CN208893327U - Semiconductor cooling liquid device and medical Transfusion device - Google Patents
Semiconductor cooling liquid device and medical Transfusion device Download PDFInfo
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- CN208893327U CN208893327U CN201820742999.0U CN201820742999U CN208893327U CN 208893327 U CN208893327 U CN 208893327U CN 201820742999 U CN201820742999 U CN 201820742999U CN 208893327 U CN208893327 U CN 208893327U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
Abstract
It includes: shell (10) that the utility model, which provides a kind of semiconductor cooling liquid device and medical Transfusion device, semiconductor cooling liquid device,;Cooling-part (20), removably it is arranged in the shell (10) and there are flow channel for liquids (21), the both ends of the flow channel for liquids (21) are respectively formed inlet and liquid outlet, and the shell (10) is equipped with and is used to form the hatch frame for replacing the cooling-part (20) and respectively inlet and outlet corresponding with the inlet and the liquid outlet;Refrigeration part is arranged close to the cooling-part (20) and freezes to the liquid flowed into the flow channel for liquids (21).With regard to long replacement low efficiency is in turn resulted in because card slot has certain length to lead to extract and be caught in the required time when the technical solution of the utility model solves the problems, such as to replace perfusion tube in the prior art.
Description
Technical field
The utility model relates to the field of medical instrument technology, and in particular to a kind of semiconductor cooling liquid device and medical Transfusion device.
Background technique
Mild hypothermia therapy is also known as frozen sleep or artificial hibernation in clinic, it is to make patient's machine with the method for drug and physics
Temperature reduction, to achieve the purpose that treatment.Body temperature is divided by the degree of hypothermia in the world: slight body temperature 33~
35 DEG C, 28~32 DEG C of moderate body temperature and 17~27 DEG C of depth body temperature, wherein light moderate body temperature is collectively referred to as Mild Hypothermal.Research hair
Existing mild hypothermia therapy is in severe brain injury acute stage status epilepticus, massive cerebral infarction or cerebral hemorrhage, cardiopulmonary resuscitation
Afterwards encephalopathy, meningitis, hyperpyretic convulsion, neonatal hypoxic ischemic encephalopathy etc. treatment in can reduce organism metabolism rate,
The inflammatory reaction for improving cellular energy metabolism, mitigating body, to play the role of armour function.Mild hypothermia therapy includes
Drug cooling and Physical temperature-lowering two ways, wherein Physical temperature-lowering is the major measure of mild hypothermia therapy.There is studies have shown that vein
It is transfused a kind of measure of 4 DEG C of liquid as Physical temperature-lowering, since it is low with easy to operate, definite effect, few intercurrent disease, expense
The advantages that honest and clean, is often employed in mild hypothermia therapy.
Currently, usually being completed with infusion apparatus during the clinical transfusion of hospital, but existing infusion apparatus has no
Medical fluid refrigerating function.When patient needs to be transfused low temperature medical fluid, it is necessary to medical fluid is placed in refrigerator-freezer carry out the long period in advance
Cooling, then take out use.But completed in this period after being taken out from refrigerator to infusion, the temperature of medical fluid exists
Constantly change and be not easily adjustable, is unable to control and knows accurate transfusion temperature, and operate comparatively laborious, timeliness
It is relatively low.
In view of the above-mentioned problems, patent document CN105536112A discloses a kind of infusion medical fluid temperature control device, it should
Device includes heat-conducting plastic block, offers the card slot for blocking perfusion tube on heat-conducting plastic block, outside the two sides of heat-conducting plastic block
Surface is separately installed with two panels semiconductor refrigerating/heating piece, and card slot bottom is equipped with temperature sensor, conductor refrigerating/heating piece, temperature
It spends sensor and connects current controller.Perfusion tube is typically disposable, needs replacing new perfusion tube after being finished, and replaces
Need to extract old perfusion tube from card slot in the process, then new perfusion tube be caught in card slot, because card slot have it is certain
Length, it is just long to extract and be caught in the required time, replaces low efficiency.
Utility model content
The main purpose of the utility model is to provide a kind of semiconductor cooling liquid device and medical Transfusion devices, to solve existing skill
It is in turn resulted in more because card slot has certain length to lead to extract and be caught in the required time with regard to long when replacing perfusion tube in art
The problem of changing low efficiency.
To achieve the above object, the utility model provides a kind of semiconductor cooling liquid device, comprising: shell;Cooling-part, can
Replacement ground is arranged in shell and has flow channel for liquids, and the both ends of flow channel for liquids are respectively formed inlet and liquid outlet, on shell
Equipped with the hatch frame and inlet and outlet corresponding with inlet and liquid outlet respectively for being used to form replacement cooling-part;System
Cold part is arranged close to cooling-part and freezes to the liquid flowed into flow channel for liquids.
