CN109299708B - Optical fingerprint sensor module and forming method thereof - Google Patents
Optical fingerprint sensor module and forming method thereof Download PDFInfo
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- CN109299708B CN109299708B CN201811455701.9A CN201811455701A CN109299708B CN 109299708 B CN109299708 B CN 109299708B CN 201811455701 A CN201811455701 A CN 201811455701A CN 109299708 B CN109299708 B CN 109299708B
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1318—Sensors therefor using electro-optical elements or layers, e.g. electroluminescent sensing
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Abstract
An optical fingerprint sensor module and a forming method thereof, the optical fingerprint sensor module comprises: a self-luminous display panel; the optical fingerprint sensor comprises a sensor transparent substrate and a fingerprint sensing circuit layer positioned on the surface of the sensor transparent substrate, wherein the fingerprint sensing circuit layer comprises a first pixel area and a first peripheral area positioned around the first pixel area, and the fingerprint sensing circuit layer comprises a first sensing surface, and the first sensing surface is opposite to the sensor transparent substrate; a light collimator layer located between the optical fingerprint sensor and the self-luminous display panel, the light collimator layer facing a first sensing surface of a first pixel region; and the light absorption layer is positioned on the first sensing surface of the first peripheral area. The performance of the optical fingerprint sensor module is improved.
Description
Technical Field
The present disclosure relates to optical fingerprint recognition, and more particularly, to an optical fingerprint sensor module and a method for forming the same.
Background
The fingerprint imaging and identifying technology is one in which the optical fingerprint sensor collects the fingerprint image of human body and compares the image with the existing fingerprint imaging information to judge whether the image is correct or not and to identify identity. Because of its convenience in use and uniqueness of human fingerprints, fingerprint imaging recognition technology has been widely applied in various fields, such as security inspection fields of public security bureau and customs, access control systems of buildings, and consumer goods fields of personal computers and mobile phones.
The imaging mode of the fingerprint imaging recognition technology comprises various technologies such as optical imaging, capacitive imaging, ultrasonic imaging and the like. Relatively, the imaging effect of the optical fingerprint imaging identification technology is relatively good, and the equipment cost is relatively low.
However, the performance of the existing optical fingerprint sensor module needs to be improved.
Disclosure of Invention
The invention provides an optical fingerprint sensor module and a forming method thereof, which are used for improving the performance of the optical fingerprint sensor module.
In order to solve the above problems, the present invention provides an optical fingerprint sensor module, comprising: a self-luminous display panel; the optical fingerprint sensor comprises a sensor transparent substrate and a fingerprint sensing circuit layer positioned on the surface of the sensor transparent substrate, wherein the fingerprint sensing circuit layer comprises a first pixel area and a first peripheral area positioned around the first pixel area, and the fingerprint sensing circuit layer comprises a first sensing surface, and the first sensing surface is opposite to the sensor transparent substrate; a light collimator layer located between the optical fingerprint sensor and the self-luminous display panel, the light collimator layer facing a first sensing surface of a first pixel region; and the light absorption layer is positioned on the first sensing surface of the first peripheral area.
Optionally, the method further comprises: and a first adhesive layer positioned between the light collimator layer and the optical fingerprint sensor, the first adhesive layer being in contact with the first sensing surface of the first pixel region and not in contact with the first sensing surface of the first peripheral region.
Optionally, the first adhesive layer includes a first adhesive central region and a first adhesive edge region located around the first adhesive central region; the first pixel area comprises a first pixel central area and a first pixel edge area positioned around the first pixel central area; the first bonding center area is in contact with the first sensing surface of the first pixel center area and is not in contact with the first sensing surface of the first pixel edge area; the light absorbing layer also extends between the first bonding edge region and the first pixel edge region.
Optionally, the width of the first pixel edge area is greater than or equal to 0.5 mm and less than or equal to 2 mm.
Optionally, the light absorbing layer also covers the entire sidewall of the first adhesive layer.
Optionally, the light collimator layer is in contact with the first sensing surface of the first pixel region.
Optionally, the light absorbing layer also covers the sidewalls of the light collimator layer.
Optionally, the method further comprises: a second adhesive layer between the self-luminous display panel and the light collimator layer; the light absorbing layer covers the entire sidewall of the light collimator layer and the entire sidewall of the second adhesive layer.
Optionally, the light absorbing layer further covers a sidewall of the sensor light-transmitting substrate and a sidewall of the fingerprint sensing circuit layer.
Optionally, the light absorbing layer is made of epoxy resin, silica gel or ink.
Optionally, the color of the light absorbing layer is black.
Optionally, the absorptivity of the light absorption layer to light with the wavelength of 400-900 nanometers is more than 90%.
Optionally, the light absorbing layer has a bottom contact area with the first sensing surface of the first peripheral region; the bottom contact area is in an annular structure; the width of the annular structure is more than 0.5 mm.
Optionally, the material of the sensor transparent substrate is glass or a PI substrate.
The invention also provides a method for forming any one of the optical fingerprint sensor modules, which comprises the following steps: providing a self-luminous display panel; the method comprises the steps that a sensing collimation module is formed, the sensing collimation module comprises an optical fingerprint sensor and a light collimator layer positioned on the surface of the optical fingerprint sensor, the optical fingerprint sensor comprises a sensor transparent substrate and a fingerprint sensing circuit layer positioned on the surface of the sensor transparent substrate, the fingerprint sensing circuit layer is positioned between the sensor transparent substrate and the light collimator layer, the fingerprint sensing circuit layer comprises a first pixel area and a first peripheral area positioned around the first pixel area, the fingerprint sensing circuit layer comprises a first sensing surface, the first sensing surface faces away from the sensor transparent substrate, and the first sensing surface of the first pixel area faces towards the light collimator layer; forming a light absorption layer, wherein the light absorption layer is positioned on a first sensing surface of the first peripheral area; the self-luminous display panel and the light collimator layer are bonded together.
Optionally, the sensing collimation module further includes: a first adhesive layer between the light collimator layer and the optical fingerprint sensor, the first adhesive layer being in contact with the first sensing surface of the first pixel region and not in contact with the first sensing surface of the first peripheral region; the method for forming the sensing collimation module comprises the following steps: providing an optical fingerprint sensor and a light collimator layer; the first sensing surface of the first pixel area and the light collimator layer are bonded together using a first bonding layer.
