CN208819833U - Metal-oxide-semiconductor clubfoot shaper - Google Patents
Metal-oxide-semiconductor clubfoot shaper Download PDFInfo
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- CN208819833U CN208819833U CN201821057734.3U CN201821057734U CN208819833U CN 208819833 U CN208819833 U CN 208819833U CN 201821057734 U CN201821057734 U CN 201821057734U CN 208819833 U CN208819833 U CN 208819833U
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Abstract
The utility model relates to a kind of metal-oxide-semiconductor clubfoot shapers, pin bending for metal-oxide-semiconductor, include: feeding mechanism, including feed member, feeding driving and impeller, is provided with sliding slot and hopper on feed member, sliding slot is connected to hopper, metal-oxide-semiconductor item is placed in sliding slot, and feeding driving transmission connection is in impeller, and impeller is under the driving that feeding drives, metal-oxide-semiconductor is pushed to move along hopper, until the pin of metal-oxide-semiconductor stretches out hopper；Feeding distribution mechanism, including sub-material actuator and cutting member, sub-material actuator are sequentially connected in cutting member, and cutting member is extend into sliding slot, and single metal-oxide-semiconductor is cut to separation from metal-oxide-semiconductor item, and the single metal-oxide-semiconductor isolated is fallen into hopper；First foldable component and the second foldable component press pin from the pin two sides of metal-oxide-semiconductor respectively, and complete the bending and molding of pin by the second foldable component.Above-mentioned metal-oxide-semiconductor bent angle molding machine can be realized the pin bending forming of the metal-oxide-semiconductor of small batch, and structure is simple, and cost is relatively low.
Description
Technical field
The utility model relates to field of machining, more particularly to a kind of metal-oxide-semiconductor clubfoot shaper.
Background technique
Metal-oxide-semiconductor item of the metal-oxide-semiconductor before processing, usually by the arrangement of a string of metal-oxide-semiconductors to be processed into strips.And MOS
Pipe will be installed on pcb board, it is necessary first to by the bending step of pin.When carrying out the Bending Processing of a large amount of MOS, Ke Yitong
Dedicated bending equipment is crossed to carry out, such equipment is generally more valuable, and if only carry out a small amount of production, processed using equipment
So that production cost is excessively high, but if singly going to form with mold with hand by operator, production efficiency is again too low for meeting.
It is therefore desirable to have a kind of can be suitable for the processing of a small amount of metal-oxide-semiconductor, lower-cost equipment.
Utility model content
Based on this, it is necessary to aiming at the problem that the at high cost of a small amount of metal-oxide-semiconductor processing, low efficiency, provide a kind of metal-oxide-semiconductor clubfoot
Molding machine.
A kind of metal-oxide-semiconductor bent angle molding machine, the pin bending for metal-oxide-semiconductor, comprising:
Feeding mechanism, including feed member, feeding driving and impeller are provided with sliding slot and hopper, institute on the feed member
It states sliding slot to be connected to the hopper, metal-oxide-semiconductor item is placed in the sliding slot, and the feeding driving transmission connection is in the promotion
Part, the impeller pushes metal-oxide-semiconductor to move along the hopper under the driving that the feeding drives, until the pin of metal-oxide-semiconductor
Stretch out the hopper；
Feeding distribution mechanism, including sub-material actuator and cutting member, the sub-material actuator transmission connection is in the cutting member, institute
It states cutting member to extend into the sliding slot, single metal-oxide-semiconductor is cut to separation from metal-oxide-semiconductor item, the single metal-oxide-semiconductor isolated is fallen into
In the hopper；
First foldable component and the second foldable component press pin from the pin two sides of metal-oxide-semiconductor respectively, and by described second
The bending and molding of foldable component completion pin.
The feed member includes pedestal and fixing seat in one of the embodiments, and the fixing seat is fixedly connected on institute
Pedestal is stated, the sliding slot is set in the fixing seat, and the hopper is set on the pedestal.
The fixing seat is removably connected to the pedestal in one of the embodiments,.
There are two the sub-material actuator and the cutting member are respectively provided in one of the embodiments, in cutting,
In a cutting member resist metal-oxide-semiconductor item, another cutting member cutting.
First foldable component includes the first bending actuator, the first connector and the in one of the embodiments,
One clamping element, in first connector, first clamping element is fixedly connected on for the first bending actuator transmission connection
First connector, first connector and first clamping element are moved down in the driving of the first bending actuator
It is dynamic.