Further, there are two refrigeration part is set, two refrigeration parts are located at the opposite two sides of cooling-part, two systems
One in cold part forms the fixation member being fixed on shell, another formation in two refrigeration parts is removable
Ground is arranged in the moving parts on shell, moving parts there is the cooling position for clamping cooling-part and unclamp after cooling-part from
The replacement position of cooling-part is replaced at hatch frame.
Further, elastic component is equipped between moving parts and shell, the biasing force of elastic component applies on the moving part
So that moving parts is moved to cooling position from replacement position, moving parts apply the active force contrary with biasing force with
Moving parts is set to be moved to replacement position from cooling position.
Further, shell includes left half cabinet and half cabinet of the right side that is movably attached on left half cabinet, left half chests
Body and right half cabinet docking surround a complete cabinet, and fixation member is fixed on left half cabinet, and moving parts is fixed on the right side
On half cabinet, active force is applied on moving parts by right half cabinet.
Further, left half cabinet is connected with right half cabinet by elastic-buckle structure, and elastic component setting is in right half cabinet
Between moving parts.
Further, elastic-buckle structure includes the elastic card fastener being arranged on left half cabinet and setting in right half cabinet
Card hole upper and with the cooperation of elastic card fastener.
Further, in the form of sheets, flow channel for liquids is in bending to cooling-part.
Further, cooling-part includes: cooling piece and two sealing elements, and cooling piece, which has, runs through its opposite two sides
And sweeping channel, two sealing elements are arranged on the opposite two sides of cooling piece and sealed passage forms flow channel for liquids.
Further, cooling piece includes that the first vertical bar being oppositely arranged and the second vertical bar, one end are connected on the first vertical bar
And multiple first horizontal stripes for being freely arranged of the other end and one end are connected on the second vertical bar and the other end is freely arranged multiple
Two horizontal stripes have distance, between the free end of the second horizontal stripe and the first vertical bar between the free end of the first horizontal stripe and the second vertical bar
With distance, it is equipped with second horizontal stripe between two the first horizontal stripes, the first vertical bar, the second vertical bar, multiple first horizontal stripes and more
A second horizontal stripe surrounds forniciform channel.
Further, cooling piece further includes the third vertical bar being connected on the free end of outermost first horizontal stripe, and second
The both ends of vertical bar extend out to, the free end of the free end of third vertical bar and second vertical bar concordant with the free end of third vertical bar
Place is connected with connector.
Further, cooling-part includes: two outline borders being oppositely arranged;Sweeping cooling tube is arranged at two
Between outline border, flow channel for liquids is formed in cooling tube;Two sealing elements, respectively correspond and are arranged on the outside of two outline borders, so that
Two outline borders, two the refrigerating chamber for accommodating refrigerant liquid is surrounded between sealing element and cooling tube, on one in two outline borders
Equipped with the injection hole being connected to refrigerating chamber.
Further, semiconductor cooling liquid device further includes two conduction cooling clamping plates, a refrigeration part, a conduction cooling clamping plate, cold
But component, another conduction cooling clamping plate and another refrigeration part are sequentially stacked setting, and a conduction cooling is fixed on a refrigeration part
Clamping plate.
The utility model also provides a kind of medical Transfusion device, comprising: sequentially connected infusion vessel, the first perfusion tube, half
The cold liquid device of conductor, the second perfusion tube and infusion niidl, semiconductor cooling liquid device are above-mentioned semiconductor cooling liquid device.
Technical solutions of the utility model, when having the advantages that replacement cooling-part, by used cooling-part from opening
Discarding is taken out at mouth structure, is then put into new cooling-part in shell from from hatch frame, to complete to replace, more
Change very easy, shortening replacing construction, raising replacement efficiency.
Detailed description of the invention
It, below will be right in order to illustrate more clearly of specific embodiment of the present invention or technical solution in the prior art
Specific embodiment or attached drawing needed to be used in the description of the prior art are briefly described, it should be apparent that, it is described below
In attached drawing be that some embodiments of the utility model are not paying creativeness for those of ordinary skill in the art
Under the premise of labour, it is also possible to obtain other drawings based on these drawings.In the accompanying drawings:
Fig. 1 shows the stereoscopic schematic diagram of the embodiment one of medical Transfusion device according to the present utility model;
Fig. 2 shows the partially exploded diagrams of the semiconductor cooling liquid device of the medical Transfusion device of Fig. 1;
Fig. 3 shows the schematic diagram for removing cabinet of the semiconductor cooling liquid device of Fig. 2;
Fig. 4 shows the stereoscopic schematic diagram of the semiconductor cooling liquid device of Fig. 2;
Fig. 5 shows enlarged diagram at the A of the semiconductor cooling liquid device of Fig. 4;
Fig. 6 shows the schematic front view of the cooling piece of the cooling-part of Fig. 5;
Fig. 7 shows the flow channel for liquids of the semiconductor cooling liquid device of the embodiment two of medical Transfusion device according to the present utility model
Schematic diagram;
Fig. 8 shows the flow channel for liquids of the semiconductor cooling liquid device of the embodiment three of medical Transfusion device according to the present utility model
Schematic diagram;
Fig. 9 shows the cooling-part of the semiconductor cooling liquid device of the example IV of medical Transfusion device according to the present utility model
Schematic diagram.
