CN208834339U - Packaging structure of user identification module card - Google Patents
Packaging structure of user identification module card Download PDFInfo
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- CN208834339U CN208834339U CN201821733016.3U CN201821733016U CN208834339U CN 208834339 U CN208834339 U CN 208834339U CN 201821733016 U CN201821733016 U CN 201821733016U CN 208834339 U CN208834339 U CN 208834339U
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- circuit substrate
- chip
- bluetooth communication
- antenna
- communication chip
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 114
- 238000004891 communication Methods 0.000 claims abstract description 105
- 230000015654 memory Effects 0.000 claims description 8
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical group [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 230000019491 signal transduction Effects 0.000 claims description 5
- 229910000859 α-Fe Inorganic materials 0.000 claims description 5
- 238000012360 testing method Methods 0.000 claims description 4
- 230000005611 electricity Effects 0.000 claims description 3
- 230000006870 function Effects 0.000 abstract description 15
- 238000001514 detection method Methods 0.000 abstract description 4
- 230000002349 favourable effect Effects 0.000 abstract 1
- 238000010295 mobile communication Methods 0.000 description 17
- 238000000034 method Methods 0.000 description 7
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000011990 functional testing Methods 0.000 description 2
- 230000007246 mechanism Effects 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- NLHHRLWOUZZQLW-UHFFFAOYSA-N Acrylonitrile Chemical compound C=CC#N NLHHRLWOUZZQLW-UHFFFAOYSA-N 0.000 description 1
- 241001062009 Indigofera Species 0.000 description 1
- UQSXHKLRYXJYBZ-UHFFFAOYSA-N Iron oxide Chemical compound [Fe]=O UQSXHKLRYXJYBZ-UHFFFAOYSA-N 0.000 description 1
- 230000008901 benefit Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000002123 temporal effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/0772—Physical layout of the record carrier
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
- G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
- G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
- G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
- G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
- G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
- G06K19/07745—Mounting details of integrated circuit chips
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Credit Cards Or The Like (AREA)
- Telephone Function (AREA)
Abstract
The embodiment of the creation discloses a packaging structure of a user identification module card, which comprises a circuit substrate and a Bluetooth communication chip arranged on the first side of the circuit substrate and forming a projection area on the circuit substrate, wherein a plurality of electric connection units positioned in the projection area are arranged between the Bluetooth communication chip and the circuit substrate; the packaging body wraps the circuit substrate and the Bluetooth communication chip, and a plurality of contact windows are formed in the second side of the circuit substrate. The Bluetooth communication chip is arranged in the SIM card to achieve richer functions and applications, and the circuit substrate area occupied by the Bluetooth communication chip is saved by the electric connection between the Bluetooth communication chip and the SIM card through the uniformly arranged connection points at the bottom of the Bluetooth communication chip and the special arrangement relation of the connection points; the SIM card quality detection with high efficiency is realized by arranging the contact window on the SIM card, so that the SIM card can meet the size requirement of a miniaturized SIM card and can be provided with more elements, and the SIM card is favorable for achieving richer user experience.
Description
Technical field
This creation is the encapsulating structure about a kind of subscriber identification module card, more particularly identifies mould about a kind of user
Structure arrangement in block card.
Background technique
With the development of mobile communication device, frivolous device body, biggish display screen become the target of pursuit.
The mobile communication device manufacturer of requirement based on to(for) frivolous body, each item in mobile communication device are continuous
Ground is also constantly surely compactified, to allow mobile communication device to have more functions, even by microminiaturization between each item
Have power reservoir capacity more preferably and occupies the biggish high capacity cell of volume to continue the time up to more permanent electric power.
Wherein, subscriber identification module card (Subscriber Identity Module, SIM) is also constantly required to contract
It is small, the Micro-SIM card of 12mm*15mm square is evolved to from the standard SIM card of 15mm*25mm square, then evolve to 8.8mm*
The Nano-SIM card of 12.3mm square, size are constantly reduced, and card thickness is also evolved to from the thickness of about 0.76mm
The Nano-SIM card of 0.67mm or so.
