CN208903279U - Optical fingerprint sensor mould group - Google Patents
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- CN208903279U CN208903279U CN201821999064.7U CN201821999064U CN208903279U CN 208903279 U CN208903279 U CN 208903279U CN 201821999064 U CN201821999064 U CN 201821999064U CN 208903279 U CN208903279 U CN 208903279U
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Abstract
A kind of optical fingerprint sensor mould group, comprising: light-emitting display panel；Optical fingerprint sensor, the optical fingerprint sensor includes sensor transparent substrates and the fingerprint sensing circuit layer positioned at sensor transparent substrates surface, the fingerprint sensing circuit layer includes the first pixel region and the first peripheral region around the first pixel region, the fingerprint sensing circuit layer includes the first sensing face, and first sensing face is backwards to sensor transparent substrates；Optical collimator layer between the optical fingerprint sensor and the light-emitting display panel, first sensing face of the optical collimator layer towards the first pixel region；Light-absorption layer, the light-absorption layer are located at the first sensing face of first peripheral region.The performance of the optical fingerprint sensor mould group is improved.
Description
Technical field
The present invention relates to optical finger print identification field more particularly to a kind of optical fingerprint sensor mould groups.
Background technique
Fingerprint imaging identification technology is the fingerprint image that human body is collected by optical fingerprint sensor, then with system
In existing fingerprint imaging information be compared, whether carrying out correct judgment, so realize identification technology.Due to its use
Convenience and somatic fingerprint uniqueness, fingerprint imaging identification technology has been widely used in every field, such as public security bureau
With field of safety check, the access control system of building and the consumer product areas such as PC and mobile phone such as customs etc..
The imaging mode of fingerprint imaging identification technology has the multiple technologies such as optical imagery, capacitance imaging, ultrasonic imaging.Relatively
For, optical finger print imaging identification technology imaging effect is relatively preferable, and equipment cost is relatively low.
However, the performance of existing optical fingerprint sensor mould group is to be improved.
Summary of the invention
Problems solved by the invention is to provide a kind of optical fingerprint sensor mould group, to improve optical fingerprint sensor mould group
Performance.
To solve the above problems, the present invention provides a kind of optical fingerprint sensor mould group, comprising: light-emitting display panel；
Optical fingerprint sensor, the optical fingerprint sensor include sensor transparent substrates and be located at the sensor transparent substrates table
The fingerprint sensing circuit layer in face, the fingerprint sensing circuit layer include the first pixel region and around the first pixel region first
Peripheral region, the fingerprint sensing circuit layer include the first sensing face, and first sensing face is backwards to sensor transparent substrates；It is located at
Optical collimator layer between the optical fingerprint sensor and the light-emitting display panel, the optical collimator layer direction first
First sensing face of pixel region；Light-absorption layer, the light-absorption layer are located at the first sensing face of first peripheral region.
Optionally, further includes: the first adhesive layer between the optical collimator layer and the optical fingerprint sensor,
First adhesive layer senses face contact with the first of first pixel region and does not contact with the first sensing face of the first peripheral region.
Optionally, first adhesive layer include the first bonding center and positioned at first bonding center around first
Bond edge area；First pixel region includes the first pixel center area and the first pixel around the first pixel center area
Marginal zone；First bonding center and the first pixel center area first sensing face contact and with the first pixel edge area first
Sensing face does not contact；The light-absorption layer also extends between the first bond edge area and the first pixel edge area.
Optionally, the width in the first pixel edge area is more than or equal to 0.5 millimeter and is less than or equal to 2 millimeters.
Optionally, the light-absorption layer also covers the entire side wall of the first adhesive layer.
Optionally, the first sensing face contact of the optical collimator layer and first pixel region.
Optionally, the light-absorption layer also covers the side wall of the optical collimator layer.
Optionally, further includes: the second adhesive layer between the light-emitting display panel and the optical collimator layer；
The light-absorption layer covers the entire side wall of the optical collimator layer and the entire side wall of the second adhesive layer.
Optionally, the light-absorption layer also covers the side wall and the fingerprint sensing circuit layer of the sensor transparent substrates
Side wall.
Optionally, the light-absorption layer is epoxy resin layer, layer of silica gel or ink layer.
Optionally, the light-absorption layer is black layer.
Optionally, the light-absorption layer is 90% or more to the absorptivity of the light of 400 nanometers~900 nano wave lengths.
Optionally, the first sensing face of the light-absorption layer and the first peripheral region has bottom contact regions；The bottom connects
Touch region structure annular in shape；The width of the cyclic structure is 0.5mm or more.
Optionally, the sensor transparent substrates are glass substrate or PI substrate.
Compared with prior art, technical solution of the present invention has the advantage that
In the optical fingerprint sensor mould group that technical solution of the present invention provides, the optical fingerprint sensor includes sensor
Transparent substrates can reduce the cost of optical fingerprint sensor in this way.The optical fingerprint sensor mould group includes light-absorption layer, institute
The first sensing face that light-absorption layer is located at first peripheral region is stated, light-absorption layer covers the first sensing face of the first peripheral region.Institute
The ambient of first sensing face incidence of the light-absorption layer for absorbing the first peripheral region of direction around optical collimator layer is stated, in turn
Stop ambient to be incident to the first sensing face for reflecting or scattering to the first pixel region in sensor transparent substrates again, therefore drops
Low ambient improves the graphical quality of optical fingerprint sensor to the optical interference of sensor devices in the first pixel region.