Wherein, the appended drawing reference in above-mentioned attached drawing are as follows:
10, shell;11, left half cabinet;111, elastic card fastener;112, guide rail;12, right half cabinet;121, card hole;122,
Elastic operation part;123, sliding block;13, hangers is connected;20, cooling-part;21, flow channel for liquids;22, cooling piece;221, first is perpendicular
Item;222, the second vertical bar;223, the first horizontal stripe;224, the second horizontal stripe;225, third vertical bar;226, connector;23, sealing element;24,
Outline border;241, injection hole;25, cooling tube;41, conduction cooling clamping plate;42, elastic component;51, radiator fan;52, heat preservation component;53, it dissipates
Backing;60, infusion vessel;71, the first perfusion tube;72, the second perfusion tube;73, infusion niidl;74, Murphy dropper;75, temperature
Sensor;76, electronic finger;77, fluid-delivery valve;78, adjuster;81, power supply line;82, power control circuit component;83, it controls
Panel;84, control panel signal wire;85, temperature sensor signal line;86, electronic finger signal wire;87, refrigeration part signal
Line.
Specific embodiment
The technical solution of the utility model is clearly and completely described below in conjunction with attached drawing, it is clear that described
Embodiment is the utility model a part of the embodiment, instead of all the embodiments.Based on the embodiments of the present invention, originally
Field those of ordinary skill every other embodiment obtained without making creative work belongs to practical
Novel protected range.
As shown in Figure 1 to Figure 3, the semiconductor cooling liquid device of the present embodiment includes: shell 10, cooling-part 20, refrigeration part,
Cooling-part 20 is removably arranged in shell 10 and has flow channel for liquids 21, and the both ends of flow channel for liquids 21 are respectively formed feed liquor
Mouthful and liquid outlet, shell 10 be equipped be used to form the hatch frame for replacing the cooling-part 20 and respectively with inlet and
The corresponding inlet and outlet of liquid outlet;Refrigeration part is close in the setting of cooling-part 20 and to the liquid flowed into flow channel for liquids 21
Freeze.
Using the semiconductor cooling liquid device of the present embodiment, when replacing cooling-part 20, by used cooling-part 20 from opening
Discarding is taken out at mouth structure, then by new cooling-part 20 from being put into shell 10 from hatch frame, to complete more
It changes, replaces very easy, shortening replacing construction, raising replacement efficiency.
In the present embodiment, there are two refrigeration part is set, two refrigeration parts are located at the opposite two sides of cooling-part 20,
One in two refrigeration parts forms the fixation member of fixed setting on the housing 10, another shape in two refrigeration parts
At the moving parts being movably disposed on shell 10, moving parts has the cooling position for clamping cooling-part 20 and release
The replacement position of cooling-part 20 is replaced after cooling-part 20 from hatch frame.When replacing cooling-part 20, by moving parts
Mobile to the direction far from fixation member, moving parts is separated with cooling-part, at this moment cooling-part can be pulled out to discarding, so
New cooling-part is placed between fixation member and moving parts afterwards, then to moving parts towards the direction of fixation member into
Row movement, moving parts and fixation member clamp cooling-part, to complete to replace, replace very easy, shortening replacing construction,
Improve replacement efficiency.And refrigeration part is equipped on the opposite two sides of cooling-part 20, refrigeration part can be to cooling
The opposite two sides of component are cooled down, and realize two-sided refrigeration, improve refrigerating capacity, and cooling effect is more preferable, shorten cooling time.
Since cooling-part is disposable parts, the other components such as refrigeration part can be reused, using the above structure
It can be with save the cost.
In the present embodiment, elastic component 42 is equipped between moving parts and shell 10, the biasing force of elastic component 42 is applied to
So that moving parts is moved to cooling position from replacement position on moving parts, apply in moving parts contrary with biasing force
Active force so that moving parts is moved to replacement position from cooling position.At cooling position, the active force of elastic component 42 is always
Effect on the moving part, can clamp always cooling-part in this way, prevent refrigeration part from separating with cooling-part and cause to freeze
The bad situation of effect.
In the present embodiment, as shown in figure 4, shell 10 is including half cabinet 11 of a left side and is movably attached left half cabinet 11
On half cabinet 12 of the right side, half cabinet 11 of a left side and right half cabinet 12 docking surround a complete cabinet, and fixation member is fixed on a left side
On half cabinet 11, moving parts is fixed on right half cabinet 12, and active force passes through right half cabinet 12 and applies on the moving part.It is defeated
After complete liquid, right half cabinet 12 is mobile to the direction far from left half cabinet 11, and right half cabinet 12 is separated with left half cabinet 11 and shape
At hatch frame, at this moment moving parts is separated with fixation member, at this moment can take used cooling-part from hatch frame
It abandons, then new cooling-part is put between the intracorporal fixation member of shell and moving parts from hatch frame, most out
The direction of right half cabinet 12 towards left half cabinet 11 is moved afterwards, moving parts and fixation member clamp cooling-part, this
When half cabinet 12 of the right side and left half cabinet 11 docking, to complete to replace.Above structure improves replacement efficiency convenient for operation.By upper
Description is stated it is found that the replacement structure of above-mentioned cooling-part uses the structure of two half box types.Specifically, right half cabinet is opened with left side
Mouth and front openings, left half cabinet have right openings corresponding with left side opening, and the foreboard of left half cabinet is longer than its top plate, bottom
The part of plate and back plate cooperates with front openings, and the foreboard of left half cabinet is equipped with control panel 83, the structure side of left half cabinet
Control panel is just set.
