CN208938960U - A kind of cooling system of stage lighting motor driven IC - Google Patents
A kind of cooling system of stage lighting motor driven IC Download PDFInfo
- Publication number
- CN208938960U CN208938960U CN201821564849.1U CN201821564849U CN208938960U CN 208938960 U CN208938960 U CN 208938960U CN 201821564849 U CN201821564849 U CN 201821564849U CN 208938960 U CN208938960 U CN 208938960U
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- pcb plate
- heat
- conductive pad
- lamp support
- stage
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to the cooling systems of stage lighting motor driven IC a kind of comprising an IC chip；One pcb plate, the IC chip are installed on the plate face of the pcb plate；One insulating heat-conductive pad is located at the one side of the pcb plate far from the IC chip, the insulating heat-conductive pad and the pcb plate heat transfer；One stage lamp support pads heat transfer with the insulating heat-conductive, and the insulating heat-conductive pad is tightly attached to the surface of the stage lamp support.The stage lamp support is regarded into radiator, so that the heat of the IC chip is led the stage lamp support, improves the heat dissipation effect of whole system, avoid IC chip overheating protection.
Description
Technical field
The utility model designs stage lighting cooling system field, more particularly to the heat dissipation of stage lighting motor driven IC a kind of
System.
Background technique
In some large-scale places, stage lighting is very widely used, and stage lighting can generate the light beam of different-effect, makes to wave
Platform has pattern smooth space perception abundant.Most of present stage lighting all added with chip, passes through process control stage lighting
Automatic variation colour image, however the chip in stage lighting can generate a large amount of heat after long-term work, how solve to radiate
Problem is stage lighting manufacturer problem all to be solved.General manufacturer, all can be high by pcb frame in order to avoid pcb plate short circuit, passes through
One radiator is installed on chip, then the back side addition radiating block of pcb plate radiates again, but this design is due to core
Piece, which needs to be wrapped up by plastic shell, to be protected, when stage lighting it is high-intensitive for a long time in use, chip still it is easy to appear overheats to ask
Topic makes stage lighting cisco unity malfunction to cause IC protection.
Summary of the invention
The purpose of this utility model is to provide the cooling systems of stage lighting motor driven IC a kind of, to solve above-mentioned background
The problem of being proposed in technology.
To achieve the above objectives, the present invention adopts the following technical solutions: a kind of heat dissipation of stage lighting motor driven IC
System a comprising IC chip；One pcb plate, the IC chip are installed on the plate face of the pcb plate；One insulating heat-conductive pad, position
In the one side of the pcb plate far from the IC chip, the insulating heat-conductive pad and the pcb plate heat transfer；One stage lamp support,
It pads heat transfer with the insulating heat-conductive, and the insulating heat-conductive pad is tightly attached to the surface of the stage lamp support.
Further, the insulating heat-conductive pad by way of adhesion respectively with the pcb plate and the stage lamp support
It is in contact.
Further, the insulating heat-conductive pad is thermal conductive silicon rubber mat, the uncured heat-conducting silicone grease of viscosity or viscosity is curable leads
Hot glue.
Further, the insulating heat-conductive pad is tightly attached to the pcb plate, and the pcb plate is all set with the stage lamp support
There is corresponding screw hole, the pcb plate is mutually fixed by screw with the stage lamp support.
Further, between the insulating heat-conductive pad and the pcb plate be equipped with heat dissipation aluminium block, the heat dissipation aluminium block with it is described
The ground wire of IC chip is connected, and the heat dissipation aluminium block is in contact with the pcb plate and the insulating heat-conductive pad respectively.
Further, the pcb plate is all equipped with corresponding screw hole with the stage lamp support, and the pcb plate passes through spiral shell
Silk is mutually fixed with the stage lamp support.
Further, the IC chip far from the pcb plate one side be equipped with metal heat sink, the metal heat sink with
The IC chip heat transfer, the metal heat sink are equipped with the radiating fin being distributed side by side.
Further, the stage lamp support is made of aluminium alloy.
Further, the pcb plate is fixed on the side of the stage lamp support, and the plate face of the pcb plate is perpendicular to water
Plane.
Further, the insulating heat-conductive pad with a thickness of between 0.3 ~ 3mm.
The utility model has the following beneficial effects: the stage lamp support is regarded radiator, make the heat of the IC chip
Amount leads the stage lamp support, improves the heat dissipation effect of whole system, avoids IC chip overheating protection.
Detailed description of the invention
The utility model is described in further detail for attached drawing, but the embodiment in attached drawing is not constituted to any of the utility model
Limitation.