Further, optical fingerprint sensor mould group further include: be located at the optical collimator layer and the optical finger print senses
The first adhesive layer between device.The light-absorption layer also covers the entire side wall of the first adhesive layer.The light-absorption layer will be glued to first
The light absorption of layer side wall incidence is tied, the light-absorption layer can not only stop light directly from the first adhesive layer side wall to the first pixel region
It is incident, moreover it is possible to stop light to be incident to from the first adhesive layer side wall and reflect or scatter to the first pixel in sensor transparent substrates again
It in first sensing face in area, therefore reduces ambient and optical interference is caused to sensor devices in the first pixel region, improve light
Learn the graphical quality of fingerprint sensor.
Further, the light-absorption layer also extends between the first bond edge area and the first pixel edge area, therefore described
Light-absorption layer by the light absorption from the first adhesive layer side wall to the incidence of the first pixel region, the light-absorption layer can not only stop directly from
First adhesive layer side wall is incident to the first pixel region, moreover it is possible to stop light to be incident in sensor transparent substrates and reflect or scatter again
To the first sensing face of the first pixel region, reduction ambient in this way causes optical interference to sensor devices in the first pixel region,
Improve the graphical quality of optical fingerprint sensor.
Secondly, the thickness of the light-absorption layer is without very thick, light-absorption layer can be done relatively thin, reduce the technology difficulty of light-absorption layer
And cost.
Further, the light-absorption layer also covers the side wall of the optical collimator layer, therefore light-absorption layer can be surrounded preferably
First adhesive layer, it is ensured that ambient light cannot be directly entered the first adhesive layer from top and then be incident in the first pixel region, avoid
The signal for not carrying finger print information is generated, ambient is reduced and optical interference is caused to sensor devices in the first pixel region.
Further, there is the second adhesive layer between the light-emitting display panel and the optical collimator layer；The extinction
Layer covers the entire side wall of the optical collimator layer and the entire side wall of the second adhesive layer.Benefit includes: that can stop ambient light
Optical collimator is entered by the second adhesive layer, and then ambient light is stopped to enter the sensor devices of optical sensor, avoids generating
The signal for not carrying finger print information generates signal reduction ambient and causes optical interference to sensor devices in the first pixel region.
Further, the light-absorption layer also covers the side wall of sensor transparent substrates and the side of the fingerprint sensing circuit layer
Wall.Light-absorption layer can stop ambient to cross optical collimator layer directly from the side wall of sensor transparent substrates and fingerprint sensing circuit
The side wall of layer is incident in the substrate of optical sensor, and light is avoided to be entered the first sense of the first pixel region after reflection and scattering
Survey face avoids generating the signal generation signal for not carrying finger print information, reduces ambient to sensor devices in the first pixel region
Cause optical interference.
Detailed description of the invention
Fig. 1 is a kind of structural schematic diagram of optical fingerprint sensor mould group；
Fig. 2 to Figure 11 is the structural schematic diagram of optical fingerprint sensor mould group forming process in one embodiment of the invention；
Figure 12 to Figure 14 is the structural schematic diagram of optical fingerprint sensor mould group forming process in another embodiment of the present invention.
Specific embodiment
As described in background, the performance of the optical fingerprint sensor mould group of the prior art is poor.
A kind of optical fingerprint sensor mould group, with reference to Fig. 1, comprising: light-emitting display panel 130；Optical fingerprint sensor
100；Optical collimator layer 120 between the optical fingerprint sensor 100 and the light-emitting display panel 130.
The optical fingerprint sensor 100 is including sensor transparent substrates and positioned at sensor transparent substrates surface
Fingerprint sensing circuit layer.The fingerprint sensing circuit layer includes the first pixel region and the first periphery around the first pixel region
Area.The material of the sensor transparent substrates be glass or PI plastics, can reduce in this way optical fingerprint sensor 100 at
This.Optical collimator layer 120 is contacted with the first pixel region.
The effect of first peripheral region includes: that the surface of the partial region of the first peripheral region needs that anisotropic conductive is arranged
Film, fingerprint sensing circuit layer are connect by anisotropic conductive film with external drive circuit.
Due to being provided with optical collimator layer 120 between light-emitting display panel 130 and optical fingerprint sensor 100, because
There is certain space between this light-emitting display panel 130 and the first peripheral region of optical fingerprint sensor 100.Optical collimator
(such as light c) can enter sensor transparent substrates across the first peripheral region to light around layer 120, and then in sensor light transmission base
The region being upward through between neighboring photosensitive pixel after plate reflection or scattering reaches optical collimator layer 120, and then by optical collimator
120 reflection of layer turnes down in the photosensitive pixel in fingerprint sensing circuit layer, and photosensitive pixel generation is caused not carry finger print information
Signal generate signal, ambient causes optical interference to photosensitive pixel in the first pixel region.
Secondly, optical fingerprint sensor mould group further include: be located at the optical collimator layer 120 and the optical finger print senses
The first adhesive layer 110 between device 100.First adhesive layer 110 and the first pixel region are towards the surface of optical collimator layer 120
Contact.Correspondingly, in order to avoid the first adhesive layer 110 stops from light-emitting display panel 130 to optical fingerprint sensor 100
Incident light, therefore the material of the first adhesive layer 110 needs for translucent material.