In the present embodiment, as shown in figure 3, the inner wall of left half cabinet is equipped with guide rail 112, right half cabinet is equipped with and leads
The sliding block 123 that rail 112 cooperates, guide rail 112 and sliding block 123 cooperate the guiding role played to moving parts, hair when preventing mobile
Raw deflection.
In the present embodiment, left half cabinet 11 is connected with right half cabinet 12 by elastic-buckle structure, on the one hand, in cooling
When position, connection is stronger, prevents half cabinet 11 of a left side and right half cabinet 12 separation;On the other hand, facilitate left half cabinet 11 and the right side
The separation of half cabinet 12.The setting of elastic component 42 is between right half cabinet 12 and moving parts.Specifically, as shown in Figure 4 and Figure 5, bullet
Property buckle structure include the elastic card fastener 111 being arranged on left half cabinet 11 and setting on half cabinet 12 of the right side and and elastic card
The card hole 121 that fastener 111 cooperates.
In the present embodiment, the fixing end of elastic card fastener 111 is fixed on the inner wall of left half cabinet 11, right half cabinet 12
Outer wall on be additionally provided with elastic operation part 122, the free end of elastic operation part 122 is located at card hole 121, free end apply court
To the active force of elastic card fastener 111, elastic operation part 122 be inserted into card hole 121 with by elastic card fastener 111 from card hole 121
To out.The setting of elastic operation part 122 separates elastic card fastener 111 and card hole convenient for operating flexibility fastener 111, easier
It is laborsaving.
In the present embodiment, in the form of sheets, structure is simple for cooling-part 20, easy to process, reduces manufacturing cost.Due to partly leading
Body refrigeration modes are suitably applied small space, and refrigerating speed is required than very fast, and specifically, refrigeration part is semiconductor chilling plate,
I.e. the type of cooling of semiconductor cooling liquid device uses semiconductor refrigerating mode, and semiconductor refrigerating mode is compared to compressor refrigeration mode
Structure is simpler.Due to the Peltier effect of semiconductor material, one end of semiconductor chilling plate its other end while refrigeration
Face is generating heat, and to realize that the efficient refrigeration effect heat that side generates that needs to generate heat scatters away in time.
In the present embodiment, as shown in fig. 6, flow channel for liquids 21 is in bending, medical fluid and refrigeration part can be increased in this way
Cooling time of contact, increase to the refrigerating capacity of unit volume transfusion fluid.
In the present embodiment, cooling-part 20 includes: cooling piece 22 and two sealing elements 23, and cooling piece 22, which has, runs through it
Opposite two sides and sweeping channel, two sealing elements 23 are arranged on the opposite two sides of cooling piece 22 and seal logical
Road forms flow channel for liquids 21.It can be convenient processing channel in this way, reduce difficulty of processing.
In the present embodiment, cooling piece 22 includes that the first vertical bar 221 being oppositely arranged is connected with the second vertical bar 222, one end
On the first vertical bar 221 and multiple first horizontal stripes 223 that the other end is freely arranged and one end are connected on the second vertical bar 222 and another
Multiple second horizontal stripes 224 that one end is freely arranged have distance between the free end of the first horizontal stripe 223 and the second vertical bar 222, the
There is distance between the free end of two horizontal stripes 224 and the first vertical bar 221, one second cross is equipped between two the first horizontal stripes 223
Item 224, the first vertical bar 221, the second vertical bar 222, multiple first horizontal stripes 223 and multiple second horizontal stripes 224 surround forniciform logical
Road.Sealing element 23 is sealed transparent film.The structure of cooling-part 20 is simple, and manufacture is easy, low in cost.
In the present embodiment, cooling piece 22 further includes the third being connected on the free end of outermost first horizontal stripe 223
Vertical bar 225, the both ends of the second vertical bar 222 extend out to it is concordant with the free end of third vertical bar 225, third vertical bar 225 from
Connector 226 is connected with the free end of the second vertical bar 222 by holding.Connector connects simple and fast convenient for connecting with perfusion tube.