Reach richer mobile communication experience, certainly will need herein a SIM card be built into more function element,
However, be only about for the Nano-SIM card of 0.67mm or so with 8.8mm*12.3mm and thickness, it is how interior in a limited space
Element needed for merging and how the fitting relation between configuration element, just determining in the SIM card size of miniaturization could be by
More elements are set.
Summary of the invention
One of this creation purpose is in size-constrained subscriber identification module card, is placed in required element.
The another object of this creation is to make size-constrained subscriber identification module card still can to have multi-functional.
A further object of this creation, which is to allow, to be had multi-functional subscriber identification module card and is able to efficiently be carried out product
Quality detection.
For the above-mentioned purpose and other purposes, this creation propose a kind of encapsulating structure of subscriber identification module card, include: electricity
Base board, bluetooth communication chip and packaging body.Bluetooth communication chip is the first side of the circuit substrate to be arranged in and described
A view field is formed on circuit substrate, is had between the bluetooth communication chip and the circuit substrate and is electrically connected the bluetooth
Multiple first electrical connecting units of communication chip and the circuit substrate, the multiple first electrical connecting unit are all located at the throwing
In the domain of shadow zone.Packaging body is for coating the circuit substrate and the bluetooth communication chip, and in the phase of the circuit substrate
Instead in offering multiple contact holes in second side of first side, wherein position is in the bluetooth communication chip and the circuit
The thickness of each first electrical connecting unit between substrate is between 0.07~0.10mm.
In one of this creation embodiment, the thickness of bluetooth communication chip can be between 0.215~0.235mm.
In one of this creation embodiment, more may include: the first of the circuit substrate is arranged near field communication antenna
Side.The near field communication antenna includes the antenna loop of chip and spiral surrounding among the chip, and the chip is iron oxygen
Body material, the two-end-point of the antenna loop are located at the bottom of the near field communication antenna, the both ends of the antenna loop
Point is electrically connected the circuit substrate through corresponding second electrical connecting unit respectively, and for signal transduction use, the near field is logical
The thickness of Iflytech's line is between 0.33~0.43mm.
In one of this creation embodiment, the bottom of the near field communication antenna can more have an at least third to be electrically connected order
Member, an at least third electrical connecting unit are used not as signal transduction.
In one of this creation embodiment, more may include: memory, be set to the first side of the circuit substrate and by
The circuit substrate is electrically connected the bluetooth communication chip, externally carries out indigo plant for storing or modifying the subscriber identification module card
Title when tooth is broadcasted.
In one of this creation embodiment, the first side of the circuit substrate can have corresponding bluetooth communication chip bottom
Multiple weld pads of the electrical contact in portion, the multiple weld pad are uniformly distributed in the view field.
In one of this creation embodiment, circuit substrate is multilager base plate, and the first side of the circuit substrate is described more
The size on the surface of the top layer of laminar substrate, the subscriber identification module card meets Nano-SIM specification.
In one of this creation embodiment, the multiple contact hole can be opened on the packaging body, and neighbouring institute
The lowest level of the multilager base plate in circuit substrate is stated, the most lower of the multilager base plate is arranged in for exposing in the multiple contact hole
Multiple first kind terminals and multiple second class terminals on the surface of layer, the multiple first kind terminal make for mobile communication device
With the multiple second class terminal uses when testing for the additional functional property of the subscriber identification module card.
In one of this creation embodiment, bluetooth communication chip is not connected with the Bluetooth antenna line outside the bluetooth communication chip
Road.
For the above-mentioned purpose and other purposes, this creation also proposes a kind of encapsulating structure of subscriber identification module card, described
The size of subscriber identification module card meets Nano-SIM specification, and the encapsulating structure includes: circuit substrate, bluetooth above-mentioned
Communication chip, near field communication antenna and the first secure element chip.The first of the circuit substrate is arranged near field communication antenna
Side is electrically connected the circuit substrate by multiple second electrical connecting units.First secure element chip is arranged in the circuit
First side of substrate is electrically connected the circuit substrate by multiple first lead units.