Fig. 1 is the integral installation figure that an embodiment of the present invention provides；
Fig. 2 is Fig. 1 partial schematic diagram；
Fig. 3 is the structural schematic diagram that second of embodiment of the utility model provides；
Fig. 4 is the structural schematic diagram that the third embodiment of the utility model provides；
Fig. 5 is the partial perspective view of Fig. 4；
Fig. 6 is the partial perspective view of Fig. 2；
Fig. 7 is the structural schematic diagram that the 4th kind of embodiment of the utility model provides.
Specific embodiment
As shown in figs. 1-2, a kind of cooling system of stage lighting motor driven IC provided by the utility model comprising IC
Chip 1, pcb plate 2, insulating heat-conductive pad 3 and stage lamp support 4.The IC chip 1 is installed on the plate face of the pcb plate 2.It is described
Insulating heat-conductive pad 3 is located at one side of the pcb plate 2 far from the IC chip 1, and the pcb plate 2 absorbs the IC chip 1 and generates
Heat, and transfer heat to the insulating heat-conductive pad 3.The insulating heat-conductive pad 3 is tightly attached to the side of the stage lamp support 4
Surface, and the insulating heat-conductive pad 3 transfers heat to the stage lamp support 4, the stage lamp support 4 is by aluminium alloy system
At the bracket of aluminium alloy production has good thermal conductivity, and lighter in weight, intensity are high, are not easy to get rusty.The pcb plate 2 is fixed
In the side of the stage lamp support 4, the plate face of the pcb plate 2 is the axial space section of stage lighting optical axis perpendicular to horizontal plane
Save space.The insulating heat-conductive pad 3 with a thickness of between 0.3 ~ 3mm, by the thickness design of the insulating heat-conductive pad 3 in this range
It inside may insure that the insulating heat-conductive pad 3 has good thermal conductivity, without that can also drop because too thick cause thermal conductivity to be deteriorated
The low cost using the insulating heat-conductive pad 3.
As illustrated in fig 2 and fig, in a kind of wherein embodiment, the insulating heat-conductive pad 3 is thermal conductive silicon rubber mat, viscosity
Uncured heat-conducting silicone grease or the curable heat-conducting glue of viscosity.The insulating heat-conductive pad 3 by way of adhesion respectively with the pcb plate
2 and the stage lamp support 4 be in contact, when the insulating heat-conductive pad 3 be thermal conductive silicon rubber mat when, can be by thermal conductive silicon rubber mat
Surface apply glue, be affixed 3 one side of insulating heat-conductive pad with the stage lamp support 4 using glue stickiness, another side
It is affixed with the pcb plate 2；When the insulating heat-conductive pad 3 is the uncured heat-conducting silicone grease of viscosity or sticky curable heat-conducting glue, institute
Insulating heat-conductive pad 3 is stated directly to be affixed with the pcb plate 2 and the stage lamp support 4.
As shown in Figure 3, in second of embodiment, the insulating heat-conductive pad 3 is tightly attached to the pcb plate 2, the insulation
Heat conductive pad 3 can choose tool it is sticking or inviscid, 2 four corners of the pcb plate be equipped with screw hole, the stage lighting branch
The screw hole of the corresponding pcb plate 2 of frame 4 is again provided with screw hole, and the pcb plate 2 is mutually screwed up by screw 21 with screw hole
It is fixed with 4 phase of stage lamp support.
As shown in figs. 4-5, it in the third embodiment, is equipped with and dissipates between the insulating heat-conductive pad 3 and the pcb plate 2
Hot aluminium block 22, the heat dissipation aluminium block 22 is connected with the ground wire of the IC chip 1, and the grounded parts as IC chip 1.It is described
The outer surface of heat dissipation aluminium block 22 is affixed with the pcb plate 2 and the insulating heat-conductive pad 3 respectively, and the heat dissipation aluminium block 22 absorbs institute
The heat of pcb plate 2 is stated, and transfers heat to the insulating heat-conductive pad 3.2 four corners of the pcb plate are equipped with screw hole, institute
The screw hole for stating the corresponding pcb plate 2 of stage lamp support 4 is again provided with screw hole, and the pcb plate 2 passes through screw 21 and spiral shell
Wire hole is mutually screwed up fixes with 4 phase of stage lamp support.
As shown in Figure 7, in the 4th kind of embodiment, the place different from the third embodiment is, the IC core
Piece 1 is equipped with metal heat sink 5, the metal heat sink 5 and 1 heat transfer of IC chip, institute far from the one side of the pcb plate 2
It states metal heat sink 5 and is equipped with the radiating fin 51 being distributed side by side, be coated between the metal heat sink 5 and the IC chip 1 scattered
Hot silica gel, the metal heat sink 5 is screwed up by screw or bayonet unit is fixed with 2 phase of pcb plate.