In the present embodiment, semiconductor cooling liquid device further includes two conduction cooling clamping plates 41, a refrigeration part, a conduction cooling folder
Plate 41, cooling-part 20, another conduction cooling clamping plate 41 and another refrigeration part are sequentially stacked setting, consolidate on a refrigeration part
A fixed conduction cooling clamping plate 41.The cooling capacity of refrigeration part not only can be passed to cooling-part by conduction cooling clamping plate 41, but also in cooling
Cooling piece and sealing element are tightly clamped when position, sealing performance when guaranteeing cooling between cooling piece and sealing element prevents
Liquid leakage.
In the present embodiment, cooling piece 22 is processed by injection molding process, i.e. the moulding that is integrally formed of cooling piece,
It is easy to process.Two sealing elements 23 are fitted in the two sides of cooling piece 22 by ultrasonic wave or hot pressing, i.e. two sealing elements use super
Sound wave or the method for hot pressing fitting are fixed on the two sides of cooling piece, so that and sealing element and cooling piece form a part,
Production process is simple, at low cost.
In the present embodiment, as shown in figure 3, semiconductor cooling liquid device further includes thermal component, thermal component setting is being freezed
The side of the separate cooling-part 20 of component, shell 10 are equipped with thermovent corresponding with thermal component.One end of refrigeration part
Its other end is in heat release while refrigeration, and thermal component, which can will put thermogenetic heat and orient in time, to be scattered away, refrigeration effect
More preferably.Thermal component includes radiator fan 51 and cooling fin 53, and cooling fin 53 is close to the heating surface of semiconductor chilling plate, heat dissipation
The side of the separate semiconductor chilling plate of cooling fin 53 is arranged in fan 51.Cooling fin 53 can increase heat dissipation area, in time will
Heat, which sheds, to be come, and heat can be oriented and is retracted to outside shell by radiator fan 51.Wherein, the material of cooling fin 53 is aluminium.
In the present embodiment, semiconductor cooling liquid device further includes the heat preservation component 52 for the surrounding for being wrapped in refrigeration part.Heat preservation
Component 52 surrounds the semiconductor chilling plate as refrigeration part, it is possible to reduce cooling-part and thermal component or free surrounding space it
Between cross-ventilation, increase refrigeration effect.Specifically, heat preservation component is heat-preservation cotton.
In the present embodiment, as shown in Fig. 2, semiconductor cooling liquid device further includes that setting is at liquid outlet and intracorporal positioned at shell
Temperature sensor 75 and setting are in the intracorporal power control circuit component 82 of case, temperature sensor 75 and power control circuit component
82 electrical connections, the real time temperature of the liquid at temperature sensor measurement liquid outlet and the temperature signal Real-time Feedback that will test to
Control circuit, control circuit control refrigeration part work according to temperature feedback signal and realize adjusting, realize output accurate temperature
Transfusion fluid, and then realize and transfusion temperature is precisely controlled.Specifically, temperature sensor uses infrared sensor, infrared sensing
Device is connect by temperature sensor signal line 85 with power control circuit component 82, and infrared sensor is relative to traditional contact
Sensor, easy for installation, instantaneity is good, it can be ensured that is precisely controlled immediately to infusion temperature, temperature feedback is made to reach instant
The effect of property.
In the present embodiment, power control circuit component 82 is connect by refrigeration part signal wire 87 with refrigeration part, electricity
Source control circuit component 82 is connected with the power supply line 81 that one end is pierced by from shell, and power supply line 81 connects 220V alternating current.Power supply control
Circuit unit 82 is connect by control panel signal wire 84 with control panel, and power control circuit component 82 is believed by radiator fan
Number line is connect with radiator fan.
In the present embodiment, control panel 83 is used to show the temperature of infusion, can be used for carrying out the temperature of infusion
Setting.Power control circuit component 82 include power unit and control circuit part, power unit convert alternating current to 24V and
The DC voltage of 5V provides low-voltage dc power supply for internal circuit running, control circuit part include control panel control circuit,
Temperature control control circuit (includes the control to pneumatic-finger).Power control circuit component 82 provides 24V direct current for refrigeration part
Source and 5V power supply is provided for control panel.
In the present embodiment, as shown in Figure 1, the opposite two side walls of shell are equipped with connection hangers 13, hangers is connected
13 are equipped with hanging hole, and hanging hole is hung on infusion support, and connection hangers is for facilitating fixed semiconductor cooling liquid device.
In the present embodiment, as shown in figure 3, conduction cooling clamping plate, heat preservation component, cooling fin and radiator fan are in rectangle and each
A size is similar.
The utility model additionally provides a kind of medical Transfusion device, as shown in Figure 1, medical Transfusion device includes: sequentially connected
Infusion vessel 60, the first perfusion tube 71, semiconductor cooling liquid device, the second perfusion tube 72 and infusion niidl 73, semiconductor cooling liquid device are
Above-mentioned semiconductor cooling liquid device.
In the present embodiment, infusion vessel 60 is infusion bottle or infusion bag etc., and infusion vessel 60 is consolidated by the way of plug-in
It is scheduled on infusion support, the size and shape of infusion vessel can not be influenced by semiconductor cooling liquid device, and infusion use scope is wide.
