CN208809676U - A kind of temperature conduction device and gas-filtering device - Google Patents
A kind of temperature conduction device and gas-filtering device Download PDFInfo
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- CN208809676U CN208809676U CN201821382744.4U CN201821382744U CN208809676U CN 208809676 U CN208809676 U CN 208809676U CN 201821382744 U CN201821382744 U CN 201821382744U CN 208809676 U CN208809676 U CN 208809676U
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- gas
- temperature
- temperature conduction
- condensation chamber
- conduction body
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- 230000005494 condensation Effects 0.000 claims abstract description 22
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- Devices That Are Associated With Refrigeration Equipment (AREA)
Abstract
The utility model provides a kind of temperature conduction device and gas-filtering device, the first temperature conduction body and second temperature conductor comprising combination installation, in the first temperature conduction body of combination installation, gas condensation chamber is equipped between second temperature conductor, gas condensation chamber two sides are communicated with air inlet gas passage and outlet gas passage, the first temperature conduction body, second temperature conductor is equipped with semi-circular recesses along gas condensation chamber both ends, the semi-circular recesses are equipped with thread far from that end of gas condensation chamber, and the first temperature conduction body, the thread of second temperature conductor matches.It also include refrigerating plant, the refrigerating plant includes semiconductor chilling plate and cooling fin, it can be adapted for different gas pipelines by screw thread installation, also make air inlet gas passage and outlet gas passage and condenser in the same horizontal line, gas transport is more efficient, but also it is avoided that gas impurities flow into gas-detecting device with gas, influence testing result.
Description
Technical field
The utility model relates to gas filtration fields, and in particular to a kind of temperature conduction device and gas-filtering device.
Background technique
In complicated gaseous environment monitoring works, sample gas contains various steam, impurity dirt can be to gas-sensing head
It causes compared with macrolesion, to influence gas controlling device service life and monitoring accuracy.Present most of research institutes are using such as
Lower processing method:
One, it is overanxious to dirt, the steam in gas to fill overanxious net realization for prime.But this mode can only be disposed absolutely mostly
Number dirt, steam ingredient, then do not work for tiny dirt, vapour molecule.
Two, prime installs general overanxious filler additional, and this mode is relatively good than a kind of effect above, but can frequently more
It changes, clean, dry filler, cause a large amount of human and material resources and environmental pollution.
Three, prime installs molecular sieve additional as overanxious filler, this mode can steam, dirt in very overanxious gas,
But also can frequently replace, clean, dry filler, cause a large amount of human and material resources and environmental pollution.
Existing many temperature conduction devices are respectively turned on inlet channel and outlet passageway the temperature conduction up and down in combination
On plate, detection gas will move from lower to upper or from top to bottom, unstable to the transmission of gas, when admission line is in upper
Fang Shi, gas move from top to bottom, and the impurity of detection gas sometimes can flow into gas-detecting device along outlet pipe down
Or exhaust apparatus, it is bad for the contaminant filter effect of gas, and exhaust has some setbacks；Most of temperature conduction device is all handle
Semiconductor chilling plate contradicts the either above or below for being mounted on temperature conduction plate, and this mounting means makes the system of semiconductor chilling plate
Cold effect is bad, influences testing result.
Utility model content
For the deficiency in the presence of the prior art, the utility model provides that a kind of gas transport is stable, refrigeration effect
Good temperature conduction device and gas-filtering device.
To achieve the above object, the utility model uses the following technical solution:
A kind of temperature conduction device, the first temperature conduction body and second temperature conductor comprising combination installation, is being combined
First temperature conduction body of installation is equipped with gas condensation chamber, the connection of gas condensation chamber two sides between second temperature conductor
There are air inlet gas passage and outlet gas passage, the first temperature conduction body, second temperature conductor are along gas condensation chamber two
End be equipped with semi-circular recesses, the semi-circular recesses far from that end of gas condensation chamber be equipped with thread, and the first temperature conduction body,
The thread of second temperature conductor matches；The semi-circular recesses size matches with gas passage；First temperature
Conductor is equipped with the placing groove for placing semiconductor chilling plate, a lateral edge of placing groove relative to the other end of gas condenser
Semi-circular recesses direction for outlet gas passage is additionally provided with the wire casing for semiconductor cooler connection；The condensation chamber packet
Containing several parallel air channels, the outermost air channel in both ends is connected to semi-circular recesses, and one is included at least between adjacent air channel
A stomata is interconnected.
