnetic oven of example offer is provided；Fig. 3 is the schematic enlarged-scale view in Fig. 2 at I；Fig. 4 is that the utility model one is real The schematic diagram of internal structure of the electromagnetic oven of example offer is provided；Fig. 5 is the sectional view along A-A of Fig. 4；Fig. 6 is the implementation of the utility model one The circuit board assemblies for the electromagnetic oven that example provides and the structural schematic diagram of heat sink；Fig. 7 provides for an embodiment of the present invention Electromagnetic oven upper cover structural schematic diagram；Fig. 8 is the corresponding partial structurtes enlarged drawing of Fig. 7.Referring to figs. 1 to shown in Fig. 8, this reality It applies example and a kind of electromagnetic oven is provided.

The electromagnetic oven includes: bottom case 1, coil panel 3, circuit board assemblies 4, cooling fan 5 and panel 2.Wherein, panel 2 Lid is located at the top of bottom case 1.Bottom case 1 is specific can include: bottom cover 11 and the upper cover 12 on bottom cover 11.Bottom case 1 and panel 2 The cavity that can accommodate coil panel 3, circuit board assemblies 4 and cooling fan 5 etc. is surrounded jointly.Wherein, panel 2 specifically can be glass Glass panel, is also possible to ceramic panel.Panel 2 can be specifically bonded in upper cover 12, wherein can be opened up in the top surface of upper cover 12 Panel 2 is bonded in upper cover 12 by glue groove by the adhesive in glue groove.Certainly, panel 2 can also be connected in upper cover 12.

In the present embodiment, bottom cover 11 is specially cavity body structure, that is, bottom cover 11 includes bottom wall and surrounds in bottom wall circumferential direction The side wall upwardly extended, the side wall of bottom cover 11 is formed as the side wall of bottom case 1, and upper cover 12 is specially frame shape lid, and the lid of upper cover 12 is set At the top of bottom cover 11.

In other implementations, being also possible to bottom cover 11 includes bottom wall, and upper cover 12 has the side wall extended downwardly, on The side wall of lid 12 is formed as at least partly side wall of bottom case 1.Alternatively, it is also possible that upper cover 12 specifically may include middle lid and position Upper cover body on middle lid, upper cover body can be frame shape lid, and middle lid may include being extended downwardly by the edge of upper cover body Side wall, the side wall of middle lid are formed as at least partly side wall of bottom case 1.

Wherein, coil panel 3 and circuit board assemblies 4 are electrically connected, and coil panel 3 specifically includes: coil plate rail and being wound around coil Coil on plate rail.Specifically can be, on coil plate rail have coiling partition, enameled wire along coiling partition winding, thus Coil is formed on coil plate rail.

When being cooked using electromagnetic oven, the cookware for being loaded with food materials is placed on panel 2, is powered to electromagnetic oven, this The electric current of Shi Huiyou high frequency is by the coil on coil panel 3, so that countless closed magnetic field forces are generated, magnetic force line cutting cookware, Countless small vortex are generated in the bottom surface of cookware, to heat to cookware.Since the magnetic line of force that coil energization generates is up and down It is two-way, in order to make the magnetic line of force be gathered in 3 top of coil panel as far as possible, that is, it is directed only to cookware, it, can be with to improve heating efficiency In the bottom of coil plate rail, magnetic stripe is set, magnetic stripe can be matched with the shape of coil plate rail, be guided by magnetic stripe to the magnetic line of force, The magnetic line of force is set to be gathered in 3 top of coil panel.

When electromagnetic oven works, coil panel 3 and circuit board assemblies 4 are main heater element, a large amount of heat can be generated, if hot Amount cannot distribute in time, will lead to coil panel 3 and 4 temperature rise of circuit board assemblies is excessively high, influence the normal use of electromagnetic oven.Cause This, radiates to heater elements such as coil panel 3 and circuit board assemblies 4 by cooling fan 5.

Wherein, there is air inlet hole 10 and exhaust vent 13, work of the cooling wind outside electromagnetic oven in cooling fan 5 on bottom case 1 Entering under from the air inlet hole 10 of bottom case 1, cooling wind blows to coil panel 3 and circuit board assemblies 4 under the action of cooling fan 5, Cooling wind takes away the heat on coil panel 3 and circuit board assemblies 4, then from the blowout of exhaust vent 13 on bottom case 1 to electromagnetic oven It is external.