Murphy dropper 74, adjuster 78 and fluid-delivery valve 77 are equipped on the first perfusion tube 71, adjuster 78 and fluid-delivery valve 77 control respectively
Fluid flow and infusion on-off.The length of second perfusion tube 72 is less than or equal to 1.5m, to reduce ambient temperature to cooled infusion
The influence of body, in order to avoid influence refrigeration effect.
In the present embodiment, the electronic finger 76 for being located at enclosure interior is set at the first end of the second perfusion tube 72, it is electronic
Finger 76 is connect by electronic finger signal wire 86 with power control circuit component 82.When feedback temperature exception, control circuit
Controlling electronic finger 76 closure and clamping perfusion tube in time to interrupt infusion, while by control panel sending warning note,
And then ensure infusion safety when being infused abnormal.
In the present embodiment, the both ends of cooling piece are separately connected the first perfusion tube 71 and the second perfusion tube 72, when leaving the factory
First perfusion tube 71, cooling piece, the second perfusion tube 72, infusion niidl 73 and the Murphy dropper 74 on the second perfusion tube 72, tune
Section device 78, fluid-delivery valve 77 form disposable component, and cooling piece and sealing element are inserted between two conduction cooling clamping plates 41 by when use,
It extracts between two conduction cooling clamping plates 41 after use, directly throws away again.Sealing element is also disposable part, after use
Directly throw away.
The installation process of cooling-part is illustrated below, it is only necessary to press elastic operation part 122, elastic operation part
Elastic card fastener 111 is supported by 122 from card hole 121, and under the action of elastic component 42, right half cabinet is flicked, and pull outward the right side half
Cooling-part is put between right half cabinet and left half cabinet by cabinet, then pushes right half cabinet that can install cooling-part
Finish.
Infusion cooling and temperature control process are illustrated below, will need to carry out cooling infusion vessel to be hung on infusion support
On, the temperature of infusion medical fluid is set by control panel, adjusts adjuster and infusion flow is set, open fluid-delivery valve, by not luxuriant and rich with fragrance
Dropper excludes the air of infusion medical fluid;Medical fluid in infusion vessel enters flow channel for liquids by perfusion tube, immediately through defeated after cooling
Liquid pipe, syringe needle are infused into patient's body.
The control process of semiconductor cooling liquid device is illustrated below, after semiconductor chilling plate is powered, cooling piece bonding is led
The one side temperature rapid decrease of cold clamping plate, by conducting the temperature also rapid decrease of conduction cooling clamping plate 41, simultaneously because semiconductor system
Temperature rapid increase for the opposite face of cold huyashi-chuuka (cold chinese-style noodles), and the thermal component that the cooling fin and small-sized heat radiating fan of aluminium are constituted passes through increase
Heat dissipation area and the air guided circulation of guidance prevent hot face excessively high, to increase the refrigeration effect of huyashi-chuuka (cold chinese-style noodles).Cooling piece is inserted in two
Between conduction cooling clamping plate, heat transfer is also passed through, the solution for flowing through flow channel for liquids realizes cooling immediately.Temperature sensor is by liquid flow
The solution temperature of road output feeds back to control circuit, and control circuit is realized defeated by the energized power of control cooling piece after being computed
Liquid temperature accurately controls.Wherein, semiconductor chilling plate is bonding with other component thermally conductive using uniformly thin heat-conducting silicone grease increase
Effect.
In conclusion semiconductor cooling liquid device and infusion apparatus are combined into one by the utility model, make to pass through perfusion tube
Transfusion fluid after disposable flow channel for liquids freezes immediately enter patient's body, structure is simple, small in size, light-weight, cost
It is low, it is easy to use, it is cooling for a long time in advance to solve the problems, such as that the treatment of Mild Hypothermal degree cooling method need to carry out medical fluid.And lead to
The control panel crossed on shell can need to be arranged at any time different infusion temperatures according to infusion, and cooling is adjustable, controls simultaneously
Panel can also come out output transfusion fluid actual temperature real-time display;Infrared temperature probe, temperature-control circuit constitute temperature
Control system may insure that the temperature of output transfusion fluid is accurate, guarantee that be infused temperature can be controlled accurately.
Fig. 7 shows the structure of the flow channel for liquids of the semiconductor cooling liquid device of the embodiment two of medical Transfusion device, flow channel for liquids
21 is substantially W-shaped, can make transfusion fluid flowing more smooth in this way.Specifically, flow channel for liquids 21 includes sequentially connected first
Oblique section, the second oblique section, straight section, the oblique section of third and the oblique section of third, the first oblique section and the second oblique section angle at an acute angle and rounding off,
Second oblique section and straight section angle and rounding off in obtuse angle, angle and rounding off, third are oblique in obtuse angle for straight section and the oblique section of third
Section and the 4th oblique section angle at an acute angle and rounding off.