Light around the side of optical fingerprint sensor mould group can expose to the side of the first adhesive layer 110, in turn
Expose in the pixel of the first pixel region of optical fingerprint sensor 100 that (light a) as shown in figure 1 in this way can pass optical finger print
Pixel causes light to interfere in sensor 100, reduces graphical effect.Secondly, exposing to the light of the side of the first adhesive layer 110 can enter
It is incident upon in sensor transparent substrates that (as shown in figure 1 when light b), light b can be reflected or be scattered, and then anti-in sensor transparent substrates
The region penetrated or be upward through between neighboring photosensitive pixel after scattering reaches optical collimator layer 120, and then by optical collimator layer 120
Reflection turnes down in photosensitive pixel, light can be caused to interfere pixel in optical fingerprint sensor 100 in this way, reduces figure effect
Fruit.
On this basis, the present invention provides a kind of optical fingerprint sensor mould group, comprising: light-emitting display panel；Optics
Fingerprint sensor, the optical fingerprint sensor include sensor transparent substrates and positioned at sensor transparent substrates surface
Fingerprint sensing circuit layer, the fingerprint sensing circuit layer include the first pixel region and the first periphery around the first pixel region
Area, the fingerprint sensing circuit layer include the first sensing face, and first sensing face is backwards to sensor transparent substrates；Positioned at described
Optical collimator layer between optical fingerprint sensor and the light-emitting display panel, the first pixel of the optical collimator layer direction
First sensing face in area；Light-absorption layer, the light-absorption layer are located at the first sensing face of first peripheral region.The optical finger print passes
The performance of sensor mould group is improved.
To make the above purposes, features and advantages of the invention more obvious and understandable, with reference to the accompanying drawing to the present invention
Specific embodiment be described in detail.
Upper and lower relation in this specification is so that optical fingerprint sensor mould group to be placed below eyes of user and is determined
Justice.When optical fingerprint sensor mould group is placed below eyes of user, and light-emitting display panel display it is face-up when, such as
Fruit says that a structure is located at the top of another structure, then illustrate this structure than another structure closer to eyes of user,
Illustrate in this together.
Fig. 2 to Figure 11 is the structural schematic diagram of optical fingerprint sensor mould group forming process in one embodiment of the invention.
With reference to Fig. 2, light-emitting display panel 200 is provided.
The light-emitting display panel 200 includes the first transparent substrates 201, the second transparent substrates 202 and self-luminescence circuit
Layer 203.Self-luminescence circuit layer 203 is between the first transparent substrates 201 and the second transparent substrates 202.First transparent substrates 201
Material with the second transparent substrates 202 can be translucent material, and specific material is unorganic glass or organic glass, be also possible to have
Other plastic products other than machine glass, such as plastic base, plastic base include PI substrate or pet substrate.
The self-luminescence circuit layer 203 includes multiple display pixel cells 2031.Multiple show is illustrated with dotted line frame in Fig. 2
Show 2031 neighbouring relations of region and each display pixel cells where pixel unit 2031.It should be noted that, although dotted line
Frame includes part the first transparent substrates 201 and the second transparent substrates 202, but this is only to facilitate display, display pixel list
Member 2031 does not include the first transparent substrates 201 and the second transparent substrates 202.
In the present embodiment, light-emitting display panel 200 is OLED display panel, correspondingly, display pixel cells 2031 are wrapped
Include the structures such as anode layer, hole injection layer (HIL), luminescent layer (EML), electron injecting layer (EIL) and cathode layer, display pixel list
Member 2031 can also include hole transmission layer (HTL) and electron transfer layer (ETL), and display pixel cells 2031 further include driving
The TFT of OLED, the driving structures such as metal wire and storage capacitance.
Then, sensing collimation mould group is formed, the sensing collimation mould group includes optical fingerprint sensor and refers to positioned at optics
The optical collimator layer of line sensor surface.
With reference to Fig. 3, optical fingerprint sensor 210 is provided, the optical fingerprint sensor 210 includes sensor transparent substrates
211 and the fingerprint sensing circuit layer 212 positioned at 211 surface of sensor transparent substrates, the fingerprint sensing circuit layer 212 wraps
Include the first pixel region 210A and the first peripheral region 210B around the first pixel region 210A, the fingerprint sensing circuit layer
212 include the first sensing face 2110, and first sensing face 2110 is backwards to sensor transparent substrates 211.
The effect of first peripheral region 210B include: the surface of the partial region of the first peripheral region 210B need to be arranged it is each to different
Property conductive film, fingerprint sensing circuit layer 212 connect by anisotropic conductive film with external drive circuit.
The sensor transparent substrates 211 can be glass substrate or PI substrate.The sensor transparent substrates 211 are right
The light transmittance of visible light is greater than 50%, and the sensor transparent substrates 211 are greater than 20% to the light transmittance of ultraviolet light.
The PI substrate compares the heat-resist of other plastic bases, and stability is good.
The cost of substrate of the sensor transparent substrates 211 relative to silica-base material is smaller, can reduce optical finger print
The cost of sensor 210.
The fingerprint sensing circuit layer 212 (referring to Fig. 4) includes the first non-transparent region and the first transmission region 2123.Institute
Stating fingerprint sensing circuit layer 212 includes signal wire 21, driving line 22 and photosensitive pixel array, if the photosensitive pixel array includes
Dry sensitive pixel elements.Wherein, each sensitive pixel elements include that Signal-controlled switch 2121, sensor devices 2122 and first are saturating
Light region 2123.Signal-controlled switch 2121 and sensor devices 2122 are all opaque, and the first non-transparent region includes described
Signal-controlled switch 2121 and sensor devices 2122, first transmission region 2123 are in addition to signal wire 21, driving line 22, letter
Region other than number control switch 2121 and sensor devices 2122.
