CN208834907U - A kind of lateral grooves ceramic capacitor - Google Patents

A kind of lateral grooves ceramic capacitor Download PDF

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Publication number
CN208834907U
CN208834907U CN201821859636.1U CN201821859636U CN208834907U CN 208834907 U CN208834907 U CN 208834907U CN 201821859636 U CN201821859636 U CN 201821859636U CN 208834907 U CN208834907 U CN 208834907U
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Prior art keywords
ceramic
ceramic matrix
lateral grooves
capacitor
ceramic capacitor
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CN201821859636.1U
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Chinese (zh)
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李国正
阙华昌
褚平顺
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KUNSHAN WANFENG ELECTRONICS CO Ltd
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KUNSHAN WANFENG ELECTRONICS CO Ltd
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Abstract

A kind of lateral grooves ceramic capacitor, including capacitor ontology, lead and encapsulated layer.The capacitor ontology is made of ceramic matrix, electrode, lateral grooves, and two electrodes are attached on matrix, welding lead on electrode, and encapsulating material wraps up capacitor ontology and part lead.The lateral grooves are the annular vacancy that ceramic capacitor side is outputed, after being encapsulated material encapsulating, the encapsulating material filling that lateral grooves are insulated, electric field line after making ceramic capacitor be powered along ceramic matrix outer surface is encapsulated material truncation, reduce across the arc discharge risk in surface, furthermore lateral grooves can increase the distance between two electrodes along ceramic surface, further reduce surface creepage risk, it is significantly reduced during ceramic capacitor processing procedure because quality fluctuation causes ceramic capacitor surface to improve ceramic capacitor safety and reliability across the risk of arc.

