CN208859338U

CN208859338U - A kind of optoelectronic integration integration module

Info

Publication number: CN208859338U
Application number: CN201821553135.0U
Authority: CN
Inventors: 朱锡河
Original assignee: Shenzhen Xingguangbao Optoelectronics Technology Co Ltd
Current assignee: Shenzhen Xingguangbao Optoelectronics Technology Co Ltd
Priority date: 2018-09-22
Filing date: 2018-09-22
Publication date: 2019-05-14
Anticipated expiration: 2028-09-22

Abstract

The utility model discloses a kind of optoelectronic integration integration modules, including substrate, power supply, LED patch and heat dissipation cavity, the upper surface of substrate two sides are pasted respectively is fixed with power supply and LED patch, it is electrically connected between LED patch and power supply by electrode wires, the bottom side of substrate, which is pasted, is fixedly installed heat dissipation cavity, the inside of substrate offers the first radiating area in the bottom side of power supply, the inside of substrate offers the second radiating area in the bottom side of LED patch, the inside of heat dissipation cavity is uniformly fixedly installed there are four cushion socket, it is socketed with damping on the inside of heat dissipation cavity and compresses plate, elongated end end on the inside of cushion socket is compressed with damping to be fixedly connected between plate, by offering heat dissipation cavity on the inside of substrate, radiating area there are two being opened up on substrate, the zone position that radiates is opposite with the position on the inside of LED patch and power supply, so that LE The heat generated in the D patch course of work can shed in time, so that integrated LED lamp radiating efficiency improves, and can prolong its service life.

Description

A kind of optoelectronic integration integration module

Technical field

The utility model relates to integrated led light technology field, specially a kind of optoelectronic integration integration module.

Background technique

LED refers to light emitting diode, is a kind of solid state semiconductor devices that can convert electrical energy into visible light, it can be with Directly convert electricity to light.The heart of LED is the chip of a semiconductor, and one end of chip is attached on a bracket, and one end is Cathode, the other end connect the anode of power supply, are encapsulated entire chip by epoxy resin.

Semiconductor wafer consists of two parts, and a part is P-type semiconductor, and hole is occupied an leading position inside it, another End is N-type semiconductor, is mainly electronics in this side.But when both semiconductors connect, just formation one between them A P-N junction.When electric current acts on this chip by conducting wire, electronics will be pushed to the area P, and electronics is with sky in the area P Cave is compound, and energy then will be issued in the form of photon, and here it is the principles that LED light shines.

Integrated LED lamp deposits following deficiency in use in the prior art:

1, integrated LED lamp radiating efficiency is low, and the heat inside LED patch cannot shed in time, influences making for LED patch Use the service life.

2, it is easily damaged the internal circuit of substrate to shock-absorbing protecting cannot be carried out to LED patch and power supply in installation process, Influence its normal use.

Utility model content

The purpose of this utility model is to provide a kind of optoelectronic integration integration modules, to solve to mention in above-mentioned background technique Out the problem of.

To achieve the above object, the utility model provides the following technical solutions: a kind of optoelectronic integration integration module, including Substrate, power supply, LED patch and heat dissipation cavity, the upper surface of described substrate two sides are pasted respectively is fixed with power supply and LED patch, described It is electrically connected between LED patch and power supply by electrode wires, the bottom side of the substrate, which is pasted, is fixedly installed heat dissipation cavity, the base The inside of plate offers the first radiating area in the bottom side of power supply, and the inside of the substrate offers second in the bottom side of LED patch Radiating area, first radiating area and the second radiating area are connected to the inside of heat dissipation cavity respectively, and the inside of the heat dissipation cavity is uniform Fixed setting there are four cushion socket, be socketed with damping on the inside of the heat dissipation cavity and compress plate, the extension on the inside of the cushion socket End end is compressed with damping to be fixedly connected between plate.

Preferably, the cushion socket includes damper cylinder, shock structure, damping spring and baffle, and the damper cylinder is specially two End has the hollow structure of through hole, and shock structure is socketed on the inside of the damper cylinder, and the intermediate of the shock structure is fixed It is provided with baffle, the damping spring is socketed in the outside of shock structure, and one end of the damping spring is fixed on the interior of damper cylinder Side, the other end end of the damping spring are fixed on the outside of baffle, and the shock structure extends to one end on the inside of heat dissipation cavity End is pasted and fixed on the outside that damping compresses plate.

Preferably, the upper surface of described substrate is uniformly pasted in the outside of LED patch is fixed with marine glue, the marine glue Specially flexible marine glue.

Preferably, the outside of the substrate uniformly offers eight mounting holes.

Preferably, the electrode wires are provided with two and it is electrically connected between the anode of power supply and cathode respectively.

Compared with prior art, the utility model has the beneficial effects that

1, it by offering heat dissipation cavity on the inside of substrate, will be opened up on substrate there are two radiating area, radiate zone position It is opposite with the position on the inside of LED patch and power supply, so that the heat generated in the LED patch course of work can shed in time, So that integrated LED lamp radiating efficiency improves, and can prolong its service life.

2, by the fixation in heat dissipation cavity, there are four damping bases, are connected with damping by cushion socket in the inside of heat dissipation cavity Plate is compressed, so that LED light can offset extraneous shaking under the action of cushion socket and damping compress plate during the installation process, It avoids shaking the influence for generating substrate, can also make normally connection use between power supply and LED patch, it is simple and convenient.

Detailed description of the invention

Fig. 1 is the utility model overall structure top view；

Fig. 2 is the utility model whole interior structural schematic diagram；

Fig. 3 is the utility model shock structure schematic diagram of internal structure.