The first non-transparent region is greater than 50% to the light transmittance of visible light, and the first non-transparent region is to ultraviolet light
Light transmittance be greater than 20%.
In conjunction with reference Fig. 5 to Fig. 8, optical collimator layer 230 is provided.
The optical collimator layer 230 has opposite the first collimation plane and the second collimation plane, the first collimation plane and the second standard
It faces directly in parallel, the optical collimator layer 230 includes multiple smooth collimation units 231, and the extending direction of the smooth collimation unit 231 hangs down
Directly in the first collimation plane and the second collimation plane.
Fig. 6 is the top view of optical collimator layer 230 in corresponding diagram 5, and Fig. 7 is the side view of optical collimator layer 230 in corresponding diagram 5
Figure, Fig. 8 are the top view of light collimation unit 231, select one of light collimation unit 231 with dotted line circle in Fig. 6 and Fig. 7
Distinguish display.
The optical collimator layer 230 is used to that the light through light-emitting display panel 200 to be made more to collimate.
In the present embodiment, each smooth collimation unit 231 has sandwich layer 2311 and surrounds the cortex 2312 of sandwich layer 2311.Light is quasi-
Straight device layer 230 is mainly using sandwich layer 2311 come by light, and cortex 2312 is then used to absorb light, sandwich layer 2311 and cortex
2312 are used cooperatively, to reach above-mentioned smooth collimating effect.
In the present embodiment, the lower the sandwich layer 2311 the better to the absorptivity of visible light and infrared light.To guarantee to pass through light
The light intensity of collimator layer 230 is enough, and selection enables sandwich layer 2311 to absorptivity < 10% of visible light and infrared light.In addition, by
In considering subsequent bonding mode, the lower the absorptivity of 2311 ultraviolet light of sandwich layer the better.In the present embodiment, sandwich layer 2311 is to can
Light-exposed light transmittance is greater than 50%, and sandwich layer 2311 is greater than 20% to the light transmittance of ultraviolet light.The cortex 2312 to visible light and
The higher the better for the absorptivity of infrared light, to absorb to the light except special angle.To guarantee to carry out respective ray of light
It effectively absorbs, selection enables cortex 2312 to absorptivity > 50% of visible light and infrared light.
The oblique light for being incident upon optical collimator layer 230 will not occur in the sandwich layer 2311 of light collimation fiber and 2312 interface of cortex
Obvious reflection, will not more be totally reflected, but can enter in cortex 2312 from sandwich layer 2311 is incident, be absorbed by cortex 2312.
It therefore, can be by primary or more with the first collimation plane of optical collimator layer 230 and the second lesser light of collimation plane angle
It is absorbed after secondary cortex 2312 by cortex 2312, and it is larger with the first collimation plane of optical collimator layer 230 and the second collimation plane angle
Light, then can be passed completely through from a sandwich layer 2311.For example, by the light of optical collimator layer 230 respectively with first
Angle between collimation plane and the second collimation plane is closer to 90 degree (such as 80 degree to 90 degree), and the light of other angles range all by
Light-emitting display panel 200 sponges.To sum up, the optical collimator layer 230 can make the light through light-emitting display panel 200
Line more collimates.The collimating effect of 230 pairs of light of optical collimator layer, the fingerprint for helping to improve optical fingerprint sensor are known
Other performance.
In other embodiments, the optical collimator layer 230 is flexible collimator.
With reference to Fig. 9, optical fingerprint sensor 210 and optical collimator layer 230 are bonded in one using the first adhesive layer 240
It rises, specifically, using the first adhesive layer 240 by the first sensing face 2110 of the first pixel region 210A and the optical collimator
Layer 230 is bonded together.
The fingerprint sensing circuit layer 212 be located at the sensor transparent substrates 211 and the optical collimator layer 230 it
Between, and the first sensing face 2110 of the first pixel region 210A is towards the optical collimator layer 230.
First adhesive layer 240 contacted with the first sensing face 2110 of the first pixel region 210A and with the first peripheral region
The first sensing face 2110 of 210B does not contact.
In the present embodiment, the material light transmission of the first adhesive layer 240.
In the present embodiment, the first adhesive layer 240 with a thickness of 0.05 millimeter~0.12 millimeter.
The sensing collimates mould group further include: be located at the optical collimator layer 230 and the optical fingerprint sensor 210 it
Between the first adhesive layer 240, the first adhesive layer 240 contacts with the first sensing face 2110 of the first pixel region 210A and with
The first sensing face 2110 of one peripheral region 210B does not contact.
With reference to Figure 10, light-emitting display panel 200 and optical collimator layer 230 are bonded together.
In the present embodiment, light-emitting display panel 200 and optical collimator layer 230 are bonded in using the second adhesive layer 250
Together.
With reference to Figure 11, light-absorption layer 260 is formed, the light-absorption layer 260 is located at the first sensing of the first peripheral region 210B
Face 2110.
The light-absorption layer 260 covers the first sensing face 2110 of the first peripheral region 210B.The light-absorption layer 260 is for inhaling
The incident ambient of the first sensing face 2110 of the first peripheral region 210B of direction around optical collimator layer 230 is received, and then is hindered
Gear ambient is incident to the first sensing face for reflecting or scattering to the first pixel region 210A in sensor transparent substrates 211 again,
Therefore ambient is reduced to the optical interference of sensor devices 2122 in the first pixel region 210A, improves optical fingerprint sensor
Graphical quality.