In one of this creation embodiment, circuit substrate can be multilager base plate, and the first side of the circuit substrate is described
The surface of the top layer of multilager base plate, the encapsulating structure further include: Bluetooth antenna route is arranged in the multilager base plate
Interbed, and part weight is presented in the Bluetooth antenna route and the near field communication antenna in the vertical direction of the circuit substrate
Folded, the Bluetooth antenna route and the near field communication antenna are all positioned adjacent to the edge of the circuit substrate, the near field
Communication antenna is ferrite antenna.
It more may include the second secure element chip in one of this creation embodiment, dislocation is stacked in first safety
On element chip, it is electrically connected the circuit substrate by multiple second lead wire units, second secure element chip does not hide
State multiple electric connection contacts on the first secure element chip surface in covert.
Whereby, it is set in subscriber identification module card through bluetooth communication chip, can reach richer function and application
(such as: by bluetooth communication pipeline, access mechanism and authentication mechanism are formed on payment flow on line), and by bluetooth communication
Particular arrangement relationship between chip and circuit substrate can save the circuit substrate area occupied needed for bluetooth communication chip, also have
Help the thickness specification for meeting Nano-SIM card；Further, contact hole being opened up on subscriber identification module card can also reach
Efficient SIM card Quality Detection, subscriber identification module card can be met outside the SIM card size requirement of miniaturization, which to be set,
More elements are set, help to reach richer user experience by multi-functional subscriber identification module card.
Detailed description of the invention
Fig. 1 is the fragmentary cross-sectional view of the encapsulating structure in one embodiment of this creation in subscriber identification module card；
Fig. 2 is the top partial view diagram of the circuit substrate in Fig. 1 embodiment in subscriber identification module card；
Fig. 3 is the top view of the circuit substrate in one embodiment of this creation in subscriber identification module card；
Fig. 4 is the sectional view at the near field communication antenna position of the encapsulating structure in Fig. 3 embodiment in subscriber identification module card；
Fig. 5 is the partial cutaway schematic view of circuit substrate in one embodiment of this creation；
Fig. 6 is the configuration diagram of near field communication antenna and Bluetooth antenna route in one embodiment of this creation；
Fig. 7 is the top view that this creates the circuit substrate in another embodiment in subscriber identification module card；
Fig. 8 is the schematic bottom view of subscriber identification module card in one embodiment of this creation.
Specific embodiment
For the purpose, feature and effect for fully understanding this creation, hereby by following specific embodiments, and cooperate attached drawing,
This creation is described in detail, is illustrated as after:
In this article, described term " include including have " or other it is any it is similar with the meaning of one's words be non-to be only limitted to this
These important documents listed by text, but may include not expressly listed but module card, chip, element, structure, device or
Usually intrinsic other important documents or step in method.
In this article, described term " electrical connection, be electrically connected " come describe the element, chip, device etc. its
Connection relationship between his representation function element or object etc. can represent between the two connected directly or indirectly.Between the two
It may include other elements or object etc. for representation function such as other elements, chip, device, and can reach simultaneously and exist between the two
The function or movement reached needed under connection relationship.In addition, the size dimension of block is only signal in each figure, unless Yu Wenzhong has
Obviously separately refer to that he anticipates, is otherwise not a kind of limitation.
In this article, the word of the similar ordinal number such as described its " first " or " second ", is to be associated with to distinguish or refer to
Same or similar unit, element or structure, and not necessarily imply the sequence of these units, element or structure spatially.It answers
It is appreciated that, in certain situations or configuration, implementation that the ordinal number family of languages is used interchangeably without influencing this creation.
The embodiment of this creation is to go out the configuration of related elements in subscriber identification module card for example, is matched by such
It sets, more spaces can be saved in narrow narrow subscriber identification module card, for accommodating more function element, core
Piece etc. so that subscriber identification module fixture is for more functions, and then allow user can experience experienced to richer mobile communication.
