CN208904040U - A kind of hyperfrequency photon detector based on light thermoelectric conversion effect - Google Patents
A kind of hyperfrequency photon detector based on light thermoelectric conversion effect Download PDFInfo
- Publication number
- CN208904040U CN208904040U CN201821509389.2U CN201821509389U CN208904040U CN 208904040 U CN208904040 U CN 208904040U CN 201821509389 U CN201821509389 U CN 201821509389U CN 208904040 U CN208904040 U CN 208904040U
- Authority
- CN
- China
- Prior art keywords
- substrate
- shielding layer
- film
- electrode
- thickness
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Photometry And Measurement Of Optical Pulse Characteristics (AREA)
Abstract
The utility model discloses a kind of hyperfrequency photon detector based on light thermoelectric conversion effect, belong to nano electron device technical field, including the left Pd electrode of lock-in amplifier, h-BN photic zone, InSe film, InSe film, P doping Si substrate DC power supply VL, P adulterate Si substrate Pd electrode, graphite shielding layer DC power supply VR, graphite shielding layer Pd electrode, graphite shielding layer, h-BN substrate, SiO2Oxide layer, P adulterate Si substrate, the right Pd electrode of InSe film, and detector has many advantages, such as that dark current is small, precision is high, strong interference immunity.In actual detection, using device unsymmetric structure and the thermoelectricity capability of InSe film, under tested light-wave irradiation, applies different voltage by adulterating Si substrate in graphite shielding layer and P, can get different thermoelectric forces, and then test out photon energy and wavelength.
Description
Technical field
It is the utility model relates to nano electron device technical field, in particular to a kind of super based on light thermoelectric conversion effect
High frequency photon detector.
Background technique
In recent years, the rapid development in Terahertz (1012Hz) wave radiation source opens extremely wide for Terahertz application
Application prospect, while more stringent requirements are proposed to the performance of terahertz wave detector part, and THz wave Detection Techniques are ground
Study carefully and has become one of most active research field in recent years.Low transmitting power and relatively high heat back due to THZ source
The interference of the coupling of scape needs highly sensitive detection means.Currently, most common means are the direct detection sides of heat absorption
Method, superconduction frequency mixing technique and thermoelectron radiotechnology, but three of the above technological approaches can only measure the intensity of radiation, Bu Nengti
For more accurate frequency and phase information, and its sensitivity is limited by background radiation, thus to Terahertz light wave when
Direct and continuous measurement within the scope of domain has become difficult point urgently to be resolved at present.Indium selenide is a kind of III-VI compounds of group, tool
There is different chemical structures, wherein that most study is InSe and In2Se3.InSe is in photoelectric conversion, photocatalysis, heat to electricity conversion etc.
Aspect has excellent physical characteristic.For this purpose, the present invention uses Si, SiO2, InSe, h-BN and graphite composite construction realize
Accurate detection to hyperfrequency photon.
Summary of the invention
The technical problems to be solved in the utility model is to overcome shortcoming in the prior art, provides a kind of sensitivity
Height, high resolution, test scope be wide, simple process hyperfrequency photon detector, for testing the physics such as THz photon wavelength spy
Property.
A kind of hyperfrequency light wave detector based on light thermoelectric conversion effect described in the utility model includes locking phase amplification
The left Pd electrode of device, h-BN photic zone, InSe film, InSe film, P doping Si substrate DC power supply VL, P doping Si substrate Pd electricity
Pole, graphite shielding layer DC power supply VR, graphite shielding layer Pd electrode, graphite shielding layer, h-BN substrate, SiO2Oxide layer, P doping
The right Pd electrode of Si substrate, InSe film is first 2 × 10 in doping concentration16cm-3It is two-sided with a thickness of the p-type of 200-240nm
The SiO with a thickness of 100-200nm is prepared on height polishing single crystal silicon substrate by thermal oxidation method2Oxide layer utilizes PMMA (poly- methyl
Methyl acrylate) transfer method will be placed in SiO with a thickness of the graphite shielding layer of 10nm thickness2Layer surface is aoxidized, then will be using change
It learns vapour deposition process preparation and SiO is transferred to by PMMA method with a thickness of the h-BN film of 30nm2Oxide layer and graphite shielding layer
Surface as h-BN substrate, the upper table of h-BN substrate then will be transferred to by PMMA method with a thickness of the InSe film of 5nm
Face is transferred to InSe film upper surface as h-BN photic zone by PMMA method for a thickness of the h-BN film of 20nm, above
Each transfer step is required through the process of acetone solution, reductive heat treatment, oxidizing thermal treatment to remove in transfer process
PMMA residue prepares the Pd electrode with a thickness of 100nm using electron beam evaporation method.