In the present embodiment, after forming sensing collimation mould group, in 2110 shape of the first sensing face of the first peripheral region 210B
At light-absorption layer 260.
In the present embodiment, after light-emitting display panel 200 and optical collimator layer 230 are bonded together, extinction is formed
Layer 260.
In other embodiments, after forming light-absorption layer, light-emitting display panel and optical collimator layer are bonded together.
In the present embodiment, the light-absorption layer 260 also covers the entire side wall of the first adhesive layer 240.The light-absorption layer 260 will
To the light absorption of the first adhesive layer 240 side wall incidence, the light-absorption layer 260 can not only stop light directly from the first adhesive layer
240 side walls are incident to the first pixel region 210A, moreover it is possible to light be stopped to be incident to sensor light transmission base from 240 side wall of the first adhesive layer
It reflects or scatters in the first pixel region 210A again in plate 211, therefore reduce ambient to photosensitive in the first pixel region 210A
Device 2122 causes optical interference, improves the graphical quality of optical fingerprint sensor.
In other embodiments, the light-absorption layer covers the side wall of the first adhesive layer segment thickness.
In the present embodiment, the light-absorption layer 260 also covers the side wall of the optical collimator layer 230, specifically, the extinction
The entire side wall or partial sidewall of the 260 covering optical collimator layer optical collimator layer 230 of layer.Therefore light-absorption layer 260 can be more
The first adhesive layer 240 is surrounded well, it is ensured that ambient light cannot be directly entered the first adhesive layer 240 from top and then be incident on first
It in pixel region 210A, avoids generating the signal for not carrying finger print information, reduces ambient to photosensitive in the first pixel region 210A
Device 2122 causes optical interference.
In other embodiments, the light-absorption layer does not cover the side wall of the optical collimator layer.
In other embodiments, light-absorption layer also cover the optical collimator layer entire side wall and the second adhesive layer it is entire
Side wall, benefit include: that ambient light can be stopped to enter optical collimator by the second adhesive layer, avoid enter into optical sensor
Sensor devices avoid generating the signal generation signal reduction ambient for not carrying finger print information to photoreceptor in the first pixel region
Part causes optical interference.
In other embodiments, the light-absorption layer also covers the side wall and the fingerprint sensing circuit of sensor transparent substrates
The side wall of layer.Light-absorption layer can stop ambient to cross optical collimator layer directly from the side wall of sensor transparent substrates and fingerprint sense
The side wall of slowdown monitoring circuit layer is incident in the substrate of optical sensor, and light is avoided to be entered optical sensor after reflection and scattering
Sensor devices 2122 avoid generating the signal generation signal for not carrying finger print information, reduce ambient in the first pixel region
Pixel device causes optical interference.
The light-absorption layer 260 is epoxy resin layer, layer of silica gel or ink layer.
The light-absorption layer 260 is black layer.
The light-absorption layer 260 is 90% or more to the absorptivity of the light of 400 nanometers~900 nano wave lengths.400 nanometers~
900 light is the more sensitive light of fingerprint sensing circuit layer.
In the present embodiment, the light-absorption layer 260 is contacted with the first sensing face 2110 of the first peripheral region 210B with bottom
Region；The bottom contact regions structure annular in shape；The width W of the cyclic structure is 0.5mm or more.If the cyclic structure
Width W be less than 0.5mm, then lead to the ineffective of 260 shielding light of light-absorption layer.
It should be noted that in other embodiments, using the first adhesive layer by optical fingerprint sensor and optical collimator
After layer is bonded together, the first sensing face in first peripheral region forms light-absorption layer, later, by light-emitting display panel
It is bonded together with optical collimator layer.In the case, the light-absorption layer is located at the first sensing face of first peripheral region, and
The light-absorption layer covers the side wall of first adhesive layer, and the light-absorption layer covers the entire side wall of the first adhesive layer, light-absorption layer
The second adhesive layer is not covered.The light-absorption layer can also cover the entire side wall or partial sidewall of the optical collimator layer.It is described
Light-absorption layer can also cover the side wall of sensor transparent substrates and the side wall of the fingerprint sensing circuit layer.
It should be noted that in other embodiments, the sensing collimation mould group includes optical fingerprint sensor and is located at
First sensing face contact of the optical collimator layer on optical fingerprint sensor surface, the optical collimator layer and first pixel region
And do not contacted with the first peripheral region, the optical collimator layer is flexible collimator.Form the method packet of the sensing collimation mould group
It includes: optical fingerprint sensor is provided；Optical collimator layer is formed in the first sensing face of the first pixel region.Correspondingly, optical finger print
There is no the first adhesive layer between sensor and optical collimator layer, the light-absorption layer does not cover the first adhesive layer.
Correspondingly, the present embodiment also provides a kind of optical fingerprint sensor mould group formed using the above method, with reference to figure
11, comprising: light-emitting display panel 200；Optical fingerprint sensor 210, the optical fingerprint sensor include sensor light transmission
Substrate 211 and fingerprint sensing circuit layer 212 positioned at 211 surface of sensor transparent substrates, the fingerprint sensing circuit layer
212 include the first pixel region 210A and the first peripheral region 210B around the first pixel region 210A, the fingerprint sensing electricity
Road floor 212 includes the first sensing face 2110, and first sensing face 2110 is backwards to sensor transparent substrates 211；Positioned at the light
Learn the optical collimator layer 230 between fingerprint sensor 210 and the light-emitting display panel 200,230 court of optical collimator layer
To the first sensing face 2110 of the first pixel region 210A；Light-absorption layer 260, the light-absorption layer 260 are located at first peripheral region
The first sensing face 2110 of 210B.