Exemplary every configuration system is applicable to the subscriber identification module card of various sizes in this creation embodiment, such as: mark
It is all applicable in quasi- SIM card, Micro-SIM card, Nano-SIM card or even smaller SIM card.The embodiment of this creation
System with Nano-SIM card as an example, with the specification (8.8mm*12.3mm, thickness about 0.76mm) of Nano-SIM card as important document,
Exemplary items in this creation embodiment are allowed to be arranged to meet the specification of Nano-SIM card, to be placed in Nano-SIM card.
Fig. 1 and Fig. 2 is please referred to, Fig. 1 is the part of the encapsulating structure in one embodiment of this creation in subscriber identification module card
Sectional view, Fig. 2 are the top partial view diagrams of the circuit substrate in Fig. 1 embodiment in subscriber identification module card.In the encapsulating structure
Include: circuit substrate 100, bluetooth communication chip 200 and packaging body 300.
Circuit substrate 100 is for carrying every electronic component in subscriber identification module card, such as: active member, passive
Element, transmission line etc., circuit substrate 100 preferably use multilager base plate, make full use of by the design of multilayer build-up
The area of each laminar substrate, so can in specific layer arrangement particular element or route, with up to making full use of in use space or its
His effect, rear extended meeting is in detailed description.
As shown in Figure 1, packaging body 300 coats circuit substrate 100 and bluetooth communication chip 200 above-mentioned, packaging body 300 can
For plastics glue material, for example may be used are as follows: plastics of polyvinyl chloride (PVC), acrylonitrile (ABS) or combinations thereof or other are suitable
For configuring the material of SIM card.Packaging body 300 is after solidifying and being cut, the subscriber identification module card of achievable each sheet.
Wherein, packaging body 300 can be offered multiple contact holes 310 at the position of second side 120 of proximate circuitry substrate 100, these
Contact hole 310 exposes the two kinds of contact terminal in second side 120 of circuit substrate 100: first kind terminal 130,
Two class terminals 140.
First kind terminal 130 can be defined as installing in subscriber identification module card to mobile communication device, for mobile logical
It interrogates device and connects and use, such as when subscriber identification module card is installed in the card slot of mobile communication device, through the first kind
Terminal 130 and mobile communication device generate contact and are electrically connected.These first kind terminals 130 for example may be used are as follows: the end VCC
Son, RST terminal, CLK terminal, I/O terminal and GND terminal etc..
Second class terminal 140 can be defined as the use when subscriber identification module card is by carry out additional functional property test,
Such as: blue tooth communication function, near-field communication function etc., in other words, the non-contact for mobile communication device of the second class terminal 140 connect
Connect use, when subscriber identification module card is installed in the card slot of mobile communication device, the second class terminal 140 not with mobile communication
Device generates contact and is electrically connected.Second class terminal 140 is directed through contact hole 310 and is revealed in outside subscriber identification module card,
It may make the Function detection of subscriber identification module card to become efficient, be easy to the element for determining flaw occur, and then after being conducive to
Judgement and disposition in continuous quality management.
As shown in Figure 1, bluetooth communication chip 200 is arranged on the first side 110 of circuit substrate 100, further say, it is blue
Tooth communication chip 200 be fixed on circuit substrate 100 by multiple first electrical connecting units 151, meanwhile, bluetooth is logical
News chip 200 can form a view field 105 on the first side 110 of circuit substrate 100 (refering to Fig. 2).Exemplified by Fig. 2
, it is the range size presented on circuit substrate 100 after representing the setting of bluetooth communication chip 200 with a dotted line frame, this
A little first electrical connecting units 151 all can be located at view field 105 in, the first electrical connecting unit 151 for example may be used are as follows: tin or its
His conductive material.
In view field 105 on 100 first side 110 of circuit substrate, can configure corresponding 200 bottom of bluetooth communication chip it
Multiple weld pads 104 of electrical contact allow by such as surface mount processing procedure (Surface Mount Technology, SMT)
Bluetooth communication chip 200 sticks together on the first side 110 of circuit substrate 100, and is electrically connected these weld pads 104, Jin Erye
Bluetooth communication chip 200 is allowed to be fixed on circuit substrate 100.