Second foldable component includes the second bending actuator, the second connector, second in one of the embodiments,
Clamping element and bending part, in second connector, second clamping element is fixed for the second bending actuator transmission connection
Second connector, second connector and second clamping element are connected in the driving of the second bending actuator
Lower movement, the bending part are fixedly connected on the connector, and first clamping element and second clamping element are respectively in institute
It states and is moved toward one another under the driving of the first bending actuator, the second bending actuator, when being moved to predeterminated position, described
One clamping element, second clamping element clamp the pin of metal-oxide-semiconductor from two sides, and complete bending by the bending part.
Second connector includes moving member, first crossbar, sliding block and elastic component, institute in one of the embodiments,
The shaft that moving member is connected to the second bending actuator is stated, the first crossbar is fixedly connected on the moving member, described
Elastic component is set between the first crossbar and the sliding block, and one end is connected to the first crossbar, and the other end is connected to institute
Sliding block is stated, second clamping element is set on the sliding block, is fixedly connected on the sliding block, and the bending part is set to described
On moving member.
Second connector further includes second crossbar in one of the embodiments, the close institute of the second crossbar
Stating setting on the end face of first crossbar, there are three protrusions, thus on the end face close to the first crossbar of the second crossbar
The first empty slot and the second empty slot are formed, the sliding block is fastened in first empty slot, in the drive of the second bending actuator
Under dynamic, the first crossbar can be slided along second empty slot, and compress the elastic component.
First connector is identical with the structure of second connector in one of the embodiments,.
It in one of the embodiments, further include slide bar, the sliding block edge of first connector and second connector
The slide bar slide in opposition.
In one of the embodiments,
Above-mentioned metal-oxide-semiconductor bent angle molding machine is divided single metal-oxide-semiconductor by feeding mechanism and feeding distribution mechanism from metal-oxide-semiconductor item
From when metal-oxide-semiconductor item is inserted into sliding slot, cutting member cuts down single metal-oxide-semiconductor from metal-oxide-semiconductor item, and feeding driving driving pushes
Part pushes the metal-oxide-semiconductor cut down to move along hopper, until the pin of metal-oxide-semiconductor stretches out outside hopper, the first foldable component and the
Two foldable components press pin from the pin two sides of metal-oxide-semiconductor respectively respectively, after clamping, complete pin by the second foldable component
Bending forming, structure is simple, cost is relatively low, the pin bending forming of the metal-oxide-semiconductor suitable for small batch.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the metal-oxide-semiconductor bent angle molding machine of an embodiment of the present invention；
Fig. 2 is the configuration schematic diagram of the metal-oxide-semiconductor bent angle molding machine of an embodiment of the present invention；
Fig. 3 is the local explosion structure diagram of the metal-oxide-semiconductor bent angle molding machine of an embodiment of the present invention；
Fig. 4 is the structural schematic diagram of the first foldable component of the metal-oxide-semiconductor bent angle molding machine of an embodiment of the present invention；
Fig. 5 is the structural schematic diagram of the second foldable component of the metal-oxide-semiconductor bent angle molding machine of an embodiment of the present invention；
Fig. 6 is the structural schematic diagram of the second crossbar of the metal-oxide-semiconductor bent angle molding machine of an embodiment of the present invention.
Specific embodiment
The utility model is more fully retouched below with reference to relevant drawings for the ease of understanding the utility model,
It states.The better embodiment of the utility model is given in attached drawing.But the utility model can come in many different forms
It realizes, however it is not limited to embodiments described herein.On the contrary, the purpose of providing these embodiments is that making practical new to this
The disclosure of type understands more thorough and comprehensive.
It should be noted that it can directly on the other element when element is referred to as " being fixed on " another element
Or there may also be elements placed in the middle.When an element is considered as " connection " another element, it, which can be, is directly connected to
To another element or it may be simultaneously present centering elements.Term as used herein " vertical ", " horizontal ", " left side ",
" right side " and similar statement for illustrative purposes only, are not meant to be the only embodiment.
Unless otherwise defined, all technical and scientific terms used herein are led with the technology for belonging to the utility model
The normally understood meaning of the technical staff in domain is identical.Terminology used in the description of the utility model herein only be
The purpose of description specific embodiment, it is not intended that in limitation the utility model.Term " and or " used herein packet
Include any and all combinations of one or more related listed items.