Optionally, the first adhesive layer includes a first adhesive central region and a first adhesive edge region located around the first adhesive central region; the first pixel area comprises a first pixel central area and a first pixel edge area positioned around the first pixel central area; the first bonding center area is in contact with the first sensing surface of the first pixel center area and is not in contact with the first sensing surface of the first pixel edge area; the light absorbing layer also extends between the first bonding edge region and the first pixel edge region; the light absorbing layer includes a first light absorbing layer; before the first sensing surface of the first pixel area and the light collimator layer are bonded together by adopting a first bonding layer, a first light absorption layer is formed on the first sensing surface of the first peripheral area, and the first light absorption layer extends to the first sensing surface of the first pixel edge area; after the first light absorption layer is formed, the first sensing surface of the first pixel central area, the light collimator layer, part of the first light absorption layer and the light collimator layer are respectively bonded together by adopting a first bonding layer.
Optionally, after the sensing collimation module is formed, a light absorption layer is formed on the first sensing surface of the first peripheral area.
Optionally, the light absorbing layer is formed after bonding the self-luminous display panel and the light collimator layer together; or after the light absorbing layer is formed, bonding the self-luminous display panel and the light collimator layer together.
Compared with the prior art, the technical scheme of the invention has the following advantages:
In the optical fingerprint sensor module provided by the technical scheme of the invention, the optical fingerprint sensor comprises the sensor light-transmitting substrate, so that the cost of the optical fingerprint sensor can be reduced. The optical fingerprint sensor module comprises a light absorption layer, wherein the light absorption layer is positioned on the first sensing surface of the first peripheral area and covers the first sensing surface of the first peripheral area. The light absorption layer is used for absorbing external light rays which are incident towards the first sensing surface of the first peripheral area around the light collimator layer, so that the external light rays are blocked from being incident into the sensor transparent substrate and then reflected or scattered to the first sensing surface of the first pixel area, the optical interference of the external light rays on the photosensitive devices in the first pixel area is reduced, and the pattern quality of the optical fingerprint sensor is improved.
Further, the optical fingerprint sensor module further includes: a first adhesive layer between the light collimator layer and the optical fingerprint sensor. The light absorbing layer also covers the entire sidewall of the first adhesive layer. The light absorption layer absorbs light incident to the side wall of the first bonding layer, the light absorption layer can not only block light from directly entering the first pixel area from the side wall of the first bonding layer, but also block light from entering the light-transmitting substrate of the sensor from the side wall of the first bonding layer and then being reflected or scattered to the first sensing surface of the first pixel area, so that optical interference of external light to a photosensitive device in the first pixel area is reduced, and the pattern quality of the optical fingerprint sensor is improved.
Further, the light absorption layer also extends to the position between the first bonding edge area and the first pixel edge area, so that the light absorption layer absorbs light incident from the side wall of the first bonding layer to the first pixel area, the light absorption layer can not only block light incident from the side wall of the first bonding layer to the first pixel area, but also block light incident into the light-transmitting substrate of the sensor and then reflected or scattered to the first sensing surface of the first pixel area, thus reducing optical interference of external light on photosensitive devices in the first pixel area, and improving the pattern quality of the optical fingerprint sensor.
And secondly, the thickness of the light absorption layer is not required to be very thick, and the light absorption layer can be thinner, so that the process difficulty and the cost of the light absorption layer are reduced.
Further, the light absorption layer also covers the side wall of the light collimator layer, so that the light absorption layer can better surround the first bonding layer, external light cannot directly enter the first bonding layer from the upper side and then enter the first pixel region, signals which do not carry fingerprint information are avoided, and optical interference of external light to photosensitive devices in the first pixel region is reduced.
Further, a second adhesive layer is provided between the self-luminous display panel and the light collimator layer; the light absorbing layer covers the entire sidewall of the light collimator layer and the entire sidewall of the second adhesive layer. Benefits include: the light collimator can prevent external light from entering the light collimator through the second bonding layer, so that the external light is prevented from entering the photosensitive device of the optical sensor, signals which do not carry fingerprint information are prevented from being generated, and optical interference of the external light on the photosensitive device in the first pixel area is reduced.
Further, the light absorption layer also covers the side wall of the sensor light-transmitting substrate and the side wall of the fingerprint sensing circuit layer. The light absorption layer can prevent external light from entering the substrate of the optical sensor directly from the side wall of the sensor light-transmitting substrate and the side wall of the fingerprint sensing circuit layer through the light collimator layer, so that the light is prevented from being reflected and scattered and then enters the first sensing surface of the first pixel area, signals which do not carry fingerprint information are prevented from being generated, and optical interference of the external light to photosensitive devices in the first pixel area is reduced.
Drawings
FIG. 1 is a schematic diagram of an optical fingerprint sensor module;
FIGS. 2-11 are schematic diagrams illustrating a process of forming an optical fingerprint sensor module according to an embodiment of the invention;
Fig. 12 to 14 are schematic structural views illustrating a process of forming an optical fingerprint sensor module according to another embodiment of the invention.
Detailed Description
As described in the background, the optical fingerprint sensor module of the prior art has poor performance.
An optical fingerprint sensor module, referring to fig. 1, comprising: a self-luminous display panel 130; an optical fingerprint sensor 100; a light collimator layer 120 located between the optical fingerprint sensor 100 and the self-luminous display panel 130.
The optical fingerprint sensor 100 includes a sensor transparent substrate and a fingerprint sensing circuit layer on a surface of the sensor transparent substrate. The fingerprint sensing circuit layer comprises a first pixel area and a first peripheral area positioned around the first pixel area. The sensor transparent substrate is made of glass or PI plastic, so that the cost of the optical fingerprint sensor 100 can be reduced. The light collimator layer 120 is in contact with the first pixel region.
The role of the first peripheral zone includes: the surface of a partial region of the first peripheral region needs to be provided with an anisotropic conductive film, and the fingerprint sensing circuit layer is connected with an external driving circuit through the anisotropic conductive film.
Since the light collimator layer 120 is disposed between the self-luminous display panel 130 and the optical fingerprint sensor 100, there is a certain space between the self-luminous display panel 130 and the first peripheral region of the optical fingerprint sensor 100. Light rays (such as light ray c) around the light collimator layer 120 pass through the first peripheral region and enter the sensor transparent substrate, and then pass upward through the region between adjacent photosensitive pixels after being reflected or scattered by the sensor transparent substrate to reach the light collimator layer 120, and then are reflected by the light collimator layer 120 downward to reach the photosensitive pixels in the fingerprint sensing circuit layer, so that the photosensitive pixels generate signals which do not carry fingerprint information, and external light rays cause optical interference to the photosensitive pixels in the first pixel region.