Bluetooth communication chip 200 can make the electrical contact of bluetooth communication chip 200 by re-distribution layer or other modes
200 bottom of bluetooth communication chip can be all located at, and can be by the configuration mode being evenly distributed, so that throwing on circuit substrate 100
Weld pad 104 in shadow zone domain 105 can generally be evenly distributed as shown in Figure 2, rather than only be distributed in surrounding or side, can not so make
Use the substrate area of 105 exterior circumferential of view field.Bluetooth communication chip 200 has the thickness of 0.215~0.235mm, compared with
It is good to be maintained at 0.225mm.
In addition, the demand thin based on thickness letter, 200 lower section of bluetooth communication chip with 0.215~0.235mm thickness
Electrical contact, to avoid occur missing solder or other electrically it is undesirable happen, must just control 151 institute of the first electrical connecting unit
The thickness of formation, it is too thin to be easy to produce missing solder or other electrical bad situations, it is too thick and be not easy to reach the thin demand of thickness letter
Or lead to the incorrect phenomenon of electrical conductivity (such as: unsuitable electrical connection occurring between adjacent contacts).Therefore, this wound
Make the first electrical connecting unit 151 that example in embodiment goes out below bluetooth communication chip 200 and be formed by thickness, is that control exists
Within 0.11mm, it is preferably between 0.07~0.10mm, so that the subscriber identification module card after the completion of encapsulation may conform to Nano-
The specification of SIM card and good electric connection can be maintained.
Setting about bluetooth communication chip 200, for example, 200 bottom of bluetooth communication chip can be in each electrically touching
Point is equipped with tin ball, in this way, allowing on weld pad 104 only needs to be applied least a portion of tin cream, penetrates piece in bluetooth communication chip 200
Process is placed on circuit substrate 100 and after high temperature tin furnace, and the first electrical connecting unit 151 can be allowed to be formed by thickness and controlled
Within 0.11mm.
Referring to Fig. 3, Fig. 3 is the top view of the circuit substrate in one embodiment of this creation in subscriber identification module card.It is blue
Tooth communication chip 200 can arrange in pairs or groups memory 210 again, memory 210 be arranged on the first side 110 of circuit substrate 100 (can be same
When refering to fig. 1), and by the transmission line of circuit substrate 100 be electrically connected bluetooth communication chip 200.Memory 210 be for
Storage subscriber identification module card externally carries out title when Bluetooth broadcast, and then for modification, to correspond to subscriber identification module card
Card issuer, and then can when subscriber identification module card is mass produced, be not limited by bluetooth communication chip 200 be bound
Bluetooth broadcast title.Although also that is, being generally configured with storage element in bluetooth communication chip 200, this implementation of this creation
In example and it is not used, but takes the mode of a plug-in memory 210 to reach multi-functional effect.The implementation of this creation
In example, for additional memory 210 is arranged, this can also be attributed to the fact that the circuit substrate face occupied needed for saving bluetooth communication chip
The further bring benefit of institute after product.
Oscillator 220 as shown in figure 3, bluetooth communication chip 200 must also arrange in pairs or groups, to further provide for bluetooth communication work
Temporal information needed for making.In one embodiment, it is only necessary to which the oscillator for the 16MHz that arranges in pairs or groups can enable bluetooth communication chip 200
It works.
Fig. 3 and Fig. 4 is please referred to, Fig. 4 is the near-field communication day of the encapsulating structure in Fig. 3 embodiment in subscriber identification module card
The sectional view at line position.As shown in figure 3, can more be configured near-field communication chip 400 and near field communication antenna on circuit substrate 100
410.Near field communication antenna 410 is arranged on the first side 110 of circuit substrate 100, and near field communication antenna 410 is by multiple second
Electrical connecting unit 152 is electrically connected circuit substrate 100.