The utility model also proposed a kind of gas-filtering device, includes temperature conduction device as described above, also includes
Refrigerating plant, the refrigerating plant include semiconductor chilling plate, and the semiconductor chilling plate is located in placing groove, the placing groove
Depth be semiconductor chilling plate thickness 1/4-3/4 between.
Further, the placing groove both ends are equipped with the card slot interface of fixed semiconductor chilling plate, the line of the placing groove
Slot end is hinged with the spill Ka Gai for closure, and the spill Ka Gai is fastened semiconductor chilling plate, spill card cover in
The opposite other side in hinged end is equipped with buckle, and the buckle is in the shape of the letter V, and the placing groove is in itself and the hinged end of spill Ka Gai
Buckle interface is equipped in the middle part of opposite other end mouth.
It further, also include cooling fin, the cooling fin contradicts setting and fills in semiconductor chilling plate far from temperature conduction
The side set is equipped with ceramic blanket between the cooling fin and temperature conduction body.
Further, the cooling fin lower end is additionally provided with screw for fixing, and the screw number is four.
When the utility model is used, by the first temperature conduction body, the combination installation of second temperature conductor, it is several parallel
Air channel forms condensation chamber, is used for gas transport, a complete threaded hole is formed by two semi-circular recesses, for connecting
Gas passage makes gas passage smoothly pass temperature conduction device, placing groove is arranged outside the first temperature conduction body, by semiconductor
Cooling piece is placed on into, makes cooling piece and condensation chamber apart from closer, the better transition temperature of energy, cooling rapidly, to gas
It is condensed.
Compared with the prior art, the utility model has the following beneficial effects:
By the way that the semi-circular recesses of the first temperature conduction body, second temperature conductor both ends, two temperature conductions are arranged in
Just at a complete threaded hole after body combination installation, different gas pipelines can be adapted for by screw thread installation, also make
In the same horizontal line, gas transport is more efficient, and can also for air inlet gas passage and outlet gas passage and condenser
It avoids gaseous impurity from flowing into gas-detecting device with gas, inlet end is provided with drainage hole, facilitate water row also in gas
It removes, temperature conduction is held in vitro is equipped with semiconductor chilling plate placing groove, and making condenser and cooling piece, refrigeration effect is more apart from closer
It is good, avoid the normal work for influencing temperature conduction body.
Detailed description of the invention
Fig. 1 is the utility model embodiment temperature conduction body structure front elevation,
Fig. 2 is the utility model embodiment temperature conduction body structured rear surface figure,
Fig. 3 is that the utility model embodiment temperature conduction body structure combines installation diagram,
Fig. 4 is the utility model embodiment buckle structure figure,
Fig. 5 is the utility model embodiment gas-filtering device side view；
In figure: semi-circular recesses 1, air channel 2, stomata 3, drainage hole 4, placing groove 5, wire casing 6, clamping groove 7, spill Ka Gai
8, buckle 9, buckle interface 10, mounting hole 11, the first temperature conduction body 121, second temperature conductor 122, semiconductor chilling plate
13, cooling fin 14, screw 15, ceramic blanket 16.
Specific embodiment
The technical solution in the utility model is further illustrated with reference to the accompanying drawings and embodiments.
As shown in Figure 1, Figure 2, Figure 3 shows, the utility model proposes a kind of temperature conduction devices, and first comprising combination installation
Temperature conduction body 121 and second temperature conductor 122, are equipped between the first temperature conduction body 121 and second temperature conductor 122
Several parallel air channels 2 form gas condensation with second temperature conductor 122 in the first temperature conduction body 121 after opposite fastening
Chamber, gas condensation chamber two sides are communicated with air inlet gas passage and outlet gas passage, the first temperature conduction body 121 with
Second temperature conductor 122 is equipped with semi-circular recesses 1 along gas condensation chamber both ends, and the semi-circular recesses 1 are condensed far from gas
That end of chamber is equipped with thread, when the first temperature conduction body 121 forms complete thread after opposite fastening with second temperature conductor 122
Hole to facilitate connecting screwed tube or gas passage, and can be suitable for different gas passages by using transfer tube, and
Air inlet gas passage and outlet gas passage and condensation chamber allow gas to smoothly transmit, efficiency of transmission is more in same level
It is high；1 size of semi-circular recesses matches with gas passage.Make the first temperature conduction body 121 and second by mounting hole 11
Temperature conduction body 122 is combined and installed together.
