CN208889844U - Waveguide feed substrate and antenna system - Google Patents
Waveguide feed substrate and antenna system Download PDFInfo
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- CN208889844U CN208889844U CN201821291142.8U CN201821291142U CN208889844U CN 208889844 U CN208889844 U CN 208889844U CN 201821291142 U CN201821291142 U CN 201821291142U CN 208889844 U CN208889844 U CN 208889844U
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Abstract
The utility model provides a kind of waveguide feed substrate and antenna system, belongs to field of communication technology.The waveguide feed substrate of the utility model, comprising: the first substrate, with holding tank；Holding tank includes bottom, the first side wall and second sidewall for connecting and being oppositely arranged with bottom；Waveguide feed structure, in holding tank, and waveguide feed structure is hollow structure, has the first face for being arranged in and accommodating trench bottom, the second face being oppositely arranged with the first face；And connection between the face and third face being oppositely arranged and fourth face between the first face and second face；Wherein, third face is arranged on the first side wall, and the second face is arranged in second sidewall；It is provided with opening on the second surface.So, the first substrate and antenna substrate can be fixed together by bonding technology, craft precision is high in this, and is formed by antenna system configuration and stablizes, and can substantially reduce antenna system because of the loss of mechanical package bring and error.
Description
Technical field
The utility model belongs to field of communication technology, and in particular to a kind of waveguide feed substrate and antenna system.
Background technique
The feed of liquid crystal antenna is mainly based on feed microstrip line and substrate integration wave-guide (SIW) feed at this stage.It is micro-
Band line feed feature is that isolation is larger, integrated level is higher, the disadvantage is that insertion loss is larger.Feeding substrate integrated waveguide feature is
Rectangular waveguide can be substituted, section size, loss characteristic, processing cost and in terms of will be better than traditional rectangular
Metal waveguide, but feeding substrate integrated waveguide structure is mostly that dielectric-slab gets through hole, upper and lower metal cladding, approximate metal waveguide
Can, dielectric-slab is mostly PCB.If glass structure is integrated with PCB construction, due to the material property of glass itself, it is not easy to
The materials substrate such as PCB is integrated, need to add fixed frame or the two is fixed together by other means, and assembly precision is poor, due to
Feed placement is more demanding to aligning accuracy to be also easy to produce biggish loss.
Utility model content
The utility model aims to solve at least one of the technical problems existing in the prior art, provides one kind and effectively improves wave
Lead the waveguide feed substrate and antenna system of the assembly precision of feed substrate and antenna substrate.
Solving technical solution used by the utility model technical problem is a kind of waveguide feed substrate, comprising:
First substrate, with holding tank；The holding tank includes bottom, and connect with the bottom and set relatively
The first side wall and second sidewall set；
Waveguide feed structure, in the holding tank, and the waveguide feed structure is hollow structure, has and sets
It sets in first face for accommodating trench bottom, the second face being oppositely arranged with first face, and is connected to first face
And second between the face and third face being oppositely arranged and fourth face；Wherein, the third face is arranged on the first side wall,
Second face is arranged in the second sidewall；Opening is provided on second face.Preferably, the material of first substrate
Material include: glass, silicon, quartz, ceramics in any one.
It may further be preferable that the material of the waveguide feed structure includes metal.
Preferably, the second substrate is provided on the second face of the waveguide feed structure.
Solving technical solution used by the utility model technical problem is a kind of antenna system comprising above-mentioned waveguide
Feed substrate, and the antenna substrate being bonded together with the waveguide feed substrate.