Near field communication antenna 410 can include the antenna loop 412 of chip 411 and spiral surrounding among chip 411.Core
Piece 411 is Ferrite Material, and the two-end-point of antenna loop 412 is located at the bottom of near field communication antenna 410, this two-end-point point
It Tou Guo not corresponding second electrical connecting unit 152 (such as two the second electrical connecting units 152 that Fig. 4 was indicated) electric connection electricity
Base board 100, for signal transduction use.In addition, the thickness of near field communication antenna 410 is between 0.33~0.43mm.Further,
The bottom of near field communication antenna 410 can more have at least one third electrical connecting unit 153, and third electrical connecting unit 153 is not
It is intended for signal transduction use, but has the function that near field communication antenna 410 to be stabilized on circuit substrate 100 and anti-
Only near field communication antenna 410 is there is a phenomenon where warpage, in addition, the configuration of near field communication antenna 410 can same processing procedure (such as:
SMT processing procedure) under be completed.
Referring to Fig. 5, Fig. 5 is the partial cutaway schematic view of circuit substrate in one embodiment of this creation.The exemplary circuit of Fig. 5
Substrate 100 is a kind of multilager base plate, and the first side 110 of circuit substrate 100 is the surface of the top layer of this multilager base plate, second
Side 120 is the undermost surface of this multilager base plate.Can for example be divided into multilager base plate upper layer 101, middle layer 102 and under
Layer 103, be that four superficial layers are combined into two-layer substrate for the example of Fig. 5, comprising: the first side 110, the first side phase
It tosses about 111, second side 120, the opposite side of second side 121.Partial conductance line arrangements can be led in each layer, such as ground connection whereby
Line or power lead are set to surface or the internal layer of multilager base plate, and conductive hole is set in earth lead or power lead, and with
Earth lead or power lead electrically isolate, and each conductive hole is respectively turned on the route of the different layers of multilayer circuit board, configured in this way
Under, so that upper area limited users identification module card, is able to configure more function element.
Referring to Fig. 6, Fig. 6 is the configuration of near field communication antenna 410 and Bluetooth antenna route 230 in one embodiment of this creation
Figure.Bluetooth antenna route 230 is represented by dotted lines, and refers to that the Bluetooth antenna route 230 is not configured in circuit substrate 100
On first side 110, but it is configured in the middle layer of multilager base plate, while by other metallic circuits are formed, is also formed blue
Tooth antenna traces 230, and then in addition to the area occupied on the first side 110 that can save circuit substrate 100, processing procedure step can also be saved
Suddenly.In addition, under near field communication antenna 410 is coated by Ferrite Material, it can be with Bluetooth antenna route 230 in circuit substrate
It is overlappingly configured in 100 vertical direction (or normal direction), and then the elasticity of configure the line in circuit substrate 100 can be increased
Degree.
However, also can not arrange in pairs or groups or be not connected under other state sample implementations of this creation, interrupt this Bluetooth antenna route
230, allow bluetooth communication chip 200 only to be communicated with the bluetooth module in mounted mobile communication device.
As shown in figure 3, the first secure element chip 510 is configured on the first side 110 of circuit substrate 100, the first peace
Full element chip 510 is electrically connected circuit substrate 100 by first lead unit 161, then by configuration in circuit substrate 100
First kind terminal 130 (such as: VCC terminal, RST terminal, CLK terminal, I/O terminal and GND terminal) in second side 120, coupling
The baseband chip of mounted mobile communication device, and then form the connection in the channel ISO7816.
Referring to Fig. 7, Fig. 7 is this top view for creating the circuit substrate in another embodiment in subscriber identification module card.
Difference with Fig. 3 is, in the present embodiment, secure element chip is divided into the second secure element chip 521 and third safety member
Part chip 522, such as: safety of payment element and telecommunication security element.Wherein, the second secure element chip 521 and third safety
522 system of element chip is that dislocation type stacks, and can expose the electrical contact on its surface with the safety chip under making way for supply
Lead wire unit is electrically connected.In addition, the blank space for not indicating element in Fig. 3 and Fig. 7 is only the signal at other elements setting,
It is not necessarily referring to do not have any element at this.