In figure: 1- substrate；11- mounting hole；The first radiating area of 12-；The second radiating area of 13-；2- power supply；3-LED patch；4- Marine glue；5- electrode wires；6- heat dissipation cavity；7- cushion socket；71- damper cylinder；72- shock structure；73- damping spring；74- baffle；8- Damping compresses plate.

Specific embodiment

The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work Every other embodiment obtained, fall within the protection scope of the utility model.

Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of optoelectronic integration integration module, including base Plate 1, power supply 2, LED patch 3 and heat dissipation cavity 6, the upper surface of described substrate 1 two sides are pasted respectively is fixed with power supply 2 and LED patch 3, It is electrically connected between the LED patch 3 and power supply 2 by electrode wires 5, the bottom side of the substrate 1, which is pasted, is fixedly installed heat dissipation The inside of chamber 6, the substrate 1 offers the first radiating area 12 in the bottom side of power supply 2, and the inside of the substrate 1 is in LED patch 3 Bottom side offer the second radiating area 13, the inside of first radiating area 12 and the second radiating area 13 respectively with heat dissipation cavity 6 connects It is logical, the inside of the heat dissipation cavity 6 uniformly be fixedly installed there are four cushion socket 7, the inside of the heat dissipation cavity 6 is socketed with damping and supports Pressing plate 8, the elongated end end of 7 inside of cushion socket is compressed with damping to be fixedly connected between plate 8.

The cushion socket 7 includes damper cylinder 71, shock structure 72, damping spring 73 and baffle 74, and the damper cylinder 71 is specific The hollow structure of through hole is had for both ends, and is socketed with shock structure 72, the shock structure 72 in the inside of the damper cylinder 71 Centre be fixedly installed baffle 74, the damping spring 73 is socketed in the outside of shock structure 72, the one of the damping spring 73 End is fixed on the inside of damper cylinder 71, and the other end end of the damping spring 73 is fixed on the outside of baffle 74, the damping One end end that column 72 extends to 6 inside of heat dissipation cavity is pasted and fixed on the outside that damping compresses plate 8.

In order to increase its waterproof performance, the upper surface of described substrate 1 the outside of LED patch 3 uniformly paste be fixed with it is anti- Glue 4, the marine glue 4 are specially flexible marine glue, and the outside of the substrate 1 uniformly offers eight mounting holes 11, The electrode wires 5 are provided with two and it is electrically connected between the anode and cathode of power supply 2 respectively.

Working principle: in use, LED light is installed and used by mounting hole 11, peace turn during using cushion socket 7 with subtract Shake compresses the cushioning effect of 8 completing substrate 1 of plate, and the heat that power supply 2 and LED patch 3 generate in use process passes through the first heat dissipation Area 12 and the second radiating area 13 shed, and improve radiating efficiency, economical and practical.

It should be noted that, in this document, relational terms such as first and second and the like are used merely to a reality Body or operation are distinguished with another entity or operation, are deposited without necessarily requiring or implying between these entities or operation In any actual relationship or order or sequence.Moreover, the terms "include", "comprise" or its any other variant are intended to Non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is not only wanted including those Element, but also including other elements that are not explicitly listed, or further include for this process, method, article or equipment Intrinsic element.

While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art, It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.

Claims

1. a kind of optoelectronic integration integration module, including substrate (1), power supply (2), LED patch (3) and heat dissipation cavity (6), the base The upper surface of plate (1) two sides are pasted respectively is fixed with power supply (2) and LED patch (3), it is characterised in that: the LED patch (3) with It is electrically connected between power supply (2) by electrode wires (5), the bottom side of the substrate (1), which is pasted, is fixedly installed heat dissipation cavity (6), institute The inside for stating substrate (1) offers the first radiating area (12) in the bottom side of power supply (2), and the inside of the substrate (1) is in LED patch (3) bottom side offers the second radiating area (13), first radiating area (12) and the second radiating area (13) respectively with heat dissipation cavity (6) inside connection, the inside of the heat dissipation cavity (6) uniformly be fixedly installed there are four cushion socket (7), the heat dissipation cavity (6) Inside be socketed with damping and compress plate (8), the elongated end end and damping on the inside of the cushion socket (7) compress solid between plate (8) Fixed connection.

2. a kind of optoelectronic integration integration module according to claim 1, it is characterised in that: the cushion socket (7) includes Damper cylinder (71), shock structure (72), damping spring (73) and baffle (74), the damper cylinder (71) are specially both ends with perforation The hollow structure in hole, and shock structure (72) are socketed on the inside of the damper cylinder (71), the centre of the shock structure (72) is solid Surely it being provided with baffle (74), the damping spring (73) is socketed in the outside of shock structure (72), and the one of the damping spring (73) End is fixed on the inside of damper cylinder (71), and the other end end of the damping spring (73) is fixed on the outside of baffle (74), institute It states one end end that shock structure (72) extends on the inside of heat dissipation cavity (6) and is pasted and fixed on the outside that damping compresses plate (8).

3. a kind of optoelectronic integration integration module according to claim 1, it is characterised in that: the upper surface of described substrate (1) It uniformly pastes and is fixed with marine glue (4) in the outside of LED patch (3), the marine glue (4) is specially flexible marine glue.

4. a kind of optoelectronic integration integration module according to claim 1, it is characterised in that: the outside of the substrate (1) Uniformly offer eight mounting holes (11).

5. a kind of optoelectronic integration integration module according to claim 1, it is characterised in that: electrode wires (5) setting Have two and its be electrically connected between the anode and cathode of power supply (2) respectively.