The utility model has the following beneficial effects:
Since in waveguide feed substrate provided by the present invention, waveguide feed structure is arranged in the first substrate
On, so, the first substrate and antenna substrate can be fixed together by bonding technology, craft precision is high in this, and
It is formed by antenna system configuration to stablize, antenna system can be substantially reduced because of the loss of mechanical package bring and error.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the waveguide feed substrate of the embodiments of the present invention 1；
Fig. 2 is the flow chart of the preparation method of the waveguide feed substrate of the embodiments of the present invention 1；
Fig. 3 is the process flow chart of the preparation method of the waveguide feed substrate of the embodiments of the present invention 1；
Fig. 4 is the structural schematic diagram of the antenna system of the embodiments of the present invention 1；
Fig. 5 is the process flow chart of the preparation method of the antenna system of the embodiments of the present invention 1；
Fig. 6 is the structural schematic diagram of the waveguide feed substrate of the embodiments of the present invention 2；
Fig. 7 is the flow chart of the preparation method of the waveguide feed substrate of the embodiments of the present invention 2；
Fig. 8 is the process flow chart of the preparation method of the waveguide feed substrate of the embodiments of the present invention 2；
Fig. 9 is the structural schematic diagram of the antenna system of the embodiments of the present invention 2；
Figure 10 is the process flow chart of the preparation method of the antenna system of the embodiments of the present invention 2.
Wherein appended drawing reference are as follows: the 1, first substrate；11, holding tank；2, waveguide feed structure；21, the first face；22, second
Face；23, third face, 24, fourth face；3, the second substrate；4, structure is sacrificed；5, antenna substrate.
Specific embodiment
It is with reference to the accompanying drawing and specific real to make those skilled in the art more fully understand the technical solution of the utility model
Mode is applied to be described in further detail the utility model.
Unless otherwise defined, technical term or scientific words used in the present embodiment are should be belonging to the utility model
With personage's ordinary meaning to understand of general technical ability in technical field." first ", " second " used in the present embodiment
And similar word is not offered as any sequence, quantity or importance, and be used only to distinguish different component parts.
The similar word such as " comprising " or "comprising", which means to occur element or object before the word, to be covered and appears in behind the word
The element enumerated perhaps object and its equivalent and be not excluded for other elements or object." connection " or " connected " etc. are similar
Word is not limited to physics or mechanical connection, but may include electrical connection, it is either direct or between
It connects."upper", "lower",
"left", "right" etc. is only used for indicating relative positional relationship, after the absolute position for being described object changes, then the phase
Positional relationship may also correspondingly be changed.
It is appreciated that ought such as layer, film, region or substrate etc element be referred to as be located at another element "above" or "below"
When, which " direct " can be located at "above" or "below" another element, or may exist intermediary element.
Embodiment 1:
As shown in Figure 1, the present embodiment provides a kind of waveguide feed substrates, comprising: the first substrate 1 and waveguide feed structure 2；
Wherein, there is holding tank 11 in the first substrate 1；The holding tank 11 has base portion, and connect and be oppositely arranged with bottom
The first side wall and second sidewall (namely holding tank 11 is similar to U-type groove)；Waveguide feed structure 2 is in holding tank 11, the wave
Leading feed structure 2 is a hollow structure inside, has the first face 21 contacted with receiving trench bottom, is set relatively with the first face 21
The second face 22 set, and be connected between the first face 21 and the second face 22 and the third face 23 being oppositely arranged and fourth face
24；Wherein, third face 23 is arranged on the first side wall of holding tank 11, and fourth face 24 is arranged in second sidewall, and is feeding
Opening is provided on second face 22 of structure；The opening can be used for the incoming end of the microstrip line of electromagnetic wave signal feed-in phase shifter
Mouthful, so that axial transmission of the electromagnetic wave signal along microstrip line.
Wherein, waveguide feed structure 2 is applied in antenna substrate, and antenna substrate is usually being moved by phase shifter and setting
Metal patch on phase device is constituted；Wherein, by taking liquid crystal phase shifter as an example, first substrate and the second substrate are generally included, with
And it is formed in the liquid crystal layer on first substrate and the second substrate, first substrate is usually by substrate and substrate close to liquid crystal layer
Microstrip line on face is constituted, and the second substrate is then by another substrate (material can be identical with the substrate in first substrate), Yi Jishe
The patch electrode for setting the periodic arrangement on the face in the substrate close to liquid crystal layer is constituted, and in the substrate away from patch electrode
Then setting is used for radiated electromagnetic wave by metal patch on face.
