CN208788818U - A kind of silicon wafer cutting equipment - Google Patents
A kind of silicon wafer cutting equipment Download PDFInfo
- Publication number
- CN208788818U CN208788818U CN201820586807.1U CN201820586807U CN208788818U CN 208788818 U CN208788818 U CN 208788818U CN 201820586807 U CN201820586807 U CN 201820586807U CN 208788818 U CN208788818 U CN 208788818U
- Authority
- CN
- China
- Prior art keywords
- motor
- eccentric wheel
- knife handle
- silicon wafer
- screw rod
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 23
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 23
- 239000010703 silicon Substances 0.000 title claims abstract description 23
- 230000008878 coupling Effects 0.000 claims abstract description 13
- 238000010168 coupling process Methods 0.000 claims abstract description 13
- 238000005859 coupling reaction Methods 0.000 claims abstract description 13
- 230000005611 electricity Effects 0.000 claims description 5
- 229910003460 diamond Inorganic materials 0.000 claims description 3
- 239000010432 diamond Substances 0.000 claims description 3
- 239000000428 dust Substances 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000004484 Briquette Substances 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000003082 abrasive agent Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 235000013339 cereals Nutrition 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000003028 elevating effect Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 230000032258 transport Effects 0.000 description 1
Landscapes
- Processing Of Stones Or Stones Resemblance Materials (AREA)
Abstract
The utility model discloses a kind of silicon wafer cutting equipments, including plane table；Eccentric wheel；Eccentric wheel strut；Workbench；Knife handle；Sliding block；First motor；Shaft coupling；Assemble case；Screw rod；Nut fixing seat；Sliding rail；Second motor and knife handle mounting plate, the second motor is provided on the downside of the plane table, second motor makes to be fixed by bolts to below plane table, eccentric wheel is provided on the upside of the plane table, the eccentric wheel is on the output shaft of the second motor, eccentric wheel strut is provided on the right side of the eccentric wheel, workbench is provided on the right side of the eccentric wheel strut, blade is provided on the upside of the workbench, knife handle is provided on the right side of the blade, knife handle mounting plate is provided on the right side of the knife handle, sliding block is provided on the right side of the knife handle mounting plate, sliding rail is provided on the right side of the sliding block, screw rod is provided on the right side of the sliding rail, the nut fixed seating is on screw rod, the silicon wafer cutting equipment makes workpiece move reciprocatingly, blade moves up and down to cut silicon wafer.
Description
Technical field
The utility model relates to silicon wafer cutting equipment technical field, specially a kind of silicon wafer cutting equipment.
Background technique
Element silicon is one of the most abundant element of reserves in the earth's crust, on the big silicon wafer of the grain of rice, has integrated 160,000 crystalline substances
Chip can be made in body pipe, silicon wafer, there is surprising operational capability, currently, being usually to utilize high strength steel in silicon wafer processing
For silk under high-speed cruising state, adhesive tape cuts grinding fluid, has steel wire that abrasive material is driven to cut with silicon rod mill under certain force effect, silicon is made
Piece, this method cutting power is poor, and the cutting time is long, low efficiency, needs certain labour.
So how to design a kind of silicon wafer cutting equipment, becoming us will currently be solved the problems, such as.
Utility model content
The purpose of this utility model is to provide a kind of silicon wafer cutting equipments, to solve mentioned above in the background art ask
Topic.
To achieve the above object, the utility model provides the following technical solutions: the second electricity is provided on the downside of the plane table
Machine, second motor make to be fixed by bolts to plane table in the following, being provided with eccentric wheel, the eccentric wheel on the upside of the plane table
On the output shaft of the second motor, eccentric wheel strut, setting on the right side of the eccentric wheel strut are provided on the right side of the eccentric wheel
There is workbench, blade is provided on the upside of the workbench, knife handle is provided on the right side of the blade, is provided with knife on the right side of the knife handle
Handle mounting plate, the knife handle mounting plate right side are provided with sliding block, and sliding rail, setting on the right side of the sliding rail are provided on the right side of the sliding block
There is screw rod, nut fixing seat is provided on the screw rod, the nut fixed seating is on screw rod, the knife handle mounting plate and spiral shell
Female fixing seat is closely connected using bolt, and shaft coupling is provided on the upside of the screw rod, and the first electricity is provided on the upside of the shaft coupling
Machine, the coupler sleeve is on first motor output shaft.