Secondly, the optical fingerprint sensor module still includes: a first adhesive layer 110 between the light-collimator layer 120 and the optical fingerprint sensor 100. The first adhesive layer 110 is in contact with the surface of the first pixel region facing the light collimator layer 120. Accordingly, in order to avoid that the first adhesive layer 110 blocks light incident from the self-luminous display panel 130 to the optical fingerprint sensor 100, the material of the first adhesive layer 110 needs to be a light-transmitting material.
Light around the side of the optical fingerprint sensor module irradiates the side of the first adhesive layer 110, and further irradiates the pixels of the first pixel area of the optical fingerprint sensor 100 (such as light a in fig. 1), which causes light interference to the pixels of the optical fingerprint sensor 100 and reduces the pattern effect. Next, when the light irradiated to the side portion of the first adhesive layer 110 is incident into the sensor transparent substrate (such as the light b in fig. 1), the light b is reflected or scattered, and then passes upward through the area between the adjacent photosensitive pixels after being reflected or scattered by the sensor transparent substrate to reach the light collimator layer 120, and then is reflected by the light collimator layer 120 to reach the photosensitive pixels downward, so that light interference is caused to the pixels in the optical fingerprint sensor 100, and the graphic effect is reduced.
On the basis, the invention provides an optical fingerprint sensor module, which comprises: a self-luminous display panel; the optical fingerprint sensor comprises a sensor transparent substrate and a fingerprint sensing circuit layer positioned on the surface of the sensor transparent substrate, wherein the fingerprint sensing circuit layer comprises a first pixel area and a first peripheral area positioned around the first pixel area, and the fingerprint sensing circuit layer comprises a first sensing surface, and the first sensing surface is opposite to the sensor transparent substrate; a light collimator layer located between the optical fingerprint sensor and the self-luminous display panel, the light collimator layer facing a first sensing surface of a first pixel region; and the light absorption layer is positioned on the first sensing surface of the first peripheral area. The performance of the optical fingerprint sensor module is improved.
In order that the above objects, features and advantages of the invention will be readily understood, a more particular description of the invention will be rendered by reference to specific embodiments thereof which are illustrated in the appended drawings.
The context in this specification is defined by placing the optical fingerprint sensor module under the eyes of the user. When the optical fingerprint sensor module is placed under the eyes of the user and the display surface of the self-luminous display panel faces upward, if one structure is said to be located above the other structure, it is said that this structure is closer to the eyes of the user than the other structure, which is described together.
Fig. 2 to 11 are schematic structural views illustrating a process of forming an optical fingerprint sensor module according to an embodiment of the invention.
Referring to fig. 2, a self-luminous display panel 200 is provided.
The self-luminous display panel 200 includes a first light-transmitting substrate 201, a second light-transmitting substrate 202, and a self-luminous circuit layer 203. The self-luminous circuit layer 203 is located between the first light-transmitting substrate 201 and the second light-transmitting substrate 202. The material of the first light-transmitting substrate 201 and the second light-transmitting substrate 202 may be a light-transmitting material, specifically, inorganic glass or organic glass, or may be other plastic products other than organic glass, such as a plastic substrate, where the plastic substrate includes a PI substrate or a PET substrate.
The self-light emitting circuit layer 203 includes a plurality of display pixel units 2031. In fig. 2, the area where the plurality of display pixel units 2031 are located and the adjacent relationship of the respective display pixel units 2031 are illustrated by a dashed box. Note that, although the dashed-line frame includes part of the first light-transmitting substrate 201 and the second light-transmitting substrate 202, this is only for convenience of display, and the display pixel unit 2031 does not include the first light-transmitting substrate 201 and the second light-transmitting substrate 202.
In this embodiment, the self-luminous display panel 200 is an OLED display panel, and correspondingly, the display pixel unit 2031 includes structures such as an anode layer, a Hole Injection Layer (HIL), an emitting layer (EML), an Electron Injection Layer (EIL), and a cathode layer, and the display pixel unit 2031 may further include structures such as a Hole Transport Layer (HTL) and an Electron Transport Layer (ETL), and the display pixel unit 2031 further includes structures such as a TFT for driving an OLED, a driving metal line, and a storage capacitor.
Next, a sensing collimation module is formed, the sensing collimation module comprising an optical fingerprint sensor and a light collimator layer positioned on the surface of the optical fingerprint sensor.
Referring to fig. 3, an optical fingerprint sensor 210 is provided, the optical fingerprint sensor 210 includes a sensor transparent substrate 211 and a fingerprint sensing circuit layer 212 disposed on a surface of the sensor transparent substrate 211, the fingerprint sensing circuit layer 212 includes a first pixel region 210A and a first peripheral region 210B disposed around the first pixel region 210A, the fingerprint sensing circuit layer 212 includes a first sensing surface 2110, and the first sensing surface 2110 faces away from the sensor transparent substrate 211.
The roles of the first peripheral region 210B include: the surface of a partial region of the first peripheral region 210B needs to be provided with an anisotropic conductive film through which the fingerprint sensing circuit layer 212 is connected to an external driving circuit.
The material of the sensor transparent substrate 211 may be glass or PI substrate. The light transmittance of the sensor light-transmitting substrate 211 to visible light is greater than 50%, and the light transmittance of the sensor light-transmitting substrate 211 to ultraviolet light is greater than 20%.
Compared with other plastic substrates, the PI substrate has good heat resistance and good stability.
The sensor transparent substrate 211 has a lower cost than a substrate made of silicon-based material, and can reduce the cost of the optical fingerprint sensor 210.
The fingerprint sensing circuit layer 212 (see fig. 4) comprises a first non-light transmissive region and a first light transmissive region 2123. The fingerprint sensing circuit layer 212 comprises a signal line 21, a driving line 22 and a photosensitive pixel array, wherein the photosensitive pixel array comprises a plurality of photosensitive pixel units. Wherein each photosensitive pixel unit includes a signal control switch 2121, a photosensitive device 2122, and a first light-transmitting region 2123. The signal control switch 2121 and the light sensing device 2122 are both opaque, the first opaque region includes the signal control switch 2121 and the light sensing device 2122, and the first light transmitting region 2123 is a region other than the signal line 21, the driving line 22, the signal control switch 2121 and the light sensing device 2122.
The first non-light-transmitting area has a light transmittance of more than 50% for visible light and a light transmittance of more than 20% for ultraviolet light.
Referring to fig. 5-8 in combination, a light-collimator layer 230 is provided.