Since in waveguide feed substrate provided by the present embodiment, waveguide feed structure 2 is arranged in the first substrate
On 1, so, the first substrate 1 and the substrate with microstrip line in antenna substrate can be fixed on by bonding technology
Together, craft precision is high in this, and is formed by antenna system configuration and stablizes, and can substantially reduce antenna system because of mechanical package
Bring loss and error.
Wherein, since microstrip line is typically formed on the glass substrate, the material of the first substrate 1 in the present embodiment
Material chooses the material that can be bonded with glass.Specifically, the material of the first substrate 1 include: glass, silicon, quartz, ceramics in appoint
It anticipates one kind.
Wherein, the material of the waveguide feed structure 2 in the present embodiment includes metal.Specifically, metal material may include:
Copper, aluminium can also use invar and steel, be also not limited to aforementioned different materials certainly, can also according to different application and
The different metal material of waveband selection.
Correspondingly, being directed to above-mentioned waveguide feed substrate, in conjunction with shown in Fig. 2 and Fig. 3, the present embodiment in the present embodiment
In additionally provide the preparation method of this kind of waveguide feed substrate, specifically comprise the following steps:
Step 1: taking one first substrate 1, etching forms holding tank 11 in the first substrate 1；Wherein, with the packet of holding tank 11
Bottom is included, the opening opposite with bottom, the first side wall and second side for being connect with bottom and being oppositely arranged and being connect with bottom
Wall.
Step 2: carrying out three faces on the bottom of holding tank 11 and two side walls in the substrate for completing above-mentioned steps
Metal growth, to form the first face 21, third face 23 and the fourth face 24 of waveguide feed structure 2.First face 21 is formed in receiving
The bottom of slot 11, third face 23 are formed on the first side wall of holding tank 11, and fourth face 24 is formed in second sidewall.
Wherein, which specifically includes: by electroplating technology, in the bottom of holding tank 11 and the first side wall and second
Side wall forms metal material, to form the first face 21, third face 23 and the fourth face 24 of waveguide feed structure 2, waveguide at this time
The first face 21, third face 23 and the fourth face 24 of feed structure 2 are integrally formed.
Utilize the principle of electrolysis by the side of electric conductor layer overlay metal it should be noted that electroplating technology refers to
Method.Plating refers in the saline solution containing pre- plating metal, using plated parent metal as cathode, by electrolysis, makes to plate
The cation of pre- plating metal is deposited in base metal surface in liquid, forms a kind of method of surface finish of coating.
Certainly, above-mentioned steps, which are also limited to, uses electroplating technology, as long as can be in the bottom of holding tank 11 and two
Trihedral is carried out on side wall into the technique of metal layer.
Step 3: being formed in the substrate for completing above-mentioned steps and sacrificing structure 4；Wherein, the filling of structure 4 is sacrificed to be formed with
The holding tank 11 in the first face 21 of waveguide feed structure 2, third face 23 and fourth face 24.
Wherein, which can specifically include: in the first face 21, the third face 23 and for being formed with waveguide feed structure 2
Deposited sacrificial layer in the substrate of 24 holding tank 11 on four sides, removal are located at the sacrificial layer material other than holding tank 11, form filling
The sacrifice structure 4 of full holding tank 11.
Wherein, the material of sacrificial layer can be silica, polysilicon, polymer etc..
Step 4: being formed by patterning processes includes the second of waveguide feed structure 2 in the substrate for completing above-mentioned steps
The figure in face 22.Wherein, there is opening on the second face 22, and connect with third face 23 and fourth face 24.