In the present embodiment, cooling fan 5 specifically can be centrifugal blower.Certainly, in other implementations, radiation air Machine 5 is also possible to axial flow blower, and the utility model is not construed as limiting this, as long as can provide to coil panel 3 and circuit board assemblies 4 Cooling wind radiates to coil panel 3 and circuit board assemblies 4.

Circuit board assemblies 4 are specific can include: circuit board 41 and the radiator 42 on circuit board 41.It is set on circuit board 41 There is electronic component, electronic component is specific can include: insulated gate bipolar transistor (insulated-gate-bipolar Transistor, abbreviation IGBT), the elements such as bridge heap.It is radiated by radiator 42 to circuit board 41, to improve circuit board 41 Radiating efficiency.Radiator 42 herein is located on circuit board 41, it is possible to understand that are as follows: radiator 42 is specifically fixed on circuit board 41 On, radiator 42 is contacted with the electronic component on circuit board 41, alternatively, radiator 42 is fixed on bottom case 1, radiator 42 with Electronic component contact on circuit board 41.The heat that electronic component on circuit board 41 issues when working quickly is transferred to scattered Hot device 42, the cooling wind that cooling fan 5 is blown out takes away the heat of radiator 42, to radiate to circuit board assemblies 4.

In the present embodiment, air inlet hole 10 is provided on the side wall of close cooling fan 5 of bottom case 1, it can be understood as, into Air holes 10 is provided on the side wall of close cooling fan 5 of bottom cover 11.In other implementations, when bottom cover 11 include bottom wall, And upper cover 12 has side wall, when the side wall of upper cover 12 is formed as at least partly side wall of bottom case 1, air inlet hole 10 is provided with bottom case 1 Close cooling fan 5 side wall on it is to be understood that at least partly air inlet hole 10 is provided on the side wall of upper cover 12.

When specific implementation, air inlet hole 10 may include multiple apertures, and aperture can be circular hole, elliptical aperture, polygonal hole etc., small The particular number and arrangement mode the utility model in hole are not construed as limiting this, and the shapes and sizes of multiple apertures can be identical, Can be different, it can specifically be set according to actual needs.

In the present embodiment, the exhaust vent 13 on bottom case 1 is specifically provided on the side wall of separate cooling fan 5 of bottom case 1, It can avoid the case where cooling wind entered in electromagnetic oven is directly blown out from exhaust vent 13 in this way.Certainly, exhaust vent 13 It can be set on the bottom wall of bottom case 1.Alternatively, opening up exhaust vent 13 on the bottom wall and side wall of bottom case 1.Exhaust vent 13 can wrap Multiple apertures are included, aperture can be circular hole, elliptical aperture, polygonal hole etc., and the particular number and arrangement mode sheet of aperture are practical new Type is not construed as limiting this, and the shapes and sizes of multiple apertures may be the same or different, and can specifically carry out according to actual needs Setting.

Wherein, cooling fan 5 is located at the side of radiator 42.In order to improve the radiating efficiency in electromagnetic oven, in this implementation In example, the lower section of cooling fan 5 is additionally provided with heat sink 40, and heat sink 40 is that radiator 42 is partially toward cooling fan 5 Lower section extends and is formed.It is understood that heat sink 40 and radiator 42 are integrally formed.

It is formed since heat sink 40 is radiator 42 towards extending below cooling fan 5, that is, increase radiator 42 Heat dissipation area, that is to say, that increase the heat dissipation area of electromagnetic oven, to improve the heat dissipation effect of electromagnetic oven, extend electricity The service life of electronic component in magnetic furnace.Simultaneously as air inlet hole 10 is provided with the side wall of the close cooling fan 5 of bottom case 1 On, by being arranged heat sink 40 below cooling fan 5, while increasing heat dissipation area, not influencing air inlet, so that bottom The space of shell 1 is effectively used, and will not influence the setting of other components electromagnetic oven Nei.

In specific implementation, heat sink 40 and the inner bottom wall of bottom case 1 can be made to be bonded, in this way setting so that from air inlet hole 10 into The flowing of the wind entered is more smooth, further improves heat dissipation effect.Alternatively, being also possible to the lower surface and bottom of heat sink 40 There is gap between the inner bottom wall of shell 1.When specific implementation, can by the gap setting between 0.3mm~5mm, so as to make from The flowing for the wind that air inlet hole 10 enters is more smooth, further improves heat dissipation effect.