The light-collimator layer 230 has opposite first and second collimation surfaces, which are parallel, and the light-collimator layer 230 includes a plurality of light-collimating units 231, and the extending direction of the light-collimating units 231 is perpendicular to the first and second collimation surfaces.
Fig. 6 is a top view of the light-collimator layer 230 of fig. 5, fig. 7 is a side view of the light-collimator layer 230 of fig. 5, fig. 8 is a top view of the light-collimator unit 231, and one of the light-collimator units 231 is selected for distinguishing and displaying by a dashed frame in fig. 6 and 7.
The light collimator layer 230 serves to collimate the light transmitted through the self-luminous display panel 200.
In this embodiment, each light collimating unit 231 has a core layer 2311 and a skin layer 2312 surrounding the core layer 2311. The light-collimating layer 230 mainly uses the core layer 2311 to pass light, and the skin layer 2312 is used to absorb light, and the core layer 2311 and the skin layer 2312 cooperate to achieve the light-collimating effect.
In this embodiment, the lower the absorption rate of visible light and infrared light by the core layer 2311 is, the better. To ensure that the intensity of light passing through light-collimator layer 230 is sufficient, core layer 2311 is selected to have an absorptivity of <10% for visible and infrared light. In addition, the lower the ultraviolet light absorption rate of the core layer 2311 is, the better the subsequent adhesion is taken into consideration. In this embodiment, the transmittance of the core layer 2311 to visible light is greater than 50%, and the transmittance of the core layer 2311 to ultraviolet light is greater than 20%. The higher the absorptivity of visible light and infrared light is, the better the cortex 2312 is, so that light outside a specific angle is absorbed. To ensure effective absorption of the respective light rays, the absorption rate of the skin 2312 for visible and infrared light is selected to be >50%.
Light obliquely incident to light-collimator layer 230 is not significantly reflected at the interface between core layer 2311 and skin layer 2312 of the light-collimating fiber, is less totally reflected, and is incident from core layer 2311 into skin layer 2312 and absorbed by skin layer 2312. Thus, light rays having a smaller angle with respect to the first and second collimation surfaces of the light collimator layer 230 are absorbed by the skin layer 2312 after passing through the skin layer 2312 one or more times, and light rays having a larger angle with respect to the first and second collimation surfaces of the light collimator layer 230 can pass completely through one core layer 2311. For example, the angles between the light rays passing through the light collimator layer 230 and the first collimating surface and the second collimating surface are respectively close to 90 degrees (e.g., 80 degrees to 90 degrees), and the light rays in other angles are absorbed by the self-luminous display panel 200. In summary, the light collimator layer 230 can collimate the light transmitted through the self-luminous display panel 200. The collimating effect of the light collimator layer 230 on the light helps to improve the fingerprint recognition performance of the optical fingerprint sensor.
In other embodiments, the light-collimator layer 230 is a flexible collimator.
Referring to fig. 9, the optical fingerprint sensor 210 and the light collimator layer 230 are bonded together using a first adhesive layer 240, and in particular, the first sensing surface 2110 of the first pixel region 210A and the light collimator layer 230 are bonded together using the first adhesive layer 240.
The fingerprint sensing circuit layer 212 is located between the sensor transparent substrate 211 and the light collimator layer 230, and the first sensing surface 2110 of the first pixel area 210A faces the light collimator layer 230.
The first adhesive layer 240 is in contact with the first sensing surface 2110 of the first pixel region 210A and is not in contact with the first sensing surface 2110 of the first peripheral region 210B.
In this embodiment, the material of the first adhesive layer 240 is transparent.
In this embodiment, the thickness of the first adhesive layer 240 is 0.05 mm to 0.12 mm.
The sensing collimation module further comprises: a first adhesive layer 240 between the light collimator layer 230 and the optical fingerprint sensor 210, the first adhesive layer 240 being in contact with the first sensing surface 2110 of the first pixel region 210A and not in contact with the first sensing surface 2110 of the first peripheral region 210B.
Referring to fig. 10, the self-luminous display panel 200 and the light collimator layer 230 are bonded together.
In this embodiment, the self-luminous display panel 200 and the light collimator layer 230 are bonded together using the second adhesive layer 250.
Referring to fig. 11, a light absorbing layer 260 is formed, the light absorbing layer 260 being located on the first sensing surface 2110 of the first peripheral region 210B.
The light absorbing layer 260 covers the first sensing surface 2110 of the first peripheral region 210B. The light absorbing layer 260 is configured to absorb the external light incident on the first sensing surface 2110 of the first peripheral area 210B around the light collimator layer 230, and further block the external light from being incident on the sensor transparent substrate 211 and then reflected or scattered to the first sensing surface of the first pixel area 210A, so as to reduce the optical interference of the external light to the photosensitive device 2122 in the first pixel area 210A, and improve the pattern quality of the optical fingerprint sensor.
In this embodiment, after the sensing collimation module is formed, the light absorbing layer 260 is formed on the first sensing surface 2110 of the first peripheral area 210B.
In this embodiment, after the self-luminous display panel 200 and the light collimator layer 230 are bonded together, the light absorbing layer 260 is formed.
In other embodiments, the self-emissive display panel and the light collimator layer are bonded together after the light absorbing layer is formed.
In this embodiment, the light absorbing layer 260 also covers the entire sidewall of the first adhesive layer 240. The light absorption layer 260 absorbs light incident to the side wall of the first adhesive layer 240, and the light absorption layer 260 can not only block light from directly entering the first pixel region 210A from the side wall of the first adhesive layer 240, but also block light from entering the sensor transparent substrate 211 from the side wall of the first adhesive layer 240 and then being reflected or scattered into the first pixel region 210A, so that optical interference of external light to the photosensitive device 2122 in the first pixel region 210A is reduced, and the pattern quality of the optical fingerprint sensor is improved.
In other embodiments, the light absorbing layer covers the sidewall of the first adhesive layer portion thickness.
In this embodiment, the light absorbing layer 260 also covers the sidewalls of the light collimator layer 230, in particular, the light absorbing layer 260 covers the entire sidewalls or a portion of the sidewalls of the light collimator layer 230. Therefore, the light absorbing layer 260 can better surround the first adhesive layer 240, so that external light cannot directly enter the first adhesive layer 240 from above and then enter the first pixel region 210A, signals which do not carry fingerprint information are avoided, and optical interference of external light to the photosensitive device 2122 in the first pixel region 210A is reduced.
In other embodiments, the light absorbing layer does not cover the sidewalls of the light collimator layer.