Please refer to Fig.1 to Fig.3, Fig. 1 to Fig. 3 illustratively show the metal-oxide-semiconductor bent angle of an embodiment of the present invention at
The structural schematic diagram of type device 10, the metal-oxide-semiconductor bent angle molding machine 10 include feeding mechanism 110, feeding distribution mechanism 120, first
Foldable component 130 and the second foldable component 140, the feeding mechanism 110 are provided with sliding slot 110a and hopper 110b, the sliding slot
110a is connected to the hopper 110b, and metal-oxide-semiconductor item is placed in the sliding slot 110a, and the feeding distribution mechanism 120 is by single metal-oxide-semiconductor
It is separated from metal-oxide-semiconductor item, the single metal-oxide-semiconductor isolated is fallen into hopper 110b, and the feeding mechanism 110 includes feeding driving 111
And impeller 113, in the impeller 113, the impeller 113 drives in the feeding for 111 transmission connection of feeding driving
Under dynamic 111 driving, metal-oxide-semiconductor is pushed to move along the hopper 110b, until the pin of metal-oxide-semiconductor stretches out the hopper 110b,
First foldable component 130 and second foldable component 140 press pin from the pin two sides of metal-oxide-semiconductor respectively, and by
The bending and molding of two foldable components 140 completion pin.
The feeding mechanism 110 includes feed member 115, and the sliding slot 110a and the hopper 110b are set to the feeding
On part 115.In one or more embodiments, the feed member 115 includes pedestal 1151 and fixing seat 1153, the fixing seat
1153 are fixedly connected on the pedestal 1151, and the sliding slot 110a is set in the fixing seat 1153, and the hopper 110b is set
It is placed on the pedestal 1151.Optionally, the fixing seat 1153 is removably connected to the pedestal 1151.By the way that base is arranged
Seat 1151 and fixing seat 1153, facilitates maintenance when can get stuck in hopper 110b, it is only necessary to by fixing seat 1153 from base
Separation is dismantled on seat 1151, can clear up hopper 110b, so that feeding mechanism 110 be made to resume work, maintenance is simple, and can operate
Property high, the maintenance without specialized maintenance personnel.
In some embodiments, the feeding mechanism 110 further includes fixing piece 117, and the fixing piece 117 is fixedly connected on
The feed member 115 is provided with holding tank on the fixing piece 117 specifically, being fixedly connected on the fixing seat 1153
117a, the holding tank 117a are connected in the sliding slot 110a, and metal-oxide-semiconductor item is contained in the holding tank 117a, and from institute
It states and is entered in holding tank 117a in sliding slot 110a.It, can be with by setting fixing piece 117 to play fixed function to metal-oxide-semiconductor item
Metal-oxide-semiconductor item is avoided to deform, and metal-oxide-semiconductor item fractures in the process that may cause.
The feeding distribution mechanism 120 includes sub-material actuator 121 and cutting member 123, and the sub-material actuator 121 is sequentially connected
It is provided with perforation 115a in corresponding to the cutting member 123 on the cutting member 123, the feed member 115, the perforation 115a connects
The sliding slot 110a is passed through, the cutting member 123 passes through the perforation 115a, and extend into the sliding slot 110a, thus will
Single metal-oxide-semiconductor cuts separation from metal-oxide-semiconductor item, and the single metal-oxide-semiconductor after cutting slides into hopper 110b out of sliding slot 110a, and by
The impeller 113 releases the hopper 110b.In the particular embodiment, the sub-material actuator 121 and the cutting member
123 be respectively provided with there are two, in cutting, one of cutting member 123 resists metal-oxide-semiconductor item, and another cutting member 123 is cut, can be with
It avoids damaging metal-oxide-semiconductor when cutting.
Referring to Fig. 4, in some embodiments, first foldable component 130 includes the first bending actuator 131, the
A connection piece 133 and the first clamping element 135, the first bending actuator 131 are sequentially connected in first connector 133,
First clamping element 135 is fixedly connected on first connector 133, and first connector 133 and described first clamp
Part 135 moves under the driving of the first bending actuator 131, to match with second foldable component 140, realizes
The clamping of metal-oxide-semiconductor.
Referring to Fig. 5, in some embodiments, the knot of second foldable component 140 and first foldable component 130
Structure is substantially the same, including the second bending actuator 141, the second connector 143 and the second clamping element 145, and second bending
Actuator 141 is sequentially connected in second connector 143, and second clamping element 145 is fixedly connected on second connection
Part 143, second connector 143 and second clamping element 145 are moved down in the driving of the second bending actuator 141
Dynamic, the difference is that second foldable component 140 further includes bending part 147, the bending part 147 is fixedly connected on described
Connector, first clamping element 135 drive in the first bending actuator 131, the second bending respectively with second clamping element 145
It is moved toward one another under the driving of moving part 141, when being moved to predeterminated position, the first clamping element 135, the second clamping element 145 are from two sides
The pin of metal-oxide-semiconductor is clamped, and bending is completed by the bending part 147.