Description

A kind of lateral grooves ceramic capacitor
Technical field
The utility model relates to the ceramic capacitors that one kind can play filtering, oscillation, coupling in circuit, especially There are the ceramic capacitors of groove for a kind of ceramic matrix side.
Background technique
Ceramic capacitor is the capacitor using ceramics as dielectric material, can play blocking, bypass, coupling in circuit Conjunction, temperature-compensating, transient voltage inhibition, tuning, energy storage, inhibits various effects such as electromagnetic interference at filtering, is nearly all electronics The necessary basic device of equipment.Breakdown voltage is to measure the important indicator of ceramic capacitor performance, and ceramic capacitor is once sent out Raw electrical breakdown, generally can concomitant circuit failure, will lead to the danger such as electric shock, fire when serious, can for guarantee ceramic capacitor It by work, should guarantee not puncture under instantaneous voltage, guarantee not puncture under long-term work voltage again, therefore promoted Product it is breakdown voltage resistant, be always the target persistently improved in the industry.The instantaneous voltage breakdown of ceramic capacitor is generally divided into two Kind, one is the practical receiving voltages of capacitor to exceed ceramic matrix proof voltage limit, and strong electrical field causes freely electric in ceramic matrix Son hits neutral molecule, forms avalanche type electron stream after being allowed to ionization, causes punch through, and such breakdown is generally by ceramic microstructures knot Structure, dielectric thickness, the factors such as electrode area determine that such breakdown occurs inside ceramic dielectric, belong to normal failure breakdown mode. Another breakdown mode is across arcing, and in ceramic dielectric sintering, outer surface is located at the interface of ceramics with air, surface Tension and free energy etc. with the difference of the sintering environment inside ceramics, cause external defects state after sintering more, ceramics The dielectric strength on surface is less than ceramics inside, and in electrode edge because of electric field distortion, field strength direction can be divided into ceramic capacitor in addition Two components vertically downward and horizontally outward are easy to the phenomenon that climbing electrical breakdown along ceramic surface occur, and also referred to as arcing punctures, Breakdown path is generally originated by electrode edge, and breakdown path level extends to ceramic matrix side or self-electrode side along ceramic surface Edge is through outer arrival ceramic matrix side oblique inside porcelain body, hereafter after electricity is climbed in ceramic matrix side, with intimate symmetrical path Reach another electrode edge.The bad form in processing procedure, sintering, welding tining, ceramic matrix surface are typically belonged to across arcing Each processing procedure process such as breakage, encapsulating material gap occurs abnormal, easily leads to across arcing generation, need in the industry one kind can reduce because Processing procedure is abnormal and the ceramic capacitor across arcing risk occurs.
Utility model content
The utility model technical problem to be solved is to provide a kind of horizontal ceramic condenser that meet national standards of proof voltage Device, it can effectively reduce across arc discharge risk, promote the safety of ceramic capacitor.
The utility model solves technical solution used by prior art problem: a kind of ceramic capacitor comprising have Capacitor ontology, first lead, the second lead, encapsulated layer, the cylindrical body ceramics that the capacitor ontology is made of ceramic dielectric material Matrix, ceramic matrix side groove and be attached on ceramic matrix first electrode, second electrode composition, first lead welding On the first electrode, on the second electrode, encapsulated layer wraps up capacitor ontology and part lead, ceramic base side to the welding of the second lead The groove in face is along ceramic matrix side to the annular vacancy outputed inside ceramic matrix, and ceramic matrix side is smooth ring Shape face, annular surface with waves one kind.
Further, the section of the ceramic matrix lateral grooves is rectangle, semicircle, one kind of half elliptic.
Further, the quantity of the ceramic matrix lateral grooves is 1-200 item.
Further, in the section of the ceramic matrix lateral grooves, it is located at innermost point and position inside ceramic matrix In the distance of the outermost point in ceramic matrix side in the horizontal direction be 0.01-5 millimeters.
Ceramic capacitor surface creepage is mainly caused by two factors jointly, and one is ceramic surface resistivity lower than ceramics Internal resistance rate, one is when applying voltage, and the electric field at ceramic capacitor electrode edge can instead give birth to distortion, direction of an electric field be not At electrode vertically downward, it is directed on the outside of electrode, electric field line reaches other side electrode edge, electricity to be similar to the path of camber line Field wire path is approximate with external surface shape, exists and across arcing hidden danger occurs, when being mingled with processing procedure abnormal factors, as sintering is led Cause surface resistivity is abnormal, ceramic matrix marginal density is relatively low, electrode deviation causes surface insulation distance to shorten, encapsulating material solidification Bad situations such as leading to encapsulating material non-tight ceramic matrix surface, easily occur across arcing.The utility model uses The method that groove is outputed in ceramic matrix side, after being encapsulated material encapsulating, the encapsulating material filling insulated inside lateral grooves makes electricity Field wire is extended into the truncation of the encapsulating material inside ceramic matrix along the path of ceramic side, and the electric field line along outer surface, which need to puncture, to be protruded into Encapsulating material can reach another electrode, this structure effectively increases the insulation performance along ceramic matrix surface, in addition, using recessed After the structure of slot, the ceramic plane of inside grooves also corresponds to the outer surface of ceramic matrix, this structure increases between two electrodes Along the distance of ceramic surface, surface creepage risk is further reduced, the utility model can effectively reduce surface creepage risk, increase The big safety of ceramic capacitor.
Compared with the prior art, the utility model has the beneficial effect that the utility model uses the knot of ceramic matrix lateral grooves Structure protrudes into the cured form of groove by encapsulating material, be truncated ceramic capacitor apply voltage after along ceramic matrix surface electricity Field wire path can effectively reduce surface creepage risk, furthermore pass through the structure of groove, it is possible to increase along ceramic matrix surface between electrode Distance, be conducive to be further reduced surface creepage risk, ensure that ceramic capacitor proof voltage level meets national standard, subtract Quality fluctuation causes ceramic capacitor surface to improve ceramic capacitor across the risk of arc during small ceramic capacitor processing procedure Safety and reliability.
Detailed description of the invention
Fig. 1 is a kind of lateral grooves ceramic capacitor structure schematic diagram of the utility model.
Fig. 2 is a kind of lateral grooves ceramic capacitor capacitor ontology front elevation of the utility model.
Fig. 3 is a kind of capacitor ontology sectional view that the side of lateral grooves ceramic capacitor is smooth of the utility model.
Fig. 4 is that a kind of side of lateral grooves ceramic capacitor of the utility model has this body section of the capacitor of waves Figure.
Specific embodiment
The specific embodiment that according to the present invention will be described in detail below with reference to the accompanying drawings:
Embodiment 1, referring to shown in attached drawing 1,2,3, the utility model relates to a kind of lateral grooves ceramic capacitor, packet Capacitor ontology 001 is included, first lead 201, the second lead 202, encapsulated layer 003, capacitor ontology 001 is by cylindrical ceramic base Body 101, the groove 102 of 101 side of ceramic matrix, the first electrode 301 being attached on ceramic matrix 101,302 groups of second electrode At first lead 201 is welded in first electrode 301, and the second lead 202 is welded in second electrode 302, and encapsulated layer 003 wraps Wrap up in capacitor ontology 001, encapsulated layer 003 wraps up a part of 201 second lead 202 of first lead, 101 side of ceramic matrix it is recessed Slot 102 is along ceramic matrix side 103 to the cyclic annular vacancy outputed inside ceramic matrix, and ceramic matrix side 103 is smooth Annular surface, the section of ceramic matrix lateral grooves 102 is rectangle, and the quantity of ceramic matrix lateral grooves 102 is 1, pottery In the section of porcelain basal body lateral grooves 102, it is located at the 101 innermost point in inside of ceramic matrix and is located at ceramic matrix side 103 The distance a of outermost point in the horizontal direction is 1 millimeter.
Embodiment 2, referring to shown in attached drawing 4, in the present embodiment, a kind of lateral grooves ceramic capacitor is in the area of embodiment 1 Be not: the ceramic matrix side 103 is the annular surface with waves, and ceramic matrix lateral grooves 102 are cut Face is half elliptic, and the quantity of ceramic matrix lateral grooves 102 is 2, in the section of ceramic matrix lateral grooves 102, is located at Distance a is the 101 innermost point in inside of ceramic matrix in the horizontal direction with the outermost point in ceramic matrix side 103 is located at 2 millimeters.
The foregoing is merely the better embodiment of the utility model, the protection scope of the utility model is not with above-mentioned reality The mode of applying is limited.