In other embodiments, the light absorbing layer also covers the entire sidewall of the light collimator layer and the entire sidewall of the second adhesive layer, benefits including: external light can be prevented from entering the light collimator through the second bonding layer, the light receiving device of the optical sensor is prevented from entering, signals which do not carry fingerprint information are prevented from being generated, and the external light is prevented from causing optical interference to the light receiving device in the first pixel area.
In other embodiments, the light absorbing layer also covers the sidewalls of the sensor light transmissive substrate and the sidewalls of the fingerprint sensing circuit layer. The light absorption layer can prevent external light from entering the substrate of the optical sensor directly from the side wall of the sensor light-transmitting substrate and the side wall of the fingerprint sensing circuit layer through the light collimator layer, so that the light is prevented from being reflected and scattered and then enters the photosensitive device 2122 of the optical sensor, signals which do not carry fingerprint information are prevented from being generated, and optical interference of the external light to pixel devices in the first pixel area is reduced.
The material of the light absorbing layer 260 is epoxy, silica gel or ink.
The light absorbing layer 260 is black in color.
The absorbance of the light absorbing layer 260 with respect to light having a wavelength of 400 nm to 900 nm is 90% or more. The light of 400-900 nanometers is the light which is more sensitive to the fingerprint sensing circuit layer.
In this embodiment, the light absorbing layer 260 has a bottom contact area with the first sensing surface 2110 of the first peripheral region 210B; the bottom contact area is in an annular structure; the width W of the annular structure is more than 0.5 mm. If the width W of the ring-shaped structure is less than 0.5mm, the light-absorbing layer 260 may have an insufficient effect of blocking light.
In other embodiments, the light absorbing layer is formed on the first sensing surface of the first peripheral region after the optical fingerprint sensor and the light collimator layer are bonded together by the first adhesive layer, and then the self-luminous display panel and the light collimator layer are bonded together. In this case, the light absorbing layer is located at the first sensing surface of the first peripheral region, and covers the sidewall of the first adhesive layer, the light absorbing layer covers the entire sidewall of the first adhesive layer, and the light absorbing layer does not cover the second adhesive layer. The light absorbing layer may also cover the entire side wall or part of the side wall of the light collimator layer. The light absorption layer can also cover the side wall of the sensor light-transmitting substrate and the side wall of the fingerprint sensing circuit layer.
It should be noted that, in other embodiments, the sensing collimation module includes an optical fingerprint sensor and a light collimator layer located on a surface of the optical fingerprint sensor, where the light collimator layer is in contact with the first sensing surface of the first pixel area and is not in contact with the first peripheral area, and the light collimator layer is a flexible collimator. The method for forming the sensing collimation module comprises the following steps: providing an optical fingerprint sensor; a light collimator layer is formed on the first sensing surface of the first pixel region. Accordingly, there is no first adhesive layer between the optical fingerprint sensor and the light collimator layer, and the light absorbing layer does not cover the first adhesive layer.
Correspondingly, the embodiment also provides an optical fingerprint sensor module formed by adopting the method, referring to fig. 11, including: a self-luminous display panel 200; an optical fingerprint sensor 210, the optical fingerprint sensor includes a sensor transparent substrate 211 and a fingerprint sensing circuit layer 212 located on a surface of the sensor transparent substrate 211, the fingerprint sensing circuit layer 212 includes a first pixel region 210A and a first peripheral region 210B located around the first pixel region 210A, the fingerprint sensing circuit layer 212 includes a first sensing surface 2110, and the first sensing surface 2110 faces away from the sensor transparent substrate 211; a light collimator layer 230 positioned between the optical fingerprint sensor 210 and the self-luminous display panel 200, the light collimator layer 230 facing the first sensing surface 2110 of the first pixel region 210A; the light absorbing layer 260, the light absorbing layer 260 is located on the first sensing surface 2110 of the first peripheral region 210B.
In this embodiment, the optical fingerprint sensor module further includes: the first adhesive layer 240 is located between the light collimator layer 230 and the optical fingerprint sensor 210, and the first adhesive layer 240 is in contact with the first sensing surface 2110 of the first pixel region 210A and is not in contact with the first sensing surface 2110 of the first peripheral region 210B.
In this embodiment, the light absorbing layer 260 covers the entire sidewall of the first adhesive layer 240.
In this embodiment, the light absorbing layer 260 also covers the sidewalls of the light collimator layer 230.
The optical fingerprint sensor module further includes: a second adhesive layer 250 between the self-luminous display panel 200 and the light collimator layer 230.
In other embodiments, the light absorbing layer covers the entire sidewall of the light collimator layer 230 and the entire sidewall of the second adhesive layer 250.
In other embodiments, the light absorbing layer also covers the sidewalls of the sensor light transmissive substrate and the sidewalls of the fingerprint sensing circuit layer.
The material of the light absorbing layer 260 is epoxy, silica gel or ink.
The light absorbing layer 260 is black in color.
The absorbance of the light absorbing layer 260 with respect to light having a wavelength of 400nm to 900 nm is 90% or more.
The light absorbing layer 260 has a bottom contact area with the first sensing surface 2110 of the first peripheral region 210B; the bottom contact area is in an annular structure; the width of the annular structure is more than 0.5 mm.
The fingerprint sensing circuit layer 212 is located between the sensor transparent substrate 211 and the light collimator layer 230.
The sensor transparent substrate 211 is made of glass or a PI substrate.
It should be noted that, in other embodiments, the light collimator layer is in contact with the first sensing surface of the first pixel area and not in contact with the first peripheral area, and the light collimator layer is a flexible collimator. Accordingly, there is no first adhesive layer between the optical fingerprint sensor and the light collimator layer, and the light absorbing layer does not cover the first adhesive layer.
Another embodiment of the present invention further provides a method for forming an optical fingerprint sensor module, which is different from the previous embodiment in that: the first adhesive layer comprises a first adhesive central region and a first adhesive edge region positioned around the first adhesive central region; the first pixel area comprises a first pixel central area and a first pixel edge area positioned around the first pixel central area; the first bonding center area is in contact with the first sensing surface of the first pixel center area and is not in contact with the first sensing surface of the first pixel edge area; the light absorbing layer also extends between the first bonding edge region and the first pixel edge region; the light absorbing layer includes a first light absorbing layer; forming a first light absorbing layer on a first sensing surface of the first peripheral region before bonding the optical fingerprint sensor and the light collimator layer together, the first light absorbing layer extending to a portion of the first sensing surface of the first pixel edge region; after the first light absorption layer is formed, the first sensing surface of the first pixel central area, the light collimator layer, part of the first light absorption layer and the light collimator layer are respectively bonded together by adopting a first bonding layer. The same contents as those of the previous embodiment are not described in detail.