Further, two sides are provided with baffle to the workbench up and down, and the workbench is only left reciprocal in the lateral direction
Movement.
Further, the blade is cutting piece made from diamond.
Further, the first motor makes to be screwed on assembly case.
Further, dust cover is provided on the first motor and the second motor.
Further, the first motor and the second motor are electrically connected with external power supply.
Compared with prior art, the utility model has the beneficial effects that the silicon wafer cutting equipment is driven using the second motor
Eccentric wheel makes workpiece move reciprocatingly, and first motor is processed with the mode that cutting blade moves up and down, and back and forth transports in workpiece
While dynamic.Cutting movement is done in blade decline, and this mode effectively saves the time, improves processing efficiency, when operation only
Workpiece need to be put on the table, opening motor can work, and it is easy to operate, effectively save labour.
Detailed description of the invention
Fig. 1 is the overall structure diagram of the utility model；
Fig. 2 is the elevating movement planar structure schematic diagram of the utility model；
Fig. 3 is the sliding-rail sliding structural schematic diagram of the utility model；
In figure: 1- plane table；2- eccentric wheel；3- eccentric wheel strut；4- workbench；5- blade；6- knife handle；7- sliding block；8-
First motor；9- shaft coupling；10- assembles case；11- screw rod；12- nut fixing seat；13- sliding rail；The second motor of 14-；15- knife handle
Mounting plate.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
In the description of the utility model, it should be noted that term " center ", "lower", "left", "right", " is erected at "upper"
Directly ", the orientation or positional relationship of the instructions such as "horizontal", "inner", "outside" is to be based on the orientation or positional relationship shown in the drawings, and is only
For ease of description the utility model and simplify description, rather than the device or element of indication or suggestion meaning must have it is specific
Orientation, be constructed and operated in a specific orientation, therefore should not be understood as limiting the present invention.In addition, term " the
One ", " second ", " third " are used for descriptive purposes only and cannot be understood as indicating or suggesting relative importance.
Fig. 1-3 is please referred to, the utility model provides a kind of technical solution: a kind of silicon wafer cutting equipment, including plane table 1；
Eccentric wheel 2；Eccentric wheel strut 3；Workbench 4；Blade 5；Knife handle 6；Sliding block 7；First motor 8；Shaft coupling 9；Assemble case 10；Screw rod
11；Nut fixing seat 12；Sliding rail 13；Second motor 14 and knife handle mounting plate 15 are provided with the second motor on the downside of the plane table 1
14, right side is provided with assembly case 10, and second motor 14 makes to be fixed by bolts to plane table 1 in the following, 1 upside of the plane table
It is provided with eccentric wheel 2, the eccentric wheel is provided with eccentric wheel on the right side of the eccentric wheel 2 on the output shaft of the second motor 14
Strut 3 is provided with workbench 4 on the right side of the eccentric wheel strut 3, and blade 5 is provided on the upside of the workbench 4, and the blade 5 is right
Side is provided with knife handle 6, and knife handle mounting plate 15 is provided on the right side of the knife handle 6, is provided with sliding block on the right side of the knife handle mounting plate 15
7, sliding rail 13 is provided on the right side of the sliding block 7, and screw rod 11 is provided on the right side of the sliding rail 13, is provided with nut on the screw rod 11
Fixing seat 12, for 12 sets of the nut fixing seat on screw rod 11, the knife handle mounting plate 15 uses bolt with nut fixing seat 12
It is close to connect, it is provided with shaft coupling 9 on the upside of the screw rod 11, first motor 8, the shaft coupling are provided on the upside of the shaft coupling 9
9 sets of device on 8 output shaft of first motor, about 4 two sides of workbench are provided with baffle, and the workbench 4 is only in right and left
It moving reciprocatingly upwards, the blade 5 is cutting piece made from diamond, and the first motor 8 makes to be screwed on assembly case 10,
Be provided with dust cover in the first motor 8 and the second motor 14, the first motor 8 and the second motor 14 with external electricity
Source is electrically connected.