Radiator 42 specifically can be copper radiator, or aluminium radiator, material of the utility model to radiator 42 Matter is not construed as limiting, and radiator 42 can also be made of the good material of other heating conductions, the material of heat sink 40 and radiator 42 Matter is identical.

Referring to shown in Fig. 2 to Fig. 6, heat sink 40 include: bent downward by radiator 42 bending part 401 formed and by The extension 402 that the lower section of bending part 401 towards cooling fan 5 extends to form.Wherein, extension 402 is close or is bonded bottom The inner bottom wall of shell 1.Setting avoid heat sink 40 can to cooling fan 5 effectively in this way, guarantee cooling fan 5 Effective outlet air；And by forming bending part 401, the extension path of heat sink 40 can be extended, that is, further increase radiating surface Product；In addition enable the extension 402 for being located at 5 lower section of cooling fan close or the inner bottom wall of fitting bottom case 1, be further ensured that The smoothness of the wind flow entered from air inlet hole 10, further improves heat dissipation effect.

Specifically, radiator 42 includes: the heat-radiating substrate 421 being arranged on circuit board 41 and is arranged in heat-radiating substrate Radiating fin 422 on 421, radiating fin 422 can be to be multiple, and multiple radiating fins 422 are intervally arranged.Wherein, radiate base Plate 421 is arranged on circuit board 41 it is to be understood that heat-radiating substrate 421 is contacted with the electronic component on circuit board 41.Electronics Heat transfer on component is to heat-radiating substrate 421, and then heat is distributed through heat-radiating substrate 421 and radiating fin 422.Radiate base Plate 421 can be fixed on circuit board 41, can also be fixed on bottom case 1, if heat-radiating substrate 421 can on circuit board 41 Electronic component contact, carry out heat transfer.Wherein, radiating fin 422 can be integrally formed with heat-radiating substrate 421.

In the present embodiment, bending part 401 is specifically and is bent downward by the part of heat-radiating substrate 421 and formed.Certainly, exist In other implementations, bending part 401 can also be bent downward by the part of radiating fin 422 and be formed.Alternatively, bending part 401 bend downward jointly and are formed for the part of heat-radiating substrate 421 and radiating fin 422.

Specifically, the height difference H between extension 402 and the main part of heat-radiating substrate 421 can be arranged in 3mm~15mm Between.That is, being arranged by the height for extending downwardly bending part 401 within the above range, in the certain situation in space Under, the whole extension path of heat sink 40 can be extended, further improve the smoothness of heat dissipation effect and wind flow.It needs Bright, the main part of above-mentioned heat-radiating substrate 421 refers to the main part of heat-radiating substrate 421 contacted with electronic component Point, correspondingly, the height difference H between extension 402 and the main part of heat-radiating substrate 421 be heat-radiating substrate 421 and electronics Plane where the upper surface of the main part of component contact and the difference in height between the upper surface of extension 402.

Further, radiating fin (not shown) can also be set in the upper surface of heat sink 40, is transferred to heat dissipation Heat on plate 40 can be distributed by heat sink 40 and the radiating fin on heat sink 40 simultaneously, improve heat sink 40 heat dissipation effect.

Further, it is also possible to open up heat release hole (not shown) on the bottom wall of bottom case 1, heat release hole is located at heat sink 40 Lower section.Heat release hole can be one, be also possible to multiple, and the cross-sectional shape of heat release hole can be round, ellipse, polygon Deng the utility model is not construed as limiting this.Since the lower section of heat sink 40 has heat release hole, the energy that heat sink 40 absorbs can Outside heat release hole Quick diffusing to electromagnetic oven, to further improve the radiating efficiency of electromagnetic oven.In addition, when heat sink 40 with When the inner bottom wall fitting of bottom case 1, that is, heat sink 40 is covered on heat release hole, to can prevent ash while effective heat dissipation Dirt, steam, insect etc. enter in bottom case 1 from heat release hole.

When specific implementation, the thickness of heat sink 40 can be arranged between 1mm~5mm, setting in this way is guaranteeing effectively to dissipate While hot, cost of manufacture is saved, and is further ensured that heat sink 40 will not impact air inlet.

Wherein, there is spacing between the upper surface of heat sink 40 and cooling fan 5, the altitude range of spacing can specifically be set It sets between 5mm~15mm.By making to form spacing between the upper surface of heat sink 40 and cooling fan 5, by the height of spacing Setting within the above range, can effectively ensure that the outlet air of cooling fan 5.