In the particular embodiment, second connector 143 includes moving member 1431, first crossbar 1432, sliding block
1433 and elastic component (not shown), the moving member 1431 is connected to the shaft of the second bending actuator 141, and described first
Cross bar 1432 is fixedly connected on the moving member 1431, and the elastic component is set to the first crossbar 1432 and the sliding block
Between 1433, one end is connected to the first crossbar 1432, and the other end is connected to the sliding block 1433, second clamping element
145 are set on the sliding block 1433, are fixedly connected on the sliding block 1433, and the bending part 147 is set to the moving member
On 1431.The moving member 1431 moves under the driving of the second bending actuator 141, moving member 1431 when moving,
Drive the first crossbar 1432 mobile, when first crossbar 1432 is mobile, by sliding block 1433 described in resilient element urges along pre-
If track sliding, until the second clamping element 145 for being fixed on sliding block 1433 be connected to metal-oxide-semiconductor out of described hopper 110b
The pin of stretching, at this point, the first clamping element 135 is connected to the pin of metal-oxide-semiconductor from the other side, the second bending actuator continues to drive
Moving member 1431 is mobile, and first crossbar 1432 follows the movement of moving member 1431 and moves, and the second clamping element 145 is held at this time
The pin of metal-oxide-semiconductor and no longer move, so that sliding block 1433 no longer slides, the compression elastic piece when moving of first crossbar 1432,
When compression elastic piece, the bending part 147 starts the bending to the pin of metal-oxide-semiconductor.
Please continue to refer to Fig. 6, in one or more embodiments, second connector 143 further includes second crossbar
1435, there are three protrusion 143a for the setting on the end face of the first crossbar 1432 of the second crossbar 1435, thus
The second crossbar 1435 forms the first empty slot 143b and the second empty slot 143c on the end face of the first crossbar 1432,
The sliding block 1433 is fastened in the first empty slot 143b, when the elastic component is compressed, 1432 edge of first crossbar
The second empty slot 143c sliding, and compress the elastic component.
In the particular embodiment, first connector 133 can complete phase with the structure of second connector 143
Together, so that the first bending actuator 131 and the second bending actuator 141 can share a driving signal, it is ensured that
The synchronization of driving.
Fig. 4 and Fig. 5 is please referred to, in one or more embodiments, in order to move moving member 1431 along preset track
It is dynamic, it is ensured that the precision of bending, first foldable component 130 and/or second foldable component 140 further include Mobile base
1436, shifting chute 143d is provided on the Mobile base 1436, and the moving member 1431 is moved along the shifting chute 143d.
Referring to Fig. 3, in one or more embodiments, the metal-oxide-semiconductor bent angle molding machine 10 further includes slide bar 150,
The sliding block 1433 of first connector 133 and second connector 143 is slided each along the slide bar 150, so that it is guaranteed that
First clamping element 135 and the second clamping element 145 can be abutted mutually when moving towards, thus from sandwich metal-oxide-semiconductor
Pin.
Above-mentioned metal-oxide-semiconductor bent angle molding machine 10, by feeding mechanism 110 and feeding distribution mechanism 120 by single metal-oxide-semiconductor from MOS
It is separated on pipe item, when metal-oxide-semiconductor item is inserted into sliding slot 110a, cutting member 123 cuts down single metal-oxide-semiconductor from metal-oxide-semiconductor item, send
111 driving impeller 113 of material driving, pushes the metal-oxide-semiconductor cut down to move along hopper 110b, until the pin of metal-oxide-semiconductor is stretched
Outside blow tank 110b, the first foldable component 130 and the second foldable component 140 press pipe from the pin two sides of metal-oxide-semiconductor respectively respectively
Foot has the second foldable component 140 to complete the bending forming of pin after clamping, and structure is simple, cost is relatively low, is suitable for few batch
The pin bending forming of the metal-oxide-semiconductor of amount.
Each technical characteristic of embodiment described above can be combined arbitrarily, for simplicity of description, not to above-mentioned reality
It applies all possible combination of each technical characteristic in example to be all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all should be considered as described in this specification.
Above-described embodiments merely represent several embodiments of the utility model, the description thereof is more specific and detailed,
But it cannot be understood as the limitations to utility model patent range.It should be pointed out that for the common skill of this field
For art personnel, without departing from the concept of the premise utility, various modifications and improvements can be made, these are belonged to
The protection scope of the utility model.Therefore, the scope of protection shall be subject to the appended claims for the utility model patent.
