CN208937701U - A kind of heat management device reducing receiver noise - Google Patents
A kind of heat management device reducing receiver noise Download PDFInfo
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- CN208937701U CN208937701U CN201821633537.1U CN201821633537U CN208937701U CN 208937701 U CN208937701 U CN 208937701U CN 201821633537 U CN201821633537 U CN 201821633537U CN 208937701 U CN208937701 U CN 208937701U
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- shell
- semiconductor chilling
- chilling plate
- heat
- management device
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Abstract
The utility model discloses a kind of heat management devices for reducing receiver noise, including shell, semiconductor chilling plate, cooling mechanism, cover board and thermal insulation board；There is the space for accommodating receiver in the shell, opening is opened up on the shell, the cover board setting forms box body structure in the upper and shell that is open, receiver is immobilized in the shell, one working face of the semiconductor chilling plate fits together with shell, another working face is bonded with cooling mechanism, and the thermal insulation board is coated on the side of semiconductor chilling plate to completely cut off two working faces of semiconductor chilling plate.Using soaking plate and radiator, make the thermally conductive or conduction cooling better effect of whole device.Using semiconductor chilling plate (TEC) make whole device it is small in size, light-weight, be easily installed and operate.The temperature of receiver is set to can achieve -60 DEG C of low temperature using semiconductor chilling plate (TEC), due to the minimum temperature of common air-conditioning temperature control.
Description
Technical field
The utility model relates to a kind of radiator of radar receiver more particularly to a kind of reduction receiver noises
Heat management device.
Background technique
Existing field of radar receiver is all using high temperature heat dissipation (forced air cooling), and the temperature of receiver is consistently higher than environment
Temperature, temperature is little to influence of noise within the scope of LF communication, within the acceptable range；But reach 100,000,000 in frequency
Hertz or more, temperature is larger to influence of noise, directly affects radar imagery precision, it is difficult to meet radar imaging technology index.
Existing field of radar receiver is all using high temperature heat dissipation (forced air cooling), and the temperature of receiver is consistently higher than environment
Temperature, temperature is little to influence of noise within the scope of LF communication, within the acceptable range；But reach 100,000,000 in frequency
Hertz or more, temperature is larger to influence of noise, directly affects radar imagery precision, it is difficult to meet radar imaging technology index.
The prior art generally uses air-conditioning to cool down radar complete machine through row, but air-conditioning own vol is big, and temperature-controlled precision is poor, cryogenic temperature
Higher (generally at 8 DEG C or more).
Utility model content
The technical problem to be solved by the utility model is to: accurate temperature control can not be carried out to receiver, provide one
Kind reduces the heat management device of receiver noise.
The utility model is that solution above-mentioned technical problem, the utility model include shell, half by the following technical programs
Conductor cooling piece, cooling mechanism, cover board and thermal insulation board；There is the space for accommodating receiver in the shell, opened on the shell
If opening, the cover board setting is above immobilized in the shell with shell composition box body structure, receiver in opening, the semiconductor system
A cold working face fits together with shell, another working face is bonded with cooling mechanism, and the thermal insulation board is coated on
The side of semiconductor chilling plate is to completely cut off two working faces of semiconductor chilling plate.
The shell has the protrusion extended to cooling mechanism, and the semiconductor chilling plate is located in the protrusion.It can
Heat concentration is transmitted to semiconductor refrigerating on piece.
The cooling mechanism includes soaking plate, and the soaking plate is fitted in semiconductor refrigerating on piece.Soaking plate can be by half
Heat or cooling capacity on conductor cooling piece are uniformly distributed, and subsequent heat transfer is convenient for.
It is connected with heat-conducting liquid in the soaking plate, heat or cooling capacity are evenly arranged in soaking plate.The heat transfer system of heat-conducting liquid
Number is up to 20000W/m2.h.The heat in the heating face of semiconductor chilling plate can be led on radiator, it can also be by semiconductor
The cooling capacity of the chill surface of cooling piece is led on radiator
The present apparatus further includes radiator, and the radiator is connected in soaking plate.Radiator from soaking plate for that will lead
The heat or cooling capacity entered is spread in environment.
Described device further includes the blower for being diffused into the heat of radiator or cooling capacity in environment.
Insulating layer is provided on the inside of the inner walls and cover board.The intracorporal refrigerating capacity of shell can be effectively reduced to scatter and disappear.