Second secure element chip 521 is that circuit substrate 100 is electrically connected by the second lead wire unit 162, third safety
Element chip 522 is then to be electrically connected circuit substrate 100 by third lead wire unit 163.For example, safety of payment element by
Bluetooth communication chip and near-field communication chip are individually coupled by different interfaces；The mounted movement of telecommunication security element coupling
The baseband chip of communication device, and then form the connection in the channel ISO7816.
Referring to Fig. 8, Fig. 8 is the schematic bottom view of subscriber identification module card in one embodiment of this creation.As shown in figure 8,
First kind terminal 130 (mobile communication device, which connects, to be used) and the second class terminal are divided into the bottom surface of subscriber identification module card
140 (functional test use), and be all direct exposed electrical contact, especially the second class terminal 140, under Multifunctional integration
Subscriber identification module card, these the second class terminals 140 facilitate the convenience of every test of additional function.
This creation has hereinbefore been disclosed with preferred embodiment, and being so familiar with the technology person should be understood that the implementation
Example is only used for describing this creation, and is not construed as limiting the range of this creation.It should be noted that such as with the embodiment etc.
The variation and displacement of effect, should all be set as being covered by the scope of this creation.Therefore, the protection scope of this creation is when with claim
Subject to institute's defender.
[symbol description]
100 circuit substrates
101 upper layers
102 middle layers
103 lower layers
The weld pad of 104 corresponding bluetooth communication chips
105 view fields
First side of 110 circuit substrates
The opposite side of first side of 111 circuit substrates
Second side of 120 circuit substrates
The opposite side of second side of 121 circuit substrates
130 first kind terminals (mobile communication device, which connects, to be used)
140 second class terminals (functional test use)
151 first electrical connecting units
152 second electrical connecting units
153 third electrical connecting units
161 first lead units
162 second lead wire units
163 third lead wire units
200 bluetooth communication chips
210 memories
220 oscillators
230 Bluetooth antenna routes
300 packaging bodies
310 contact holes
400 near-field communication chips
410 near field communication antennas
411 chips
412 antenna loops
510 first secure element chips
521 second secure element chips
522 third secure element chips.
Claims (12)
1. a kind of encapsulating structure of subscriber identification module card, it is characterised in that include:
One circuit substrate；
One bluetooth communication chip is set to the first side of the circuit substrate and forms a projected area on the circuit substrate
Domain has between the bluetooth communication chip and the circuit substrate and is electrically connected the bluetooth communication chip and the circuit substrate
Multiple first electrical connecting units, the multiple first electrical connecting unit is all located in the view field；And
One packaging body coats the circuit substrate and the bluetooth communication chip, and in the circuit substrate in contrast to described
Multiple contact holes are offered in second side of first side,
Wherein, the thickness of each first electrical connecting unit between the bluetooth communication chip and the circuit substrate is situated between
In 0.07~0.10mm.
2. encapsulating structure as described in claim 1, it is characterised in that: the thickness of the bluetooth communication chip between 0.215~
0.235mm。
3. encapsulating structure as described in claim 1, it is characterised in that further include: a near field communication antenna is set to the electricity
First side of base board, the near field communication antenna include the antenna of a chip and spiral surrounding among the chip and return
Road, the chip are Ferrite Material, and the two-end-point of the antenna loop is located at the bottom of the near field communication antenna, institute
The two-end-point for stating antenna loop is electrically connected the circuit substrate through corresponding second electrical connecting unit respectively, for signal biography
Use is led, the thickness of the near field communication antenna is between 0.33~0.43mm.
4. encapsulating structure as claimed in claim 3, it is characterised in that: the bottom of the near field communication antenna has more at least one
Third electrical connecting unit, an at least third electrical connecting unit are used not as signal transduction.
5. encapsulating structure as described in claim 1 is characterized in that further including: a memory is set to the circuit substrate
First side is simultaneously electrically connected the bluetooth communication chip by the circuit substrate, for storing or modifying the subscriber identification module
Card externally carries out title when Bluetooth broadcast.