Fig. 12 to 14 are schematic structural views illustrating a process of forming an optical fingerprint sensor module according to another embodiment of the invention.
The steps in this embodiment are all performed on the basis of fig. 2 to 8.
Referring to fig. 12, a first light absorbing layer 360 is formed on the first sensing surface 2110 of the first peripheral region 210B, and the first light absorbing layer 360 extends to the first sensing surface 2110 of the first pixel edge region.
The material, color and absorptivity of the first light absorbing layer 360 refer to the previous embodiment.
The first light absorbing layer 360 and the first sensing surface 2110 of the first peripheral region 210B have a bottom contact area, and the size of the bottom contact area refers to the size of the bottom contact area in the previous embodiment.
The width of the first pixel edge area is greater than or equal to 0.5 mm and less than or equal to 2 mm.
The first pixel edge area is an area of the first pixel area where the first light absorbing layer 360 is bonded.
If the width of the first pixel edge area is greater than 2mm, the area of the first pixel area designed for bonding with the first light absorbing layer 360 is too large, resulting in blocking of light in the light collimator layer by the first light absorbing layer 360, and if the width of the first pixel edge area is less than 0.5 mm, the size of the first light absorbing layer 360 extending to the first pixel area is smaller, and blocking of light incident from the side wall of the first bonding layer by the first light absorbing layer 360 is poor.
Referring to fig. 13, after the first light absorbing layer 360 is formed, the optical fingerprint sensor 210 and the light collimator layer 230 are bonded together using the first adhesive layer 340, and in particular, the first sensing surface of the first pixel center region and the light collimator layer 230, and a portion of the first light absorbing layer 360 and the light collimator layer are bonded together using the first adhesive layer 340, respectively.
The first light absorbing layer 360 is located on the first sensing surface 2110 of the first peripheral region 210B, and the first light absorbing layer 360 covers the sidewall of the first adhesive layer 340.
The first adhesive layer 340 includes a first adhesive central region and a first adhesive edge region located around the first adhesive central region; the first pixel area comprises a first pixel central area and a first pixel edge area positioned around the first pixel central area; the first bonding center area is in contact with the first sensing surface of the first pixel center area and is not in contact with the first sensing surface of the first pixel edge area; the first light absorbing layer 360 also extends between the first bonding edge region and the first pixel edge region.
Referring to fig. 14, the self-luminous display panel 200 and the light collimator layer 230 are bonded together.
In this embodiment, the self-luminous display panel 200 and the light collimator layer 230 are bonded together using the second adhesive layer 350.
In this embodiment, after the optical fingerprint sensor 210 and the light collimator layer 230 are bonded together using the first adhesive layer 340, the self-luminous display panel 200 and the light collimator layer 230 are bonded together using the second adhesive layer 350.
In other embodiments, the self-luminous display panel 200 and the light collimator layer 230 are bonded together using the second adhesive layer to form the first light absorbing layer, and then the optical fingerprint sensor 210 and the light collimator layer 230 are bonded together using the first adhesive layer; or after the first light absorbing layer is formed, the self-luminous display panel 200 and the light collimator layer 230 are bonded together using the second adhesive layer, and then the optical fingerprint sensor 210 and the light collimator layer 230 are bonded together using the first adhesive layer.
In this embodiment, the light absorbing layer includes only the first light absorbing layer 360.
In other embodiments, after the optical fingerprint sensor 210 and the light collimator layer 230 are bonded together using the first adhesive layer 340, a second light absorbing layer is formed, the second light absorbing layer covers the sidewalls of the light collimator layer and a portion of the sidewalls of the first adhesive layer, and the first light absorbing layer 360 and the second light absorbing layer cover all of the sidewalls of the first adhesive layer. The second light-absorbing layer and the first light-absorbing layer 360 constitute the total light-absorbing layer.
In other embodiments, after the optical fingerprint sensor 210 and the light collimator layer 230 are bonded together using the first adhesive layer 340, and after the self-luminous display panel 200 and the light collimator layer 230 are bonded together using the second adhesive layer, a second light absorbing layer is formed, the second light absorbing layer covers the sidewalls of the light collimator layer and a portion of the sidewalls of the first adhesive layer, and the first light absorbing layer and the second light absorbing layer entirely cover the sidewalls of the first adhesive layer. The second light absorbing layer may also cover the sidewalls of the second adhesive layer. The second light-absorbing layer and the first light-absorbing layer constitute the total light-absorbing layer.
In other embodiments, it may further include: and forming a third light absorption layer on the side wall of the sensor light-transmitting substrate and the side wall of the fingerprint sensing circuit layer. The first light absorbing layer, the second light absorbing layer, and the third light absorbing layer constitute a total light absorbing layer.
Correspondingly, the embodiment also provides an optical fingerprint sensor module formed by adopting the method, please refer to fig. 14, which includes: a self-luminous display panel 200; an optical fingerprint sensor 210, the optical fingerprint sensor including a sensor transparent substrate and a fingerprint sensing circuit layer on a surface of the sensor transparent substrate, the optical fingerprint sensor 210 including a first pixel region 210A and a first peripheral region 210B around the first pixel region 210A, the optical fingerprint sensor 210 including a first sensing surface 2110 facing away from the sensor transparent substrate; a light collimator layer 230 positioned between the optical fingerprint sensor 210 and the self-luminous display panel 200, the light collimator layer 230 facing the first sensing surface of the first pixel region; a first adhesive layer 340 between the light-collimator layer 230 and the optical fingerprint sensor 210, the first adhesive layer 340 being in contact with the first sensing surface of the first pixel region 210A and not in contact with the first sensing surface of the first peripheral region 210B; the first adhesive layer comprises a first adhesive central region and a first adhesive edge region positioned around the first adhesive central region; the first pixel area comprises a first pixel central area and a first pixel edge area positioned around the first pixel central area; the first bonding center area is in contact with the first sensing surface of the first pixel center area and is not in contact with the first sensing surface of the first pixel edge area; a light absorbing layer located on the first sensing surface 2110 of the first peripheral region 210B, the light absorbing layer also extending between the first bonding edge region and the first pixel edge region. The material, color and absorptivity of the light absorbing layer are all as described in the previous embodiment.
The light absorbing layer and the first sensing surface 2110 of the first peripheral region 210B have a bottom contact area, the size of which is in accordance with the previous embodiment.