Claims (10)
1. a kind of metal-oxide-semiconductor clubfoot shaper, the pin bending for metal-oxide-semiconductor characterized by comprising
Feeding mechanism, including feed member, feeding driving and impeller are provided with sliding slot and hopper, the cunning on the feed member
Slot is connected to the hopper, and metal-oxide-semiconductor item is placed in the sliding slot, and the feeding driving transmission connection is in the impeller, institute
Impeller is stated under the driving that the feeding drives, metal-oxide-semiconductor is pushed to move along the hopper, until the pin of metal-oxide-semiconductor stretches out
The hopper；
Feeding distribution mechanism, including sub-material actuator and cutting member, the sub-material actuator transmission connection are described to cut in the cutting member
Cutter member is extend into the sliding slot, and single metal-oxide-semiconductor is cut to separation from metal-oxide-semiconductor item, and the single metal-oxide-semiconductor isolated falls into described
In hopper；
First foldable component and the second foldable component press pin from the pin two sides of metal-oxide-semiconductor respectively, and by second bending
The bending and molding of component completion pin.
2. metal-oxide-semiconductor clubfoot shaper according to claim 1, which is characterized in that the feed member includes pedestal and consolidates
Reservation, the fixing seat are fixedly connected on the pedestal, and the sliding slot is set in the fixing seat, and the hopper is set to institute
It states on pedestal.
3. metal-oxide-semiconductor clubfoot shaper according to claim 2, which is characterized in that the fixing seat removably connects
In the pedestal.
4. metal-oxide-semiconductor clubfoot shaper according to claim 1, which is characterized in that the sub-material actuator and described cut
There are two cutter member is respectively provided with, in cutting, one of them described cutting member resists metal-oxide-semiconductor item, another cutting member cutting.
5. metal-oxide-semiconductor clubfoot shaper according to claim 1, which is characterized in that first foldable component includes the
One bending actuator, the first connector and the first clamping element, the first bending actuator transmission connection is in first connection
Part, first clamping element are fixedly connected on first connector, and first connector and first clamping element are in institute
It states and is moved under the driving of the first bending actuator.
6. metal-oxide-semiconductor clubfoot shaper according to claim 5, which is characterized in that second foldable component includes the
Two bending actuators, the second connector, the second clamping element and bending part, the second bending actuator transmission connection is in described the
Two connectors, second clamping element are fixedly connected on second connector, and second connector and described second clamp
Part moves under the driving of the second bending actuator, and the bending part is fixedly connected on the connector, first folder
Tight part and second clamping element respectively the first bending actuator, the second bending actuator driving under transport in opposite directions
Dynamic, when being moved to predeterminated position, first clamping element, second clamping element clamp the pin of metal-oxide-semiconductor from two sides, and by
The bending part completes bending.
7. metal-oxide-semiconductor clubfoot shaper according to claim 6, which is characterized in that second connector includes movement
Part, first crossbar, sliding block and elastic component, the moving member are connected to the shaft of the second bending actuator, and described first is horizontal
Bar is fixedly connected on the moving member, and the elastic component is set between the first crossbar and the sliding block, and one end is connected to
The first crossbar, the other end are connected to the sliding block, and second clamping element is set on the sliding block, are fixedly connected on institute
Sliding block is stated, the bending part is set on the moving member.
8. metal-oxide-semiconductor clubfoot shaper according to claim 7, which is characterized in that second connector further includes
Two cross bars, there are three protrusions for the setting on the end face of the first crossbar of the second crossbar, thus horizontal described second
Bar forms the first empty slot and the second empty slot on the end face of the first crossbar, and the sliding block is fastened in first empty slot
Interior, under the driving of the second bending actuator, the first crossbar can be slided along second empty slot, and compress institute
State elastic component.
9. metal-oxide-semiconductor clubfoot shaper according to claim 7 or 8, which is characterized in that first connector with it is described
The structure of second connector is identical.
10. metal-oxide-semiconductor clubfoot shaper according to claim 7, which is characterized in that further include slide bar, described first connects
The sliding block of fitting and second connector slides in opposition along the slide bar.
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821057734.3U CN208819833U (en) | 2018-07-05 | 2018-07-05 | Metal-oxide-semiconductor clubfoot shaper |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821057734.3U CN208819833U (en) | 2018-07-05 | 2018-07-05 | Metal-oxide-semiconductor clubfoot shaper |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112331583A (en) * | 2020-10-14 | 2021-02-05 | 安徽科技学院 | Packaging device for MOSFET device production |
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2018
- 2018-07-05 CN CN201821057734.3U patent/CN208819833U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112331583A (en) * | 2020-10-14 | 2021-02-05 | 安徽科技学院 | Packaging device for MOSFET device production |
| CN112331583B (en) * | 2020-10-14 | 2023-04-07 | 安徽科技学院 | Packaging device for MOSFET device production |
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