For several parallel air channels 2, the outermost air channel 2 in both ends is connected to semi-circular recesses 1, adjacent air channel
Stomata 3 is contained at least one between 2 to be interconnected.The direct horizontal transport of detection gas is into air channel 2 after keeping gas passage fixed,
Efficiency of transmission is higher；Each parallel air channel 2,2 pitch density of air channel in outside are greater than the pitch density in inside
Each parallel air channel 2, i.e., generally speaking ventilation groove width in an intermediate position or interval are less than width or the interval at both ends,
On the one hand can cool down below the minimum placing groove of temperature as far as possible, and with the first temperature conduction body, second temperature conductor
Heat exchange is carried out, on the other hand, avoids gas access larger particles that may be present from influencing airway patency, or in gas vent
There is possible ponding in end or ice pellets blocks air flue, thus guarantee the normal use of temperature conduction device or gas-filtering device,
Extend service life.
The semi-circular recesses 1 for air inlet gas passage are equipped with the drainage hole 4 through the first temperature conduction body 122,
The drainage hole 4 is between screw thread and gas condensation chamber.Drainage hole 4 is blocked with absorbent wool, facilitates draining, also avoids other gas
Body, which enters gas passage, influences gas transport and detection.
The temperature conduction body 12 is equipped with relative to the other end of gas condenser for placing putting for semiconductor chilling plate
Slot 5 is set, the side of placing groove 5 is additionally provided with along 1 direction of semi-circular recesses for outlet gas passage for semiconductor cooler
The wire casing 6 of connection.Wire casing is convenient for cooling piece wiring, and line is placed in wire casing, has also seen route more while playing protection circuit
Beauty,
The second temperature conductor 122 is provided with clamping groove 7 relative to the other end of placing groove 5, and temperature is facilitated to pass
Device connecting and fixing on other articles is led, while clamping groove 7 is arranged in parallel in multiple row, and clamping groove size spacing is different,
Facilitate the clamping of temperature sensor.
As shown in figure 5, a kind of gas-filtering device, also includes refrigerating plant, the refrigerating plant includes semiconductor refrigerating
Piece 13 and cooling fin 14, the semiconductor chilling plate 13 are located in placing groove 5, and the depth of the placing groove 5 is semiconductor refrigerating
Between the 1/4-3/4 of the thickness of piece 13.Semiconductor chilling plate 5 connects direct current and can work, in chill surface when work
Another side will generate heat.The size design of placing groove will not influence cooling piece refrigeration effect, and will not cooling piece be generated heat
The temperature in face influences temperature conduction device.The input terminal of semiconductor chilling plate can also connect external temperature controller, to realize
More accurate temperature control, and combination temperature sensor uses, temperature sensor can be inserted into clamping groove 7 and use, due to card
Access slot 7 is in the distal end of cooling piece, and surface temperature more condenses cavity temperature close to gas.
As shown in figure 4,5 both ends of placing groove are equipped with the card slot interface of fixed semiconductor chilling plate, the placing groove 5
6 end of wire casing is hinged with the concave spill card lid 8 for closure, and the spill card lid 8 is fastened semiconductor chilling plate 13, recessed
Be equipped with buckle 9 in the opposite other side in hinged end on type spill card lid 8, the buckle 9 is in the shape of the letter V, the placing groove 5 its with
Buckle interface 10 is equipped in the middle part of the opposite other end mouth of the hinged end of concave spill card lid 8, it is convenient to cooling piece installation and maintenance.
When environment temperature is lower, due to reducing the use of cooling piece, the heating temperature of cooling piece is lower, therefore can not have to cooling fin,
Directly fastened using card lid 8, it is succinct convenient.
It also include cooling fin 14, semiconductor chilling plate 13 is arranged in far from temperature conduction device in the conflict of cooling fin 14
Side facilitates the heat dissipation of semiconductor chilling plate heating surface, it is made to maintain to work normally, and the cooling fin 14 and the first temperature pass
Ceramic blanket 16 is equipped between conductor 121.Because 13 back side of semiconductor chilling plate is heating surface, with ceramic blanket 16 to heating surface
It is thermally shielded, heat insulation is more preferable, and the temperature of heating surface is avoided to influence the first temperature conduction body 121.
14 lower end of cooling fin is additionally provided with screw 15 for fixing, and 15 quantity of screw is four；Second temperature
Conductor is correspondingly provided with screw hole, is directly connected to fix to facilitate.
Finally, it is stated that above embodiments are merely intended for describing the technical solutions of the present application, but not for limiting the present application, although ginseng
The utility model is described in detail according to preferred embodiment, those skilled in the art should understand that, it can be to this
The technical solution of utility model is modified or replaced equivalently, without departing from the objective and model of technical solutions of the utility model
It encloses, should all cover in the scope of the claims of the utility model.