Wherein, which specifically includes: using sputtering or electroplating technology, being formed on forming the substrate by sacrifice structure
Metal material layer, later, exposure, development, etching formed include include waveguide feed structure 2 the second face 22 figure.Herein
It should be noted that formed metal material layer be also not limited to sputtering and plating, can with it is other it is any being capable of deposited metal film
The technique of layer.
Step 5: passing through the opening of waveguide feed structure 2, structure 4 is sacrificed in removal, to form waveguide feed structure.
Wherein, it is discharged by dry or wet etch technique and sacrifices structure 4, to form waveguide feed structure.
Correspondingly, above-mentioned waveguide feed structure 2 is directed to, as shown in figure 4, additionally providing a kind of aerial system in the present embodiment
System, which includes above-mentioned waveguide feed substrate, and certainly, which further includes antenna substrate 5.
It include above-mentioned waveguide feed substrate by antenna system in this present embodiment, it therefore, can be by waveguide feed structure 2
The first substrate 1 be fixed together with the substrate with microstrip line in antenna substrate 5 by bonding technology, this kind of craft precision
Height, and be formed by antenna system configuration and stablize, antenna system can be substantially reduced because of the loss of mechanical package bring and error.
Correspondingly, above-mentioned antenna system is directed to, as shown in figure 5, the present embodiment additionally provides the system of this kind of antenna system
Preparation Method, wherein the waveguide feed substrate in the antenna system can be adopted to be prepared with the aforedescribed process.The preparation of the antenna system
Method specifically includes:
The antenna substrate 5 that preparation is completed is fixed together by way of bonding with waveguide feed substrate.
Wherein, by taking antenna substrate 5 is made of phase shifter and the metal patch being arranged on phase shifter as an example；Wherein, with
For liquid crystal phase shifter, first substrate and the second substrate are generally included, and be formed on first substrate and the second substrate
Liquid crystal layer, microstrip line of the first substrate usually by substrate and substrate on the face of liquid crystal layer are constituted, and the second substrate is then by another
One substrate (material can be identical with the substrate in first substrate), and period of the substrate on the face of liquid crystal layer is set
Property arrangement patch electrode constitute, and then setting is used for radiation electric by metal patch on face of the substrate away from patch electrode
Magnetic wave.
So, in bonding, the waveguide feed structure 2 of waveguide feed substrate towards the substrate with microstrip line, with
Waveguide feed substrate and antenna substrate 5 are fixed together, this kind of craft precision height, and it is steady to be formed by antenna system configuration
It is fixed, antenna system can be substantially reduced because of the loss of mechanical package bring and error.
Embodiment 2:
As shown in fig. 6, the waveguide the present embodiment provides a kind of waveguide feed substrate, in the waveguide feed substrate and embodiment
Feed substrate is roughly the same, and difference is, is provided with the second substrate on the second face 22 of waveguide feed structure 2.
It, can be by waveguide feed substrate when being fixed together using the waveguide feed substrate in the present embodiment with antenna substrate
The second substrate 3 be fixed together with the substrate of microstrip line by bonding technology with antenna substrate, craft precision is high in this,
And be formed by antenna system configuration and stablize, antenna system can be substantially reduced because of the loss of mechanical package bring and error.
Wherein, reality can be used in the material of the first substrate 1 and waveguide feed structure 2 in the present embodiment waveguide feed substrate
Apply identical material in example 1.The material of second substrate 3 then can be identical as the first substrate 1, chooses the material that can be bonded with glass
Material.Specifically, the material of the second substrate 3 include: glass, silicon, quartz, ceramics in any one.
Correspondingly, in conjunction with shown in Fig. 7 and 8, the present embodiment additionally provides this for the waveguide feed substrate in the present embodiment
The preparation method of kind waveguide feed substrate, specifically comprises the following steps:
Step 1: taking one first substrate 1, etching forms holding tank 11 in the first substrate 1；Wherein, with the packet of holding tank 11
Bottom is included, the opening opposite with bottom, the first side wall and second side for being connect with bottom and being oppositely arranged and being connect with bottom
Wall.