Fig. 8 shows the structure of the flow channel for liquids of the semiconductor cooling liquid device of the embodiment three of medical Transfusion device, flow channel for liquids
Including the sequentially connected first perpendicular section, the first segmental arc, the first crosspiece, the first semicircle segmental arc, the second crosspiece, the second semicircle segmental arc,
Third crosspiece, third semicircle segmental arc, the 4th crosspiece, the 4th semicircle segmental arc, the 5th crosspiece, the 5th semicircle segmental arc, the 6th crosspiece,
Two segmental arcs and the second perpendicular section, the second crosspiece, third crosspiece, the length of the 4th crosspiece and the 5th crosspiece are identical, the first crosspiece, the 6th
The length of crosspiece is identical and half the length is the length of the second crosspiece, aforesaid liquid runner make liquid flowing more smooth,
The case where effectively preventing liquid from blocking.Certainly, between two adjacent crosspieces can also by perpendicular section connection, at this moment crosspiece and
Perpendicular section passes through segmental arc rounding off.
Fig. 9 shows the structure of the cooling-part of the semiconductor cooling liquid device of the example IV of medical Transfusion device, cooling-part
20 include: two outline borders being oppositely arranged 24, sweeping cooling tube 25 and two sealing elements 23, and cooling tube 25 is arranged two
Between a outline border 24, flow channel for liquids 21 is formed in cooling tube 25;Two sealing elements 23, which respectively correspond, is arranged in two outline borders 24
On outside so that two outline border 24, two surrounded between sealing element 23 and cooling tube 25 accommodate refrigerant liquid refrigerating chamber, two
One in a outline border 24 is equipped with the injection hole 241 being connected to refrigerating chamber.Refrigeration is injected into refrigerating chamber by injection hole 241
Liquid blocks injection hole 241 after filling, and increases to the solution refrigeration effect in cooling tube 25.
In the present embodiment, outline border 24 is processed by injection molding process, and production process is simple, low in cost.Cooling tube
25 be thin plastic tube, is convenient for transition temperature.The inside of each outline border 24 is equipped with the aperture cooperated with the both ends of cooling tube 25, and two
A aperture formation surrounds circular hole, which is convenient for cooperating with cooling tube 25 and perfusion tube.Sealing element is sealing film.
In the present embodiment, cooling tube 25 is connect with outline border 24 by ultrasonic wire bonding.Two sealing elements 23 pass through respectively
Ultrasonic wave or hot pressing are fitted on the outside of outline border 24.
The forming process of cooling-part is illustrated below, the two panels outline border 24 of injection molding, in two panels outline border 24
One is equipped with injection hole 241, will be placed between two panels outline border after thin plastic tube brake forming, uses ultrasonic wire bonding mode
It crimps thin plastic tube to form cooling during rolling part with outline border, be bonded in the two sides of cooling during rolling part using ultrasonic wave or hot pressing
Sealing film and cooling during rolling part are formed integrated cooling-part by mode, are surrounded between outline border, sealing film and thin plastic tube
Refrigerating chamber.
As interchangeable embodiment, cooling-part is a sweeping cooling tube.
As interchangeable embodiment, the replacement structure of cooling-part can also use the structure of plug-in, and at this moment two
A refrigeration part is each attached in shell, and the space that is put into for being put into cooling-part is formed between two refrigeration parts, opening
Structure be with the plug-and-pull port that is put into space and be connected to, when replacing cooling-part, first by used cooling-part from plug-and-pull port extraction,
New cooling-part is put into space from being inserted into from plug-and-pull port again, to complete to replace.
Obviously, the above embodiments are merely examples for clarifying the description, and does not limit the embodiments.It is right
For those of ordinary skill in the art, can also make on the basis of the above description it is other it is various forms of variation or
It changes.There is no necessity and possibility to exhaust all the enbodiments.And it is extended from this it is obvious variation or
It changes among the protection scope created still in the utility model.
Claims (13)
1. a kind of semiconductor cooling liquid device characterized by comprising
Shell (10);
Cooling-part (20) is removably arranged in the shell (10) and has flow channel for liquids (21), the flow channel for liquids
(21) both ends are respectively formed inlet and liquid outlet, and the shell (10), which is equipped with, is used to form the replacement cooling-part
(20) hatch frame and respectively inlet and outlet corresponding with the inlet and the liquid outlet;
Refrigeration part is arranged and to the liquid system flowed into the flow channel for liquids (21) close to the cooling-part (20)
It is cold.
2. semiconductor cooling liquid device according to claim 1, which is characterized in that there are two the refrigeration part is set, two institutes
The opposite two sides that refrigeration part is located at the cooling-part (20) are stated, the formation fixation in two refrigeration parts is set
The fixation member on the shell (10) is set, another formation in two refrigeration parts is movably disposed at described
Moving parts on shell (10), the moving parts have described in the cooling position for clamping the cooling-part (20) and release
The replacement position of the cooling-part (20) is replaced after cooling-part (20) from the hatch frame.