In the present embodiment, optical fingerprint sensor mould group further include: be located at optical collimator layer 230 and the optical finger print passes
The first adhesive layer 240 between sensor 210, the first adhesive layer 240 are contacted with the first sensing face 2110 of the first pixel region 210A
And it is not contacted with the first sensing face 2110 of the first peripheral region 210B.
In the present embodiment, the light-absorption layer 260 covers the entire side wall of first adhesive layer 240.
In the present embodiment, the light-absorption layer 260 also covers the side wall of the optical collimator layer 230.
The optical fingerprint sensor mould group further include: be located at the light-emitting display panel 200 and the optical collimator
The second adhesive layer 250 between layer 230.
In other embodiments, the light-absorption layer covers the entire side wall and the second adhesive layer of the optical collimator layer 230
250 entire side wall.
In other embodiments, the light-absorption layer also covers the side wall and the fingerprint sensing circuit of sensor transparent substrates
The side wall of layer.
The light-absorption layer 260 is epoxy resin layer, layer of silica gel or ink layer.
The light-absorption layer 260 is black layer.
The light-absorption layer 260 is 90% or more to the absorptivity of the light of 400 nanometers~900 nano wave lengths.
The first sensing face 2110 of the light-absorption layer 260 and the first peripheral region 210B have bottom contact regions；The bottom
Portion's contact area structure annular in shape；The width of the cyclic structure is 0.5mm or more.
The fingerprint sensing circuit layer 212 be located at the sensor transparent substrates 211 and the optical collimator layer 230 it
Between.
The sensor transparent substrates 211 are glass substrate or PI substrate.
It should be noted that in other embodiments, the first sensing of the optical collimator layer and first pixel region
It face contact and is not contacted with the first peripheral region, the optical collimator layer is flexible collimator.Correspondingly, optical fingerprint sensor and
There is no the first adhesive layer between optical collimator layer, the light-absorption layer does not cover the first adhesive layer.
Another embodiment of the present invention also provides a kind of forming method of optical fingerprint sensor mould group, in the present embodiment with before
The difference of one embodiment is: first adhesive layer includes the first bonding center and bonds around center positioned at first
First bond edge area；First pixel region include the first pixel center area and around the first pixel center area first
Pixel edge area；First bonding center and the first pixel center area first sensing face contact and with the first pixel edge area
First sensing face does not contact；The light-absorption layer also extends between the first bond edge area and the first pixel edge area；The suction
Photosphere includes the first light-absorption layer；Before being bonded together optical fingerprint sensor and optical collimator layer, at described first week
First sensing face in border area forms the first light-absorption layer, and the first light-absorption layer extends to the sensing of part first in the first pixel edge area
Face；It is respectively that first sensing face in first pixel center area and light is quasi- using the first adhesive layer after forming the first light-absorption layer
Straight device layer and the first light-absorption layer of part and optical collimator layer are bonded together.It is identical as previous embodiment about the present embodiment
Content, be no longer described in detail.
Figure 12 to Figure 14 is the structural schematic diagram of optical fingerprint sensor mould group forming process in another embodiment of the present invention.
Step in the present embodiment carries out on the basis of Fig. 2 to Fig. 8.
With reference to Figure 12, the first light-absorption layer 360, and first are formed in the first sensing face 2110 of the first peripheral region 210B
Light-absorption layer 360 extends to first sensing face 2110 in the first pixel edge area.
Material, color and the absorptivity of first light-absorption layer 360 are referring to previous embodiment.
The first sensing face 2110 of first light-absorption layer 360 and the first peripheral region 210B have bottom contact regions, institute
State size of the size referring to bottom contact regions in previous embodiment of bottom contact regions.
The width in the first pixel edge area is more than or equal to 0.5 millimeter and is less than or equal to 2 millimeters.
First pixel edge area is the region in the first pixel region with the first light-absorption layer 360 bonding place.
If the width in first pixel edge area be greater than 2 millimeters, cause in the first pixel region be and the first light-absorption layer
The region of 360 bonding designs is excessive, causes the first light-absorption layer 360 to light blocking in optical collimator layer, if first pixel side
For the width in edge area less than 0.5 millimeter, the size that the first light-absorption layer 360 extends to the first pixel region is smaller, and the first light-absorption layer 360 is right
It is poor from the barrier effect of the light of the first adhesive layer side wall incidence.
With reference to Figure 13, after forming the first light-absorption layer 360, using the first adhesive layer 340 by optical fingerprint sensor 210 and light
Collimator layer 230 is bonded together, specifically, using the first adhesive layer 340 respectively by the first of first pixel center area
Sensing face and optical collimator layer 230 and the first light-absorption layer of part 360 and optical collimator layer are bonded together.
First light-absorption layer 360 is located at the first sensing face 2110 of the first peripheral region 210B, and described first inhales
Photosphere 360 covers the side wall of first adhesive layer 340.
First adhesive layer 340 includes the first bonding center and the first bonding around the first bonding center
Marginal zone；First pixel region includes the first pixel center area and the first pixel edge around the first pixel center area
Area；First bonding center senses face contact with the first of the first pixel center area and senses with the first of the first pixel edge area
Face does not contact；First light-absorption layer 360 also extends between the first bond edge area and the first pixel edge area.