Step 2: carrying out three faces on the bottom of holding tank 11 and two side walls in the substrate for completing above-mentioned steps
Metal growth, to form the first face 21, third face 23 and the fourth face 24 of waveguide feed structure 2.First face 21 is formed in receiving
The bottom of slot 11, third face 23 are formed on the first side wall of holding tank 11, and fourth face 24 is formed in second sidewall.
Wherein, which specifically includes: by electroplating technology, in the bottom of holding tank 11 and the first side wall and second
Side wall forms metal material, to form the first face 21, third face 23 and the fourth face 24 of waveguide feed structure 2.
Utilize the principle of electrolysis by the side of electric conductor layer overlay metal it should be noted that electroplating technology refers to
Method.Plating refers in the saline solution containing pre- plating metal, using plated parent metal as cathode, by electrolysis, makes to plate
The cation of pre- plating metal is deposited in base metal surface in liquid, forms a kind of method of surface finish of coating.
Certainly, above-mentioned steps, which are also limited to, uses electroplating technology, as long as can be in the bottom of holding tank 11 and two
Trihedral is carried out on side wall into the technique of metal layer.
Step 3: taking one second substrate 3, in the second substrate 3, being formed by patterning processes includes waveguide feed structure 2
The second face 22 figure；Wherein, there is opening in the second face 22 of waveguide feed structure 2.
Wherein, which specifically includes: using sputtering or electroplating technology, metal material layer is formed in the second substrate 3,
Later, expose, develop, etching formed include include waveguide feed structure 2 the second face 22 figure.It needs to illustrate herein
It is to form metal material layer to be also not limited to sputtering and plating, it can be with other any techniques for capableing of depositing metal membrane layer.
Step 4: the first substrate of above-mentioned steps will be completed and complete the second substrate of above-mentioned steps, it is fixed together, shape
At waveguide feed substrate.
Wherein, which specifically by the first substrate for completing above-mentioned steps and can complete above-mentioned steps using bonding technology
The second substrate, be fixed together, formed waveguide feed substrate.
It should be noted that above-mentioned step three can be implemented before step 1.That is, can first complete
The preparation in the second face 22 of the waveguide feed structure 2 in the second substrate, completes the waveguide feed structure on first substrate again later
The preparation in 2 the first face 21, third face 23 and fourth face 24.
Correspondingly, above-mentioned waveguide feed structure 2 is directed to, as shown in figure 9, additionally providing a kind of aerial system in the present embodiment
System, which includes above-mentioned waveguide feed substrate, and certainly, which further includes antenna substrate 5.
It include above-mentioned waveguide feed substrate by antenna system in this present embodiment, it therefore, can be by waveguide feed structure 2
The second substrate 3 be fixed together with the substrate with microstrip line in antenna substrate 5 by bonding technology, this kind of craft precision
Height, and be formed by antenna system configuration and stablize, antenna system can be substantially reduced because of the loss of mechanical package bring and error.
Correspondingly, being directed to above-mentioned antenna system, as shown in Figure 10, the present embodiment additionally provides the system of this kind of antenna system
Preparation Method, wherein the waveguide feed substrate in the antenna system can be adopted to be prepared with the aforedescribed process.The preparation of the antenna system
Method specifically includes:
The antenna substrate 5 that preparation is completed is fixed together by way of bonding with waveguide feed substrate.
Wherein, by taking antenna substrate 5 is made of phase shifter and the metal patch being arranged on phase shifter as an example；Wherein, with
For liquid crystal phase shifter, first substrate and the second substrate are generally included, and be formed on first substrate and the second substrate
Liquid crystal layer, microstrip line of the first substrate usually by substrate and substrate on the face of liquid crystal layer are constituted, and the second substrate is then by another
One substrate (material can be identical with the substrate in first substrate), and period of the substrate on the face of liquid crystal layer is set
Property arrangement patch electrode constitute, and then setting is used for radiation electric by metal patch on face of the substrate away from patch electrode
Magnetic wave.