Working principle: firstly, silico briquette is placed on workbench 4, the starting of the second motor 14 is rotated by output shaft and is driven
Eccentric wheel 2 rotates, and the rotation of eccentric wheel 2 drives workbench 4 to move reciprocatingly by eccentric wheel strut 3, while first motor 8 opens
Dynamic, the rotation of 8 output shaft upper coupling 9 of first motor drives screw rod 11 to rotate, and the nut fixing seat 12 covered on screw rod 11 is with moving knife
Handle mounting plate is moved up and down by sliding rail 13 and the support of sliding block 7, so that the blade 5 on knife handle 6 be driven to move up and down cutting silico briquette.
While there has been shown and described that the embodiments of the present invention, for the ordinary skill in the art,
It is understood that these embodiments can be carried out with a variety of variations in the case where not departing from the principles of the present invention and spirit, repaired
Change, replacement and variant, the scope of the utility model is defined by the appended claims and the equivalents thereof.
Claims (6)
1. a kind of silicon wafer cutting equipment, including plane table (1)；Eccentric wheel (2)；Eccentric wheel strut (3)；Workbench (4)；Blade
(5)；Knife handle (6)；Sliding block (7)；First motor (8)；Shaft coupling (9)；It assembles case (10)；Screw rod (11)；Nut fixing seat (12)；
Sliding rail (13)；Second motor (14) and knife handle mounting plate (15), it is characterised in that: be provided with second on the downside of the plane table (1)
Motor (14), right side are provided with assembly case (10), and second motor (14) makes to be fixed by bolts to plane table (1) in the following, institute
It states and is provided with eccentric wheel (2) on the upside of plane table (1), the eccentric wheel is on the output shaft of the second motor (14), the bias
It is provided with eccentric wheel strut (3) on the right side of wheel (2), is provided with workbench (4), the workbench on the right side of the eccentric wheel strut (3)
(4) upside is provided with blade (5), is provided with knife handle (6) on the right side of the blade (5), and knife handle peace is provided on the right side of the knife handle (6)
Loading board (15), knife handle mounting plate (15) right side are provided with sliding block (7), are provided with sliding rail (13), institute on the right side of the sliding block (7)
It states and is provided with screw rod (11) on the right side of sliding rail (13), be provided with nut fixing seat (12) on the screw rod (11), the nut is fixed
Seat (12) covers on screw rod (11), and the knife handle mounting plate (15) is closely connect with nut fixing seat (12) using bolt, described
It is provided with shaft coupling (9), is provided with first motor (8) on the upside of the shaft coupling (9), the shaft coupling (9) on the upside of screw rod (11)
It covers on first motor (8) output shaft.
2. a kind of silicon wafer cutting equipment according to claim 1, it is characterised in that: the workbench (4) sets two sides up and down
It is equipped with baffle.
3. a kind of silicon wafer cutting equipment according to claim 1, it is characterised in that: the blade (5) is diamond cut
Piece.
4. a kind of silicon wafer cutting equipment according to claim 1, it is characterised in that: the first motor (8) uses screw
It is fixed in assembly case (10).
5. a kind of silicon wafer cutting equipment according to claim 1, it is characterised in that: the first motor (8) and the second electricity
Machine is provided with dust cover on (14).
6. a kind of silicon wafer cutting equipment according to claim 1, it is characterised in that: the first motor (8) and the second electricity
Machine (14) is electrically connected with external power supply.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820586807.1U CN208788818U (en) | 2018-04-24 | 2018-04-24 | A kind of silicon wafer cutting equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820586807.1U CN208788818U (en) | 2018-04-24 | 2018-04-24 | A kind of silicon wafer cutting equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208788818U true CN208788818U (en) | 2019-04-26 |
Family
ID=66199516
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820586807.1U Expired - Fee Related CN208788818U (en) | 2018-04-24 | 2018-04-24 | A kind of silicon wafer cutting equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208788818U (en) |
-
2018
- 2018-04-24 CN CN201820586807.1U patent/CN208788818U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20190426 |