Further, as a specific structural form, the Pd electrode is deposited respectively by electron beam evaporation method
In the side of InSe film upper surface, graphite shielding layer side and P doping Si substrate, wherein in InSe film upper surface, respectively
Symmetrical two Pd electrodes are deposited, deposition thickness 100nm is left by external lock-in amplifier, InSe film by conducting wire
The right Pd electrode of Pd electrode, InSe film, graphite shielding layer DC power supply VR, graphite shielding layer Pd electrode, P adulterate Si substrate direct current
Power supply VL connection, can measure under different hyperfrequency light-wave irradiations, two interelectrode voltage differences of InSe film, and then obtain light wave
Wavelength.
Further, as a specific structural form, the graphite shielding layer uses mechanical stripping method from Gao Ding
It is obtained into pyrolytic graphite, with a thickness of 10nm, length 40nm, width is the rectangular film of 30nm, and graphite shielding layer is clipped in
H-BN substrate and SiO2Play the role of shielding electric field between oxide layer.
Further, as a specific structural form, the h-BN film is using chemical vapour deposition technique system
Standby, h-BN photic zone has the rectangular film structure that with a thickness of 20nm and length is 50nm, width is 30nm, the length of h-BN substrate
Degree is that its bottom of right side is reserved rectangular notch during the preparation process and be used to place by 80nm, width 40nm with a thickness of 10nm
Graphite shielding layer.
Further, the lock-in amplifier use 30MHz high-frequency digital lock-in amplifier, sensitivity 1nV to 1V, when
Between constant be 3us to 3Ks.
Detection principle: according to Seebeck effect, keep the temperature difference that will generate electromotive force at semiconductor both ends, this detector uses
Tested hyperfrequency light wave is passed through h-BN photic zone using the preferable pyroelecthc properties of InSe film by asymmetrical device architecture
It is radiated at InSe film upper surface, so that its both ends is generated the temperature difference, then adulterate Si by adjusting graphite shielding layer DC power supply VR and P
The voltage volt value of substrate DC power supply VL makes InSe film left-half have different electron mobilities from right half part, in turn
By the thermoelectromotive force signal of acquisition InSe film both ends response, optical wavelength and energy information are obtained.
Below with attached drawing, the present invention is further illustrated, but the embodiment in attached drawing is not constituted to the present invention
Any restrictions.
Fig. 1 is a kind of main view signal of hyperfrequency photon detector based on light thermoelectric conversion effect of the utility model
Figure;
Fig. 2 is a kind of vertical view signal of hyperfrequency photon detector based on light thermoelectric conversion effect of the utility model
Figure;
Fig. 3 is a kind of left view signal of hyperfrequency photon detector based on light thermoelectric conversion effect of the utility model
Figure;
Fig. 4 is a kind of thermoelectromotive force of hyperfrequency photon detector based on light thermoelectric conversion effect of the utility model
With electron mobility relational graph in InSe film;
Fig. 5 be the utility model a kind of hyperfrequency photon detector based on light thermoelectric conversion effect photon energy with
The relational graph of thermoelectromotive force.
Specific embodiment
In order to make the content of the utility model be easier to be clearly understood, below according to specific embodiment and combine attached
Figure, is described in further details the utility model.Obviously, the embodiments are a part of the embodiments of the present invention,
Rather than whole embodiments.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creativeness
Every other embodiment obtained, fall within the protection scope of the utility model under the premise of labour.