Since radiator 42 extends to form heat sink 40, that is, the entire area of radiator 42 increases, in order to improve radiator 42 overall stability can be arranged mounting hole 423 in one end of the close heat sink 40 of the main part of heat-radiating substrate 421, pass through Heat-radiating substrate 421 and bottom case 1 are fixed the mounting hole 423.For example, the position of mounting hole is corresponded on bottom case 1 has stud, During installation, mounting hole is aligned with stud, and then the two is fixed together by screw, alternatively, corresponding to mounting hole on bottom case 1 423 position has the buckle being caught in mounting hole 423 upwardly extended.

In the prior art, cooling fan 5 is specifically fixed on the bottom cover of bottom case 1, the position of the correspondence cooling fan of bottom cover The components such as the higher-height stud or the buckle that need setting for fixing cooling fan are set, in the present embodiment, due to The lower section of cooling fan 5 is provided with heat sink 40, in order to avoid the components for fixing cooling fan on bottom cover are to heat dissipation Plate 40 causes to interfere, and the components for fixing cooling fan of bottom cover is avoided to cause gear to set air inlet to a certain extent, Influence intake and intake velocity.Based on this, the electromagnetic oven of the present embodiment, cooling fan 5 is specifically fixed in upper cover 12.

It specifically can be, fixed structure 6 be set in upper cover 12, cooling fan 5 is solid by the fixed structure 6 in upper cover 12 It is scheduled in upper cover 12.

That is, being arranged the fixed structure 6 for being used to fix cooling fan 5 in upper cover 12, that is, entire cooling fan 5 are mounted in upper cover 12 by the fixed structure 6 of upper cover 12, all due to the fixed structure 6 for fixing entire cooling fan 5 In upper cover 12, therefore that no setting is required for the position of the correspondence cooling fan 5 of bottom cover 11 is any for fixing consolidating for cooling fan 5 Determine structure 6, to will not cause to interfere to the extension of heat sink 40, and can avoid 6 pairs of air inlets of fixed structure and gear is caused to set, improve Intake and intake velocity so that the heat dissipation of electromagnetic oven internal heat generation element is faster improve the radiating efficiency of electromagnetic oven.

Referring to figs. 1 to Fig. 8, fixed structure 6 is specific can include: the first connecting portion 61 in upper cover 12 is arranged in.Radiation air Machine 5 is fixed in upper cover 12 by the first connecting portion 61.

When specific implementation, the position of first connecting portion 61 is corresponded on the cooling fan 5 of the present embodiment, and be provided with can be with first The second connecting portion 50 of the matching connection of interconnecting piece 61, is realized by the interaction of first connecting portion 61 and second connecting portion 50 and is dissipated Fixation between air-heater 5 and upper cover 12.It should be noted that can not also be set on cooling fan 5 in other implementations Second connecting portion 50 is set, only cooling fan 5 is fixed in upper cover 12 by first connecting portion 61, for example, first connecting portion 61 It may include specifically clip, clip is stuck in the periphery of cooling fan 5, thus on the basis for not influencing 5 air inlet and the outlet of cooling fan On, realize the fixation to cooling fan 5.

Fixed structure 6 specifically includes: the linking arm 60 extended towards the inside of upper cover 12, first connecting portion 61 are specifically arranged On the linking arm 60.By being arranged towards the linking arm 60 extended on the inside of upper cover 12, so that more to the fixation of cooling fan 5 It is convenient.

In the present embodiment, linking arm 60 is specifically as follows plate, that is, linking arm 60 is specially connecting plate, connecting plate One end is connect with upper cover 12, and the other end of connecting plate is towards extending on the inside of upper cover 12.By setting plate for linking arm 60, While guaranteeing effectively fixed to cooling fan 5, occupied space of the linking arm 60 on electromagnetic oven cavity heights is reduced.When So, in other implementations, linking arm 60 or column, the same fixation that can be achieved to cooling fan 5.

More preferred, linking arm 60 can be integrally formed with upper cover 12, for example, upper cover 12 is plastic cover, in production When lid 12, integrated injection molding forms linking arm 60 in upper cover 12.Setting is so that total production is more convenient, and improves in this way The overall structural strength and stability of upper cover 12 and fixed structure 6.

In a kind of feasible implementation of the present embodiment, first connecting portion 61 can specifically include the first screw hole.Phase Ying Di, second connecting portion 50 include the second screw hole corresponding with the first screw hole, and cooling fan 5 is by being threaded through the first screw hole and Fastener in two screw holes is fixed in upper cover 12.