Claims (4)

1. a kind of lateral grooves ceramic capacitor, which is characterized in that include capacitor ontology, first lead, the second lead, encapsulating Layer, the groove of cylindrical body ceramic matrix, ceramic matrix side that the capacitor ontology is made of ceramic dielectric material and is attached to First electrode, second electrode composition on ceramic matrix, first lead are welded on the first electrode, and the second lead is welded on second On electrode, encapsulated layer wraps up capacitor ontology and part lead, and the groove of ceramic matrix side is along ceramic matrix side to pottery The annular vacancy outputed inside porcelain basal body, ceramic matrix side are smooth annular surface, the annular surface with waves It is a kind of.
2. a kind of lateral grooves ceramic capacitor according to claim 1, which is characterized in that the ceramic matrix side The section of groove is rectangle, semicircle, one kind of half elliptic.
3. a kind of lateral grooves ceramic capacitor according to claim 1, which is characterized in that the ceramic matrix side The quantity of groove is 1-200 item.
4. a kind of lateral grooves ceramic capacitor according to claim 1, which is characterized in that the ceramic matrix side is recessed In the section of slot, it is located at innermost point inside ceramic matrix and is located at the outermost point in ceramic matrix side in the horizontal direction Distance be 0.01-5 millimeters.
CN201821859636.1U 2018-11-13 2018-11-13 A kind of lateral grooves ceramic capacitor Active CN208834907U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201821859636.1U CN208834907U (en) 2018-11-13 2018-11-13 A kind of lateral grooves ceramic capacitor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201821859636.1U CN208834907U (en) 2018-11-13 2018-11-13 A kind of lateral grooves ceramic capacitor

Publications (1)

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CN208834907U true CN208834907U (en) 2019-05-07

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CN201821859636.1U Active CN208834907U (en) 2018-11-13 2018-11-13 A kind of lateral grooves ceramic capacitor

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110739152A (en) * 2019-10-22 2020-01-31 暄泰电子(苏州)有限公司 platform type ceramic chip mechanism

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110739152A (en) * 2019-10-22 2020-01-31 暄泰电子(苏州)有限公司 platform type ceramic chip mechanism

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