3. semiconductor cooling liquid device according to claim 2, which is characterized in that the moving parts and the shell (10) it
Between be equipped with elastic component (42), the biasing force of the elastic component (42) be applied on the moving parts so that the moving parts from
The replacement position is moved to the cooling position, applies the active force contrary with the biasing force in the moving parts
So that the moving parts is moved to the replacement position from the cooling position.
4. semiconductor cooling liquid device according to claim 3, which is characterized in that the shell (10) includes left half cabinet (11)
With half cabinet of the right side (12) being movably attached on left half cabinet (11), left half cabinet (11) and the right half chests
Body (12) docking surrounds a complete cabinet, and the fixation member is fixed on left half cabinet (11), the moving portion
Part is fixed on right half cabinet (12), and the active force is applied to the moving parts by right half cabinet (12)
On.
5. semiconductor cooling liquid device according to claim 4, which is characterized in that left half cabinet (11) and the right half chests
Body (12) is connected by elastic-buckle structure, and the elastic component (42) is arranged in right half cabinet (12) and the moving parts
Between.
6. semiconductor cooling liquid device according to claim 5, which is characterized in that the elastic-buckle structure includes being arranged in institute
Elastic card fastener (111) on left half cabinet (11) and setting are stated on right half cabinet (12) and with the elastic card fastener
(111) card hole (121) cooperated.
7. semiconductor cooling liquid device according to claim 1, which is characterized in that the cooling-part (20) is in the form of sheets, described
Flow channel for liquids (21) is in bending.
8. semiconductor cooling liquid device according to claim 7, which is characterized in that the cooling-part (20) includes: cooling piece
(22) and two sealing elements (23), the cooling piece (22), which has, runs through its opposite two sides and sweeping channel, and two
A sealing element (23), which is arranged on the opposite two sides of the cooling piece (22) and seals the channel, forms the liquid
Runner (21).
9. semiconductor cooling liquid device according to claim 8, which is characterized in that the cooling piece (22) includes being oppositely arranged
First vertical bar (221) and the second vertical bar (222), one end are connected on first vertical bar (221) and the other end is freely arranged
Multiple second cross that multiple first horizontal stripes (223) and one end are connected on second vertical bar (222) and the other end is freely arranged
Item (224) has distance, second horizontal stripe between the free end and second vertical bar (222) of first horizontal stripe (223)
(224) there is distance between free end and first vertical bar (221), be equipped with one between two first horizontal stripes (223)
A second horizontal stripe (224), first vertical bar (221), second vertical bar (222), multiple first horizontal stripes (223)
And multiple second horizontal stripes (224) surround the forniciform channel.
10. semiconductor cooling liquid device according to claim 9, which is characterized in that the cooling piece (22) further includes being connected to
Third vertical bar (225) on the free end of outermost first horizontal stripe (223), the both ends of second vertical bar (222) to
, the free end of the third vertical bar (225) and described second perpendicular concordant with the free end of the third vertical bar (225) is extended to outside
The free end of item (222) is connected with connector (226).
11. semiconductor cooling liquid device according to claim 7, which is characterized in that the cooling-part (20) includes:
Two outline borders (24) being oppositely arranged;
Sweeping cooling tube (25) is arranged between two outline borders (24), in the cooling tube (25) described in formation
Flow channel for liquids (21);
Two sealing elements (23) respectively correspond and are arranged on the outside of two outline borders (24), so that two outline borders
(24), the refrigerating chamber for accommodating refrigerant liquid, two institutes are surrounded between two sealing elements (23) and the cooling tube (25)
It states one in outline border (24) and is equipped with the injection hole (241) being connected to the refrigerating chamber.
12. the semiconductor cooling liquid device according to claim 8 or 11, which is characterized in that the semiconductor cooling liquid device further includes
Two conduction cooling clamping plates (41) are a refrigeration part, a conduction cooling clamping plate (41), the cooling-part (20), another
A conduction cooling clamping plate (41) and another described refrigeration part are sequentially stacked setting, fix one on a refrigeration part
The conduction cooling clamping plate (41).
13. a kind of medical Transfusion device, comprising: sequentially connected infusion vessel (60), the first perfusion tube (71), semiconductor cooling liquid
Device, the second perfusion tube (72) and infusion niidl (73), which is characterized in that the semiconductor cooling liquid device is in claim 1 to 12
Described in any item semiconductor cooling liquid devices.
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CN201820742999.0U CN208893327U (en) | 2018-05-16 | 2018-05-16 | Semiconductor cooling liquid device and medical Transfusion device |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN108568007A (en) * | 2018-05-16 | 2018-09-25 | 佛山特种医用导管有限责任公司 | Semiconductor cooling liquid device and medical Transfusion device |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108568007A (en) * | 2018-05-16 | 2018-09-25 | 佛山特种医用导管有限责任公司 | Semiconductor cooling liquid device and medical Transfusion device |
CN108568007B (en) * | 2018-05-16 | 2023-12-05 | 佛山特种医用导管有限责任公司 | Semiconductor liquid cooler and medical infusion apparatus |
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