With reference to Figure 14, light-emitting display panel 200 and optical collimator layer 230 are bonded together.
In the present embodiment, light-emitting display panel 200 and optical collimator layer 230 are bonded in using the second adhesive layer 350
Together.
In the present embodiment, optical fingerprint sensor 210 and optical collimator layer 230 are bonded in using the first adhesive layer 340
After together, light-emitting display panel 200 and optical collimator layer 230 are bonded together using the second adhesive layer 350.
In other embodiments, light-emitting display panel 200 and optical collimator layer 230 are bonded in using the second adhesive layer
After together, forms the first light-absorption layer and later glued optical fingerprint sensor 210 and optical collimator layer 230 using the first adhesive layer
Knot is together；Alternatively, after forming the first light-absorption layer, using the second adhesive layer by light-emitting display panel 200 and optical collimator layer
230 are bonded together, and later, optical fingerprint sensor 210 and optical collimator layer 230 are bonded in one using the first adhesive layer
It rises.
In the present embodiment, light-absorption layer only includes the first light-absorption layer 360.
In other embodiments, optical fingerprint sensor 210 and optical collimator layer 230 are glued using the first adhesive layer 340
After tying together, the second light-absorption layer is formed, the second light-absorption layer covers the side wall of optical collimator layer and the part of the first adhesive layer
Side wall, the first light-absorption layer 360 and the second light-absorption layer all cover the side wall of the first adhesive layer.Second light-absorption layer and the first extinction
Layer 360 constitutes total light-absorption layer.
In other embodiments, optical fingerprint sensor 210 and optical collimator layer 230 are glued using the first adhesive layer 340
After tying together, and light-emitting display panel 200 and optical collimator layer 230 are bonded together by it using the second adhesive layer
Afterwards, the second light-absorption layer is formed, the second light-absorption layer covers the side wall of optical collimator layer and the partial sidewall of the first adhesive layer, and first inhales
Photosphere and the second light-absorption layer all cover the side wall of the first adhesive layer.Second light-absorption layer can also cover the side of the second adhesive layer
Wall.Second light-absorption layer and the first light-absorption layer constitute total light-absorption layer.
It in other embodiments, can also include: the side of side wall and fingerprint sensing circuit layer in sensor transparent substrates
Wall forms third light-absorption layer.First light-absorption layer, the second light-absorption layer and third light-absorption layer constitute total light-absorption layer.
Correspondingly, the present embodiment also provides a kind of optical fingerprint sensor mould group formed using the above method, please refer to
Figure 14, comprising: light-emitting display panel 200；Optical fingerprint sensor 210, the optical fingerprint sensor include that sensor is saturating
Photopolymer substrate and fingerprint sensing circuit layer positioned at sensor transparent substrates surface, the optical fingerprint sensor 210 include
First pixel region 210A and the first peripheral region 210B around the first pixel region 210A, the optical fingerprint sensor 210
Including the first sensing face 2110, first sensing face is backwards to sensor transparent substrates；Positioned at the optical fingerprint sensor 210
Optical collimator layer 230 between the light-emitting display panel 200, the optical collimator layer 230 is towards the first pixel region
First sensing face；The first adhesive layer 340 between the optical collimator layer 230 and the optical fingerprint sensor 210, the
One adhesive layer 340 senses face contact with the first of the first pixel region 210A and does not connect with the first sensing face of the first peripheral region 210B
Touching；First adhesive layer includes the first bonding center and the first bond edge area around the first bonding center；
First pixel region includes the first pixel center area and the first pixel edge area around the first pixel center area；First
Bonding center senses face contact with the first of the first pixel center area and does not connect with first sensing face in the first pixel edge area
Touching；Light-absorption layer, the light-absorption layer are located at the first sensing face 2110 of the first peripheral region 210B, and the light-absorption layer also extends to
Between first bond edge area and the first pixel edge area.Material, color and the absorptivity of the light-absorption layer are referring to previous
Embodiment.
The first sensing face 2110 of the light-absorption layer and the first peripheral region 210B have bottom contact regions, and the bottom connects
The size in region is touched referring to previous embodiment.
In the present embodiment, light-absorption layer only includes the first light-absorption layer 360, and first light-absorption layer 360 is located at described first week
The first sensing face 2110 of border area 210B, and first light-absorption layer 360 covers the side wall of first adhesive layer 340, first
Light-absorption layer 360 also extends between the first bond edge area and the first pixel edge area.
The width in the first pixel edge area is more than or equal to 0.5 millimeter and is less than or equal to 2 millimeters.
In other embodiments, light-absorption layer only includes the first light-absorption layer 360 and the second light-absorption layer, and the second light-absorption layer covers light
The partial sidewall of the side wall of collimator layer and the first adhesive layer, the first light-absorption layer and the second light-absorption layer are by the side wall of the first adhesive layer
All coverings.
The optical fingerprint sensor mould group further include: between light-emitting display panel 200 and optical collimator layer 230
The second adhesive layer.
In other embodiments, the partial sidewall of the side wall of the second light-absorption layer covering optical collimator layer and the first adhesive layer,
First light-absorption layer and the second light-absorption layer all cover the side wall of the first adhesive layer, and the second light-absorption layer also covers the second adhesive layer
Side wall.
