CN208817699U - A kind of semiconductor boiler heating system - Google Patents

A kind of semiconductor boiler heating system Download PDF

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Publication number
CN208817699U
CN208817699U CN201820969885.XU CN201820969885U CN208817699U CN 208817699 U CN208817699 U CN 208817699U CN 201820969885 U CN201820969885 U CN 201820969885U CN 208817699 U CN208817699 U CN 208817699U
Authority
CN
China
Prior art keywords
boiler
water tank
pipe
semiconductor
heating system
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201820969885.XU
Other languages
Chinese (zh)
Inventor
丁宏宇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changchun Best Hundred Science And Technology Co Ltd
Original Assignee
Changchun Best Hundred Science And Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changchun Best Hundred Science And Technology Co Ltd filed Critical Changchun Best Hundred Science And Technology Co Ltd
Priority to CN201820969885.XU priority Critical patent/CN208817699U/en
Application granted granted Critical
Publication of CN208817699U publication Critical patent/CN208817699U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

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Abstract

The utility model discloses a kind of semiconductor boiler heating systems, including boiler, the boiler is connected to by boiler water inlet pipe and boiler discharging tube with insulated water tank, return pipe is connected on the insulated water tank, it is connected with return water opening and closing valve and y-type filter on the return pipe in turn, the insulated water tank is connected with tap water inlet pipe by ball-cock assembly, overflow pipe and sewage pipe below the insulated water tank are connected in parallel on downcomer, are also pumped by first circulation below the insulated water tank and are connected to check-valves with system water supply pipe.The utility model has the beneficial effects that: this semiconductor boiler heating system can be greatly improved the heating efficiency of system, be economized on resources by the installation and configuration of science.

Description

A kind of semiconductor boiler heating system
Technical field
The utility model relates to boiler heat supplying technical field, in particular to a kind of semiconductor boiler heating system.
Background technique
Family heating or heat supply generally use miniature boiler realization, and especially in northern area, such demand is further obvious, However existing heating system disadvantage is also quite obvious, what is stood in the breach is since system design and Rig up error are led The heating efficiency of cause is low, causes the waste situation of the energy more serious, so a kind of economical and energy saving, heat supply heat supply efficiency are high Boiler heating system is urgently studied.
Utility model content
Performance is poor etc. in terms of to solve the installation of above boiler heating system, heating efficiency and energy conservation and environmental protection existing asks Topic, the utility model provide a kind of semiconductor boiler heating system.
In order to achieve the above object, the used technical solution is as follows:
A kind of semiconductor boiler heating system, including boiler, the boiler by boiler water inlet pipe and boiler discharging tube with Insulated water tank is connected to, and is connected with return pipe on the insulated water tank, is connected with return water opening and closing valve and Y type on the return pipe in turn Filter, the insulated water tank are connected with tap water inlet pipe by ball-cock assembly, overflow pipe and row below the insulated water tank Dirty pipe is connected in parallel on downcomer, also passes through first circulation pump and check-valves and system water supply Guan Lian below the insulated water tank It is logical.
As further explanation, the boiler uses semiconductor boiler.
As further explanation, the boiler water inlet pipe is pumped equipped with second circulation.
As further explanation, be connected in parallel between the insulated water tank and system water supply pipe two groups of first circulations pump with Check-valves.
As further explanation, the tap water water inlet is equipped with the filter for softened water.
As further explanation, the boiler can take parallel way to connect with insulated water tank.
The utility model has the beneficial effects that:
This semiconductor boiler heating system by science installation and configuration, can greatly improve system for thermal effect Rate economizes on resources.
Detailed description of the invention
Fig. 1 is the utility model boiler heating system structural schematic diagram;
Wherein: 1, boiler, 2, insulated water tank, 3, second circulation pump, 4, boiler discharging tube, 5, return water opening and closing valve, 6, Y type mistake Filter, 7, return pipe, 8, system water supply pipe, 9, tap water inlet pipe, 10, ball-cock assembly, 11, downcomer, 12, first circulation pump, 13, check-valves, 14, boiler water inlet pipe.
Specific embodiment
The utility model is described further with reference to the accompanying drawing.
Embodiment:
As shown in view 1,
A kind of semiconductor boiler heating system, including boiler 1, the boiler pass through boiler water inlet pipe 14 and boiler discharging tube 4 are connected to insulated water tank, and return pipe 7 is connected on the insulated water tank 2, are connected with return water opening and closing on the return pipe 7 in turn Valve 5 and y-type filter 6, the insulated water tank 2 are connected with tap water inlet pipe 9 by ball-cock assembly 10, under the insulated water tank 2 The overflow pipe and sewage pipe of side are connected in parallel on downcomer 11,2 lower section of the insulated water tank also by first circulation pump 12 and Check-valves is connected to system water supply pipe 8.
The boiler 1 uses semiconductor boiler.
1 outlet pipe of boiler is equipped with second circulation pump 3.
Two groups of first circulation pumps 12 and check-valves 13 are connected in parallel between the insulated water tank 2 and system water supply pipe 8.
The tap water inlet pipe 9 is equipped with the filter for softened water.
The boiler 1 can take parallel way to connect with insulated water tank 2.
The foregoing describe the basic principles and main features of the utility model, It should be understood by those skilled in the art that this Utility model is not restricted to the described embodiments, and the above embodiments and description only describe the originals of the utility model Reason, on the premise of not departing from the spirit and scope of the utility model, the utility model also has various changes and improvements, these changes Change and improvement is fallen within the scope of the claimed invention, range is claimed by the attached claims in utility model Book and its equivalent thereof.

Claims (6)

1. a kind of semiconductor boiler heating system, which is characterized in that including boiler, the boiler passes through boiler water inlet pipe and boiler Outlet pipe is connected to insulated water tank, and return pipe is connected on the insulated water tank, return water is connected in turn on the return pipe and opens Valve closing and y-type filter, the insulated water tank are connected with tap water inlet pipe by ball-cock assembly, overflowing below the insulated water tank Flow tube and sewage pipe are connected in parallel on downcomer, also pass through first circulation pump and check-valves and system below the insulated water tank Water supplying pipe connection.
2. a kind of semiconductor boiler heating system according to claim 1, which is characterized in that the boiler uses semiconductor Boiler.
3. a kind of semiconductor boiler heating system according to claim 1, which is characterized in that set on the boiler water inlet pipe There is second circulation pump.
4. a kind of semiconductor boiler heating system according to claim 1, which is characterized in that the insulated water tank and system Two groups of first circulation pumps and check-valves are connected in parallel between water supplying pipe.
5. a kind of semiconductor boiler heating system according to claim 1, which is characterized in that the tap water inlet pipe peace Equipped with the filter for softened water.
6. a kind of semiconductor boiler heating system according to claim 1, which is characterized in that the boiler can take parallel connection Mode is connect with insulated water tank.
CN201820969885.XU 2018-06-22 2018-06-22 A kind of semiconductor boiler heating system Expired - Fee Related CN208817699U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201820969885.XU CN208817699U (en) 2018-06-22 2018-06-22 A kind of semiconductor boiler heating system

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201820969885.XU CN208817699U (en) 2018-06-22 2018-06-22 A kind of semiconductor boiler heating system

Publications (1)

Publication Number Publication Date
CN208817699U true CN208817699U (en) 2019-05-03

Family

ID=66270030

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201820969885.XU Expired - Fee Related CN208817699U (en) 2018-06-22 2018-06-22 A kind of semiconductor boiler heating system

Country Status (1)

Country Link
CN (1) CN208817699U (en)

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Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20190503

Termination date: 20210622

CF01 Termination of patent right due to non-payment of annual fee