After semiconductor chilling plate is powered, a working face refrigeration, corresponding another working face heating changes half
The input voltage direction of conductor cooling piece can change chill surface and heat the direction in face, working principle: if shell is intracorporal
The temperature of receiver is higher than set temperature value, that face that semiconductor chilling plate is contacted with shell is chill surface, reduces in shell
Temperature, until temperature reaches setting value semiconductor chilling plate and stops working, if the temperature of the intracorporal receiver of shell is lower than setting
Determine temperature value, that face that semiconductor chilling plate is contacted with shell is heating face, the intracorporal temperature of heating box, until temperature reaches
Setting value semiconductor chilling plate stops working.
The effect of thermal insulation board is the huyashi-chuuka (cold chinese-style noodles) for completely cutting off semiconductor chilling plate and hot face, prevents hot short circuit.Shell and cover board composition
The box body of receiver is installed；Insulating layer plays heat insulation effect, and the heat of box body or cooling capacity is prevented to scatter and disappear；Semiconductor chilling plate rises
To the effect for the heat or cooling capacity for extracting box body, the intracorporal temperature of box is controlled, is temperature control kernel component；Thermal insulation board plays
Completely cut off the effect of semiconductor chilling plate huyashi-chuuka (cold chinese-style noodles) and the hot face of semiconductor chilling plate；Soaking plate, radiator and blower collective effect, will be partly
The heating capacity or refrigerating capacity of conductor cooling piece are discharged into environment.
The utility model has the advantage that the utility model is controlled using semiconductor chilling plate (TEC) compared with prior art
The temperature of receiver processed, temperature control are more preferably accurate.Using soaking plate and radiator, make the thermally conductive or conduction cooling effect of whole device more
It is good.Using semiconductor chilling plate (TEC) make whole device it is small in size, light-weight, be easily installed and operate.Using semiconductor system
The low temperature that cold (TEC) makes the temperature of receiver can achieve -60 DEG C, due to the minimum temperature of common air-conditioning temperature control.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the utility model；
Fig. 2 is the left view of Fig. 1；
Fig. 3 is the sectional view along AA of Fig. 1；
Fig. 4 is the perspective view of the utility model.
Specific embodiment
It elaborates below to the embodiments of the present invention, the present embodiment before being with technical solutions of the utility model
It puts and is implemented, the detailed implementation method and specific operation process are given, but the protection scope of the utility model is unlimited
In following embodiments.
Embodiment 1
As shown in figures 1-4, the heat management device of the present embodiment includes shell 3, semiconductor chilling plate 6, cooling mechanism, lid
Plate 1 and thermal insulation board 5；There is the space for accommodating receiver 4 in the shell 3, open up opening on the shell 3, the cover board 1 is set
It sets and is above fixed in shell 3 with the composition box body structure of shell 3, receiver 4 in opening, a work of the semiconductor chilling plate 6
Make face to fit together with shell 3, another working face is bonded with cooling mechanism, and the thermal insulation board 5 is coated on semiconductor refrigerating
The side of piece 6 is to completely cut off two working faces of semiconductor chilling plate 6.
The shell 3 has the protrusion extended to cooling mechanism, and the semiconductor chilling plate 6 is located in the protrusion.Energy
It is enough that heat concentration is transmitted on semiconductor chilling plate 6.
After semiconductor chilling plate 6 is powered, a working face refrigeration, corresponding another working face heating changes
The input voltage direction of semiconductor chilling plate 6 can change chill surface and heat the direction in face, working principle: if shell 3
The temperature of interior receiver 4 is higher than set temperature value, that face that semiconductor chilling plate 6 is contacted with shell 3 is chill surface, reduces
Temperature in shell 3, until temperature reaches setting value semiconductor chilling plate 6 and stops working, if the receiver 4 in shell 3
Temperature be lower than set temperature value, that face that semiconductor chilling plate 6 is contacted with shell 3 be heating face, the intracorporal temperature of heating box,
Until temperature reaches setting value semiconductor chilling plate 6 and stops working.
Embodiment 2
In the present embodiment, cooling mechanism includes soaking plate 7, and the soaking plate 7 is fitted on semiconductor chilling plate 6.Soaking
Plate 7 can by semiconductor chilling plate 6 heat or cooling capacity be uniformly distributed, be convenient for subsequent heat transfer.