In other embodiments, light-absorption layer only includes the first light-absorption layer 360, the second light-absorption layer and third light-absorption layer, third
Light-absorption layer is located at the side wall of sensor transparent substrates and the side wall of fingerprint sensing circuit layer.
Although present disclosure is as above, present invention is not limited to this.Anyone skilled in the art are not departing from this
It in the spirit and scope of invention, can make various changes or modifications, therefore protection scope of the present invention should be with claim institute
Subject to the range of restriction.
Claims (14)
1. a kind of optical fingerprint sensor mould group characterized by comprising
Light-emitting display panel；
Optical fingerprint sensor, the optical fingerprint sensor include sensor transparent substrates and be located at the sensor light transmission base
The fingerprint sensing circuit layer of plate surface, the fingerprint sensing circuit layer include the first pixel region and around the first pixel region
First peripheral region, the fingerprint sensing circuit layer include the first sensing face, and first sensing face is backwards to sensor transparent substrates；
Optical collimator layer between the optical fingerprint sensor and the light-emitting display panel, the optical collimator layer
Towards the first sensing face of the first pixel region；
Light-absorption layer, the light-absorption layer are located at the first sensing face of first peripheral region.
2. optical fingerprint sensor mould group according to claim 1, which is characterized in that further include: it is located at the light and collimates
First sensing of the first adhesive layer between device layer and the optical fingerprint sensor, the first adhesive layer and first pixel region
It face contact and is not contacted with the first sensing face of the first peripheral region.
3. optical fingerprint sensor mould group according to claim 2, which is characterized in that first adhesive layer includes first
Bond center and the first bond edge area around the first bonding center；First pixel region includes the first pixel
Center and the first pixel edge area around the first pixel center area；First bonding center and the first pixel center area
The first sensing face contact and do not contacted with first sensing face in the first pixel edge area；It is viscous that the light-absorption layer also extends to first
It ties between marginal zone and the first pixel edge area.
4. optical fingerprint sensor mould group according to claim 3, which is characterized in that the width in the first pixel edge area is big
In equal to 0.5 millimeter and less than or equal to 2 millimeters.
5. optical fingerprint sensor mould group according to claim 2, which is characterized in that it is viscous that the light-absorption layer also covers first
Tie the entire side wall of layer.
6. optical fingerprint sensor mould group according to claim 1, which is characterized in that the optical collimator layer and described the
First sensing face contact of one pixel region.
7. optical fingerprint sensor mould group according to claim 5 or 6, which is characterized in that the light-absorption layer also covers institute
State the side wall of optical collimator layer.
8. optical fingerprint sensor mould group according to claim 1, which is characterized in that further include: it is located at the self-luminous
The second adhesive layer between display panel and the optical collimator layer；The light-absorption layer covers the entire side of the optical collimator layer
The entire side wall of wall and the second adhesive layer.
9. optical fingerprint sensor mould group according to claim 1, which is characterized in that the light-absorption layer also covers the biography
The side wall of the side wall of sensor transparent substrates and the fingerprint sensing circuit layer.
10. optical fingerprint sensor mould group according to claim 1, which is characterized in that the light-absorption layer is epoxy resin
Layer, layer of silica gel or ink layer.
11. optical fingerprint sensor mould group according to claim 1, which is characterized in that the light-absorption layer is black layer.
12. optical fingerprint sensor mould group according to claim 1, which is characterized in that the light-absorption layer to 400 nanometers~
The absorptivity of the light of 900 nano wave lengths is 90% or more.
13. optical fingerprint sensor mould group according to claim 1, which is characterized in that the light-absorption layer and the first periphery
First sensing face in area has bottom contact regions；The bottom contact regions structure annular in shape；The width of the cyclic structure
For 0.5mm or more.
14. optical fingerprint sensor mould group according to claim 1, which is characterized in that the sensor transparent substrates are
Glass substrate or PI substrate.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821999064.7U CN208903279U (en) | 2018-11-30 | 2018-11-30 | Optical fingerprint sensor mould group |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821999064.7U CN208903279U (en) | 2018-11-30 | 2018-11-30 | Optical fingerprint sensor mould group |
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| CN208903279U true CN208903279U (en) | 2019-05-24 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109299708A (en) * | 2018-11-30 | 2019-02-01 | 上海箩箕技术有限公司 | Optical fingerprint sensor mould group and forming method thereof |
| CN110414501A (en) * | 2019-07-29 | 2019-11-05 | Oppo（重庆）智能科技有限公司 | The processing method of a kind of electronic equipment and electronic equipment |
| US11783618B2 (en) | 2020-08-06 | 2023-10-10 | Samsung Display Co., Ltd. | Fingerprint sensor, method for manufacturing fingerprint sensor, and display device including fingerprint sensor |
-
2018
- 2018-11-30 CN CN201821999064.7U patent/CN208903279U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109299708A (en) * | 2018-11-30 | 2019-02-01 | 上海箩箕技术有限公司 | Optical fingerprint sensor mould group and forming method thereof |
| CN109299708B (en) * | 2018-11-30 | 2024-05-14 | 上海箩箕技术有限公司 | Optical fingerprint sensor module and forming method thereof |
| CN110414501A (en) * | 2019-07-29 | 2019-11-05 | Oppo（重庆）智能科技有限公司 | The processing method of a kind of electronic equipment and electronic equipment |
| US11783618B2 (en) | 2020-08-06 | 2023-10-10 | Samsung Display Co., Ltd. | Fingerprint sensor, method for manufacturing fingerprint sensor, and display device including fingerprint sensor |
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