As shown in Fig. 1 ~ 5, a kind of hyperfrequency photon detector based on light thermoelectric conversion effect, which includes locking phase
The left Pd electrode (3) of amplifier (1), h-BN photic zone (2), InSe film, InSe film (4), P adulterate Si substrate DC power supply VL
(5), P adulterate Si substrate Pd electrode (6), graphite shielding layer DC power supply VR(7), graphite shielding layer Pd electrode (8), graphite shielding
Layer (9), h-BN substrate (10), SiO2Oxide layer (11), P adulterate Si substrate (12), the right Pd electrode (13) of InSe film, exist first
Doping concentration is 2 × 1016cm-3The two-sided high polishing single crystal silicon substrate of the p-type with a thickness of 200-240nm on pass through thermal oxidation method
Prepare the SiO with a thickness of 100-200nm2Oxide layer, will be with a thickness of 10nm using PMMA (polymethyl methacrylate) transfer method
The graphite shielding layer of thickness is placed in SiO2Layer surface is aoxidized, then chemical vapour deposition technique will be used to prepare the h- with a thickness of 30nm
BN film is transferred to SiO by PMMA method2It the surface of oxide layer and graphite shielding layer, then will be with a thickness of as h-BN substrate
The InSe film of 5nm is transferred to the upper surface of h-BN substrate by PMMA method, will pass through with a thickness of the h-BN film of 20nm
PMMA method is transferred to InSe film upper surface as h-BN photic zone, and above each transfer step requires molten by acetone
Solution, reductive heat treatment, oxidizing thermal treatment process to remove the PMMA residue in transfer process, using electron beam evaporation legal system
The standby Pd electrode with a thickness of 100nm.
Fig. 4 show electron mobility relational graph in InSe thin-film electromotive force and InSe film, is arranged in an experiment
VR=15uV, VL=25uV are thin with left InSe at interface using the left side of graphite linings as interface due to the screen effect of graphite linings
Film has lower electron mobility n (x), and significantly raised with right electron mobility n (x) at interface, thermoelectromotive force then exists
Reach maximum value on the left of InSe film, reaches minimum value on right side.
Fig. 5 show the relational graph of photon energy and thermoelectromotive force, the thermoelectric that photon energy and InSe film generate
Kinetic potential approximation proportional, with the raising of photon energy, thermoelectromotive force is gradually risen.
In conclusion the utility model provides a kind of tool of hyperfrequency photon detector based on light thermoelectric conversion effect
Body structure and connection type have many advantages, such as that dark current is small, precision is high, strong interference immunity.It is non-using device in actual detection
The thermoelectricity capability of symmetrical structure and InSe film is applied under tested light-wave irradiation by adulterating Si substrate in graphite shielding layer and P
Add different voltage, can get different thermoelectric forces, and then tests out photon energy and wavelength.
Claims (5)
1. a kind of hyperfrequency photon detector based on light thermoelectric conversion effect, characterized by comprising: lock-in amplifier (1),
The left Pd electrode (3) of h-BN photic zone (2), InSe film, InSe film (4), P doping Si substrate DC power supply VL (5), P doping
Si substrate Pd electrode (6), graphite shielding layer DC power supply VR (7), graphite shielding layer Pd electrode (8), graphite shielding layer (9), h-
BN substrate (10), SiO2Oxide layer (11), P adulterate Si substrate (12), the right Pd electrode (13) of InSe film, are 2 in doping concentration
×1016cm-3The two-sided high polishing single crystal silicon substrate of the p-type with a thickness of 200-240nm on preparation with a thickness of 100-200nm SiO2
Oxide layer will be placed in SiO with a thickness of the graphite shielding layer of 10nm thickness2Layer surface is aoxidized, then will be with a thickness of the h-BN of 30nm
Film is transferred to SiO2It the surface of oxide layer and graphite shielding layer, then will be with a thickness of the InSe film of 5nm as h-BN substrate
It is transferred to the upper surface of h-BN substrate, is transferred to InSe film upper surface as h-BN light transmission for a thickness of the h-BN film of 20nm
Layer.
2. a kind of hyperfrequency photon detector based on light thermoelectric conversion effect according to claim 1, it is characterised in that
The Pd electrode is respectively deposited at the side of InSe film upper surface, graphite shielding layer side and P doping Si substrate, wherein
InSe film upper surface, deposits symmetrical two Pd electrodes respectively, deposition thickness 100nm, by conducting wire by outer lock
The left Pd electrode (3) of phase amplifier (1), InSe film, the right Pd electrode (13) of InSe film, graphite shielding layer DC power supply VR (7),
Graphite shielding layer Pd electrode (8), P doping Si substrate DC power supply VL (5) connection, can measure under different hyperfrequency light-wave irradiations,
(4) two interelectrode voltage differences of InSe film, and then obtain optical wavelength.
3. a kind of hyperfrequency photon detector based on light thermoelectric conversion effect according to claim 1, it is characterised in that
For the graphite shielding layer with a thickness of 10nm, length is less than 40nm, and width is less than the rectangular film of 30nm, and graphite shielding layer is clipped in
H-BN substrate and SiO2Play the role of shielding electric field between oxide layer.