In this embodiment, the light-absorbing layer includes only the first light-absorbing layer 360, the first light-absorbing layer 360 is located on the first sensing surface 2110 of the first peripheral region 210B, and the first light-absorbing layer 360 covers the sidewall of the first adhesive layer 340, and the first light-absorbing layer 360 further extends between the first adhesive edge region and the first pixel edge region.
The width of the first pixel edge area is greater than or equal to 0.5 mm and less than or equal to 2 mm.
In other embodiments, the light absorbing layer comprises only a first light absorbing layer 360 and a second light absorbing layer, the second light absorbing layer covering the sidewalls of the light collimator layer and a portion of the sidewalls of the first bonding layer, the first light absorbing layer and the second light absorbing layer covering the sidewalls of the first bonding layer entirely.
The optical fingerprint sensor module further includes: a second adhesive layer between the self-luminous display panel 200 and the light collimator layer 230.
In other embodiments, the second light absorbing layer covers the sidewalls of the light collimator layer and a portion of the sidewalls of the first adhesive layer, the first light absorbing layer and the second light absorbing layer entirely cover the sidewalls of the first adhesive layer, and the second light absorbing layer also covers the sidewalls of the second adhesive layer.
In other embodiments, the light absorbing layers include only the first light absorbing layer 360, the second light absorbing layer, and the third light absorbing layer located on the sidewall of the sensor light transmissive substrate and the sidewall of the fingerprint sensing circuit layer.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention should be assessed accordingly to that of the appended claims.
Claims (19)
1. An optical fingerprint sensor module, comprising:
A self-luminous display panel;
The optical fingerprint sensor comprises a sensor transparent substrate and a fingerprint sensing circuit layer positioned on the surface of the sensor transparent substrate, wherein the fingerprint sensing circuit layer comprises a first pixel area and a first peripheral area positioned around the first pixel area, and the fingerprint sensing circuit layer comprises a first sensing surface, and the first sensing surface is opposite to the sensor transparent substrate;
A light collimator layer located between the optical fingerprint sensor and the self-luminous display panel, the light collimator layer facing a first sensing surface of a first pixel region;
The light absorption layer is positioned on the first sensing surface of the first peripheral area adjacent to the first pixel area to block light from entering the sensor transparent substrate.
2. The optical fingerprint sensor module of claim 1, further comprising: and a first adhesive layer positioned between the light collimator layer and the optical fingerprint sensor, the first adhesive layer being in contact with the first sensing surface of the first pixel region and not in contact with the first sensing surface of the first peripheral region.
3. The optical fingerprint sensor module of claim 2, wherein the first adhesive layer includes a first adhesive central region and a first adhesive edge region located around the first adhesive central region; the first pixel area comprises a first pixel central area and a first pixel edge area positioned around the first pixel central area; the first bonding center area is in contact with the first sensing surface of the first pixel center area and is not in contact with the first sensing surface of the first pixel edge area; the light absorbing layer also extends between the first bonding edge region and the first pixel edge region.
4. The optical fingerprint sensor module according to claim 3, wherein the width of the first pixel edge area is greater than or equal to 0.5 mm and less than or equal to 2mm.
5. The optical fingerprint sensor module of claim 2, wherein the light absorbing layer further covers an entire sidewall of the first adhesive layer.
6. The optical fingerprint sensor module of claim 1, wherein the light collimator layer is in contact with the first sensing surface of the first pixel region.
7. The optical fingerprint sensor module of claim 5 or 6, wherein the light absorbing layer further covers sidewalls of the light collimator layer.
8. The optical fingerprint sensor module of claim 1, further comprising: a second adhesive layer between the self-luminous display panel and the light collimator layer; the light absorbing layer covers the entire sidewall of the light collimator layer and the entire sidewall of the second adhesive layer.
9. The optical fingerprint sensor module of claim 1, wherein the light absorbing layer further covers sidewalls of the sensor light transmissive substrate and sidewalls of the fingerprint sensing circuit layer.
10. The optical fingerprint sensor module of claim 1, wherein the light absorbing layer is made of epoxy, silicone, or ink.
11. The optical fingerprint sensor module of claim 1, wherein the light absorbing layer is black in color.
12. The optical fingerprint sensor module according to claim 1, wherein the absorbance of the light absorbing layer for light having a wavelength of 400 nm to 900 nm is 90% or more.
13. The optical fingerprint sensor module of claim 1, wherein the light absorbing layer has a bottom contact area with the first sensing surface of the first peripheral region; the bottom contact area is in an annular structure; the width of the annular structure is more than 0.5 mm.
14. The optical fingerprint sensor module of claim 1, wherein the sensor transparent substrate is made of glass or PI substrate.
15. A method of forming an optical fingerprint sensor module according to any one of claims 1 to 14, comprising:
Providing a self-luminous display panel;
the method comprises the steps that a sensing collimation module is formed, the sensing collimation module comprises an optical fingerprint sensor and a light collimator layer positioned on the surface of the optical fingerprint sensor, the optical fingerprint sensor comprises a sensor transparent substrate and a fingerprint sensing circuit layer positioned on the surface of the sensor transparent substrate, the fingerprint sensing circuit layer is positioned between the sensor transparent substrate and the light collimator layer, the fingerprint sensing circuit layer comprises a first pixel area and a first peripheral area positioned around the first pixel area, the fingerprint sensing circuit layer comprises a first sensing surface, the first sensing surface faces away from the sensor transparent substrate, and the first sensing surface of the first pixel area faces towards the light collimator layer;
Forming a light absorption layer, wherein the light absorption layer is positioned on a first sensing surface of a first peripheral area adjacent to the first pixel area so as to block light from entering the sensor transparent substrate;
The self-luminous display panel and the light collimator layer are bonded together.
16. The method of forming an optical fingerprint sensor module of claim 15, wherein the sensing alignment module further comprises: a first adhesive layer between the light collimator layer and the optical fingerprint sensor, the first adhesive layer being in contact with the first sensing surface of the first pixel region and not in contact with the first sensing surface of the first peripheral region;
The method for forming the sensing collimation module comprises the following steps: providing an optical fingerprint sensor and a light collimator layer; the first sensing surface of the first pixel area and the light collimator layer are bonded together using a first bonding layer.