In the present embodiment, first connecting portion 61 specifically includes the stud being arranged on linking arm 60, offers on stud First screw hole.Wherein, fastener specifically can be screw, be also possible to Primary-secondary rivet, be also possible to bolt.It is of course also possible to It is not provided with stud, but directly opens up screw hole on linking arm 60.

In another feasible implementation, one of them of first connecting portion 61 and second connecting portion 50 are buckle, The another one of first connecting portion 61 and second connecting portion 50 are can be with the card slot or card hole of the buckle snap-fit.Than Such as, buckle is provided on linking arm 60, the position of corresponding buckle is provided with card hole or card slot on cooling fan 5, to pass through It buckles and card slot or the cooperation realization cooling fan 5 of card hole and being reliably fixed for upper cover 12.

Certainly, in other implementations, fixed structure 6 can not also include linking arm 60, but straight in upper cover 12 Setting first connecting portion 61 is connect, for example, first connecting portion 61 is the hook that the inner edge of upper cover 12 is arranged in, the side of cooling fan 5 The card slot that can cooperate with hook or card hole are provided on edge.

Wherein, linking arm 60 can be set at least two, at least two linking arms 60 are arranged at intervals in upper cover 12, often At least one first connecting portion 61 is provided on a linking arm 60.By setting at least two for linking arm 60, in this way may be used Multiple positions of cooling fan 5 are fixed, the fixed reliability and stability of cooling fan 5 is further improved, can subtract Small noise.

In the present embodiment, linking arm 60 is specially two, and the end of each linking arm 60 is respectively arranged with a stud, In a linking arm 60 extend to the side of cooling fan 5, another one linking arm 60 extends to the another of cooling fan 5 Side.Wherein, the end positioned at the linking arm 60 in left side can be along the outer case bending of cooling fan 5, to adapt to the wheel of cooling fan 5 Exterior feature, more convenient connection, and make total more beautiful.

The line between two tie points that two linking arms 60 can be made to be formed on cooling fan 5 passes through cooling fan 5 Geometric center.It is corresponding on cooling fan 5 that tie point herein can be understood as the first connecting portion 61 on linking arm 60 The link position of second connecting portion 50.Setting is so that two tie points are corresponding in the center of gravity two sides of cooling fan 5, so that dissipating in this way Air-heater 5 is more steady, and shaking when cooling fan 5 being avoided to work reduces noise.

It should be noted that multiple first connecting portions 61 also can be set on a linking arm 60, for example, multiple first connect Socket part 61 is intervally arranged along the extending direction of linking arm 60, and correspondingly, second connecting portion 50 and first on cooling fan 5 connect Socket part 61 corresponds.The particular number of first connecting portion 61 can be according to the specific development length of linking arm 60 and actual demand Etc. being set.

When specific implementation, glue groove 62 can be opened up on one side towards panel 2 in linking arm 60, can accommodated in glue groove 62 glutinous Agent is tied, linking arm 60 is bonded in the lower surface of panel 2 by adhesive, to improve upper cover 12, fixed structure 6, heat dissipation The overall stability of blower 5, panel 2.Wherein, the glue groove 62 on linking arm 60 can be connected to the glue groove in upper cover 12.Specifically When connection, adhesive being clicked and entered or being injected into glue groove 62, adhesive is thus prevented arbitrarily to flow, adhesive easier to control is used Amount.Adhesive specifically can be silicone adhesive, it is of course also possible to be silica gel, the utility model is not construed as limiting the material of adhesive, As long as high temperature resistant and can have preferable viscosity.

Glue groove 62 is specific can include: gluing slot and be provided with gluing slot at least side excessive glue groove.When specific installation, Panel 2, is then placed in upper cover 12 by dispensing or injecting glue into gluing slot, and linking arm 60 is made to be bonded in 2 lower surface of panel.If In bonding, adhesive is overflowed from gluing slot, since at least side of gluing slot has excessive glue groove, excessive coheres Agent can enter in excessive glue groove, and excessive adhesive is thus prevented arbitrarily to flow and make to the other component in electromagnetism furnace chamber At influence.

Certainly, in other implementations, cooling fan 5 also be can connect on coil panel 3 and/or on radiator 42, For example, having the linking arm extended towards cooling fan 5 on coil panel 3, there is the first fixed part, cooling fan 5 on linking arm It is upper that there is the second fixed part that connection can be matched with the first fixed part, the fixation of same achievable cooling fan 5；Cooling fan 5 It can be connect by connector with radiator 42.