So, in bonding, the waveguide feed structure 2 of waveguide feed substrate towards the substrate with microstrip line, with
Second substrate 3 of waveguide feed substrate is fixed together with antenna substrate 5, this kind of craft precision height, and it is formed by antenna
System structure is stablized, and can substantially reduce antenna system because of the loss of mechanical package bring and error.
It is understood that embodiment of above is merely to illustrate that the principles of the present invention and uses exemplary
Embodiment, however the utility model is not limited thereto.For those skilled in the art, this is not being departed from
In the case where the spirit and essence of utility model, various changes and modifications can be made therein, these variations and modifications are also considered as this reality
With novel protection scope.
Claims (6)
1. a kind of waveguide feed substrate characterized by comprising
First substrate, with holding tank；The holding tank includes bottom, and connect and be oppositely arranged with the bottom
The first side wall and second sidewall；
Waveguide feed structure, in the holding tank, and the waveguide feed structure is hollow structure, and there is setting to exist
First face for accommodating trench bottom, the second face being oppositely arranged with first face, and it is connected to first face and the
Between the two faces and third face being oppositely arranged and fourth face；Wherein, the third face is arranged on the first side wall, and second
Face is arranged in the second sidewall；Opening is provided on second face.
2. waveguide feed substrate according to claim 1, which is characterized in that the material of first substrate include: glass,
Silicon, quartz, ceramics in any one.
3. waveguide feed substrate according to claim 2, which is characterized in that the material of the waveguide feed structure includes gold
Belong to.
4. waveguide feed substrate according to claim 1, which is characterized in that on the second face of the waveguide feed structure
It is provided with the second substrate.
5. waveguide feed substrate according to claim 4, which is characterized in that the material of second substrate includes: silicon, stone
English, ceramics in any one.
6. a kind of antenna system, which is characterized in that including waveguide feed substrate of any of claims 1-5, and
The antenna substrate being bonded together with the waveguide feed substrate.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821291142.8U CN208889844U (en) | 2018-08-10 | 2018-08-10 | Waveguide feed substrate and antenna system |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201821291142.8U CN208889844U (en) | 2018-08-10 | 2018-08-10 | Waveguide feed substrate and antenna system |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109950697A (en) * | 2018-08-10 | 2019-06-28 | 北京京东方传感技术有限公司 | Waveguide feed substrate and preparation method thereof, antenna system and preparation method thereof |
| CN114156641A (en) * | 2020-09-08 | 2022-03-08 | 京东方科技集团股份有限公司 | Antenna and manufacturing method thereof, antenna device and manufacturing method thereof |
-
2018
- 2018-08-10 CN CN201821291142.8U patent/CN208889844U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109950697A (en) * | 2018-08-10 | 2019-06-28 | 北京京东方传感技术有限公司 | Waveguide feed substrate and preparation method thereof, antenna system and preparation method thereof |
| WO2020030128A1 (en) * | 2018-08-10 | 2020-02-13 | 京东方科技集团股份有限公司 | Waveguide feed substrate and preparation method therefor, and antenna system and preparation method therefor |
| US11228103B2 (en) | 2018-08-10 | 2022-01-18 | Beijing Boe Sensor Technology Co., Ltd. | Waveguide feed substrate and manufacturing method thereof, and antenna system and manufacturing method thereof |
| CN114156641A (en) * | 2020-09-08 | 2022-03-08 | 京东方科技集团股份有限公司 | Antenna and manufacturing method thereof, antenna device and manufacturing method thereof |
| CN114156641B (en) * | 2020-09-08 | 2024-04-19 | 京东方科技集团股份有限公司 | Antenna and manufacturing method thereof, antenna device and manufacturing method thereof |
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