17. The method of forming an optical fingerprint sensor module of claim 16, wherein the first adhesive layer includes a first adhesive central region and a first adhesive edge region located around the first adhesive central region; the first pixel area comprises a first pixel central area and a first pixel edge area positioned around the first pixel central area; the first bonding center area is in contact with the first sensing surface of the first pixel center area and is not in contact with the first sensing surface of the first pixel edge area; the light absorbing layer also extends between the first bonding edge region and the first pixel edge region; the light absorbing layer includes a first light absorbing layer;
before the first sensing surface of the first pixel area and the light collimator layer are bonded together by adopting a first bonding layer, a first light absorption layer is formed on the first sensing surface of the first peripheral area, and the first light absorption layer extends to the first sensing surface of the first pixel edge area; after the first light absorption layer is formed, the first sensing surface of the first pixel central area, the light collimator layer, part of the first light absorption layer and the light collimator layer are respectively bonded together by adopting a first bonding layer.
18. The method of claim 15, wherein the light absorbing layer is formed on the first sensing surface of the first peripheral region after the sensing alignment module is formed.
19. The method of forming an optical fingerprint sensor module according to claim 15, wherein the light absorbing layer is formed after bonding the self-luminous display panel and the light collimator layer together; or alternatively
After the light absorbing layer is formed, the self-luminous display panel and the light collimator layer are bonded together.
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109685047A (en) * | 2019-03-01 | 2019-04-26 | 惠科股份有限公司 | Finger print input device and display device |
| CN109829452B (en) * | 2019-03-26 | 2024-02-27 | 上海箩箕技术有限公司 | Optical fingerprint sensor module and forming method thereof |
| CN112151572B (en) * | 2019-06-28 | 2023-06-23 | 云谷（固安）科技有限公司 | Fingerprint identification display device, preparation method thereof and fingerprint identification display device |
| TWI754934B (en) * | 2019-11-12 | 2022-02-11 | 神盾股份有限公司 | Electronic device |
| CN113133323A (en) * | 2019-11-15 | 2021-07-16 | 京东方科技集团股份有限公司 | Display panel and display device |
| CN111341823B (en) * | 2020-03-16 | 2022-12-20 | 京东方科技集团股份有限公司 | Display substrate and preparation method thereof |
| CN113327953B (en) * | 2021-05-11 | 2022-09-27 | 武汉华星光电技术有限公司 | Display panel |
Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006128811A (en) * | 2004-10-26 | 2006-05-18 | Mitsumi Electric Co Ltd | Image detection apparatus and manufacturing method thereof |
| CN102629619A (en) * | 2012-04-28 | 2012-08-08 | 上海中科高等研究院 | Image sensor |
| CN202433878U (en) * | 2011-12-27 | 2012-09-12 | 深圳市三海光电技术有限公司 | Capacitive touch screen liquid crystal board module structure with lower luminous reflectance for environment |
| CN104881196A (en) * | 2015-06-23 | 2015-09-02 | 京东方科技集团股份有限公司 | Substrate and display screen |
| CN105094227A (en) * | 2015-07-10 | 2015-11-25 | 麦克思商务咨询(深圳)有限公司 | Electronic apparatus |
| CN105184248A (en) * | 2015-08-28 | 2015-12-23 | 京东方科技集团股份有限公司 | Fingerprint identification device and fingerprint identification system |
| CN105184282A (en) * | 2015-10-14 | 2015-12-23 | 京东方科技集团股份有限公司 | Optical fingerprint detection device and display equipment |
| CN107480661A (en) * | 2017-09-30 | 2017-12-15 | 苏州迈瑞微电子有限公司 | A kind of light path of optical fingerprint sensor and there is its optical fingerprint sensor |
| CN107689384A (en) * | 2016-08-05 | 2018-02-13 | 上海箩箕技术有限公司 | Display module |
| WO2018103196A1 (en) * | 2016-12-09 | 2018-06-14 | 上海箩箕技术有限公司 | Display module and usage method thereof |
| WO2018113103A1 (en) * | 2016-12-23 | 2018-06-28 | 创智能科技股份有限公司 | Biometric identification device |
| CN207611400U (en) * | 2018-01-02 | 2018-07-13 | 京东方科技集团股份有限公司 | Display device |
| CN208903279U (en) * | 2018-11-30 | 2019-05-24 | 上海箩箕技术有限公司 | Optical fingerprint sensor mould group |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2008205317A (en) * | 2007-02-21 | 2008-09-04 | Nec Electronics Corp | Solid-state imaging apparatus, method of manufacturing the same and electronic device using the same |
-
2018
- 2018-11-30 CN CN201811455701.9A patent/CN109299708B/en active Active
Patent Citations (14)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2006128811A (en) * | 2004-10-26 | 2006-05-18 | Mitsumi Electric Co Ltd | Image detection apparatus and manufacturing method thereof |
| CN202433878U (en) * | 2011-12-27 | 2012-09-12 | 深圳市三海光电技术有限公司 | Capacitive touch screen liquid crystal board module structure with lower luminous reflectance for environment |
| CN102629619A (en) * | 2012-04-28 | 2012-08-08 | 上海中科高等研究院 | Image sensor |
| CN104881196A (en) * | 2015-06-23 | 2015-09-02 | 京东方科技集团股份有限公司 | Substrate and display screen |
| CN105094227A (en) * | 2015-07-10 | 2015-11-25 | 麦克思商务咨询(深圳)有限公司 | Electronic apparatus |
| CN105184248A (en) * | 2015-08-28 | 2015-12-23 | 京东方科技集团股份有限公司 | Fingerprint identification device and fingerprint identification system |
| CN105184282A (en) * | 2015-10-14 | 2015-12-23 | 京东方科技集团股份有限公司 | Optical fingerprint detection device and display equipment |
| CN107689384A (en) * | 2016-08-05 | 2018-02-13 | 上海箩箕技术有限公司 | Display module |
| WO2018103196A1 (en) * | 2016-12-09 | 2018-06-14 | 上海箩箕技术有限公司 | Display module and usage method thereof |
| CN108227973A (en) * | 2016-12-09 | 2018-06-29 | 上海箩箕技术有限公司 | Display module and its application method |
| WO2018113103A1 (en) * | 2016-12-23 | 2018-06-28 | 创智能科技股份有限公司 | Biometric identification device |
| CN107480661A (en) * | 2017-09-30 | 2017-12-15 | 苏州迈瑞微电子有限公司 | A kind of light path of optical fingerprint sensor and there is its optical fingerprint sensor |
| CN207611400U (en) * | 2018-01-02 | 2018-07-13 | 京东方科技集团股份有限公司 | Display device |
| CN208903279U (en) * | 2018-11-30 | 2019-05-24 | 上海箩箕技术有限公司 | Optical fingerprint sensor mould group |
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