4. a kind of hyperfrequency photon detector based on light thermoelectric conversion effect according to claim 1, it is characterised in that
The h-BN photic zone has the rectangular film structure that with a thickness of 20nm and length is 50nm, width is 30nm, h-BN substrate
Length be 80nm, width 40nm, with a thickness of 10nm, bottom of right side reserves rectangular notch for placing graphite shielding layer.
5. a kind of hyperfrequency photon detector based on light thermoelectric conversion effect according to claim 1, it is characterised in that
The lock-in amplifier uses 30MHz high-frequency digital lock-in amplifier, sensitivity 1nV to 1V, and time constant is 3us to 3Ks.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821509389.2U CN208904040U (en) | 2018-09-16 | 2018-09-16 | A kind of hyperfrequency photon detector based on light thermoelectric conversion effect |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201821509389.2U CN208904040U (en) | 2018-09-16 | 2018-09-16 | A kind of hyperfrequency photon detector based on light thermoelectric conversion effect |
Publications (1)
Publication Number | Publication Date |
---|---|
CN208904040U true CN208904040U (en) | 2019-05-24 |
Family
ID=66572487
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201821509389.2U Expired - Fee Related CN208904040U (en) | 2018-09-16 | 2018-09-16 | A kind of hyperfrequency photon detector based on light thermoelectric conversion effect |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN208904040U (en) |
-
2018
- 2018-09-16 CN CN201821509389.2U patent/CN208904040U/en not_active Expired - Fee Related
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Chen et al. | Broadband Bi2O2Se photodetectors from infrared to terahertz | |
Luo et al. | High‐Performance and Polarization‐Sensitive Imaging Photodetector Based on WS2/Te Tunneling Heterostructure | |
Shi et al. | Opto-electro-modulated transient photovoltage and photocurrent system for investigation of charge transport and recombination in solar cells | |
CN109119506A (en) | A kind of hyperfrequency photon detector based on light thermoelectric conversion effect | |
Moore | Collection length of holes in a‐Si: H by surface photovoltage using a liquid Schottky barrier | |
Jin et al. | High-performance black silicon photodetectors operating over a wide temperature range | |
Inoue et al. | Crystalline disorder reduction and defect‐type change in silicon on sapphire films by silicon implantation and subsequent thermal annealing | |
Mochizuki et al. | Noncontact evaluation of electrical passivation of oxidized silicon using laser terahertz emission microscope and corona charging | |
Liu et al. | Top-gated black phosphorus phototransistor for sensitive broadband detection | |
Voitsekhovskii et al. | Photoelectrical characteristics of metal–insulator–semiconductor structures based on graded-gap HgCdTe grown by molecular-beam epitaxy | |
Du et al. | Organic photodetectors based on pentacene single crystals with fast response and flexibility | |
Zeng et al. | Manipulating Picosecond Photoresponse in van der Waals Heterostructure Photodetectors | |
Alaloul et al. | Plasmonic photovoltaic double-graphene detector integrated into tin slot waveguides | |
Zeng et al. | Ultrafast Photocurrent Detection in Low‐Dimensional Materials | |
CN208904040U (en) | A kind of hyperfrequency photon detector based on light thermoelectric conversion effect | |
Sarkar et al. | Dember effect in C60 thin films | |
Zhu | Graphene geometric diodes for optical rectennas | |
Zhang et al. | Nonlinear Photodetector Based on InSe p–n Homojunction for Improving Spatial Imaging Resolution | |
Chen et al. | A high-performance broadband phototransistor array of a PdSe 2/SOI Schottky junction | |
Li et al. | A concise way to estimate the average density of interface states in an ITO–SiOx/n-Si heterojunction solar cell | |
Anelli et al. | A new concept of monolithic silicon pixel detectors: hydrogenated amorphous silicon on ASIC | |
Narchi et al. | Nanoscale investigation of carrier lifetime on the cross section of epitaxial silicon solar cells using Kelvin probe force microscopy | |
CN110767769A (en) | Detection unit, ultra-wideband photodetector and detection method | |
Kavasoglu et al. | Intensity modulated short circuit current spectroscopy for solar cells | |
Zhou et al. | Sensitive photodetection based on the surface states of p-type silicon |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190524 Termination date: 20190916 |