The utility model regards radiator using the insulating heat-conductive pad 3 as medium, by the stage lamp support 4,
So that the heat of the IC chip 1 is led the stage lamp support 4, improve the heat dissipation effect of whole system, avoids 1 mistake of IC chip
Thermal protection.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of cooling system of stage lighting motor driven IC characterized by comprising
One IC chip；
One pcb plate, the IC chip are installed on the plate face of the pcb plate；
One insulating heat-conductive pad is located at the one side of the pcb plate far from the IC chip, the insulating heat-conductive pad and the pcb
Plate heat transfer；
One stage lamp support pads heat transfer with the insulating heat-conductive, and the insulating heat-conductive pad is affixed on the stage lamp support
Surface.
2. the cooling system of stage lighting motor driven IC according to claim 1, it is characterised in that: the insulating heat-conductive pad
It is in contact respectively with the pcb plate and the stage lamp support by way of adhesion.
3. according to the cooling system of stage lighting motor driven IC as claimed in claim 2, it is characterised in that: the insulating heat-conductive pad is
Thermal conductive silicon rubber mat, the uncured heat-conducting silicone grease of viscosity or the curable heat-conducting glue of viscosity.
4. the cooling system of stage lighting motor driven IC according to claim 1, it is characterised in that: the insulating heat-conductive pad
It is tightly attached to the pcb plate, the pcb plate is all equipped with corresponding screw hole with the stage lamp support, and the pcb plate passes through screw
It is mutually fixed with the stage lamp support.
5. the cooling system of stage lighting motor driven IC according to claim 1, it is characterised in that: the insulating heat-conductive pad
Heat dissipation aluminium block is equipped between the pcb plate, the heat dissipation aluminium block is connected with the ground wire of the IC chip, the heat dissipation aluminium block
It is in contact respectively with the pcb plate and the insulating heat-conductive pad.
6. the cooling system of stage lighting motor driven IC according to claim 5, it is characterised in that: the pcb plate and institute
It states stage lamp support and is all equipped with corresponding screw hole, the pcb plate is mutually fixed by screw with the stage lamp support.
7. the cooling system of stage lighting motor driven IC according to any one of claim 1 to 6, it is characterised in that: institute
It states IC chip and is equipped with metal heat sink, the metal heat sink and the IC chip heat transfer, institute far from the one side of the pcb plate
It states metal heat sink and is equipped with the radiating fin being distributed side by side.
8. the cooling system of stage lighting motor driven IC according to any one of claim 1 to 6, it is characterised in that: institute
Stage lamp support is stated to be made of aluminium alloy.
9. the cooling system of stage lighting motor driven IC according to claim 1, it is characterised in that: the pcb plate is fixed
In the side of the stage lamp support, the plate face of the pcb plate is perpendicular to horizontal plane.
10. the cooling system of stage lighting motor driven IC according to claim 1, it is characterised in that: the insulating heat-conductive
Pad with a thickness of between 0.3 ~ 3mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821564849.1U CN208938960U (en) | 2018-09-25 | 2018-09-25 | A kind of cooling system of stage lighting motor driven IC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821564849.1U CN208938960U (en) | 2018-09-25 | 2018-09-25 | A kind of cooling system of stage lighting motor driven IC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208938960U true CN208938960U (en) | 2019-06-04 |
Family
ID=66722298
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821564849.1U Active CN208938960U (en) | 2018-09-25 | 2018-09-25 | A kind of cooling system of stage lighting motor driven IC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208938960U (en) |
-
2018
- 2018-09-25 CN CN201821564849.1U patent/CN208938960U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 510000 No. 27 Fuyuan Road, Xinya Street, Huadu District, Guangzhou City, Guangdong Province Patentee after: Guangzhou Mingdao Culture Technology Group Co.,Ltd. Address before: Huadu District, Guangdong province Guangzhou Xinya Street Fuyuan 510800 City Road No. 27 Patentee before: GUANGZHOU GTD LIGHTING TECHNOLOGY Co.,Ltd. |
|
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: A heat dissipation system of stage lamp motor driven IC Effective date of registration: 20220623 Granted publication date: 20190604 Pledgee: China Co. truction Bank Corp Guangzhou branch Pledgor: Guangzhou Mingdao Culture Technology Group Co.,Ltd. Registration number: Y2022980008723 |