It is connected with heat-conducting liquid in the soaking plate 7, heat or cooling capacity are evenly arranged in soaking plate 7.The heat transfer of heat-conducting liquid
Coefficient is up to 20000W/m2.h.The heat in the heating face of semiconductor chilling plate 6 can be led on radiator, it can also be by half
The cooling capacity of the chill surface of conductor cooling piece 6 is led on radiator
Cooling mechanism further includes radiator 8, and the radiator 8 is connected in soaking plate 7.Radiator 8 is used for will be from soaking
The heat or cooling capacity imported on plate 7 is spread in environment.
Cooling mechanism further includes the blower 9 for being diffused into the heat of radiator 8 or cooling capacity in environment.
Other embodiments and embodiment 1 are identical.
Embodiment 3
In the present embodiment, insulating layer 2 is provided on the inside of 3 inner wall of shell and cover board 1.It can effectively reduce in shell 3
Refrigerating capacity scatter and disappear.
Other embodiments and embodiment 1 are identical.
The effect of thermal insulation board 5 is the huyashi-chuuka (cold chinese-style noodles) for completely cutting off semiconductor chilling plate 6 and hot face, prevents hot short circuit.Shell 3 and cover board 1
The box body of composition installation receiver 4；Insulating layer 2 plays heat insulation effect, and the heat of box body or cooling capacity is prevented to scatter and disappear；Semiconductor system
The heat or cooling capacity for playing the role of extracting box body for cold 6, control the intracorporal temperature of box, are temperature control kernel component；Every
Hot plate 5 plays the role of completely cutting off 6 huyashi-chuuka (cold chinese-style noodles) of semiconductor chilling plate and the hot face of semiconductor chilling plate 6；Soaking plate 7, radiator 8 and blower
The heating capacity of semiconductor chilling plate 6 or refrigerating capacity are discharged into environment by 9 collective effects.
The above is only the preferred embodiment of the utility model only, is not intended to limit the utility model, all at this
Made any modifications, equivalent replacements, and improvements etc., should be included in the utility model within the spirit and principle of utility model
Protection scope within.
Claims (7)
1. a kind of heat management device for reducing receiver noise, which is characterized in that including shell, semiconductor chilling plate, heat dissipation machine
Structure, cover board and thermal insulation board；There is the space for accommodating receiver in the shell, open up opening on the shell, the cover board is set
It sets and is above immobilized in the shell with shell composition box body structure, receiver in opening, a working face of the semiconductor chilling plate
It fits together with shell, another working face is bonded with cooling mechanism, and the thermal insulation board is coated on the side of semiconductor chilling plate
Face is to completely cut off two working faces of semiconductor chilling plate.
2. a kind of heat management device for reducing receiver noise according to claim 1, which is characterized in that the shell tool
The protrusion that oriented cooling mechanism extends, the semiconductor chilling plate are located in the protrusion.
3. a kind of heat management device for reducing receiver noise according to claim 1, which is characterized in that the heat dissipation machine
Structure includes soaking plate, and the soaking plate is fitted in semiconductor refrigerating on piece.
4. a kind of heat management device for reducing receiver noise according to claim 3, which is characterized in that the soaking plate
It is inside connected with heat-conducting liquid, heat or cooling capacity are evenly arranged in soaking plate.
5. a kind of heat management device for reducing receiver noise according to claim 4, which is characterized in that further include heat dissipation
Device, the radiator are connected in soaking plate.
6. a kind of heat management device for reducing receiver noise according to claim 5, which is characterized in that described device is also
Including the blower for being diffused into the heat of radiator or cooling capacity in environment.
7. a kind of heat management device for reducing receiver noise according to claim 1, which is characterized in that in the shell
Insulating layer is provided on the inside of wall and cover board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821633537.1U CN208937701U (en) | 2018-10-09 | 2018-10-09 | A kind of heat management device reducing receiver noise |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821633537.1U CN208937701U (en) | 2018-10-09 | 2018-10-09 | A kind of heat management device reducing receiver noise |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208937701U true CN208937701U (en) | 2019-06-04 |
Family
ID=66723904
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821633537.1U Active CN208937701U (en) | 2018-10-09 | 2018-10-09 | A kind of heat management device reducing receiver noise |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208937701U (en) |
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2018
- 2018-10-09 CN CN201821633537.1U patent/CN208937701U/en active Active
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