Claims (8)
1. a kind of temperature conduction device, it is characterised in that: the first temperature conduction body comprising combination installation and second temperature conduction
Body is equipped with gas condensation chamber, the gas condensation chamber between the first temperature conduction body, second temperature conductor of combination installation
Two sides are communicated with air inlet gas passage and outlet gas passage, and the first temperature conduction body, second temperature conductor are along gas
Condensation chamber both ends are equipped with semi-circular recesses, and the semi-circular recesses are equipped with thread, and the first temperature far from that end of gas condensation chamber
Spend conductor, the thread of second temperature conductor matches；The semi-circular recesses size matches with gas passage；It is described
First temperature conduction body is equipped with the placing groove for placing semiconductor chilling plate, placing groove relative to the other end of gas condenser
Side along for outlet gas passage semi-circular recesses direction be additionally provided with for semiconductor cooler connection wire casing；It is described
Condensation chamber includes several parallel air channels, and the outermost air channel in both ends is connected to semi-circular recesses, between adjacent air channel extremely
It is interconnected less comprising a stomata.
2. a kind of temperature conduction device as described in claim 1, it is characterised in that: the semicircle for air inlet gas passage
Connected in star is equipped with the drainage hole through temperature conduction body, and the drainage hole is between screw thread and gas condensation chamber.
3. a kind of temperature conduction device as described in claim 1, it is characterised in that: the second temperature conductor is separate with the
The fastening end face of one temperature conduction body is provided with clamping groove.
4. a kind of temperature conduction device as described in claim 1, it is characterised in that: each parallel air channel is logical in outside
Air drain pitch density is greater than the pitch density in inside.
5. a kind of gas-filtering device, it is characterised in that: comprising any temperature conduction device of Claims 1-4, also wrap
Containing refrigerating plant, the refrigerating plant includes semiconductor chilling plate, and the semiconductor chilling plate is located in placing groove, the placement
The depth of slot is between the 1/4-3/4 of the thickness of semiconductor chilling plate.
6. a kind of gas-filtering device as claimed in claim 5, it is characterised in that: the placing groove both ends are equipped with fixation and partly lead
The card slot interface of body cooling piece, the wire casing end of the placing groove are hinged with the spill Ka Gai for closure, the spill card cover buckle
Fixed semiconductor chilling plate is closed, is covered in spill card and is equipped with buckle in the opposite other side in hinged end, the buckle is in the shape of the letter V,
The placing groove is equipped with buckle interface in the middle part of its opposite other end mouth with the hinged end of spill Ka Gai.
7. a kind of gas-filtering device as claimed in claim 5, it is characterised in that: also include cooling fin, the cooling fin supports
Side of the semiconductor chilling plate far from temperature conduction device is arranged in touching, and ceramics are equipped between the cooling fin and temperature conduction body
Pad.
8. a kind of gas-filtering device as claimed in claim 7, it is characterised in that: the cooling fin lower end is additionally provided with for solid
Fixed screw, the screw number are four.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821382744.4U CN208809676U (en) | 2018-08-24 | 2018-08-24 | A kind of temperature conduction device and gas-filtering device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821382744.4U CN208809676U (en) | 2018-08-24 | 2018-08-24 | A kind of temperature conduction device and gas-filtering device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208809676U true CN208809676U (en) | 2019-05-03 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821382744.4U Withdrawn - After Issue CN208809676U (en) | 2018-08-24 | 2018-08-24 | A kind of temperature conduction device and gas-filtering device |
Country Status (1)
| Country | Link |
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| CN (1) | CN208809676U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108854332A (en) * | 2018-08-24 | 2018-11-23 | 重庆市荣冠科技有限公司 | A kind of temperature conduction device and gas-filtering device |
-
2018
- 2018-08-24 CN CN201821382744.4U patent/CN208809676U/en not_active Withdrawn - After Issue
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108854332A (en) * | 2018-08-24 | 2018-11-23 | 重庆市荣冠科技有限公司 | A kind of temperature conduction device and gas-filtering device |
| CN108854332B (en) * | 2018-08-24 | 2023-12-05 | 重庆市荣冠科技有限公司 | Temperature conduction device and gas filtering device |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
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| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20190503 Effective date of abandoning: 20231205 |
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| AV01 | Patent right actively abandoned |
Granted publication date: 20190503 Effective date of abandoning: 20231205 |