It should be noted that referring specifically to cooling fan 5 when cooling fan 5 herein is connect with radiator 42 and dissipating The main body of hot device 42 connects, and specifically, cooling fan 5 is connect with the radiating fin 422 of radiator 42 and/or heat-radiating substrate 421, And it is not connect with heat sink 40.

Since cooling fan 5 is fixed on coil panel 3 and/or radiator 42, same nothing on the bottom cover 11 of bottom case 1 Components for fixing cooling fan 5 need to be set, to will not cause to interfere to heat sink 40, and can avoid components into Wind causes gear to set, to improve intake and intake velocity, so that the heat dissipation of electromagnetic oven internal heat generation element is faster, improves electricity The radiating efficiency of magnetic furnace.

Alternatively, cooling fan 5 can also be connected to the lower surface of panel 2, for example, cooling fan 5 is viscous by adhesive It connects in the lower surface of panel 2, above-mentioned technical effect equally can be achieved.

Finally, it should be noted that the above various embodiments is only to illustrate the technical solution of the utility model, rather than it is limited System；Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should Understand: it is still possible to modify the technical solutions described in the foregoing embodiments, or to some or all of Technical characteristic is equivalently replaced；And these are modified or replaceed, it does not separate the essence of the corresponding technical solution, and this is practical new The range of each embodiment technical solution of type.

Claims (10)

1. a kind of electromagnetic oven, including bottom case (1), coil panel (3), circuit board assemblies (4), cooling fan (5) and lid are located at institute State the panel (2) on bottom case (1)；The bottom case (1) and the panel (2) surround jointly can accommodate the coil panel (3), described The cavity of circuit board assemblies (4) and the cooling fan (5)；The circuit board assemblies (4) include circuit board (41) and dissipate Hot device (42), the cooling fan (5) are located at the side of the radiator (42), the close radiation air of the bottom case (1) Air inlet hole (10) are offered on the side wall of machine (5), which is characterized in that

It is provided with heat sink (40) below the cooling fan (5), the heat sink (40) is the portion of the radiator (42) The lower section towards the cooling fan (5) is divided to extend and formed.

2. electromagnetic oven according to claim 1, which is characterized in that the interior bottom of the heat sink (40) and the bottom case (1) Wall fitting；

Alternatively, having gap between the lower surface of the heat sink (40) and the inner bottom wall of the bottom case (1)；

The range in the gap is 0.3mm~5mm.

3. electromagnetic oven according to claim 1, which is characterized in that the heat sink (40) includes: by the radiator (42) bending part to be formed (401) is bent downward and by the bending part (401) towards prolonging below the cooling fan (5) Stretch the extension to be formed (402)；

The extension (402) is close or is bonded the inner bottom wall of the bottom case (1).

4. electromagnetic oven according to claim 3, which is characterized in that the radiator (42) includes being arranged in the circuit board (41) radiating fin (422) of heat-radiating substrate (421) and setting on the heat-radiating substrate (421) on；

The bending part (401) bent downward by the part of the heat-radiating substrate (421) and/or the radiating fin (422) and It is formed.

5. electromagnetic oven according to claim 4, which is characterized in that the extension (402) and the heat-radiating substrate (421) Main part between difference in height (H) range be 3mm~15mm.

6. electromagnetic oven according to claim 1, which is characterized in that the upper surface of the heat sink (40) is additionally provided with heat dissipation Fin.

7. electromagnetic oven according to claim 1, which is characterized in that offer heat release hole on the bottom wall of the bottom case (1), institute State the lower section that heat release hole is located at the heat sink (40).

8. electromagnetic oven according to claim 1, which is characterized in that the thickness range of the heat sink (40) be 1mm~ 5mm；

There is spacing between the upper surface and the cooling fan (5) of the heat sink (40)；The altitude range of the spacing is 5mm~15mm.

9. electromagnetic oven according to any one of claims 1 to 8, which is characterized in that the bottom case (1) include bottom cover (11) with And it is located at the upper cover (12) on the bottom cover (11)；

The cooling fan (5) is fixed on the upper cover (12).

10. electromagnetic oven according to any one of claims 1 to 8, which is characterized in that the cooling fan (5) and the line Enclose disk (3) and/or radiator connection；

Alternatively, the cooling fan (5) is connected to the lower surface of the panel (2).