6. encapsulating structure as described in claim 1, it is characterised in that: described in having and correspond in the first side of the circuit substrate
Multiple weld pads of the electrical contact of bluetooth communication chip bottom, the multiple weld pad are distributed in the view field.
7. such as encapsulating structure of any of claims 1-6, it is characterised in that: the circuit substrate is multilager base plate,
First side of the circuit substrate is the surface of the top layer of the multilager base plate, the size of the subscriber identification module card
Meet Nano-SIM specification.
8. encapsulating structure as claimed in claim 7, it is characterised in that: the multiple contact hole is provided on the packaging body,
And the lowest level of the multilager base plate in the neighbouring circuit substrate, the multiple contact hole are arranged for exposing in the multilayer
Multiple first kind terminals and multiple second class terminals on the undermost surface of substrate, the multiple first kind terminal is for movement
Communication device uses, and the multiple second class terminal uses when testing for the additional functional property of the subscriber identification module card.
9. encapsulating structure as claimed in claim 7, it is characterised in that: the bluetooth communication chip is not connected with the bluetooth communication
Bluetooth antenna route outside chip.
10. a kind of encapsulating structure of subscriber identification module card, the size of the subscriber identification module card meet Nano-SIM
Specification, it is characterised in that the encapsulating structure includes:
One circuit substrate；
One bluetooth communication chip is set to the first side of the circuit substrate and forms a projected area on the circuit substrate
Domain has between the bluetooth communication chip and the circuit substrate and is electrically connected the bluetooth communication chip and the circuit substrate
Multiple first electrical connecting units, the multiple first electrical connecting unit is all located in the view field；
One near field communication antenna is set to the first side of the circuit substrate, is electrically connected by multiple second electrical connecting units
The circuit substrate；And
One first secure element chip is set to the first side of the circuit substrate, electrically connects by multiple first lead units
Connect the circuit substrate.
11. encapsulating structure as claimed in claim 10, it is characterised in that: the circuit substrate is multilager base plate, the circuit
First side of substrate is the surface of the top layer of the multilager base plate, and the encapsulating structure further includes:
The middle layer of the multilager base plate is arranged in one Bluetooth antenna route, and the Bluetooth antenna route and the near field are logical
Iflytech's line partly overlaps in the vertical direction of the circuit substrate, and the Bluetooth antenna route and the near field communication antenna are all
It is positioned adjacent to the edge of the circuit substrate, the near field communication antenna is ferrite antenna.
12. encapsulating structure as claimed in claim 10, it is characterised in that further include one second secure element chip, dislocation is stacked
In in first secure element chip, the circuit substrate, second peace are electrically connected by multiple second lead wire units
Full element chip does not cover multiple electric connection contacts on first secure element chip surface.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| TW107133696 | 2018-09-25 | ||
| TW107133696A TWI672635B (en) | 2018-09-25 | 2018-09-25 | User identification module card packaging structure and manufacturing method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208834339U true CN208834339U (en) | 2019-05-07 |
Family
ID=66319470
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811242310.9A Pending CN110942133A (en) | 2018-09-25 | 2018-10-24 | Packaging structure of user identification module card and manufacturing method thereof |
| CN201821733016.3U Active CN208834339U (en) | 2018-09-25 | 2018-10-24 | Packaging structure of user identification module card |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811242310.9A Pending CN110942133A (en) | 2018-09-25 | 2018-10-24 | Packaging structure of user identification module card and manufacturing method thereof |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN110942133A (en) |
| TW (1) | TWI672635B (en) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM467960U (en) * | 2013-07-23 | 2013-12-11 | Mao Bang Electronic Co Ltd | Adhesion card for smart card |
-
2018
- 2018-09-25 TW TW107133696A patent/TWI672635B/en active
- 2018-10-24 CN CN201811242310.9A patent/CN110942133A/en active Pending
- 2018-10-24 CN CN201821733016.3U patent/CN208834339U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| CN110942133A (en) | 2020-03-31 |
| TW202013257A (en) | 2020-04-01 |
| TWI672635B (en) | 2019-09-21 |
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